MILITARY OTP ROM 626

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Part	Manufacturer	Memory IC Type	Temperature Grade	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Terminal Form	Parallel or Serial	Operating Mode	No. of Words	Nominal Supply Voltage / Vsup (V)	Memory Width	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Output Characteristics	Organization	No. of Words Code	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Maximum Supply Voltage (Vsup)	Maximum Seated Height	Width	Qualification	Memory Density	Minimum Supply Voltage (Vsup)	JESD-609 Code	Length	Maximum Access Time
5962-88735013X	STMicroelectronics	OTP ROM	MILITARY	28	QCCN	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	1	CMOS		NO LEAD	PARALLEL	SYNCHRONOUS	2048 words	5	8	CHIP CARRIER			1.27 mm	125 Cel		2KX8	2K	-55 Cel	TIN LEAD	QUAD	S-CQCC-N28	5.5 V	1.9812 mm	11.43 mm	Not Qualified	16384 bit	4.5 V	e0	11.43 mm
82S181A/BKA	NXP Semiconductors	OTP ROM	MILITARY	24	DFP	RECTANGULAR	CERAMIC, METAL-SEALED COFIRED	YES	1	BIPOLAR		FLAT	PARALLEL	ASYNCHRONOUS	1024 words	5	8	FLATPACK			1.27 mm	125 Cel	3-STATE	1KX8	1K	-55 Cel		DUAL	R-CDFP-F24	5.5 V	2.286 mm	9.144 mm	Not Qualified	8192 bit	4.5 V			55 ns
82S130A/BFA	NXP Semiconductors	OTP ROM	MILITARY	16	DFP	RECTANGULAR	CERAMIC, METAL-SEALED COFIRED	YES	1	BIPOLAR		FLAT	PARALLEL	ASYNCHRONOUS	512 words	5	4	FLATPACK			1.27 mm	125 Cel	OPEN-COLLECTOR	512X4	512	-55 Cel		DUAL	R-CDFP-F16	5.5 V	2.159 mm	6.731 mm	Not Qualified	2048 bit	4.5 V			35 ns
82S185B/BVA	NXP Semiconductors	OTP ROM	MILITARY	18	DIP	RECTANGULAR	CERAMIC, GLASS-SEALED	NO	1	BIPOLAR		THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	2048 words	5	4	IN-LINE			2.54 mm	125 Cel	3-STATE	2KX4	2K	-55 Cel	TIN/NICKEL PALLADIUM GOLD	DUAL	R-GDIP-T18	5.5 V	5.08 mm	7.62 mm	Not Qualified	8192 bit	4.5 V	e3/e4		90 ns
82S123B/BFA	NXP Semiconductors	OTP ROM	MILITARY	16	DFP	RECTANGULAR	CERAMIC, METAL-SEALED COFIRED	YES	1	BIPOLAR		FLAT	PARALLEL	ASYNCHRONOUS	32 words	5	8	FLATPACK			1.27 mm	125 Cel	3-STATE	32X8	32	-55 Cel		DUAL	R-CDFP-F16	5.5 V	2.159 mm	6.731 mm	Not Qualified	256 bit	4.5 V			30 ns
82HS641A/B3A	NXP Semiconductors	OTP ROM	MILITARY	28	QCCN	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	1	BIPOLAR		NO LEAD	PARALLEL	ASYNCHRONOUS	8192 words	5	8	CHIP CARRIER			1.27 mm	125 Cel	3-STATE	8KX8	8K	-55 Cel		QUAD	S-CQCC-N28	5.5 V	1.905 mm	11.43 mm	Not Qualified	65536 bit	4.5 V		11.43 mm	55 ns
82S123A/BEA	NXP Semiconductors	OTP ROM	MILITARY	16	DIP	RECTANGULAR	CERAMIC, GLASS-SEALED	NO	1	BIPOLAR		THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	32 words	5	8	IN-LINE			2.54 mm	125 Cel	3-STATE	32X8	32	-55 Cel		DUAL	R-GDIP-T16	5.5 V	5.08 mm	7.62 mm	Not Qualified	256 bit	4.5 V		19.535 mm	35 ns
