Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Refresh Cycles | Package Shape | Total Dose (V) | Package Body Material | Surface Mount | No. of Functions | Technology | Screening Level | Nominal Negative Supply Voltage | Terminal Form | Parallel or Serial | Operating Mode | Maximum Supply Current | No. of Words | Self Refresh | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Standby Voltage | Minimum Operating Temperature | Terminal Finish | Terminal Position | No. of Ports | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Maximum Clock Frequency (fCLK) | Width | Qualification | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Output Enable | Maximum Standby Current | Length | Maximum Access Time |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
NXP Semiconductors |
SRAM MODULE |
COMMERCIAL |
144 |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
BICMOS |
NO LEAD |
PARALLEL |
SYNCHRONOUS |
524288 words |
3.3 |
36 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
512KX36 |
512K |
0 Cel |
DUAL |
R-XDMA-N144 |
3.6 V |
Not Qualified |
18874368 bit |
3.135 V |
FLOW-THROUGH ARCHITECTURE |
10 ns |
||||||||||||||||||||||||||||||
NXP Semiconductors |
SRAM MODULE |
COMMERCIAL |
144 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
BICMOS |
NO LEAD |
PARALLEL |
SYNCHRONOUS |
262144 words |
3.3 |
36 |
MICROELECTRONIC ASSEMBLY |
.8 mm |
70 Cel |
256KX36 |
256K |
0 Cel |
ZIG-ZAG |
R-XZMA-N144 |
3.6 V |
25.55 mm |
3.8 mm |
9437184 bit |
3.135 V |
WD-MAX |
67.6 mm |
10 ns |
||||||||||||||||||||||||||
Infineon Technologies |
MULTI-PORT SRAM |
INDUSTRIAL |
144 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
131072 words |
3.3 |
18 |
GRID ARRAY, LOW PROFILE |
1 mm |
85 Cel |
128KX18 |
128K |
-40 Cel |
TIN LEAD |
BOTTOM |
S-PBGA-B144 |
3.465 V |
1.6 mm |
13 mm |
Not Qualified |
2359296 bit |
3.135 V |
PIPELINED ARCHITECTURE |
e0 |
13 mm |
4 ns |
|||||||||||||||||||||||
Renesas Electronics |
CACHE TAG SRAM MODULE |
COMMERCIAL |
144 |
DIMM |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
PARALLEL |
SYNCHRONOUS |
500 mA |
32768 words |
COMMON |
3.3 |
3.3 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM144,32 |
SRAMs |
.8 mm |
70 Cel |
3-STATE |
32KX64 |
32K |
3.14 V |
0 Cel |
DUAL |
R-PDMA-N144 |
Not Qualified |
262144 bit |
.012 Amp |
12 ns |
||||||||||||||||||||||||
|
Renesas Electronics |
STANDARD SRAM |
INDUSTRIAL |
144 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
8192 words |
3 |
16 |
GRID ARRAY |
85 Cel |
8KX16 |
8K |
-40 Cel |
MATTE TIN |
BOTTOM |
S-PBGA-B144 |
3.3 V |
Not Qualified |
131072 bit |
2.7 V |
e3 |
55 ns |
|||||||||||||||||||||||||||
|
Renesas Electronics |
STANDARD SRAM |
INDUSTRIAL |
144 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
8192 words |
1.8 |
16 |
GRID ARRAY |
85 Cel |
8KX16 |
8K |
