Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Refresh Cycles | Package Shape | Total Dose (V) | Package Body Material | Surface Mount | No. of Functions | Technology | Screening Level | Nominal Negative Supply Voltage | Terminal Form | Parallel or Serial | Operating Mode | Maximum Supply Current | No. of Words | Self Refresh | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Standby Voltage | Minimum Operating Temperature | Terminal Finish | Terminal Position | No. of Ports | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Maximum Clock Frequency (fCLK) | Width | Qualification | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Output Enable | Maximum Standby Current | Length | Maximum Access Time |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Infineon Technologies |
STANDARD SRAM |
32 |
SOJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
80 mA |
131072 words |
COMMON |
5 |
8 |
SMALL OUTLINE |
SOJ32,.34 |
1.27 mm |
85 Cel |
3-STATE |
128KX8 |
128K |
2 V |
-40 Cel |
DUAL |
R-PDSO-J32 |
5.5 V |
3.556 mm |
7.5819 mm |
1048576 bit |
4.5 V |
YES |
.01 Amp |
20.828 mm |
15 ns |
|||||||||||||||||||||
Infineon Technologies |
STANDARD SRAM |
32 |
SOJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
90 mA |
131072 words |
COMMON |
5 |
8 |
SMALL OUTLINE |
SOJ32,.34 |
1.27 mm |
70 Cel |
3-STATE |
128KX8 |
128K |
2 V |
0 Cel |
DUAL |
R-PDSO-J32 |
5.5 V |
3.556 mm |
7.5819 mm |
1048576 bit |
4.5 V |
YES |
.01 Amp |
20.828 mm |
12 ns |
|||||||||||||||||||||
Infineon Technologies |
STANDARD SRAM |
32 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
80 mA |
131072 words |
COMMON |
5 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP32,.8,20 |
.5 mm |
70 Cel |
3-STATE |
128KX8 |
128K |
2 V |
0 Cel |
DUAL |
R-PDSO-G32 |
5.5 V |
1.2 mm |
8 mm |
1048576 bit |
4.5 V |
YES |
.01 Amp |
18.4 mm |
15 ns |
|||||||||||||||||||||
Infineon Technologies |
STANDARD SRAM |
32 |
SOJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
80 mA |
131072 words |
COMMON |
5 |
8 |
SMALL OUTLINE |
SOJ32,.44 |
1.27 mm |
70 Cel |
3-STATE |
128KX8 |
128K |
2 V |
0 Cel |
DUAL |
R-PDSO-J32 |
5.5 V |
3.7592 mm |
10.16 mm |
1048576 bit |
4.5 V |
YES |
.01 Amp |
20.955 mm |
15 ns |
|||||||||||||||||||||
Infineon Technologies |
STANDARD SRAM |
32 |
SOJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
80 mA |
131072 words |
COMMON |
5 |
8 |
SMALL OUTLINE |
SOJ32,.44 |
1.27 mm |
70 Cel |
3-STATE |
128KX8 |
128K |
2 V |
0 Cel |
DUAL |
R-PDSO-J32 |
5.5 V |
3.7592 mm |
10.16 mm |
1048576 bit |
4.5 V |
YES |
.01 Amp |
20.955 mm |
15 ns |
|||||||||||||||||||||
Infineon Technologies |
STANDARD SRAM |
32 |
SOJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
80 mA |
131072 words |
COMMON |
5 |
8 |
SMALL OUTLINE |
SOJ32,.44 |
1.27 mm |
85 Cel |
3-STATE |
128KX8 |
128K |
2 V |
-40 Cel |
DUAL |
R-PDSO-J32 |
5.5 V |
3.7592 mm |
10.16 mm |
1048576 bit |
4.5 V |
YES |
.01 Amp |
20.955 mm |
15 ns |
|||||||||||||||||||||
Infineon Technologies |
STANDARD SRAM |
32 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
80 mA |
131072 words |
COMMON |