82S141/BKA	NXP Semiconductors	OTP ROM	MILITARY	24	DFP	RECTANGULAR	CERAMIC, METAL-SEALED COFIRED	YES	1	BIPOLAR		FLAT	PARALLEL	ASYNCHRONOUS	512 words	5	8	FLATPACK			1.27 mm	125 Cel	3-STATE	512X8	512	-55 Cel		DUAL	R-CDFP-F24	5.5 V	2.286 mm	9.144 mm	Not Qualified	4096 bit	4.5 V			90 ns
82S131A/BFA	NXP Semiconductors	OTP ROM	MILITARY	16	DFP	RECTANGULAR	CERAMIC, METAL-SEALED COFIRED	YES	1	BIPOLAR		FLAT	PARALLEL	ASYNCHRONOUS	512 words	5	4	FLATPACK			1.27 mm	125 Cel	3-STATE	512X4	512	-55 Cel		DUAL	R-CDFP-F16	5.5 V	2.159 mm	6.731 mm	Not Qualified	2048 bit	4.5 V			35 ns
82008023X	NXP Semiconductors	OTP ROM	MILITARY	28	QCCN	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	1	BIPOLAR		NO LEAD	PARALLEL	ASYNCHRONOUS	4096 words	5	8	CHIP CARRIER				125 Cel		4KX8	4K	-55 Cel		QUAD	S-CQCC-N28	5.5 V			Not Qualified	32768 bit	4.5 V			55 ns
82009023A	NXP Semiconductors	OTP ROM	MILITARY	28	QCCN	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	1	BIPOLAR	MIL-STD-883	NO LEAD	PARALLEL	ASYNCHRONOUS	8192 words	5	8	CHIP CARRIER				125 Cel		8KX8	8K	-55 Cel		QUAD	S-CQCC-N28	5.5 V			Not Qualified	65536 bit	4.5 V			55 ns
82S131/BEA	NXP Semiconductors	OTP ROM	MILITARY	16	DIP	RECTANGULAR	CERAMIC, GLASS-SEALED	NO	1	BIPOLAR		THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	512 words	5	4	IN-LINE			2.54 mm	125 Cel	3-STATE	512X4	512	-55 Cel		DUAL	R-GDIP-T16	5.5 V	5.08 mm	7.62 mm	Not Qualified	2048 bit	4.5 V		19.535 mm	60 ns
82S23/BFA	NXP Semiconductors	OTP ROM	MILITARY	16	DFP	RECTANGULAR	CERAMIC, METAL-SEALED COFIRED	YES	1	BIPOLAR		FLAT	PARALLEL	ASYNCHRONOUS	32 words	5	8	FLATPACK			1.27 mm	125 Cel	OPEN-COLLECTOR	32X8	32	-55 Cel		DUAL	R-CDFP-F16	5.5 V	2.159 mm	6.731 mm	Not Qualified	256 bit	4.5 V			50 ns
82S137A/BVA	NXP Semiconductors	OTP ROM	MILITARY	18	DIP	RECTANGULAR	CERAMIC, GLASS-SEALED	NO	1	BIPOLAR		THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	1024 words	5	4	IN-LINE			2.54 mm	125 Cel	3-STATE	1KX4	1K	-55 Cel		DUAL	R-GDIP-T18	5.5 V	5.08 mm	7.62 mm	Not Qualified	4096 bit	4.5 V			55 ns
82S191A/BLA	NXP Semiconductors	OTP ROM	MILITARY	24	DIP	RECTANGULAR	CERAMIC, GLASS-SEALED	NO	1	BIPOLAR		THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	2048 words	5	8	IN-LINE			2.54 mm	125 Cel	3-STATE	2KX8	2K	-55 Cel		DUAL	R-GDIP-T24	5.5 V	5.08 mm	7.62 mm	Not Qualified	16384 bit	4.5 V			55 ns
