MILITARY OTP ROM 626

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Part	Manufacturer	Memory IC Type	Temperature Grade	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Terminal Form	Parallel or Serial	Operating Mode	Maximum Supply Current	No. of Words	Nominal Supply Voltage / Vsup (V)	Power Supplies (V)	Memory Width	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Output Characteristics	Organization	No. of Words Code	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Maximum Supply Voltage (Vsup)	Maximum Seated Height	Width	Qualification	Memory Density	Minimum Supply Voltage (Vsup)	JESD-609 Code	Length	Maximum Access Time
82S191A/BJA	NXP Semiconductors	OTP ROM	MILITARY	24	DIP	RECTANGULAR	CERAMIC, GLASS-SEALED	NO	1	BIPOLAR		THROUGH-HOLE	PARALLEL	ASYNCHRONOUS		2048 words	5		8	IN-LINE			2.54 mm	125 Cel	3-STATE	2KX8	2K	-55 Cel		DUAL	R-GDIP-T24	5.5 V	5.715 mm	15.24 mm	Not Qualified	16384 bit	4.5 V			55 ns
7801601JX	NXP Semiconductors	OTP ROM	MILITARY	24	DIP	RECTANGULAR	CERAMIC, METAL-SEALED COFIRED	NO	1	CMOS		THROUGH-HOLE	PARALLEL	ASYNCHRONOUS		512 words	5		8	IN-LINE				125 Cel		512X8	512	-55 Cel		DUAL	R-CDIP-T24	5.5 V			Not Qualified	4096 bit	4.5 V			90 ns
82S181A/B3A	NXP Semiconductors	OTP ROM	MILITARY	28	QCCN	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	1	BIPOLAR		NO LEAD	PARALLEL	ASYNCHRONOUS		1024 words	5		8	CHIP CARRIER			1.27 mm	125 Cel	3-STATE	1KX8	1K	-55 Cel		QUAD	S-CQCC-N28	5.5 V	1.905 mm	11.43 mm	Not Qualified	8192 bit	4.5 V		11.43 mm	55 ns
82HS641A/BJA	NXP Semiconductors	OTP ROM	MILITARY	24	DIP	RECTANGULAR	CERAMIC, GLASS-SEALED	NO	1	BIPOLAR		THROUGH-HOLE	PARALLEL	ASYNCHRONOUS		8192 words	5		8	IN-LINE			2.54 mm	125 Cel	3-STATE	8KX8	8K	-55 Cel		DUAL	R-GDIP-T24	5.5 V	5.715 mm	15.24 mm	Not Qualified	65536 bit	4.5 V			55 ns
8200804KX	NXP Semiconductors	OTP ROM	MILITARY	24	DFP	RECTANGULAR	CERAMIC, GLASS-SEALED	YES	1	CMOS	MIL-STD-883	FLAT	PARALLEL	ASYNCHRONOUS		4096 words	5		8	FLATPACK				125 Cel		4KX8	4K	-55 Cel		DUAL	R-GDFP-F24	5.5 V				32768 bit	4.5 V			70 ns
82S185/BVA	NXP Semiconductors	OTP ROM	MILITARY	18	DIP	RECTANGULAR	CERAMIC, METAL-SEALED COFIRED	NO	1	BIPOLAR		THROUGH-HOLE	PARALLEL	ASYNCHRONOUS		2048 words	5		4	IN-LINE			2.54 mm	125 Cel	3-STATE	2KX4	2K	-55 Cel		DUAL	R-GDIP-T18	5.5 V	5.08 mm	7.62 mm	Not Qualified	8192 bit	4.5 V			115 ns
82LS181/BJA	NXP Semiconductors	OTP ROM	MILITARY	24	DIP	RECTANGULAR	CERAMIC	NO		TTL	38535Q/M;38534H;883B	THROUGH-HOLE				1024 words	5	5	8	IN-LINE	DIP24,.6	OTP ROMs	2.54 mm	125 Cel		1KX8	1K	-55 Cel	Tin/Lead (Sn/Pb)	DUAL	R-XDIP-T24				Not Qualified	8192 bit		e0		120 ns