5 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP32,.8,20 |
.5 mm |
70 Cel |
3-STATE |
128KX8 |
128K |
2 V |
0 Cel |
DUAL |
R-PDSO-G32 |
5.5 V |
1.2 mm |
8 mm |
1048576 bit |
4.5 V |
YES |
.01 Amp |
18.4 mm |
15 ns |
|||||||||||||||||||||
Infineon Technologies |
STANDARD SRAM |
32 |
SOJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
80 mA |
131072 words |
COMMON |
5 |
8 |
SMALL OUTLINE |
SOJ32,.34 |
1.27 mm |
70 Cel |
3-STATE |
128KX8 |
128K |
2 V |
0 Cel |
DUAL |
R-PDSO-J32 |
5.5 V |
3.556 mm |
7.5819 mm |
1048576 bit |
4.5 V |
YES |
.01 Amp |
20.828 mm |
15 ns |
|||||||||||||||||||||
Infineon Technologies |
STANDARD SRAM |
32 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
75 mA |
131072 words |
COMMON |
5 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP32,.8,20 |
.5 mm |
70 Cel |
3-STATE |
128KX8 |
128K |
2 V |
0 Cel |
DUAL |
R-PDSO-G32 |
5.5 V |
1.2 mm |
8 mm |
1048576 bit |
4.5 V |
YES |
.01 Amp |
18.4 mm |
20 ns |
|||||||||||||||||||||
Infineon Technologies |
STANDARD SRAM |
32 |
SOJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
75 mA |
131072 words |
COMMON |
5 |
8 |
SMALL OUTLINE |
SOJ32,.34 |
1.27 mm |
70 Cel |
3-STATE |
128KX8 |
128K |
2 V |
0 Cel |
DUAL |
R-PDSO-J32 |
5.5 V |
3.556 mm |
7.5819 mm |
1048576 bit |
4.5 V |
YES |
.01 Amp |
20.828 mm |
20 ns |
|||||||||||||||||||||
Infineon Technologies |
STANDARD SRAM |
32 |
SOJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
90 mA |
131072 words |
COMMON |
5 |
8 |
SMALL OUTLINE |
SOJ32,.44 |
1.27 mm |
70 Cel |
3-STATE |
128KX8 |
128K |
2 V |
0 Cel |
DUAL |
R-PDSO-J32 |
5.5 V |
3.7592 mm |
10.16 mm |
1048576 bit |
4.5 V |
YES |
.01 Amp |
20.955 mm |
12 ns |
|||||||||||||||||||||
Infineon Technologies |
STANDARD SRAM |
32 |
SOJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
80 mA |
131072 words |
COMMON |
5 |
8 |
SMALL OUTLINE |
SOJ32,.34 |
1.27 mm |
70 Cel |
3-STATE |
128KX8 |
128K |
2 V |
0 Cel |
DUAL |
R-PDSO-J32 |
5.5 V |
3.556 mm |
7.5819 mm |
1048576 bit |
4.5 V |
YES |
.01 Amp |
20.828 mm |
15 ns |
|||||||||||||||||||||
Infineon Technologies |
STANDARD SRAM |
32 |
SOJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
75 mA |
131072 words |
COMMON |
5 |
8 |
SMALL OUTLINE |
SOJ32,.44 |
1.27 mm |
85 Cel |
3-STATE |
128KX8 |
128K |
2 V |
-40 Cel |
DUAL |
R-PDSO-J32 |
5.5 V |
3.7592 mm |
10.16 mm |
1048576 bit |
4.5 V |
YES |
.01 Amp |
20.955 mm |
20 ns |
|||||||||||||||||||||
Infineon Technologies |
STANDARD SRAM |
32 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
90 mA |
131072 words |
COMMON |
5 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP32,.8,20 |
.5 mm |
70 Cel |
3-STATE |
128KX8 |
128K |
2 V |
0 Cel |
DUAL |
R-PDSO-G32 |
5.5 V |
1.2 mm |
8 mm |
1048576 bit |
4.5 V |
YES |
.01 Amp |
18.4 mm |
12 ns |
|||||||||||||||||||||
|
Infineon Technologies |
STANDARD SRAM |
INDUSTRIAL |
32 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
18 mA |
262144 words |
COMMON |
3 |
2.5/3.3 |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP32,.56,20 |
SRAMs |
.5 mm |
85 Cel |
3-STATE |
256KX8 |
256K |
1.5 V |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G32 |
3 |
3.6 V |