-40 Cel |
MATTE TIN |
BOTTOM |
S-PBGA-B144 |
1.9 V |
Not Qualified |
131072 bit |
1.7 V |
e3 |
55 ns |
|||||||||||||||||||||||||||
Renesas Electronics |
APPLICATION SPECIFIC SRAM |
COMMERCIAL |
144 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
645 mA |
262144 words |
COMMON |
3.3 |
2.5/3.3,3.3 |
18 |
FLATPACK |
QFP144,.87SQ,20 |
SRAMs |
.5 mm |
70 Cel |
3-STATE |
256KX18 |
256K |
3.15 V |
0 Cel |
TIN LEAD |
QUAD |
2 |
S-PQFP-G144 |
3.45 V |
133 MHz |
Not Qualified |
4718592 bit |
3.15 V |
FLOW-THROUGH OR PIPELINED ARCHITECTURE |
e0 |
.00003 Amp |
15 ns |
||||||||||||||||
Renesas Electronics |
APPLICATION SPECIFIC SRAM |
INDUSTRIAL |
144 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
675 mA |
262144 words |
COMMON |
3.3 |
2.5/3.3,3.3 |
18 |
FLATPACK |
QFP144,.87SQ,20 |
SRAMs |
.5 mm |
85 Cel |
3-STATE |
256KX18 |
256K |
3.15 V |
-40 Cel |
TIN LEAD |
QUAD |
2 |
S-PQFP-G144 |
3.45 V |
133 MHz |
Not Qualified |
4718592 bit |
3.15 V |
FLOW-THROUGH OR PIPELINED ARCHITECTURE |
e0 |
.00004 Amp |
15 ns |
||||||||||||||||
Renesas Electronics |
MULTI-PORT SRAM |
INDUSTRIAL |
144 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
262144 words |
3.3 |
18 |
FLATPACK, LOW PROFILE, FINE PITCH |
.5 mm |
85 Cel |
256KX18 |
256K |
-40 Cel |
TIN LEAD |
QUAD |
S-PQFP-G144 |
4 |
3.45 V |
1.6 mm |
20 mm |
Not Qualified |
4718592 bit |
3.15 V |
FLOW-THROUGH OR PIPELINED ARCHITECTURE |
e0 |
20 mm |
10 ns |
||||||||||||||||||||||
|
Renesas Electronics |
STANDARD SRAM |
INDUSTRIAL |
144 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
8192 words |
1.8 |
16 |
GRID ARRAY |
85 Cel |
8KX16 |
8K |
-40 Cel |
MATTE TIN |
BOTTOM |
S-PBGA-B144 |
1.9 V |
Not Qualified |
131072 bit |
1.7 V |
e3 |
55 ns |
|||||||||||||||||||||||||||
Renesas Electronics |
CACHE TAG SRAM MODULE |
COMMERCIAL |
144 |
DIMM |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
PARALLEL |
SYNCHRONOUS |
500 mA |
32768 words |
COMMON |
3.3 |
3.3 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM144,32 |
SRAMs |
.8 mm |
70 Cel |
3-STATE |
32KX64 |
32K |
3.14 V |
0 Cel |
DUAL |
R-PDMA-N144 |
Not Qualified |
262144 bit |
.012 Amp |
15 ns |
||||||||||||||||||||||||
Renesas Electronics |
APPLICATION SPECIFIC SRAM |
COMMERCIAL |
144 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
180 mA |
32768 words |
COMMON |
3.3 |
3.3 |
16 |
GRID ARRAY, FINE PITCH |
BGA144,13X13,32 |
SRAMs |
.8 mm |
70 Cel |
3-STATE |
32KX16 |
32K |
3 V |
0 Cel |
TIN LEAD |
BOTTOM |
2 |
S-PBGA-B144 |
3 |
Not Qualified |
524288 bit |
e0 |
.003 Amp |
55 ns |
||||||||||||||||||||
Renesas Electronics |
STANDARD SRAM |
INDUSTRIAL |
144 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
8192 words |
1.8 |
16 |
GRID ARRAY |
85 Cel |
8KX16 |
8K |
-40 Cel |
TIN LEAD |
BOTTOM |
S-PBGA-B144 |
1.9 V |
Not Qualified |
131072 bit |
