Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Refresh Cycles | Package Shape | Total Dose (V) | Package Body Material | Surface Mount | No. of Functions | Technology | Screening Level | Nominal Negative Supply Voltage | Terminal Form | Parallel or Serial | Operating Mode | Maximum Supply Current | No. of Words | Self Refresh | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Standby Voltage | Minimum Operating Temperature | Terminal Finish | Terminal Position | No. of Ports | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Maximum Clock Frequency (fCLK) | Width | Qualification | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Output Enable | Maximum Standby Current | Length | Maximum Access Time |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Infineon Technologies |
STANDARD SRAM |
INDUSTRIAL |
119 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
275 mA |
1048576 words |
COMMON |
2.5/3.3,3.3 |
18 |
GRID ARRAY |
BGA119,7X17,50 |
SRAMs |
1.27 mm |
85 Cel |
3-STATE |
1MX18 |
1M |
3.14 V |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B119 |
3 |
167 MHz |
Not Qualified |
18874368 bit |
e1 |
20 |
260 |
.07 Amp |
3.4 ns |
||||||||||||||||||
Infineon Technologies |
ZBT SRAM |
COMMERCIAL |
119 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
2097152 words |
COMMON |
1.8/2.5,2.5 |
36 |
GRID ARRAY |
BGA119,7X17,50 |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
2MX36 |
2M |
2.38 V |
0 Cel |
BOTTOM |
R-PBGA-B119 |
300 MHz |
Not Qualified |
75497472 bit |
2.2 ns |
||||||||||||||||||||||||||
Infineon Technologies |
STANDARD SRAM |
COMMERCIAL |
119 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
310 mA |
1048576 words |
COMMON |
2.5/3.3,3.3 |
18 |
GRID ARRAY |
BGA119,7X17,50 |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
1MX18 |
1M |
3.14 V |
0 Cel |
Tin/Lead (Sn/Pb) |
BOTTOM |
R-PBGA-B119 |
133 MHz |
Not Qualified |
18874368 bit |
e0 |
.015 Amp |
4.2 ns |
||||||||||||||||||||||
|
Infineon Technologies |
ZBT SRAM |
INDUSTRIAL |
119 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
250 mA |
524288 words |
COMMON |
3.3 |
2.5/3.3,3.3 |
18 |
GRID ARRAY |
BGA119,7X17,50 |
SRAMs |
1.27 mm |
85 Cel |
3-STATE |
512KX18 |
512K |
3.14 V |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B119 |
3 |
3.6 V |
2.4 mm |
250 MHz |
14 mm |
Not Qualified |
9437184 bit |
3.135 V |
PIPELINED ARCHITECTURE |
e1 |
20 |
260 |
.04 Amp |
22 mm |
2.8 ns |
||||||||||
Infineon Technologies |
STANDARD SRAM |
COMMERCIAL |
119 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
275 mA |
524288 words |
COMMON |
2.5/3.3,3.3 |
36 |
GRID ARRAY |
BGA119,7X17,50 |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
512KX36 |
512K |
3.14 V |
0 Cel |
BOTTOM |
R-PBGA-B119 |
167 MHz |
Not Qualified |
18874368 bit |
.07 Amp |
3.4 ns |
||||||||||||||||||||||||
Infineon Technologies |
STANDARD SRAM |
COMMERCIAL |
119 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
350 mA |
524288 words |
COMMON |
2.5/3.3,3.3 |
36 |
GRID ARRAY |
BGA119,7X17,50 |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
512KX36 |
512K |
3.14 V |
0 Cel |
BOTTOM |
R-PBGA-B119 |
250 MHz |
Not Qualified |
18874368 bit |
.07 Amp |
2.6 ns |
||||||||||||||||||||||||
|
Infineon Technologies |
STANDARD SRAM |
INDUSTRIAL |
119 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
350 mA |
1048576 words |
COMMON |
2.5/3.3,3.3 |
18 |
GRID ARRAY |
BGA119,7X17,50 |
SRAMs |
1.27 mm |
85 Cel |
3-STATE |
1MX18 |
1M |
3.14 V |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B119 |
3 |