1.2 mm |
8 mm |
Not Qualified |
2097152 bit |
2.2 V |
e4 |
20 |
260 |
.000004 Amp |
11.8 mm |
45 ns |
||||||||||||
|
Infineon Technologies |
SRAM STD |
INDUSTRIAL |
32 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
18 mA |
262144 words |
COMMON |
5 |
5 |
8 |
SMALL OUTLINE |
SOP32,.56 |
SRAMs |
1.27 mm |
85 Cel |
3-STATE |
256KX8 |
256K |
2 V |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G32 |
3 |
5.5 V |
2.997 mm |
11.303 mm |
Not Qualified |
2097152 bit |
4.5 V |
e4 |
20 |
260 |
.000005 Amp |
20.4465 mm |
45 ns |
||||||||||||
|
Infineon Technologies |
STANDARD SRAM |
INDUSTRIAL |
32 |
SOJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
60 mA |
131072 words |
COMMON |
3.3 |
3.3 |
8 |
SMALL OUTLINE |
SOJ32,.44 |
SRAMs |
1.27 mm |
85 Cel |
3-STATE |
128KX8 |
128K |
2 V |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-J32 |
3 |
3.6 V |
3.75 mm |
10.16 mm |
Not Qualified |
1048576 bit |
3 V |
e4 |
40 |
260 |
.003 Amp |
20.955 mm |
10 ns |
||||||||||||
|
Infineon Technologies |
STANDARD SRAM |
INDUSTRIAL |
32 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
80 mA |
131072 words |
COMMON |
5 |
5 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP32,.8,20 |
SRAMs |
.5 mm |
85 Cel |
3-STATE |
128KX8 |
128K |
2 V |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G32 |
3 |
5.5 V |
1.2 mm |
8 mm |
Not Qualified |
1048576 bit |
4.5 V |
e4 |
30 |
260 |
.003 Amp |
18.4 mm |
10 ns |
||||||||||||
|
Infineon Technologies |
STANDARD SRAM |
INDUSTRIAL |
32 |
TSOP2 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
524288 words |
5 |
8 |
SMALL OUTLINE, THIN PROFILE |
1.27 mm |
85 Cel |
512KX8 |
512K |
-40 Cel |
PURE TIN |
DUAL |
R-PDSO-G32 |
3 |
5.5 V |
1.2 mm |
10.16 mm |
4194304 bit |
4.5 V |
260 |
20.95 mm |
45 ns |
|||||||||||||||||||||||
Diodes Incorporated |
STANDARD SRAM |
COMMERCIAL |
32 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
THROUGH-HOLE |
PARALLEL |
SYNCHRONOUS |
200 mA |
32768 words |
COMMON |
5 |
5 |
9 |
IN-LINE |
DIP32,.3 |
SRAMs |
2.54 mm |
70 Cel |
3-STATE |
32KX9 |
32K |
4.5 V |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDIP-T32 |
Not Qualified |
294912 bit |
e0 |
.13 Amp |
34 ns |
||||||||||||||||||||||
Diodes Incorporated |
STANDARD SRAM |
COMMERCIAL |
32 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
THROUGH-HOLE |
PARALLEL |
SYNCHRONOUS |
220 mA |
32768 words |
COMMON |
5 |
5 |
9 |
IN-LINE |
DIP32,.3 |
SRAMs |
2.54 mm |
70 Cel |
3-STATE |
32KX9 |
32K |
4.5 V |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDIP-T32 |
Not Qualified |
294912 bit |
e0 |
.13 Amp |
24 ns |
||||||||||||||||||||||
Diodes Incorporated |
STANDARD SRAM |
COMMERCIAL |
32 |
SOJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
J BEND |
PARALLEL |
SYNCHRONOUS |
260 mA |
32768 words |
COMMON |
5 |
5 |
9 |
SMALL OUTLINE |
SOJ32,.34 |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
32KX9 |
32K |
4.5 V |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-J32 |
Not Qualified |
294912 bit |
e0 |
.15 Amp |
14 ns |
||||||||||||||||||||||
Diodes Incorporated |
STANDARD SRAM |
COMMERCIAL |