1.7 V |
e0 |
55 ns |
||||||||||||||||||||||||||||
|
Renesas Electronics |
DDR SRAM |
144 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
16777216 words |
1.8 |
18 |
GRID ARRAY, THIN PROFILE |
1 mm |
16MX18 |
16M |
TIN BISMUTH |
BOTTOM |
R-PBGA-B144 |
1.9 V |
1.2 mm |
11 mm |
301989888 bit |
1.7 V |
IT ALSO OPERATES AT 2.5V |
e6 |
18.5 mm |
|||||||||||||||||||||||||||
|
Renesas Electronics |
MULTI-PORT SRAM |
INDUSTRIAL |
144 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
131072 words |
3.3 |
18 |
FLATPACK, LOW PROFILE, FINE PITCH |
.5 mm |
85 Cel |
128KX18 |
128K |
-40 Cel |
MATTE TIN |
QUAD |
S-PQFP-G144 |
3.45 V |
1.6 mm |
20 mm |
Not Qualified |
2359296 bit |
3.15 V |
FLOW-THROUGH OR PIPELINED ARCHITECTURE |
e3 |
20 mm |
15 ns |
||||||||||||||||||||||
|
Renesas Electronics |
MULTI-PORT SRAM |
COMMERCIAL |
144 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
225 mA |
32768 words |
COMMON |
3.3 |
3.3 |
16 |
GRID ARRAY |
BGA144,13X13,32 |
SRAMs |
.8 mm |
70 Cel |
3-STATE |
32KX16 |
32K |
3 V |
0 Cel |
MATTE TIN |
BOTTOM |
2 |
S-PBGA-B144 |
3.6 V |
Not Qualified |
524288 bit |
3 V |
e3 |
.006 Amp |
55 ns |
|||||||||||||||||
Renesas Electronics |
STANDARD SRAM |
INDUSTRIAL |
144 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
8192 words |
1.8 |
16 |
GRID ARRAY |
85 Cel |
8KX16 |
8K |
-40 Cel |
TIN LEAD |
BOTTOM |
S-PBGA-B144 |
1.9 V |
Not Qualified |
131072 bit |
1.7 V |
e0 |
55 ns |
||||||||||||||||||||||||||||
|
Renesas Electronics |
MULTI-PORT SRAM |
INDUSTRIAL |
144 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
131072 words |
3.3 |
18 |
FLATPACK, LOW PROFILE, FINE PITCH |
.5 mm |
85 Cel |
128KX18 |
128K |
-40 Cel |
MATTE TIN |
QUAD |
S-PQFP-G144 |
3.45 V |
1.6 mm |
20 mm |
Not Qualified |
2359296 bit |
3.15 V |
FLOW-THROUGH OR PIPELINED ARCHITECTURE |
e3 |
20 mm |
12 ns |
||||||||||||||||||||||
|
Renesas Electronics |
STANDARD SRAM |
INDUSTRIAL |
144 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
8192 words |
3 |
16 |
GRID ARRAY |
85 Cel |
8KX16 |
8K |
-40 Cel |
MATTE TIN |
BOTTOM |
S-PBGA-B144 |
3.3 V |
Not Qualified |
131072 bit |
2.7 V |
e3 |
55 ns |
|||||||||||||||||||||||||||
Renesas Electronics |
MULTI-PORT SRAM |
COMMERCIAL |
144 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
32768 words |
3.3 |
16 |
GRID ARRAY |
70 Cel |
32KX16 |
32K |
0 Cel |
BOTTOM |
S-PBGA-B144 |
3.6 V |
524288 bit |
3 V |
55 ns |
|||||||||||||||||||||||||||||||
|
Renesas Electronics |
MULTI-PORT SRAM |
COMMERCIAL |
144 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
225 mA |
32768 words |
COMMON |
3.3 |
3.3 |
16 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA144,13X13,32 |
SRAMs |
.8 mm |
70 Cel |
3-STATE |
32KX16 |
32K |
3 V |
0 Cel |
MATTE TIN |
BOTTOM |
2 |
S-PBGA-B144 |
3.6 V |
1.5 mm |
12 mm |
Not Qualified |
