144 SRAM 67

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Part RoHS Manufacturer Memory IC Type Temperature Grade No. of Terminals Package Code Refresh Cycles Package Shape Total Dose (V) Package Body Material Surface Mount No. of Functions Technology Screening Level Nominal Negative Supply Voltage Terminal Form Parallel or Serial Operating Mode Maximum Supply Current No. of Words Self Refresh Input/Output Type Nominal Supply Voltage / Vsup (V) Power Supplies (V) Memory Width Package Style (Meter) Package Equivalence Code Alternate Memory Width Sub-Category Terminal Pitch Maximum Operating Temperature Reverse Pinout Output Characteristics Organization No. of Words Code Minimum Standby Voltage Minimum Operating Temperature Terminal Finish Terminal Position No. of Ports JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Supply Voltage (Vsup) Maximum Seated Height Maximum Clock Frequency (fCLK) Width Qualification Memory Density Minimum Supply Voltage (Vsup) Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Output Enable Maximum Standby Current Length Maximum Access Time

MCM36F9DG10

NXP Semiconductors

SRAM MODULE

COMMERCIAL

144

RECTANGULAR

UNSPECIFIED

NO

1

BICMOS

NO LEAD

PARALLEL

SYNCHRONOUS

524288 words

3.3

36

MICROELECTRONIC ASSEMBLY

70 Cel

512KX36

512K

0 Cel

DUAL

R-XDMA-N144

3.6 V

Not Qualified

18874368 bit

3.135 V

FLOW-THROUGH ARCHITECTURE

10 ns

MCM36F8DG10

NXP Semiconductors

SRAM MODULE

COMMERCIAL

144

DIMM

RECTANGULAR

UNSPECIFIED

NO

1

BICMOS

NO LEAD

PARALLEL

SYNCHRONOUS

262144 words

3.3

36

MICROELECTRONIC ASSEMBLY

.8 mm

70 Cel

256KX36

256K

0 Cel

ZIG-ZAG

R-XZMA-N144

3.6 V

25.55 mm

3.8 mm

9437184 bit

3.135 V

WD-MAX

67.6 mm

10 ns

CY7C0831AV-167BBI

Infineon Technologies

MULTI-PORT SRAM

INDUSTRIAL

144

LBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

131072 words

3.3

18

GRID ARRAY, LOW PROFILE

1 mm

85 Cel

128KX18

128K

-40 Cel

TIN LEAD

BOTTOM

S-PBGA-B144

3.465 V

1.6 mm

13 mm

Not Qualified

2359296 bit

3.135 V

PIPELINED ARCHITECTURE

e0

13 mm

4 ns

7MPV6271S12M

Renesas Electronics

CACHE TAG SRAM MODULE

COMMERCIAL

144

DIMM

RECTANGULAR

PLASTIC/EPOXY

NO

CMOS

NO LEAD

PARALLEL

SYNCHRONOUS

500 mA

32768 words

COMMON

3.3

3.3

64

MICROELECTRONIC ASSEMBLY

DIMM144,32

SRAMs

.8 mm

70 Cel

3-STATE

32KX64

32K

3.14 V

0 Cel

DUAL

R-PDMA-N144

Not Qualified

262144 bit

.012 Amp

12 ns

70V525L55BZGI

Renesas Electronics

STANDARD SRAM

INDUSTRIAL

144

BGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

8192 words

3

16

GRID ARRAY

85 Cel

8KX16

8K

-40 Cel

MATTE TIN

BOTTOM

S-PBGA-B144

3.3 V

Not Qualified

131072 bit

2.7 V

e3

55 ns

70P5258L55BZGI

Renesas Electronics

STANDARD SRAM

INDUSTRIAL

144

BGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

8192 words

1.8

16

GRID ARRAY

85 Cel

8KX16

8K

-40 Cel

MATTE TIN

BOTTOM

S-PBGA-B144

1.9 V

Not Qualified

131072 bit

1.7 V

e3

55 ns

70V7319S133DD8

Renesas Electronics

APPLICATION SPECIFIC SRAM

COMMERCIAL

144

QFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

SYNCHRONOUS

645 mA

262144 words

COMMON

3.3

2.5/3.3,3.3

18

FLATPACK

QFP144,.87SQ,20

SRAMs

.5 mm

70 Cel

3-STATE

256KX18

256K

3.15 V

0 Cel

TIN LEAD

QUAD

2

S-PQFP-G144

3.45 V

133 MHz

Not Qualified

4718592 bit

3.15 V

FLOW-THROUGH OR PIPELINED ARCHITECTURE

e0

.00003 Amp

15 ns

70V7319S133DDI8

Renesas Electronics

APPLICATION SPECIFIC SRAM

INDUSTRIAL

144

QFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

SYNCHRONOUS

675 mA

262144 words

COMMON

3.3

2.5/3.3,3.3

18

FLATPACK

QFP144,.87SQ,20

SRAMs

.5 mm

85 Cel

3-STATE

256KX18

256K

3.15 V

-40 Cel

TIN LEAD

QUAD

2

S-PQFP-G144

3.45 V

133 MHz

Not Qualified

4718592 bit

3.15 V

FLOW-THROUGH OR PIPELINED ARCHITECTURE

e0

.00004 Amp

15 ns

70V7319S200DDI

Renesas Electronics

MULTI-PORT SRAM

INDUSTRIAL

144

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

SYNCHRONOUS

262144 words

3.3

18

FLATPACK, LOW PROFILE, FINE PITCH

.5 mm

85 Cel

256KX18

256K

-40 Cel

TIN LEAD

QUAD

S-PQFP-G144

4

3.45 V

1.6 mm

20 mm

Not Qualified

4718592 bit

3.15 V

FLOW-THROUGH OR PIPELINED ARCHITECTURE

e0

20 mm

10 ns

70P525L55BZGI

Renesas Electronics

STANDARD SRAM

INDUSTRIAL

144

BGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

8192 words

1.8

16

GRID ARRAY

85 Cel

8KX16

8K

-40 Cel

MATTE TIN

BOTTOM

S-PBGA-B144

1.9 V

Not Qualified

131072 bit

1.7 V

e3

55 ns

7MPV6271S15M

Renesas Electronics

CACHE TAG SRAM MODULE

COMMERCIAL

144

DIMM

RECTANGULAR

PLASTIC/EPOXY

NO

CMOS

NO LEAD

PARALLEL

SYNCHRONOUS

500 mA

32768 words

COMMON

3.3

3.3

64

MICROELECTRONIC ASSEMBLY

DIMM144,32

SRAMs

.8 mm

70 Cel

3-STATE

32KX64

32K

3.14 V

0 Cel

DUAL

R-PDMA-N144

Not Qualified

262144 bit

.012 Amp

15 ns

70V27L55BF

Renesas Electronics

APPLICATION SPECIFIC SRAM

COMMERCIAL

144

FBGA

SQUARE

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

ASYNCHRONOUS

180 mA

32768 words

COMMON

3.3

3.3

16

GRID ARRAY, FINE PITCH

BGA144,13X13,32

SRAMs

.8 mm

70 Cel

3-STATE

32KX16

32K

3 V

0 Cel

TIN LEAD

BOTTOM

2

S-PBGA-B144

3

Not Qualified

524288 bit

e0

.003 Amp

55 ns

IDT70P5258ML55BZ

Renesas Electronics

STANDARD SRAM

INDUSTRIAL

144

BGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

8192 words

1.8

16

GRID ARRAY

85 Cel

8KX16

8K

-40 Cel

TIN LEAD

BOTTOM

S-PBGA-B144

1.9 V

Not Qualified

131072 bit

1.7 V

e0

55 ns

UPD48288118AF1-E18-DW1-A

Renesas Electronics

DDR SRAM

144

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

16777216 words

1.8

18

GRID ARRAY, THIN PROFILE

1 mm

16MX18

16M

TIN BISMUTH

BOTTOM

R-PBGA-B144

1.9 V

1.2 mm

11 mm

301989888 bit

1.7 V

IT ALSO OPERATES AT 2.5V

e6

18.5 mm

IDT70V7399S133DDGI

Renesas Electronics

MULTI-PORT SRAM

INDUSTRIAL

144

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

SYNCHRONOUS

131072 words

3.3

18

FLATPACK, LOW PROFILE, FINE PITCH

.5 mm

85 Cel

128KX18

128K

-40 Cel

MATTE TIN

QUAD

S-PQFP-G144

3.45 V

1.6 mm

20 mm

Not Qualified