82009033A	NXP Semiconductors	OTP ROM	MILITARY	28	QCCN	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	1	BIPOLAR	MIL-STD-883	NO LEAD	PARALLEL	ASYNCHRONOUS	8192 words	5	8	CHIP CARRIER				125 Cel		8KX8	8K	-55 Cel		QUAD	S-CQCC-N28	5.5 V			Not Qualified	65536 bit	4.5 V			45 ns
8200801JA	NXP Semiconductors	OTP ROM	MILITARY	24	DIP	RECTANGULAR	CERAMIC, GLASS-SEALED	NO	1	BIPOLAR	MIL-STD-883	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	4096 words	5	8	IN-LINE				125 Cel		4KX8	4K	-55 Cel		DUAL	R-GDIP-T24	5.5 V			Not Qualified	32768 bit	4.5 V			95 ns
82008013A	NXP Semiconductors	OTP ROM	MILITARY	28	QCCN	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	1	BIPOLAR	MIL-STD-883	NO LEAD	PARALLEL	ASYNCHRONOUS	4096 words	5	8	CHIP CARRIER				125 Cel		4KX8	4K	-55 Cel		QUAD	S-CQCC-N28	5.5 V			Not Qualified	32768 bit	4.5 V			95 ns
8200804JA	NXP Semiconductors	OTP ROM	MILITARY	24	DIP	RECTANGULAR	CERAMIC, GLASS-SEALED	NO	1	BIPOLAR	MIL-STD-883	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	4096 words	5	8	IN-LINE				125 Cel		4KX8	4K	-55 Cel		DUAL	R-GDIP-T24	5.5 V			Not Qualified	32768 bit	4.5 V			70 ns
82S181/BKA	NXP Semiconductors	OTP ROM	MILITARY	24	DFP	RECTANGULAR	CERAMIC, METAL-SEALED COFIRED	YES	1	BIPOLAR		FLAT	PARALLEL	ASYNCHRONOUS	1024 words	5	8	FLATPACK			1.27 mm	125 Cel	3-STATE	1KX8	1K	-55 Cel		DUAL	R-CDFP-F24	5.5 V	2.286 mm	9.144 mm	Not Qualified	8192 bit	4.5 V			90 ns
82S137/BVA	NXP Semiconductors	OTP ROM	MILITARY	18	DIP	RECTANGULAR	CERAMIC, GLASS-SEALED	NO	1	BIPOLAR		THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	1024 words	5	4	IN-LINE			2.54 mm	125 Cel	3-STATE	1KX4	1K	-55 Cel		DUAL	R-GDIP-T18	5.5 V	5.08 mm	7.62 mm	Not Qualified	4096 bit	4.5 V			70 ns
S82S136F	NXP Semiconductors	OTP ROM	MILITARY	18	DIP	RECTANGULAR	CERAMIC, METAL-SEALED COFIRED	NO	1	BIPOLAR		THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	1024 words	5	4	IN-LINE	DIP18,.3	OTP ROMs	2.54 mm	125 Cel	OPEN-COLLECTOR	1KX4	1K	-55 Cel	TIN LEAD	DUAL	R-CDIP-T18	5.5 V			Not Qualified	4096 bit	4.5 V	e0		80 ns
82008013X	NXP Semiconductors	OTP ROM	MILITARY	28	QCCN	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	1	BIPOLAR	MIL-STD-883	NO LEAD	PARALLEL	ASYNCHRONOUS	4096 words	5	8	CHIP CARRIER				125 Cel		4KX8	4K	-55 Cel		QUAD	S-CQCC-N28	5.5 V				32768 bit	4.5 V			95 ns
82S123/BFA	NXP Semiconductors	OTP ROM	MILITARY	16	DFP	RECTANGULAR	CERAMIC, METAL-SEALED COFIRED	YES	1	BIPOLAR		FLAT	PARALLEL	ASYNCHRONOUS	32 words	5	8	FLATPACK			1.27 mm	125 Cel	3-STATE	32X8	32	-55 Cel		DUAL	R-CDFP-F16	5.5 V	2.159 mm	6.731 mm	Not Qualified	256 bit	4.5 V			50 ns