524288 bit |
3 V |
e3 |
.006 Amp |
12 mm |
55 ns |
||||||||||||||
Renesas Electronics |
STANDARD SRAM |
INDUSTRIAL |
144 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
8192 words |
3 |
16 |
GRID ARRAY |
85 Cel |
8KX16 |
8K |
-40 Cel |
TIN LEAD |
BOTTOM |
S-PBGA-B144 |
3.3 V |
Not Qualified |
131072 bit |
2.7 V |
e0 |
55 ns |
||||||||||||||||||||||||||||
|
Renesas Electronics |
MULTI-PORT SRAM |
COMMERCIAL |
144 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
131072 words |
3.3 |
18 |
FLATPACK, LOW PROFILE, FINE PITCH |
.5 mm |
70 Cel |
128KX18 |
128K |
0 Cel |
MATTE TIN |
QUAD |
S-PQFP-G144 |
3.45 V |
1.6 mm |
20 mm |
Not Qualified |
2359296 bit |
3.15 V |
FLOW-THROUGH OR PIPELINED ARCHITECTURE |
e3 |
20 mm |
12 ns |
||||||||||||||||||||||
|
Renesas Electronics |
DDR SRAM |
144 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
16777216 words |
1.8 |
18 |
GRID ARRAY, THIN PROFILE |
1 mm |
16MX18 |
16M |
TIN BISMUTH |
BOTTOM |
R-PBGA-B144 |
1.9 V |
1.2 mm |
11 mm |
301989888 bit |
1.7 V |
TERM PITCH-MAX |
e6 |
18.5 mm |
|||||||||||||||||||||||||||
|
Renesas Electronics |
DDR SRAM |
144 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
16777216 words |
1.8 |
18 |
GRID ARRAY, THIN PROFILE |
1 mm |
16MX18 |
16M |
TIN BISMUTH |
BOTTOM |
R-PBGA-B144 |
1.9 V |
1.2 mm |
11 mm |
301989888 bit |
1.7 V |
IT ALSO OPERATES AT 2.5V |
e6 |
18.5 mm |
|||||||||||||||||||||||||||
Renesas Electronics |
MULTI-PORT SRAM |
COMMERCIAL |
144 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
180 mA |
32768 words |
COMMON |
3.3 |
3.3 |
16 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA144,13X13,32 |
SRAMs |
.8 mm |
70 Cel |
3-STATE |
32KX16 |
32K |
3 V |
0 Cel |
TIN LEAD |
BOTTOM |
2 |
S-PBGA-B144 |
3 |
3.6 V |
1.5 mm |
12 mm |
Not Qualified |
524288 bit |
3 V |
CONFIGURED AS 32K X 16 |
e0 |
.003 Amp |
12 mm |
55 ns |
|||||||||||||
|
Renesas Electronics |
DDR SRAM |
144 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
8388608 words |
1.8 |
36 |
GRID ARRAY, THIN PROFILE |
1 mm |
8MX36 |
8M |
TIN BISMUTH |
BOTTOM |
R-PBGA-B144 |
1.9 V |
1.2 mm |
11 mm |
301989888 bit |
1.7 V |
TERM PITCH-MAX |
e6 |
18.5 mm |
|||||||||||||||||||||||||||
|
Renesas Electronics |
STANDARD SRAM |
INDUSTRIAL |
144 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
8192 words |
1.8 |
16 |
GRID ARRAY |
85 Cel |
8KX16 |
8K |
-40 Cel |
MATTE TIN |
BOTTOM |
S-PBGA-B144 |
1.9 V |
Not Qualified |
131072 bit |
1.7 V |
e3 |
55 ns |
|||||||||||||||||||||||||||
|
Renesas Electronics |
DDR SRAM |
144 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
8388608 words |
1.8 |
36 |
GRID ARRAY, THIN PROFILE |
1 mm |
8MX36 |
8M |
TIN BISMUTH |
BOTTOM |
R-PBGA-B144 |
1.9 V |
1.2 mm |
11 mm |
301989888 bit |
1.7 V |
TERM PITCH-MAX |
e6 |
18.5 mm |
|||||||||||||||||||||||||||
Renesas Electronics |