2359296 bit

3.15 V

FLOW-THROUGH OR PIPELINED ARCHITECTURE

e3

20 mm

15 ns

70V27S55BFG

Renesas Electronics

MULTI-PORT SRAM

COMMERCIAL

144

BGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

225 mA

32768 words

COMMON

3.3

3.3

16

GRID ARRAY

BGA144,13X13,32

SRAMs

.8 mm

70 Cel

3-STATE

32KX16

32K

3 V

0 Cel

MATTE TIN

BOTTOM

2

S-PBGA-B144

3.6 V

Not Qualified

524288 bit

3 V

e3

.006 Amp

55 ns

IDT70P525ML55BZ

Renesas Electronics

STANDARD SRAM

INDUSTRIAL

144

BGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

8192 words

1.8

16

GRID ARRAY

85 Cel

8KX16

8K

-40 Cel

TIN LEAD

BOTTOM

S-PBGA-B144

1.9 V

Not Qualified

131072 bit

1.7 V

e0

55 ns

IDT70V7399S166DDGI

Renesas Electronics

MULTI-PORT SRAM

INDUSTRIAL

144

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

SYNCHRONOUS

131072 words

3.3

18

FLATPACK, LOW PROFILE, FINE PITCH

.5 mm

85 Cel

128KX18

128K

-40 Cel

MATTE TIN

QUAD

S-PQFP-G144

3.45 V

1.6 mm

20 mm

Not Qualified

2359296 bit

3.15 V

FLOW-THROUGH OR PIPELINED ARCHITECTURE

e3

20 mm

12 ns

IDT70V525L55BZGI

Renesas Electronics

STANDARD SRAM

INDUSTRIAL

144

BGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

8192 words

3

16

GRID ARRAY

85 Cel

8KX16

8K

-40 Cel

MATTE TIN

BOTTOM

S-PBGA-B144

3.3 V

Not Qualified

131072 bit

2.7 V

e3

55 ns

70V27L55BFG8

Renesas Electronics

MULTI-PORT SRAM

COMMERCIAL

144

BGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

32768 words

3.3

16

GRID ARRAY

70 Cel

32KX16

32K

0 Cel

BOTTOM

S-PBGA-B144

3.6 V

524288 bit

3 V

55 ns

IDT70V27S55BFG

Renesas Electronics

MULTI-PORT SRAM

COMMERCIAL

144

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

225 mA

32768 words

COMMON

3.3

3.3

16

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA144,13X13,32

SRAMs

.8 mm

70 Cel

3-STATE

32KX16

32K

3 V

0 Cel

MATTE TIN

BOTTOM

2

S-PBGA-B144

3.6 V

1.5 mm

12 mm

Not Qualified

524288 bit

3 V

e3

.006 Amp

12 mm

55 ns

IDT70V525ML55BZ

Renesas Electronics

STANDARD SRAM

INDUSTRIAL

144

BGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

8192 words

3

16

GRID ARRAY

85 Cel

8KX16

8K

-40 Cel

TIN LEAD

BOTTOM

S-PBGA-B144

3.3 V

Not Qualified

131072 bit

2.7 V

e0

55 ns

IDT70V7399S166DDG

Renesas Electronics

MULTI-PORT SRAM

COMMERCIAL

144

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

SYNCHRONOUS

131072 words

3.3

18

FLATPACK, LOW PROFILE, FINE PITCH

.5 mm

70 Cel

128KX18

128K

0 Cel

MATTE TIN

QUAD

S-PQFP-G144

3.45 V

1.6 mm

20 mm

Not Qualified

2359296 bit

3.15 V

FLOW-THROUGH OR PIPELINED ARCHITECTURE

e3

20 mm

12 ns

UPD48288218AF1-E24-DW1-A

Renesas Electronics

DDR SRAM

144

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

16777216 words

1.8

18

GRID ARRAY, THIN PROFILE

1 mm

16MX18

16M

TIN BISMUTH

BOTTOM

R-PBGA-B144

1.9 V

1.2 mm

11 mm

301989888 bit

1.7 V

TERM PITCH-MAX

e6

18.5 mm

UPD48288118AF1-E24-DW1-A

Renesas Electronics

DDR SRAM

144

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