8200803JX	NXP Semiconductors	OTP ROM	MILITARY	24	DIP	RECTANGULAR	CERAMIC, GLASS-SEALED	NO	1	BIPOLAR	MIL-STD-883	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	4096 words	5	8	IN-LINE				125 Cel		4KX8	4K	-55 Cel		DUAL	R-GDIP-T24	5.5 V			Not Qualified	32768 bit	4.5 V			45 ns
78016013X	NXP Semiconductors	OTP ROM	MILITARY	28	QCCN	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	1	CMOS		NO LEAD	PARALLEL	ASYNCHRONOUS	512 words	5	8	CHIP CARRIER				125 Cel		512X8	512	-55 Cel		QUAD	S-CQCC-N28	5.5 V			Not Qualified	4096 bit	4.5 V			90 ns
82S129A/BEA	NXP Semiconductors	OTP ROM	MILITARY	16	DIP	RECTANGULAR	CERAMIC, GLASS-SEALED	NO	1	BIPOLAR		THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	256 words	5	4	IN-LINE			2.54 mm	125 Cel	3-STATE	256X4	256	-55 Cel		DUAL	R-GDIP-T16	5.5 V	5.08 mm	7.62 mm	Not Qualified	1024 bit	4.5 V		19.535 mm	35 ns
8200903JA	NXP Semiconductors	OTP ROM	MILITARY	24	DIP	RECTANGULAR	CERAMIC, GLASS-SEALED	NO	1	BIPOLAR	MIL-STD-883	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	8192 words	5	8	IN-LINE				125 Cel		8KX8	8K	-55 Cel		DUAL	R-GDIP-T24	5.5 V			Not Qualified	65536 bit	4.5 V			45 ns
82S191/BJA	NXP Semiconductors	OTP ROM	MILITARY	24	DIP	RECTANGULAR	CERAMIC, GLASS-SEALED	NO	1	BIPOLAR		THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	2048 words	5	8	IN-LINE			2.54 mm	125 Cel	3-STATE	2KX8	2K	-55 Cel		DUAL	R-GDIP-T24	5.5 V	5.715 mm	15.24 mm	Not Qualified	16384 bit	4.5 V			100 ns
82S126/BFA	NXP Semiconductors	OTP ROM	MILITARY	16	DFP	RECTANGULAR	CERAMIC, METAL-SEALED COFIRED	YES	1	BIPOLAR		FLAT	PARALLEL	ASYNCHRONOUS	256 words	5	4	FLATPACK			1.27 mm	125 Cel	OPEN-COLLECTOR	256X4	256	-55 Cel		DUAL	R-CDFP-F16	5.5 V	2.159 mm	6.731 mm	Not Qualified	1024 bit	4.5 V			60 ns
8200901JX	NXP Semiconductors	OTP ROM	MILITARY	24	DIP	RECTANGULAR	CERAMIC, GLASS-SEALED	NO	1	BIPOLAR	MIL-STD-883	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	8192 words	5	8	IN-LINE				125 Cel		8KX8	8K	-55 Cel		DUAL	R-GDIP-T24	5.5 V				65536 bit	4.5 V			100 ns
82S191/BLA	NXP Semiconductors	OTP ROM	MILITARY	24	DIP	RECTANGULAR	CERAMIC, GLASS-SEALED	NO	1	BIPOLAR		THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	2048 words	5	8	IN-LINE			2.54 mm	125 Cel	3-STATE	2KX8	2K	-55 Cel		DUAL	R-GDIP-T24	5.5 V	5.08 mm	7.62 mm	Not Qualified	16384 bit	4.5 V			100 ns
82S141/BJA	NXP Semiconductors	OTP ROM	MILITARY	24	DIP	RECTANGULAR	CERAMIC, GLASS-SEALED	NO	1	BIPOLAR		THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	512 words	5	8	IN-LINE			2.54 mm	125 Cel	3-STATE	512X8	512	-55 Cel		DUAL	R-GDIP-T24	5.5 V	5.715 mm	15.24 mm	Not Qualified	4096 bit	4.5 V			90 ns