APPLICATION SPECIFIC SRAM |
COMMERCIAL |
144 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
225 mA |
32768 words |
COMMON |
3.3 |
3.3 |
16 |
GRID ARRAY, FINE PITCH |
BGA144,13X13,32 |
SRAMs |
.8 mm |
70 Cel |
3-STATE |
32KX16 |
32K |
3 V |
0 Cel |
TIN LEAD |
BOTTOM |
2 |
S-PBGA-B144 |
3 |
Not Qualified |
524288 bit |
e0 |
.006 Amp |
55 ns |
||||||||||||||||||||
|
Renesas Electronics |
MULTI-PORT SRAM |
COMMERCIAL |
144 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
131072 words |
3.3 |
18 |
FLATPACK, LOW PROFILE, FINE PITCH |
.5 mm |
70 Cel |
128KX18 |
128K |
0 Cel |
MATTE TIN |
QUAD |
S-PQFP-G144 |
3.45 V |
1.6 mm |
20 mm |
Not Qualified |
2359296 bit |
3.15 V |
FLOW-THROUGH OR PIPELINED ARCHITECTURE |
e3 |
20 mm |
15 ns |
||||||||||||||||||||||
Renesas Electronics |
MULTI-PORT SRAM |
COMMERCIAL |
144 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
225 mA |
32768 words |
COMMON |
3.3 |
3.3 |
16 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA144,13X13,32 |
SRAMs |
.8 mm |
70 Cel |
3-STATE |
32KX16 |
32K |
3 V |
0 Cel |
TIN LEAD |
BOTTOM |
2 |
S-PBGA-B144 |
3 |
3.6 V |
1.5 mm |
12 mm |
Not Qualified |
524288 bit |
3 V |
CONFIGURED AS 32K X 16 |
e0 |
.006 Amp |
12 mm |
55 ns |
|||||||||||||
|
Renesas Electronics |
DDR SRAM |
144 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
16777216 words |
1.8 |
18 |
GRID ARRAY, THIN PROFILE |
1 mm |
16MX18 |
16M |
TIN BISMUTH |
BOTTOM |
R-PBGA-B144 |
1.9 V |
1.2 mm |
11 mm |
301989888 bit |
1.7 V |
TERM PITCH-MAX |
e6 |
18.5 mm |
|||||||||||||||||||||||||||
|
Renesas Electronics |
DDR SRAM |
144 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
33554432 words |
1.8 |
9 |
GRID ARRAY, THIN PROFILE |
1 mm |
32MX9 |
32M |
TIN BISMUTH |
BOTTOM |
R-PBGA-B144 |
1.9 V |
1.2 mm |
11 mm |
301989888 bit |
1.7 V |
TERM PITCH-MAX |
e6 |
18.5 mm |
|||||||||||||||||||||||||||
Renesas Electronics |
CACHE TAG SRAM MODULE |
COMMERCIAL |
144 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
CMOS |
NO LEAD |
PARALLEL |
SYNCHRONOUS |
500 mA |
32768 words |
COMMON |
3.3 |
3.3 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM144,32 |
SRAMs |
.8 mm |
70 Cel |
3-STATE |
32KX64 |
32K |
3.14 V |
0 Cel |
TIN LEAD |
ZIG-ZAG |
1 |
R-XZMA-N144 |
3.6 V |
Not Qualified |
2097152 bit |
3.15 V |
8K X 8 CACHE TAG |
e0 |
YES |
.012 Amp |
7 ns |
||||||||||||||||
|
Renesas Electronics |
MULTI-PORT SRAM |
COMMERCIAL |
144 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
262144 words |
3.3 |
18 |
FLATPACK, LOW PROFILE, FINE PITCH |
.5 mm |
70 Cel |
256KX18 |
256K |
0 Cel |
MATTE TIN |
QUAD |
S-PQFP-G144 |
3.45 V |
1.6 mm |
20 mm |
Not Qualified |
4718592 bit |
3.15 V |
FLOW-THROUGH OR PIPELINED ARCHITECTURE |
e3 |
20 mm |
10 ns |
||||||||||||||||||||||
|
Renesas Electronics |
MULTI-PORT SRAM |