16777216 words

1.8

18

GRID ARRAY, THIN PROFILE

1 mm

16MX18

16M

TIN BISMUTH

BOTTOM

R-PBGA-B144

1.9 V

1.2 mm

11 mm

301989888 bit

1.7 V

IT ALSO OPERATES AT 2.5V

e6

18.5 mm

IDT70V27L55BF

Renesas Electronics

MULTI-PORT SRAM

COMMERCIAL

144

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

180 mA

32768 words

COMMON

3.3

3.3

16

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA144,13X13,32

SRAMs

.8 mm

70 Cel

3-STATE

32KX16

32K

3 V

0 Cel

TIN LEAD

BOTTOM

2

S-PBGA-B144

3

3.6 V

1.5 mm

12 mm

Not Qualified

524288 bit

3 V

CONFIGURED AS 32K X 16

e0

.003 Amp

12 mm

55 ns

UPD48288236AF1-E18-DW1-A

Renesas Electronics

DDR SRAM

144

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

8388608 words

1.8

36

GRID ARRAY, THIN PROFILE

1 mm

8MX36

8M

TIN BISMUTH

BOTTOM

R-PBGA-B144

1.9 V

1.2 mm

11 mm

301989888 bit

1.7 V

TERM PITCH-MAX

e6

18.5 mm

IDT70P5258L55BZGI

Renesas Electronics

STANDARD SRAM

INDUSTRIAL

144

BGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

8192 words

1.8

16

GRID ARRAY

85 Cel

8KX16

8K

-40 Cel

MATTE TIN

BOTTOM

S-PBGA-B144

1.9 V

Not Qualified

131072 bit

1.7 V

e3

55 ns

UPD48288236AF1-E24-DW1-A

Renesas Electronics

DDR SRAM

144

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

8388608 words

1.8

36

GRID ARRAY, THIN PROFILE

1 mm

8MX36

8M

TIN BISMUTH

BOTTOM

R-PBGA-B144

1.9 V

1.2 mm

11 mm

301989888 bit

1.7 V

TERM PITCH-MAX

e6

18.5 mm

70V27S55BF

Renesas Electronics

APPLICATION SPECIFIC SRAM

COMMERCIAL

144

FBGA

SQUARE

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

ASYNCHRONOUS

225 mA

32768 words

COMMON

3.3

3.3

16

GRID ARRAY, FINE PITCH

BGA144,13X13,32

SRAMs

.8 mm

70 Cel

3-STATE

32KX16

32K

3 V

0 Cel

TIN LEAD

BOTTOM

2

S-PBGA-B144

3

Not Qualified

524288 bit

e0

.006 Amp

55 ns

IDT70V7399S133DDG

Renesas Electronics

MULTI-PORT SRAM

COMMERCIAL

144

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

SYNCHRONOUS

131072 words

3.3

18

FLATPACK, LOW PROFILE, FINE PITCH

.5 mm

70 Cel

128KX18

128K

0 Cel

MATTE TIN

QUAD

S-PQFP-G144

3.45 V

1.6 mm

20 mm

Not Qualified

2359296 bit

3.15 V

FLOW-THROUGH OR PIPELINED ARCHITECTURE

e3

20 mm

15 ns

IDT70V27S55BF

Renesas Electronics

MULTI-PORT SRAM

COMMERCIAL

144

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

225 mA

32768 words

COMMON

3.3

3.3

16

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA144,13X13,32

SRAMs

.8 mm

70 Cel

3-STATE

32KX16

32K

3 V

0 Cel

TIN LEAD

BOTTOM

2

S-PBGA-B144

3

3.6 V

1.5 mm

12 mm

Not Qualified

524288 bit

3 V

CONFIGURED AS 32K X 16

e0

.006 Amp

12 mm

55 ns

UPD48288218AF1-E18-DW1-A

Renesas Electronics

DDR SRAM

144

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

16777216 words

1.8

18

GRID ARRAY, THIN PROFILE

1 mm

16MX18

16M

TIN BISMUTH

BOTTOM

R-PBGA-B144

1.9 V

1.2 mm

11 mm

301989888 bit

1.7 V

TERM PITCH-MAX

e6

18.5 mm

UPD48288209AF1-E24-DW1-A

Renesas Electronics

DDR SRAM

144

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