8200801JX	NXP Semiconductors	OTP ROM	MILITARY	24	DIP	RECTANGULAR	CERAMIC, GLASS-SEALED	NO	1	BIPOLAR	MIL-STD-883	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS		4096 words	5		8	IN-LINE				125 Cel		4KX8	4K	-55 Cel		DUAL	R-GDIP-T24	5.5 V				32768 bit	4.5 V			95 ns
82S191/B3A	NXP Semiconductors	OTP ROM	MILITARY	28	QCCN	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	1	BIPOLAR		NO LEAD	PARALLEL	ASYNCHRONOUS		2048 words	5		8	CHIP CARRIER			1.27 mm	125 Cel	3-STATE	2KX8	2K	-55 Cel		QUAD	S-CQCC-N28	5.5 V	1.905 mm	11.43 mm	Not Qualified	16384 bit	4.5 V		11.43 mm	100 ns
82S23A/BEA	NXP Semiconductors	OTP ROM	MILITARY	16	DIP	RECTANGULAR	CERAMIC, GLASS-SEALED	NO	1	BIPOLAR		THROUGH-HOLE	PARALLEL	ASYNCHRONOUS		32 words	5		8	IN-LINE			2.54 mm	125 Cel	OPEN-COLLECTOR	32X8	32	-55 Cel		DUAL	R-GDIP-T16	5.5 V	5.08 mm	7.62 mm	Not Qualified	256 bit	4.5 V		19.535 mm	35 ns
7801601JA	NXP Semiconductors	OTP ROM	MILITARY	24	DIP	RECTANGULAR	CERAMIC, METAL-SEALED COFIRED	NO	1	CMOS	MIL-STD-883	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS		512 words	5		8	IN-LINE				125 Cel		512X8	512	-55 Cel		DUAL	R-CDIP-T24	5.5 V				4096 bit	4.5 V			90 ns
82008043A	NXP Semiconductors	OTP ROM	MILITARY	28	QCCN	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	1	BIPOLAR	MIL-STD-883	NO LEAD	PARALLEL	ASYNCHRONOUS		4096 words	5		8	CHIP CARRIER				125 Cel		4KX8	4K	-55 Cel		QUAD	S-CQCC-N28	5.5 V			Not Qualified	32768 bit	4.5 V			70 ns
82S185A/BYA	NXP Semiconductors	OTP ROM	MILITARY	18	DFP	RECTANGULAR	CERAMIC, METAL-SEALED COFIRED	YES	1	BIPOLAR		FLAT	PARALLEL	ASYNCHRONOUS		2048 words	5		4	FLATPACK				125 Cel	3-STATE	2KX4	2K	-55 Cel		DUAL	R-CDFP-F18	5.5 V			Not Qualified	8192 bit	4.5 V			55 ns
S82S185F	NXP Semiconductors	OTP ROM	MILITARY	18		RECTANGULAR	CERAMIC, METAL-SEALED COFIRED	NO	1	BIPOLAR		THROUGH-HOLE	PARALLEL	ASYNCHRONOUS		2048 words	5		4	IN-LINE				125 Cel	3-STATE	2KX4	2K	-55 Cel		DUAL	R-CDIP-T18	5.5 V			Not Qualified	8192 bit	4.5 V			150 ns
82S131A/BEA	NXP Semiconductors	OTP ROM	MILITARY	16	DIP	RECTANGULAR	CERAMIC, GLASS-SEALED	NO	1	BIPOLAR		THROUGH-HOLE	PARALLEL	ASYNCHRONOUS		512 words	5		4	IN-LINE			2.54 mm	125 Cel	3-STATE	512X4	512	-55 Cel		DUAL	R-GDIP-T16	5.5 V	5.08 mm	7.62 mm	Not Qualified	2048 bit	4.5 V		19.535 mm	35 ns
8200802KA	NXP Semiconductors	OTP ROM	MILITARY	24	DFP	RECTANGULAR	CERAMIC, GLASS-SEALED	YES	1	BIPOLAR	MIL-STD-883	FLAT	PARALLEL	ASYNCHRONOUS		4096 words	5		8	FLATPACK				125 Cel		4KX8	4K	-55 Cel		DUAL	R-GDFP-F24	5.5 V			Not Qualified	32768 bit	4.5 V			55 ns