COMMERCIAL |
144 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
524288 words |
3.3 |
18 |
FLATPACK, LOW PROFILE, FINE PITCH |
.5 mm |
70 Cel |
512KX18 |
512K |
0 Cel |
MATTE TIN |
QUAD |
S-PQFP-G144 |
3.45 V |
1.6 mm |
20 mm |
Not Qualified |
9437184 bit |
3.15 V |
FLOW-THROUGH OR PIPELINED ARCHITECTURE |
e3 |
20 mm |
10 ns |
||||||||||||||||||||||
Renesas Electronics |
MULTI-PORT SRAM |
COMMERCIAL |
144 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
32768 words |
3.3 |
16 |
GRID ARRAY |
70 Cel |
32KX16 |
32K |
0 Cel |
BOTTOM |
S-PBGA-B144 |
3.6 V |
524288 bit |
3 V |
15 ns |
|||||||||||||||||||||||||||||||
|
Renesas Electronics |
MULTI-PORT SRAM |
COMMERCIAL |
144 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
180 mA |
32768 words |
COMMON |
3.3 |
3.3 |
16 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA144,13X13,32 |
SRAMs |
.8 mm |
70 Cel |
3-STATE |
32KX16 |
32K |
3 V |
0 Cel |
MATTE TIN |
BOTTOM |
2 |
S-PBGA-B144 |
3.6 V |
1.5 mm |
12 mm |
Not Qualified |
524288 bit |
3 V |
e3 |
.003 Amp |
12 mm |
55 ns |
||||||||||||||
Renesas Electronics |
MULTI-PORT SRAM |
COMMERCIAL |
144 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
131072 words |
3.3 |
18 |
FLATPACK, LOW PROFILE, FINE PITCH |
.5 mm |
70 Cel |
128KX18 |
128K |
0 Cel |
TIN LEAD |
QUAD |
S-PQFP-G144 |
4 |
3.45 V |
1.6 mm |
20 mm |
Not Qualified |
2359296 bit |
3.15 V |
FLOW-THROUGH OR PIPELINED ARCHITECTURE |
e0 |
20 mm |
10 ns |
||||||||||||||||||||||
|
Renesas Electronics |
STANDARD SRAM |
INDUSTRIAL |
144 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
8192 words |
1.8 |
16 |
GRID ARRAY |
85 Cel |
8KX16 |
8K |
-40 Cel |
MATTE TIN |
BOTTOM |
S-PBGA-B144 |
1.9 V |
Not Qualified |
131072 bit |
1.7 V |
e3 |
55 ns |
|||||||||||||||||||||||||||
Renesas Electronics |
CACHE TAG SRAM MODULE |
COMMERCIAL |
144 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
CMOS |
NO LEAD |
PARALLEL |
SYNCHRONOUS |
500 mA |
32768 words |
COMMON |
3.3 |
3.3 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM144,32 |
SRAMs |
.8 mm |
70 Cel |
3-STATE |
32KX64 |
32K |
3.14 V |
0 Cel |
TIN LEAD |
ZIG-ZAG |
1 |
R-XZMA-N144 |
3.6 V |
Not Qualified |
2097152 bit |
3.15 V |
8K X 8 CACHE TAG |
e0 |
YES |
.012 Amp |
7 ns |
||||||||||||||||
|
Renesas Electronics |
MULTI-PORT SRAM |
COMMERCIAL |
144 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
180 mA |
32768 words |
COMMON |
3.3 |
3.3 |
16 |
GRID ARRAY |
BGA144,13X13,32 |
SRAMs |
.8 mm |
70 Cel |
3-STATE |
32KX16 |
32K |
3 V |
0 Cel |
MATTE TIN |
BOTTOM |
2 |
S-PBGA-B144 |
3.6 V |
Not Qualified |
524288 bit |
3 V |
e3 |
.003 Amp |
55 ns |
|||||||||||||||||
Renesas Electronics |
MULTI-PORT SRAM |
COMMERCIAL |
144 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
32768 words |
3.3 |
16 |
GRID ARRAY |
70 Cel |
32KX16 |
32K |
0 Cel |