33554432 words

1.8

9

GRID ARRAY, THIN PROFILE

1 mm

32MX9

32M

TIN BISMUTH

BOTTOM

R-PBGA-B144

1.9 V

1.2 mm

11 mm

301989888 bit

1.7 V

TERM PITCH-MAX

e6

18.5 mm

IDT7MPV6271S15M

Renesas Electronics

CACHE TAG SRAM MODULE

COMMERCIAL

144

DIMM

RECTANGULAR

UNSPECIFIED

NO

1

CMOS

NO LEAD

PARALLEL

SYNCHRONOUS

500 mA

32768 words

COMMON

3.3

3.3

64

MICROELECTRONIC ASSEMBLY

DIMM144,32

SRAMs

.8 mm

70 Cel

3-STATE

32KX64

32K

3.14 V

0 Cel

TIN LEAD

ZIG-ZAG

1

R-XZMA-N144

3.6 V

Not Qualified

2097152 bit

3.15 V

8K X 8 CACHE TAG

e0

YES

.012 Amp

7 ns

IDT70V7319S200DDG

Renesas Electronics

MULTI-PORT SRAM

COMMERCIAL

144

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

SYNCHRONOUS

262144 words

3.3

18

FLATPACK, LOW PROFILE, FINE PITCH

.5 mm

70 Cel

256KX18

256K

0 Cel

MATTE TIN

QUAD

S-PQFP-G144

3.45 V

1.6 mm

20 mm

Not Qualified

4718592 bit

3.15 V

FLOW-THROUGH OR PIPELINED ARCHITECTURE

e3

20 mm

10 ns

IDT70V7339S200DDG

Renesas Electronics

MULTI-PORT SRAM

COMMERCIAL

144

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

SYNCHRONOUS

524288 words

3.3

18

FLATPACK, LOW PROFILE, FINE PITCH

.5 mm

70 Cel

512KX18

512K

0 Cel

MATTE TIN

QUAD

S-PQFP-G144

3.45 V

1.6 mm

20 mm

Not Qualified

9437184 bit

3.15 V

FLOW-THROUGH OR PIPELINED ARCHITECTURE

e3

20 mm

10 ns

70V27L15BFG8

Renesas Electronics

MULTI-PORT SRAM

COMMERCIAL

144

BGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

32768 words

3.3

16

GRID ARRAY

70 Cel

32KX16

32K

0 Cel

BOTTOM

S-PBGA-B144

3.6 V

524288 bit

3 V

15 ns

IDT70V27L55BFG

Renesas Electronics

MULTI-PORT SRAM

COMMERCIAL

144

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

180 mA

32768 words

COMMON

3.3

3.3

16

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA144,13X13,32

SRAMs

.8 mm

70 Cel

3-STATE

32KX16

32K

3 V

0 Cel

MATTE TIN

BOTTOM

2

S-PBGA-B144

3.6 V

1.5 mm

12 mm

Not Qualified

524288 bit

3 V

e3

.003 Amp

12 mm

55 ns

IDT70V7399S200DD

Renesas Electronics

MULTI-PORT SRAM

COMMERCIAL

144

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

SYNCHRONOUS

131072 words

3.3

18

FLATPACK, LOW PROFILE, FINE PITCH

.5 mm

70 Cel

128KX18

128K

0 Cel

TIN LEAD

QUAD

S-PQFP-G144

4

3.45 V

1.6 mm

20 mm

Not Qualified

2359296 bit

3.15 V

FLOW-THROUGH OR PIPELINED ARCHITECTURE

e0

20 mm

10 ns

IDT70P525L55BZGI

Renesas Electronics

STANDARD SRAM

INDUSTRIAL

144

BGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

8192 words

1.8

16

GRID ARRAY

85 Cel

8KX16

8K

-40 Cel

MATTE TIN

BOTTOM

S-PBGA-B144

1.9 V

Not Qualified

131072 bit

1.7 V

e3

55 ns

IDT7MPV6271S12M

Renesas Electronics

CACHE TAG SRAM MODULE

COMMERCIAL

144

DIMM

RECTANGULAR

UNSPECIFIED

NO

1

CMOS

NO LEAD

PARALLEL

SYNCHRONOUS

500 mA

32768 words

COMMON

3.3

3.3

64

MICROELECTRONIC ASSEMBLY

DIMM144,32

SRAMs

.8 mm

70 Cel

3-STATE

32KX64

32K

3.14 V

0 Cel

TIN LEAD

ZIG-ZAG

1

R-XZMA-N144

3.6 V

Not Qualified

2097152 bit

3.15 V

8K X 8 CACHE TAG