8200803KA	NXP Semiconductors	OTP ROM	MILITARY	24	DFP	RECTANGULAR	CERAMIC, GLASS-SEALED	YES	1	BIPOLAR	MIL-STD-883	FLAT	PARALLEL	ASYNCHRONOUS	190 mA	4096 words	5	5	8	FLATPACK	FL24,.4	OTP ROMs	1.27 mm	125 Cel		4KX8	4K	-55 Cel		DUAL	R-GDFP-F24	5.5 V			Not Qualified	32768 bit	4.5 V			45 ns
82HS321A/BKA	NXP Semiconductors	OTP ROM	MILITARY	24	DFP	RECTANGULAR	CERAMIC, METAL-SEALED COFIRED	YES	1	BIPOLAR		FLAT	PARALLEL	ASYNCHRONOUS		4096 words	5		8	FLATPACK			1.27 mm	125 Cel	3-STATE	4KX8	4K	-55 Cel		DUAL	R-CDFP-F24	5.5 V	2.286 mm	9.144 mm	Not Qualified	32768 bit	4.5 V			30 ns
82S130/BEA	NXP Semiconductors	OTP ROM	MILITARY	16	DIP	RECTANGULAR	CERAMIC, GLASS-SEALED	NO	1	BIPOLAR		THROUGH-HOLE	PARALLEL	ASYNCHRONOUS		512 words	5		4	IN-LINE			2.54 mm	125 Cel	OPEN-COLLECTOR	512X4	512	-55 Cel		DUAL	R-GDIP-T16	5.5 V	5.08 mm	7.62 mm	Not Qualified	2048 bit	4.5 V		19.535 mm	60 ns
82S126/BEA	NXP Semiconductors	OTP ROM	MILITARY	16	DIP	RECTANGULAR	CERAMIC, GLASS-SEALED	NO	1	BIPOLAR		THROUGH-HOLE	PARALLEL	ASYNCHRONOUS		256 words	5		4	IN-LINE			2.54 mm	125 Cel	OPEN-COLLECTOR	256X4	256	-55 Cel		DUAL	R-GDIP-T16	5.5 V	5.08 mm	7.62 mm	Not Qualified	1024 bit	4.5 V		19.535 mm	60 ns
82HS321A/BJA	NXP Semiconductors	OTP ROM	MILITARY	24	DIP	RECTANGULAR	CERAMIC, GLASS-SEALED	NO	1	BIPOLAR		THROUGH-HOLE	PARALLEL	ASYNCHRONOUS		4096 words	5		8	IN-LINE			2.54 mm	125 Cel	3-STATE	4KX8	4K	-55 Cel		DUAL	R-GDIP-T24	5.5 V	5.715 mm	15.24 mm	Not Qualified	32768 bit	4.5 V			30 ns
82HS641B/BJA	NXP Semiconductors	OTP ROM	MILITARY	24	DIP	RECTANGULAR	CERAMIC, GLASS-SEALED	NO	1	BIPOLAR		THROUGH-HOLE	PARALLEL	ASYNCHRONOUS		8192 words	5		8	IN-LINE			2.54 mm	125 Cel	3-STATE	8KX8	8K	-55 Cel		DUAL	R-GDIP-T24	5.5 V	5.715 mm	15.24 mm	Not Qualified	65536 bit	4.5 V			45 ns
82S129/BFA	NXP Semiconductors	OTP ROM	MILITARY	16	DFP	RECTANGULAR	CERAMIC, METAL-SEALED COFIRED	YES	1	BIPOLAR		FLAT	PARALLEL	ASYNCHRONOUS		256 words	5		4	FLATPACK			1.27 mm	125 Cel	3-STATE	256X4	256	-55 Cel		DUAL	R-CDFP-F16	5.5 V	2.159 mm	6.731 mm	Not Qualified	1024 bit	4.5 V			60 ns
82S126A/BEA	NXP Semiconductors	OTP ROM	MILITARY	16	DIP	RECTANGULAR	CERAMIC, GLASS-SEALED	NO	1	BIPOLAR		THROUGH-HOLE	PARALLEL	ASYNCHRONOUS		256 words	5		4	IN-LINE			2.54 mm	125 Cel	OPEN-COLLECTOR	256X4	256	-55 Cel		DUAL	R-GDIP-T16	5.5 V	5.08 mm	7.62 mm	Not Qualified	1024 bit	4.5 V		19.535 mm	35 ns
8200801KA	NXP Semiconductors	OTP ROM	MILITARY	24	DFP	RECTANGULAR	CERAMIC, GLASS-SEALED	YES	1	BIPOLAR	MIL-STD-883	FLAT	PARALLEL	ASYNCHRONOUS		4096 words	5		8	FLATPACK				125 Cel		4KX8	4K	-55 Cel		DUAL	R-GDFP-F24	5.5 V			Not Qualified	32768 bit	4.5 V			95 ns