250 MHz |
Not Qualified |
18874368 bit |
e1 |
20 |
260 |
.07 Amp |
3.4 ns |
||||||||||||||||||
Infineon Technologies |
STANDARD SRAM |
COMMERCIAL |
119 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
280 mA |
1048576 words |
COMMON |
2.5/3.3,3.3 |
18 |
GRID ARRAY |
BGA119,7X17,50 |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
1MX18 |
1M |
3.14 V |
0 Cel |
Tin/Lead (Sn/Pb) |
BOTTOM |
R-PBGA-B119 |
150 MHz |
Not Qualified |
18874368 bit |
e0 |
.015 Amp |
3.8 ns |
||||||||||||||||||||||
|
Infineon Technologies |
STANDARD SRAM |
119 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
175 mA |
262144 words |
COMMON |
3.3 |
24 |
GRID ARRAY |
BGA119,7X17,50 |
1.27 mm |
85 Cel |
3-STATE |
256KX24 |
256K |
2 V |
-40 Cel |
BOTTOM |
1 |
R-PBGA-B119 |
3.6 V |
2.4 mm |
14 mm |
6291456 bit |
3 V |
YES |
.025 Amp |
22 mm |
10 ns |
|||||||||||||||||||
|
Infineon Technologies |
STANDARD SRAM |
119 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
175 mA |
131072 words |
COMMON |
3.3 |
24 |
GRID ARRAY |
BGA119,7X17,50 |
1.27 mm |
85 Cel |
3-STATE |
128KX24 |
128K |
2 V |
-40 Cel |
BOTTOM |
1 |
R-PBGA-B119 |
3.6 V |
2.4 mm |
14 mm |
3145728 bit |
3 V |
YES |
.025 Amp |
22 mm |
10 ns |
|||||||||||||||||||
|
Infineon Technologies |
STANDARD SRAM |
INDUSTRIAL |
119 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
524288 words |
3 |
32 |
GRID ARRAY |
1.27 mm |
85 Cel |
512KX32 |
512K |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B119 |
3 |
3.6 V |
2.4 mm |
14 mm |
16777216 bit |
2.2 V |
e1 |
260 |
22 mm |
10 ns |
||||||||||||||||||||||
|
Infineon Technologies |
STANDARD SRAM |
COMMERCIAL |
119 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
350 mA |
1048576 words |
COMMON |
2.5/3.3,3.3 |
18 |
GRID ARRAY |
BGA119,7X17,50 |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
1MX18 |
1M |
3.14 V |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B119 |
3 |
250 MHz |
Not Qualified |
18874368 bit |
e1 |
20 |
260 |
.07 Amp |
3.4 ns |
||||||||||||||||||
|
Infineon Technologies |
STANDARD SRAM |
INDUSTRIAL |
119 |
HBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
32 mA |
524288 words |
COMMON |
1.8 |
32 |
GRID ARRAY, HEAT SINK/SLUG |
BGA119,7X17,50 |
1.27 mm |
85 Cel |
3-STATE |
512KX32 |
512K |
1 V |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1 |
R-PBGA-B119 |
3 |
2.2 V |
2.4 mm |
14 mm |
16777216 bit |
1.65 V |
e1 |
260 |
YES |
.000026 Amp |
22 mm |
55 ns |
||||||||||||||
Infineon Technologies |
CACHE SRAM |
INDUSTRIAL |
119 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
250 mA |
262144 words |
COMMON |
3.3 |
2.5/3.3,3.3 |
36 |
GRID ARRAY |
BGA119,7X17,50 |
SRAMs |
1.27 mm |
85 Cel |
3-STATE |
256KX36 |
256K |
3.14 V |
-40 Cel |
TIN LEAD |
BOTTOM |
R-PBGA-B119 |
3 |
3.6 V |
2.4 mm |
133 MHz |
14 mm |
Not Qualified |
9437184 bit |
3.135 V |
FLOW THROUGH ARCHITECTURE |
e0 |
.04 Amp |
22 mm |
6.5 ns |
|||||||||||||
Renesas Electronics |
ZBT SRAM |
COMMERCIAL |
119 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
524288 words |
2.5 |
36 |
GRID ARRAY |
1.27 mm |
70 Cel |
512KX36 |
512K |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B119 |
2.625 V |
2.35 mm |
14 mm |
Not Qualified |
18874368 bit |
2.375 V |
PIPELINED ARCHITECTURE; CAN ALSO OPERATE AT 3.3V SUPPLY |
e1 |
22 mm |
3 ns |
|||||||||||||||||||||||
Renesas Electronics |
ZBT SRAM |
COMMERCIAL |
119 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
524288 words |
2.5 |
18 |
GRID ARRAY |
1.27 mm |
70 Cel |
512KX18 |
512K |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B119 |