8200804KA	NXP Semiconductors	OTP ROM	MILITARY	24	DFP	RECTANGULAR	CERAMIC, GLASS-SEALED	YES	1	BIPOLAR	MIL-STD-883	FLAT	PARALLEL	ASYNCHRONOUS	4096 words	5	8	FLATPACK				125 Cel		4KX8	4K	-55 Cel		DUAL	R-GDFP-F24	5.5 V			Not Qualified	32768 bit	4.5 V			70 ns
82HS321A/B3A	NXP Semiconductors	OTP ROM	MILITARY	28	QCCN	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	1	BIPOLAR		NO LEAD	PARALLEL	ASYNCHRONOUS	4096 words	5	8	CHIP CARRIER			1.27 mm	125 Cel	3-STATE	4KX8	4K	-55 Cel		QUAD	S-CQCC-N28	5.5 V	1.905 mm	11.43 mm	Not Qualified	32768 bit	4.5 V		11.43 mm	30 ns
82S131/BFA	NXP Semiconductors	OTP ROM	MILITARY	16	DFP	RECTANGULAR	CERAMIC, METAL-SEALED COFIRED	YES	1	BIPOLAR		FLAT	PARALLEL	ASYNCHRONOUS	512 words	5	4	FLATPACK			1.27 mm	125 Cel	3-STATE	512X4	512	-55 Cel		DUAL	R-CDFP-F16	5.5 V	2.159 mm	6.731 mm	Not Qualified	2048 bit	4.5 V			60 ns
82S130A/BEA	NXP Semiconductors	OTP ROM	MILITARY	16	DIP	RECTANGULAR	CERAMIC, GLASS-SEALED	NO	1	BIPOLAR		THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	512 words	5	4	IN-LINE			2.54 mm	125 Cel	OPEN-COLLECTOR	512X4	512	-55 Cel		DUAL	R-GDIP-T16	5.5 V	5.08 mm	7.62 mm	Not Qualified	2048 bit	4.5 V		19.535 mm	35 ns
S82S131F	NXP Semiconductors	OTP ROM	MILITARY	16		RECTANGULAR	CERAMIC, GLASS-SEALED	NO	1	BIPOLAR		THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	512 words	5	4	IN-LINE				125 Cel	3-STATE	512X4	512	-55 Cel		DUAL	R-GDIP-T16	5.5 V			Not Qualified	2048 bit	4.5 V			70 ns
82S23A/BFA	NXP Semiconductors	OTP ROM	MILITARY	16	DFP	RECTANGULAR	CERAMIC, METAL-SEALED COFIRED	YES	1	BIPOLAR		FLAT	PARALLEL	ASYNCHRONOUS	32 words	5	8	FLATPACK			1.27 mm	125 Cel	OPEN-COLLECTOR	32X8	32	-55 Cel		DUAL	R-CDFP-F16	5.5 V	2.159 mm	6.731 mm	Not Qualified	256 bit	4.5 V			35 ns
8200802KX	NXP Semiconductors	OTP ROM	MILITARY	24	DFP	RECTANGULAR	CERAMIC, GLASS-SEALED	YES	1	BIPOLAR		FLAT	PARALLEL	ASYNCHRONOUS	4096 words	5	8	FLATPACK				125 Cel		4KX8	4K	-55 Cel		DUAL	R-GDFP-F24	5.5 V			Not Qualified	32768 bit	4.5 V			55 ns
8200902JA	NXP Semiconductors	OTP ROM	MILITARY	24	DIP	RECTANGULAR	CERAMIC, GLASS-SEALED	NO	1	BIPOLAR	MIL-STD-883	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	8192 words	5	8	IN-LINE				125 Cel		8KX8	8K	-55 Cel		DUAL	R-GDIP-T24	5.5 V			Not Qualified	65536 bit	4.5 V			55 ns
82S147/BRA	NXP Semiconductors	OTP ROM	MILITARY	20	DIP	RECTANGULAR	CERAMIC, GLASS-SEALED	NO	1	BIPOLAR		THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	512 words	5	8	IN-LINE			2.54 mm	125 Cel	3-STATE	512X8	512	-55 Cel		DUAL	R-GDIP-T20	5.5 V	5.08 mm	7.62 mm	Not Qualified	4096 bit	4.5 V			75 ns