e0

YES

.012 Amp

7 ns

70V27L55BFG

Renesas Electronics

MULTI-PORT SRAM

COMMERCIAL

144

BGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

180 mA

32768 words

COMMON

3.3

3.3

16

GRID ARRAY

BGA144,13X13,32

SRAMs

.8 mm

70 Cel

3-STATE

32KX16

32K

3 V

0 Cel

MATTE TIN

BOTTOM

2

S-PBGA-B144

3.6 V

Not Qualified

524288 bit

3 V

e3

.003 Amp

55 ns

70V27S55BFG8

Renesas Electronics

MULTI-PORT SRAM

COMMERCIAL

144

BGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

32768 words

3.3

16

GRID ARRAY

70 Cel

32KX16

32K

0 Cel

MATTE TIN

BOTTOM

S-PBGA-B144

3.6 V

524288 bit

3 V

e3

55 ns

KMM965G115P-G7

Samsung

SRAM MODULE

COMMERCIAL

144

RECTANGULAR

UNSPECIFIED

NO

1

CMOS

NO LEAD

PARALLEL

SYNCHRONOUS

1048576 words

3.3

64

MICROELECTRONIC ASSEMBLY

70 Cel

1MX64

1M

0 Cel

DUAL

R-XDMA-N144

3.6 V

Not Qualified

67108864 bit

3 V

5.5 ns

KMM966G115Q-G8

Samsung

SRAM MODULE

COMMERCIAL

144

RECTANGULAR

UNSPECIFIED

NO

1

CMOS

NO LEAD

PARALLEL

SYNCHRONOUS

1048576 words

3.3

64

MICROELECTRONIC ASSEMBLY

70 Cel

1MX64

1M

0 Cel

DUAL

R-XDMA-N144

3.6 V

Not Qualified

67108864 bit

3 V

6 ns

KMM966G225Q-G8

Samsung

SRAM MODULE

COMMERCIAL

144

RECTANGULAR

UNSPECIFIED

NO

1

CMOS

NO LEAD

PARALLEL

SYNCHRONOUS

2097152 words

3.3

64

MICROELECTRONIC ASSEMBLY

70 Cel

2MX64

2M

0 Cel

DUAL

R-XDMA-N144

3.6 V

Not Qualified

134217728 bit

3 V

6 ns

KMM966G225Q-G7

Samsung

SRAM MODULE

COMMERCIAL

144

RECTANGULAR

UNSPECIFIED

NO

1

CMOS

NO LEAD

PARALLEL

SYNCHRONOUS

2097152 words

3.3

64

MICROELECTRONIC ASSEMBLY

70 Cel

2MX64

2M

0 Cel

DUAL

R-XDMA-N144

3.6 V

Not Qualified

134217728 bit

3 V

5.5 ns

SRAM

SRAM, or Static Random-Access Memory, is a type of volatile computer memory that stores data as a flip-flop, which retains the data as long as power is supplied to the system. SRAM is commonly used as cache memory and in other applications where high-speed access to data is required.

SRAM is a type of memory that is faster and more expensive than DRAM (Dynamic Random-Access Memory). It is commonly used as cache memory in computer systems and other digital devices to improve the speed of data access. SRAM is also used in applications where high-speed data processing is required, such as in networking equipment, video games, and other high-performance computing applications.

One of the advantages of using SRAM is that it provides faster access to data than other types of memory, such as DRAM. This is because SRAM does not need to be refreshed like DRAM, which makes it faster and more reliable. Additionally, SRAM uses less power than other types of memory, which makes it ideal for use in battery-powered devices.

One of the disadvantages of using SRAM is that it is more expensive and less dense than other types of memory, such as DRAM or flash memory. This means that it is not suitable for applications that require large amounts of memory at a low cost. Additionally, SRAM is volatile, which means that it cannot store data permanently.