82S129A/BFA	NXP Semiconductors	OTP ROM	MILITARY	16	DFP	RECTANGULAR	CERAMIC, METAL-SEALED COFIRED	YES	1	BIPOLAR		FLAT	PARALLEL	ASYNCHRONOUS		256 words	5		4	FLATPACK			1.27 mm	125 Cel	3-STATE	256X4	256	-55 Cel		DUAL	R-CDFP-F16	5.5 V	2.159 mm	6.731 mm	Not Qualified	1024 bit	4.5 V			35 ns
82S181/B3A	NXP Semiconductors	OTP ROM	MILITARY	28	QCCN	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	1	BIPOLAR		NO LEAD	PARALLEL	ASYNCHRONOUS		1024 words	5		8	CHIP CARRIER			1.27 mm	125 Cel	3-STATE	1KX8	1K	-55 Cel		QUAD	S-CQCC-N28	5.5 V	1.905 mm	11.43 mm	Not Qualified	8192 bit	4.5 V		11.43 mm	90 ns
82S130/BFA	NXP Semiconductors	OTP ROM	MILITARY	16	DFP	RECTANGULAR	CERAMIC, METAL-SEALED COFIRED	YES	1	BIPOLAR		FLAT	PARALLEL	ASYNCHRONOUS		512 words	5		4	FLATPACK			1.27 mm	125 Cel	OPEN-COLLECTOR	512X4	512	-55 Cel		DUAL	R-CDFP-F16	5.5 V	2.159 mm	6.731 mm	Not Qualified	2048 bit	4.5 V			60 ns
82S185B/BYA	NXP Semiconductors	OTP ROM	MILITARY	18	DFP	RECTANGULAR	CERAMIC, METAL-SEALED COFIRED	YES	1	BIPOLAR		FLAT	PARALLEL	ASYNCHRONOUS		2048 words	5		4	FLATPACK				125 Cel	3-STATE	2KX4	2K	-55 Cel		DUAL	R-CDFP-F18	5.5 V			Not Qualified	8192 bit	4.5 V			90 ns
82S147A/BRA	NXP Semiconductors	OTP ROM	MILITARY	20	DIP	RECTANGULAR	CERAMIC, GLASS-SEALED	NO	1	BIPOLAR		THROUGH-HOLE	PARALLEL	ASYNCHRONOUS		512 words	5		8	IN-LINE			2.54 mm	125 Cel	3-STATE	512X8	512	-55 Cel		DUAL	R-GDIP-T20	5.5 V	5.08 mm	7.62 mm	Not Qualified	4096 bit	4.5 V			55 ns
82009013A	NXP Semiconductors	OTP ROM	MILITARY	28	QCCN	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	1	BIPOLAR	MIL-STD-883	NO LEAD	PARALLEL	ASYNCHRONOUS		8192 words	5		8	CHIP CARRIER				125 Cel		8KX8	8K	-55 Cel		QUAD	S-CQCC-N28	5.5 V			Not Qualified	65536 bit	4.5 V			100 ns
82HS641B/B3A	NXP Semiconductors	OTP ROM	MILITARY	28	QCCN	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	1	BIPOLAR		NO LEAD	PARALLEL	ASYNCHRONOUS		8192 words	5		8	CHIP CARRIER			1.27 mm	125 Cel	3-STATE	8KX8	8K	-55 Cel		QUAD	S-CQCC-N28	5.5 V	1.905 mm	11.43 mm	Not Qualified	65536 bit	4.5 V		11.43 mm	45 ns
82S185A/BVA	NXP Semiconductors	OTP ROM	MILITARY	18	DIP	RECTANGULAR	CERAMIC, GLASS-SEALED	NO	1	BIPOLAR		THROUGH-HOLE	PARALLEL	ASYNCHRONOUS		2048 words	5		4	IN-LINE			2.54 mm	125 Cel	3-STATE	2KX4	2K	-55 Cel		DUAL	R-GDIP-T18	5.5 V	5.08 mm	7.62 mm	Not Qualified	8192 bit	4.5 V			55 ns