2.625 V |
2.35 mm |
14 mm |
Not Qualified |
9437184 bit |
2.375 V |
FLOW-THROUGH ARCHITECTURE; CAN ALSO OPERATE AT 3.3V SUPPLY |
e1 |
22 mm |
6.5 ns |
|||||||||||||||||||||||
Renesas Electronics |
ZBT SRAM |
COMMERCIAL |
119 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
1048576 words |
2.5 |
18 |
GRID ARRAY |
1.27 mm |
70 Cel |
1MX18 |
1M |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B119 |
2.625 V |
2.35 mm |
14 mm |
Not Qualified |
18874368 bit |
2.375 V |
PIPELINED ARCHITECTURE; CAN ALSO OPERATE AT 3.3V SUPPLY |
e1 |
22 mm |
3 ns |
|||||||||||||||||||||||
Renesas Electronics |
ZBT SRAM |
COMMERCIAL |
119 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
524288 words |
2.5 |
18 |
GRID ARRAY |
1.27 mm |
70 Cel |
512KX18 |
512K |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B119 |
2.625 V |
2.35 mm |
14 mm |
Not Qualified |
9437184 bit |
2.375 V |
FLOW-THROUGH ARCHITECTURE; CAN ALSO OPERATE AT 3.3V SUPPLY |
e1 |
22 mm |
8.5 ns |
|||||||||||||||||||||||
Renesas Electronics |
LATE-WRITE SRAM |
OTHER |
119 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
450 mA |
524288 words |
COMMON |
2.5 |
1.5,2.5 |
36 |
GRID ARRAY |
BGA119,7X17,50 |
SRAMs |
1.27 mm |
85 Cel |
3-STATE |
512KX36 |
512K |
2.38 V |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B119 |
2.63 V |
2.24 mm |
357 MHz |
14 mm |
Not Qualified |
18874368 bit |
2.38 V |
e1 |
.15 Amp |
22 mm |
1.6 ns |
|||||||||||||||
Renesas Electronics |
STANDARD SRAM |
COMMERCIAL |
119 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
32768 words |
3.3 |
36 |
GRID ARRAY |
1.27 mm |
70 Cel |
32KX36 |
32K |
0 Cel |
TIN LEAD |
BOTTOM |
R-PBGA-B119 |
3.465 V |
2.1 mm |
14 mm |
Not Qualified |
1179648 bit |
3.2 V |
e0 |
22 mm |
3.5 ns |
||||||||||||||||||||||||
Renesas Electronics |
STANDARD SRAM |
COMMERCIAL |
119 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
262144 words |
3.3 |
18 |
GRID ARRAY |
1.27 mm |
70 Cel |
256KX18 |
256K |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B119 |
3.465 V |
2.1 mm |
14 mm |
Not Qualified |
4718592 bit |
3.135 V |
e1 |
22 mm |
6 ns |
||||||||||||||||||||||||
Renesas Electronics |
ZBT SRAM |
COMMERCIAL |
119 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
262144 words |
2.5 |
36 |
GRID ARRAY |
1.27 mm |
70 Cel |
256KX36 |
256K |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B119 |
2.625 V |
2.35 mm |
14 mm |
Not Qualified |
9437184 bit |
2.375 V |
PIPELINED ARCHITECTURE |
e1 |
22 mm |
3.5 ns |
|||||||||||||||||||||||
Renesas Electronics |
ZBT SRAM |
COMMERCIAL |
119 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
262144 words |
2.5 |
36 |
GRID ARRAY |
1.27 mm |
70 Cel |
256KX36 |
256K |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B119 |
2.625 V |
2.35 mm |
14 mm |
Not Qualified |
9437184 bit |
2.375 V |
FLOW-THROUGH ARCHITECTURE; CAN ALSO OPERATE AT 3.3V SUPPLY |
e1 |
22 mm |
7.5 ns |
|||||||||||||||||||||||
Renesas Electronics |
ZBT SRAM |
COMMERCIAL |
119 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
524288 words |
2.5 |
36 |
GRID ARRAY |
1.27 mm |
70 Cel |
512KX36 |
512K |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B119 |
2.625 V |
2.35 mm |
14 mm |
Not Qualified |
18874368 bit |
2.375 V |
PIPELINED ARCHITECTURE; CAN ALSO OPERATE AT 3.3V SUPPLY |
e1 |
22 mm |
3.5 ns |
|||||||||||||||||||||||
Renesas Electronics |
ZBT SRAM |
COMMERCIAL |
119 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
1048576 words |
2.5 |
18 |
GRID ARRAY |
1.27 mm |
70 Cel |
1MX18 |