MATTE TIN |
BOTTOM |
S-PBGA-B144 |
3.6 V |
524288 bit |
3 V |
e3 |
55 ns |
|||||||||||||||||||||||||||||
Samsung |
SRAM MODULE |
COMMERCIAL |
144 |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
CMOS |
NO LEAD |
PARALLEL |
SYNCHRONOUS |
1048576 words |
3.3 |
64 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
1MX64 |
1M |
0 Cel |
DUAL |
R-XDMA-N144 |
3.6 V |
Not Qualified |
67108864 bit |
3 V |
5.5 ns |
|||||||||||||||||||||||||||||||
Samsung |
SRAM MODULE |
COMMERCIAL |
144 |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
CMOS |
NO LEAD |
PARALLEL |
SYNCHRONOUS |
1048576 words |
3.3 |
64 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
1MX64 |
1M |
0 Cel |
DUAL |
R-XDMA-N144 |
3.6 V |
Not Qualified |
67108864 bit |
3 V |
6 ns |
|||||||||||||||||||||||||||||||
Samsung |
SRAM MODULE |
COMMERCIAL |
144 |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
CMOS |
NO LEAD |
PARALLEL |
SYNCHRONOUS |
2097152 words |
3.3 |
64 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
2MX64 |
2M |
0 Cel |
DUAL |
R-XDMA-N144 |
3.6 V |
Not Qualified |
134217728 bit |
3 V |
6 ns |
|||||||||||||||||||||||||||||||
Samsung |
SRAM MODULE |
COMMERCIAL |
144 |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
CMOS |
NO LEAD |
PARALLEL |
SYNCHRONOUS |
2097152 words |
3.3 |
64 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
2MX64 |
2M |
0 Cel |
DUAL |
R-XDMA-N144 |
3.6 V |
Not Qualified |
134217728 bit |
3 V |
5.5 ns |
SRAM, or Static Random-Access Memory, is a type of volatile computer memory that stores data as a flip-flop, which retains the data as long as power is supplied to the system. SRAM is commonly used as cache memory and in other applications where high-speed access to data is required.
SRAM is a type of memory that is faster and more expensive than DRAM (Dynamic Random-Access Memory). It is commonly used as cache memory in computer systems and other digital devices to improve the speed of data access. SRAM is also used in applications where high-speed data processing is required, such as in networking equipment, video games, and other high-performance computing applications.
One of the advantages of using SRAM is that it provides faster access to data than other types of memory, such as DRAM. This is because SRAM does not need to be refreshed like DRAM, which makes it faster and more reliable. Additionally, SRAM uses less power than other types of memory, which makes it ideal for use in battery-powered devices.
One of the disadvantages of using SRAM is that it is more expensive and less dense than other types of memory, such as DRAM or flash memory. This means that it is not suitable for applications that require large amounts of memory at a low cost. Additionally, SRAM is volatile, which means that it cannot store data permanently.