82009013X	NXP Semiconductors	OTP ROM	MILITARY	28	QCCN	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	1	BIPOLAR		NO LEAD	PARALLEL	ASYNCHRONOUS		8192 words	5		8	CHIP CARRIER				125 Cel		8KX8	8K	-55 Cel		QUAD	S-CQCC-N28	5.5 V				65536 bit	4.5 V			100 ns
78016013A	NXP Semiconductors	OTP ROM	MILITARY	28	QCCN	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	1	CMOS	MIL-STD-883	NO LEAD	PARALLEL	ASYNCHRONOUS		512 words	5		8	CHIP CARRIER				125 Cel		512X8	512	-55 Cel		QUAD	S-CQCC-N28	5.5 V				4096 bit	4.5 V			90 ns
8200803JA	NXP Semiconductors	OTP ROM	MILITARY	24	DIP	RECTANGULAR	CERAMIC, GLASS-SEALED	NO	1	BIPOLAR	MIL-STD-883	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS		4096 words	5		8	IN-LINE				125 Cel		4KX8	4K	-55 Cel		DUAL	R-GDIP-T24	5.5 V			Not Qualified	32768 bit	4.5 V			45 ns
82S123B/BEA	NXP Semiconductors	OTP ROM	MILITARY	16	DIP	RECTANGULAR	CERAMIC, GLASS-SEALED	NO	1	BIPOLAR		THROUGH-HOLE	PARALLEL	ASYNCHRONOUS		32 words	5		8	IN-LINE			2.54 mm	125 Cel	3-STATE	32X8	32	-55 Cel		DUAL	R-GDIP-T16	5.5 V	5.08 mm	7.62 mm	Not Qualified	256 bit	4.5 V		19.535 mm	30 ns
82S23B/BEA	NXP Semiconductors	OTP ROM	MILITARY	16	DIP	RECTANGULAR	CERAMIC, GLASS-SEALED	NO	1	BIPOLAR		THROUGH-HOLE	PARALLEL	ASYNCHRONOUS		32 words	5		8	IN-LINE			2.54 mm	125 Cel	OPEN-COLLECTOR	32X8	32	-55 Cel		DUAL	R-GDIP-T16	5.5 V	5.08 mm	7.62 mm	Not Qualified	256 bit	4.5 V		19.535 mm	30 ns
82S181A/BJA	NXP Semiconductors	OTP ROM	MILITARY	24	DIP	RECTANGULAR	CERAMIC, GLASS-SEALED	NO	1	BIPOLAR		THROUGH-HOLE	PARALLEL	ASYNCHRONOUS		1024 words	5		8	IN-LINE			2.54 mm	125 Cel	3-STATE	1KX8	1K	-55 Cel		DUAL	R-GDIP-T24	5.5 V	5.715 mm	15.24 mm	Not Qualified	8192 bit	4.5 V			55 ns
82S191/BKA	NXP Semiconductors	OTP ROM	MILITARY	24	DFP	RECTANGULAR	CERAMIC, METAL-SEALED COFIRED	YES	1	BIPOLAR		FLAT	PARALLEL	ASYNCHRONOUS		2048 words	5		8	FLATPACK			1.27 mm	125 Cel	3-STATE	2KX8	2K	-55 Cel		DUAL	R-CDFP-F24	5.5 V	2.286 mm	9.144 mm	Not Qualified	16384 bit	4.5 V			100 ns
82008033X	NXP Semiconductors	OTP ROM	MILITARY	28	QCCN	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	1	BIPOLAR		NO LEAD	PARALLEL	ASYNCHRONOUS		4096 words	5		8	CHIP CARRIER				125 Cel		4KX8	4K	-55 Cel		QUAD	S-CQCC-N28	5.5 V				32768 bit	4.5 V			45 ns
82S126A/BFA	NXP Semiconductors	OTP ROM	MILITARY	16	DFP	RECTANGULAR	CERAMIC, METAL-SEALED COFIRED	YES	1	BIPOLAR		FLAT	PARALLEL	ASYNCHRONOUS		256 words	5		4	FLATPACK			1.27 mm	125 Cel	OPEN-COLLECTOR	256X4	256	-55 Cel		DUAL	R-CDFP-F16	5.5 V	2.159 mm	6.731 mm	Not Qualified	1024 bit	4.5 V			35 ns