1M |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B119 |
2.625 V |
2.35 mm |
14 mm |
Not Qualified |
18874368 bit |
2.375 V |
PIPELINED ARCHITECTURE; CAN ALSO OPERATE AT 3.3V SUPPLY |
e1 |
22 mm |
3.5 ns |
|||||||||||||||||||||||
Renesas Electronics |
ZBT SRAM |
COMMERCIAL |
119 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
1048576 words |
2.5 |
18 |
GRID ARRAY |
1.27 mm |
70 Cel |
1MX18 |
1M |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B119 |
2.625 V |
2.35 mm |
14 mm |
Not Qualified |
18874368 bit |
2.375 V |
FLOW-THROUGH ARCHITECTURE; CAN ALSO OPERATE AT 3.3V SUPPLY |
e1 |
22 mm |
7.5 ns |
|||||||||||||||||||||||
Renesas Electronics |
ZBT SRAM |
COMMERCIAL |
119 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
524288 words |
2.5 |
36 |
GRID ARRAY |
1.27 mm |
70 Cel |
512KX36 |
512K |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B119 |
2.625 V |
2.35 mm |
14 mm |
Not Qualified |
18874368 bit |
2.375 V |
FLOW-THROUGH ARCHITECTURE; CAN ALSO OPERATE AT 3.3V SUPPLY |
e1 |
22 mm |
7.5 ns |
|||||||||||||||||||||||
|
Renesas Electronics |
LATE-WRITE SRAM |
OTHER |
119 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
450 mA |
524288 words |
COMMON |
2.5 |
1.5,2.5 |
36 |
GRID ARRAY |
BGA119,7X17,50 |
SRAMs |
1.27 mm |
85 Cel |
3-STATE |
512KX36 |
512K |
2.38 V |
0 Cel |
BOTTOM |
R-PBGA-B119 |
3 |
2.63 V |
2.24 mm |
303 MHz |
14 mm |
Not Qualified |
18874368 bit |
2.38 V |
20 |
260 |
.15 Amp |
22 mm |
1.6 ns |
|||||||||||||
Renesas Electronics |
ZBT SRAM |
COMMERCIAL |
119 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
262144 words |
2.5 |
36 |
GRID ARRAY |
1.27 mm |
70 Cel |
256KX36 |
256K |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B119 |
2.625 V |
2.35 mm |
14 mm |
Not Qualified |
9437184 bit |
2.375 V |
PIPELINED ARCHITECTURE |
e1 |
22 mm |
3 ns |
|||||||||||||||||||||||
Renesas Electronics |
STANDARD SRAM |
COMMERCIAL |
119 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
32768 words |
3.3 |
36 |
GRID ARRAY |
1.27 mm |
70 Cel |
32KX36 |
32K |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B119 |
3.465 V |
2.1 mm |
14 mm |
Not Qualified |
1179648 bit |
3.2 V |
e1 |
22 mm |
4 ns |
||||||||||||||||||||||||
Renesas Electronics |
ZBT SRAM |
COMMERCIAL |
119 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
262144 words |
2.5 |
36 |
GRID ARRAY |
1.27 mm |
70 Cel |
256KX36 |
256K |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B119 |
2.625 V |
2.35 mm |
14 mm |
Not Qualified |
9437184 bit |
2.375 V |
PIPELINED ARCHITECTURE |
e1 |
22 mm |
2.6 ns |
|||||||||||||||||||||||
Renesas Electronics |
LATE-WRITE SRAM |
OTHER |
119 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
350 mA |
524288 words |
COMMON |
2.5 |
1.5,2.5 |
36 |
GRID ARRAY |
BGA119,7X17,50 |
SRAMs |
1.27 mm |
85 Cel |
3-STATE |
512KX36 |
512K |
2.38 V |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B119 |
2.63 V |
2.24 mm |
153 MHz |
14 mm |
Not Qualified |
18874368 bit |
2.38 V |
e1 |
.15 Amp |
22 mm |
5.5 ns |
|||||||||||||||
Renesas Electronics |
ZBT SRAM |
COMMERCIAL |
119 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
524288 words |
2.5 |
36 |
GRID ARRAY |
1.27 mm |
70 Cel |
512KX36 |
512K |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B119 |
2.625 V |
2.35 mm |
14 mm |
Not Qualified |
18874368 bit |
2.375 V |
FLOW-THROUGH ARCHITECTURE; CAN ALSO OPERATE AT 3.3V SUPPLY |
e1 |
22 mm |
6.5 ns |
|||||||||||||||||||||||
Renesas Electronics |
ZBT SRAM |
COMMERCIAL |
119 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