82008033A	NXP Semiconductors	OTP ROM	MILITARY	28	QCCN	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	1	BIPOLAR	MIL-STD-883	NO LEAD	PARALLEL	ASYNCHRONOUS	4096 words	5	8	CHIP CARRIER				125 Cel		4KX8	4K	-55 Cel		QUAD	S-CQCC-N28	5.5 V			Not Qualified	32768 bit	4.5 V			45 ns
82S191A/B3A	NXP Semiconductors	OTP ROM	MILITARY	28	QCCN	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	1	BIPOLAR		NO LEAD	PARALLEL	ASYNCHRONOUS	2048 words	5	8	CHIP CARRIER			1.27 mm	125 Cel	3-STATE	2KX8	2K	-55 Cel		QUAD	S-CQCC-N28	5.5 V	1.905 mm	11.43 mm	Not Qualified	16384 bit	4.5 V		11.43 mm	55 ns
82S191A/BKA	NXP Semiconductors	OTP ROM	MILITARY	24	DFP	RECTANGULAR	CERAMIC, METAL-SEALED COFIRED	YES	1	BIPOLAR		FLAT	PARALLEL	ASYNCHRONOUS	2048 words	5	8	FLATPACK			1.27 mm	125 Cel	3-STATE	2KX8	2K	-55 Cel		DUAL	R-CDFP-F24	5.5 V	2.286 mm	9.144 mm	Not Qualified	16384 bit	4.5 V			55 ns
8200802JA	NXP Semiconductors	OTP ROM	MILITARY	24	DIP	RECTANGULAR	CERAMIC, GLASS-SEALED	NO	1	BIPOLAR	MIL-STD-883	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	4096 words	5	8	IN-LINE				125 Cel		4KX8	4K	-55 Cel		DUAL	R-GDIP-T24	5.5 V			Not Qualified	32768 bit	4.5 V			55 ns
82S147B/BRA	NXP Semiconductors	OTP ROM	MILITARY	20	DIP	RECTANGULAR	CERAMIC, GLASS-SEALED	NO	1	BIPOLAR		THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	512 words	5	8	IN-LINE			2.54 mm	125 Cel	3-STATE	512X8	512	-55 Cel		DUAL	R-GDIP-T20	5.5 V	5.08 mm	7.62 mm	Not Qualified	4096 bit	4.5 V			45 ns
S82S23F	NXP Semiconductors	OTP ROM	MILITARY	16		RECTANGULAR	CERAMIC, GLASS-SEALED	NO	1	BIPOLAR		THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	32 words	5	8	IN-LINE				125 Cel	OPEN-COLLECTOR	32X8	32	-55 Cel		DUAL	R-GDIP-T16	5.5 V			Not Qualified	256 bit	4.5 V			65 ns

OTP ROM

OTP ROM, or One-Time Programmable Read-Only Memory, is a type of non-volatile computer memory that is programmed once and cannot be reprogrammed. OTP ROM is used to store data that needs to be permanently stored and cannot be changed or updated in the future.

OTP ROM is created using a process similar to that used to manufacture Mask ROM. However, instead of programming the memory during the manufacturing process, OTP ROM is programmed after the manufacturing process, but before it is delivered to the customer. This allows the customer to program the memory with the data that they need to store permanently.

OTP ROM is commonly used in devices such as microcontrollers, smart cards, and other electronic devices that require permanent storage of data. It is ideal for storing critical data, such as system settings, encryption keys, and other sensitive information that needs to be permanently stored and cannot be changed or updated in the future.