82S123A/BFA	NXP Semiconductors	OTP ROM	MILITARY	16	DFP	RECTANGULAR	CERAMIC, METAL-SEALED COFIRED	YES	1	BIPOLAR		FLAT	PARALLEL	ASYNCHRONOUS		32 words	5		8	FLATPACK			1.27 mm	125 Cel	3-STATE	32X8	32	-55 Cel		DUAL	R-CDFP-F16	5.5 V	2.159 mm	6.731 mm	Not Qualified	256 bit	4.5 V			35 ns
82S115/BJA	NXP Semiconductors	OTP ROM	MILITARY	24	DIP	RECTANGULAR	CERAMIC, GLASS-SEALED	NO	1	BIPOLAR		THROUGH-HOLE	PARALLEL	ASYNCHRONOUS		512 words	5		8	IN-LINE			2.54 mm	125 Cel	3-STATE	512X8	512	-55 Cel		DUAL	R-GDIP-T24	5.5 V	5.715 mm	15.24 mm	Not Qualified	4096 bit	4.5 V			90 ns
7801601KX	NXP Semiconductors	OTP ROM	MILITARY	24	DFP	RECTANGULAR	CERAMIC, METAL-SEALED COFIRED	YES	1	CMOS		FLAT	PARALLEL	ASYNCHRONOUS		512 words	5		8	FLATPACK				125 Cel		512X8	512	-55 Cel		DUAL	R-CDFP-F24	5.5 V			Not Qualified	4096 bit	4.5 V			90 ns
82S115/BKA	NXP Semiconductors	OTP ROM	MILITARY	24	DFP	RECTANGULAR	CERAMIC, METAL-SEALED COFIRED	YES	1	BIPOLAR		FLAT	PARALLEL	ASYNCHRONOUS		512 words	5		8	FLATPACK			1.27 mm	125 Cel	3-STATE	512X8	512	-55 Cel		DUAL	R-CDFP-F24	5.5 V	2.286 mm	9.144 mm	Not Qualified	4096 bit	4.5 V			90 ns
8200902JX	NXP Semiconductors	OTP ROM	MILITARY	24	DIP	RECTANGULAR	CERAMIC, GLASS-SEALED	NO	1	BIPOLAR		THROUGH-HOLE	PARALLEL	ASYNCHRONOUS		8192 words	5		8	IN-LINE			2.54 mm	125 Cel		8KX8	8K	-55 Cel		DUAL	R-GDIP-T24	5.5 V	5.715 mm	15.24 mm		65536 bit	4.5 V		32.0675 mm	55 ns
82S185/BYA	NXP Semiconductors	OTP ROM	MILITARY	18	DFP	RECTANGULAR	CERAMIC, METAL-SEALED COFIRED	YES	1	BIPOLAR		FLAT	PARALLEL	ASYNCHRONOUS		2048 words	5		4	FLATPACK				125 Cel	3-STATE	2KX4	2K	-55 Cel		DUAL	R-CDFP-F18	5.5 V			Not Qualified	8192 bit	4.5 V			115 ns

OTP ROM

OTP ROM, or One-Time Programmable Read-Only Memory, is a type of non-volatile computer memory that is programmed once and cannot be reprogrammed. OTP ROM is used to store data that needs to be permanently stored and cannot be changed or updated in the future.

OTP ROM is created using a process similar to that used to manufacture Mask ROM. However, instead of programming the memory during the manufacturing process, OTP ROM is programmed after the manufacturing process, but before it is delivered to the customer. This allows the customer to program the memory with the data that they need to store permanently.

OTP ROM is commonly used in devices such as microcontrollers, smart cards, and other electronic devices that require permanent storage of data. It is ideal for storing critical data, such as system settings, encryption keys, and other sensitive information that needs to be permanently stored and cannot be changed or updated in the future.