1048576 words |
2.5 |
18 |
GRID ARRAY |
1.27 mm |
70 Cel |
1MX18 |
1M |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B119 |
2.625 V |
2.35 mm |
14 mm |
Not Qualified |
18874368 bit |
2.375 V |
FLOW-THROUGH ARCHITECTURE; CAN ALSO OPERATE AT 3.3V SUPPLY |
e1 |
22 mm |
6.5 ns |
|||||||||||||||||||||||
Renesas Electronics |
ZBT SRAM |
COMMERCIAL |
119 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
262144 words |
2.5 |
36 |
GRID ARRAY |
1.27 mm |
70 Cel |
256KX36 |
256K |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B119 |
2.625 V |
2.35 mm |
14 mm |
Not Qualified |
9437184 bit |
2.375 V |
FLOW-THROUGH ARCHITECTURE; CAN ALSO OPERATE AT 3.3V SUPPLY |
e1 |
22 mm |
8.5 ns |
|||||||||||||||||||||||
Renesas Electronics |
STANDARD SRAM |
COMMERCIAL |
119 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
131072 words |
3.3 |
36 |
GRID ARRAY |
1.27 mm |
70 Cel |
128KX36 |
128K |
0 Cel |
TIN LEAD |
BOTTOM |
R-PBGA-B119 |
3.465 V |
2.35 mm |
14 mm |
Not Qualified |
4718592 bit |
3.135 V |
e0 |
22 mm |
7 ns |
||||||||||||||||||||||||
Renesas Electronics |
ZBT SRAM |
COMMERCIAL |
119 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
1048576 words |
2.5 |
18 |
GRID ARRAY |
1.27 mm |
70 Cel |
1MX18 |
1M |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B119 |
2.625 V |
2.35 mm |
14 mm |
Not Qualified |
18874368 bit |
2.375 V |
PIPELINED ARCHITECTURE; CAN ALSO OPERATE AT 3.3V SUPPLY |
e1 |
22 mm |
2.6 ns |
|||||||||||||||||||||||
Renesas Electronics |
ZBT SRAM |
COMMERCIAL |
119 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
262144 words |
2.5 |
36 |
GRID ARRAY |
1.27 mm |
70 Cel |
256KX36 |
256K |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B119 |
2.625 V |
2.35 mm |
14 mm |
Not Qualified |
9437184 bit |
2.375 V |
FLOW-THROUGH ARCHITECTURE; CAN ALSO OPERATE AT 3.3V SUPPLY |
e1 |
22 mm |
6.5 ns |
|||||||||||||||||||||||
Renesas Electronics |
STANDARD SRAM |
COMMERCIAL |
119 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
262144 words |
3.3 |
18 |
GRID ARRAY |
1.27 mm |
70 Cel |
256KX18 |
256K |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B119 |
3.465 V |
2.1 mm |
14 mm |
Not Qualified |
4718592 bit |
3.135 V |
e1 |
22 mm |
7.5 ns |
||||||||||||||||||||||||
Renesas Electronics |
STANDARD SRAM |
COMMERCIAL |
119 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
131072 words |
3.3 |
36 |
GRID ARRAY |
1.27 mm |
70 Cel |
128KX36 |
128K |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B119 |
3.465 V |
2.1 mm |
14 mm |
Not Qualified |
4718592 bit |
3.135 V |
e1 |
22 mm |
7.5 ns |
||||||||||||||||||||||||
Renesas Electronics |
ZBT SRAM |
COMMERCIAL |
119 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
524288 words |
2.5 |
18 |
GRID ARRAY |
1.27 mm |
70 Cel |
512KX18 |
512K |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B119 |
2.625 V |
2.35 mm |
14 mm |
Not Qualified |
9437184 bit |
2.375 V |
PIPELINED ARCHITECTURE |
e1 |
22 mm |
3 ns |
|||||||||||||||||||||||
Renesas Electronics |
ZBT SRAM |
COMMERCIAL |
119 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
524288 words |
2.5 |
18 |
GRID ARRAY |
1.27 mm |
70 Cel |
512KX18 |
512K |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B119 |
2.625 V |
2.35 mm |
14 mm |
Not Qualified |
9437184 bit |
2.375 V |
PIPELINED ARCHITECTURE |
e1 |
22 mm |
2.6 ns |
|||||||||||||||||||||||
Renesas Electronics |
ZBT SRAM |
COMMERCIAL |
119 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
1048576 words |
2.5 |
18 |
GRID ARRAY |
1.27 mm |
70 Cel |
1MX18 |
1M |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B119 |
2.625 V |
2.35 mm |
14 mm |
Not Qualified |
18874368 bit |
2.375 V |
FLOW-THROUGH ARCHITECTURE; CAN ALSO OPERATE AT 3.3V SUPPLY |
e1 |
22 mm |
8.5 ns |
|||||||||||||||||||||||
Renesas Electronics |
ZBT SRAM |
COMMERCIAL |
119 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
524288 words |
2.5 |
18 |
GRID ARRAY |
1.27 mm |
70 Cel |
512KX18 |
512K |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B119 |
2.625 V |
2.35 mm |
14 mm |
Not Qualified |
9437184 bit |
2.375 V |
PIPELINED ARCHITECTURE |
e1 |
22 mm |
3.5 ns |
|||||||||||||||||||||||
Renesas Electronics |
LATE-WRITE SRAM |
OTHER |
119 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
550 mA |
1048576 words |
COMMON |
2.5 |
1.5,2.5 |
36 |
GRID ARRAY |
BGA119,7X17,50 |
SRAMs |
1.27 mm |
85 Cel |
3-STATE |
1MX36 |
1M |
2.38 V |
0 Cel |
TIN LEAD |
BOTTOM |
R-PBGA-B119 |
2.63 V |
2.18 mm |
300 MHz |
14 mm |
Not Qualified |
37748736 bit |
2.38 V |
e0 |
240 |
.15 Amp |
22 mm |
1.6 ns |
||||||||||||||
Renesas Electronics |
STANDARD SRAM |
COMMERCIAL |
119 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
600 mA |
262144 words |
COMMON |
3.3 |
2.5/3.3,3.3 |
18 |
GRID ARRAY |
BGA119,7X17,50 |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
256KX18 |
256K |
3.14 V |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B119 |
3.465 V |
2.35 mm |
14 mm |
Not Qualified |
4718592 bit |
3.135 V |
e1 |
.1 Amp |
22 mm |
7 ns |
||||||||||||||||
Renesas Electronics |
STANDARD SRAM |
COMMERCIAL |
119 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
131072 words |
3.3 |
36 |
GRID ARRAY |
1.27 mm |
70 Cel |
128KX36 |
128K |
0 Cel |
TIN LEAD |
BOTTOM |
R-PBGA-B119 |
3.465 V |
2.1 mm |
14 mm |
Not Qualified |
4718592 bit |
3.135 V |
e0 |
22 mm |
6 ns |
||||||||||||||||||||||||
Renesas Electronics |
STANDARD SRAM |
COMMERCIAL |
119 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
32768 words |
3.3 |
36 |
GRID ARRAY |
1.27 mm |
70 Cel |
32KX36 |
32K |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B119 |
3.465 V |
2.1 mm |
14 mm |
Not Qualified |
1179648 bit |
3.2 V |
POWER DOWN OPTION; BYTE WRITE CONTROL |
e1 |
22 mm |
3 ns |
SRAM, or Static Random-Access Memory, is a type of volatile computer memory that stores data as a flip-flop, which retains the data as long as power is supplied to the system. SRAM is commonly used as cache memory and in other applications where high-speed access to data is required.
SRAM is a type of memory that is faster and more expensive than DRAM (Dynamic Random-Access Memory). It is commonly used as cache memory in computer systems and other digital devices to improve the speed of data access. SRAM is also used in applications where high-speed data processing is required, such as in networking equipment, video games, and other high-performance computing applications.
One of the advantages of using SRAM is that it provides faster access to data than other types of memory, such as DRAM. This is because SRAM does not need to be refreshed like DRAM, which makes it faster and more reliable. Additionally, SRAM uses less power than other types of memory, which makes it ideal for use in battery-powered devices.
One of the disadvantages of using SRAM is that it is more expensive and less dense than other types of memory, such as DRAM or flash memory. This means that it is not suitable for applications that require large amounts of memory at a low cost. Additionally, SRAM is volatile, which means that it cannot store data permanently.