32 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
THROUGH-HOLE |
PARALLEL |
SYNCHRONOUS |
240 mA |
32768 words |
COMMON |
5 |
5 |
9 |
IN-LINE |
DIP32,.3 |
SRAMs |
2.54 mm |
70 Cel |
3-STATE |
32KX9 |
32K |
4.5 V |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDIP-T32 |
Not Qualified |
294912 bit |
e0 |
.13 Amp |
19 ns |
||||||||||||||||||||||
Diodes Incorporated |
STANDARD SRAM |
COMMERCIAL |
32 |
SOJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
J BEND |
PARALLEL |
SYNCHRONOUS |
220 mA |
32768 words |
COMMON |
5 |
5 |
9 |
SMALL OUTLINE |
SOJ32,.34 |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
32KX9 |
32K |
4.5 V |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-J32 |
Not Qualified |
294912 bit |
e0 |
.13 Amp |
24 ns |
||||||||||||||||||||||
Diodes Incorporated |
STANDARD SRAM |
COMMERCIAL |
32 |
SOJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
J BEND |
PARALLEL |
SYNCHRONOUS |
240 mA |
32768 words |
COMMON |
5 |
5 |
9 |
SMALL OUTLINE |
SOJ32,.34 |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
32KX9 |
32K |
4.5 V |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-J32 |
Not Qualified |
294912 bit |
e0 |
.13 Amp |
19 ns |
||||||||||||||||||||||
Diodes Incorporated |
STANDARD SRAM |
COMMERCIAL |
32 |
SOJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
J BEND |
PARALLEL |
SYNCHRONOUS |
200 mA |
32768 words |
COMMON |
5 |
5 |
9 |
SMALL OUTLINE |
SOJ32,.34 |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
32KX9 |
32K |
4.5 V |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-J32 |
Not Qualified |
294912 bit |
e0 |
.13 Amp |
34 ns |
||||||||||||||||||||||
Diodes Incorporated |
STANDARD SRAM |
COMMERCIAL |
32 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
THROUGH-HOLE |
PARALLEL |
SYNCHRONOUS |
260 mA |
32768 words |
COMMON |
5 |
5 |
9 |
IN-LINE |
DIP32,.3 |
SRAMs |
2.54 mm |
70 Cel |
3-STATE |
32KX9 |
32K |
4.5 V |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDIP-T32 |
Not Qualified |
294912 bit |
e0 |
.15 Amp |
14 ns |
||||||||||||||||||||||
Maxim Integrated |
NON-VOLATILE SRAM |
COMMERCIAL |
32 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
THROUGH-HOLE |
95 mA |
524288 words |
5 |
5 |
8 |
IN-LINE |
DIP32,.6 |
SRAMs |
2.54 mm |
70 Cel |
512KX8 |
512K |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDIP-T32 |
Not Qualified |
4194304 bit |
e0 |
.004 Amp |
150 ns |
|||||||||||||||||||||||||||
Maxim Integrated |
NON-VOLATILE SRAM |
COMMERCIAL |
32 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
THROUGH-HOLE |
40 mA |
524288 words |
3/3.3 |
8 |
IN-LINE |
DIP32,.6 |
SRAMs |
2.54 mm |
70 Cel |
512KX8 |
512K |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDIP-T32 |
Not Qualified |
4194304 bit |
e0 |
.004 Amp |
150 ns |
||||||||||||||||||||||||||||
Maxim Integrated |
NON-VOLATILE SRAM |
COMMERCIAL |
32 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
THROUGH-HOLE |
40 mA |
524288 words |
3/3.3 |
8 |
IN-LINE |
DIP32,.6 |
SRAMs |
2.54 mm |
70 Cel |
512KX8 |
512K |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDIP-T32 |
Not Qualified |
4194304 bit |
e0 |
.004 Amp |
200 ns |
||||||||||||||||||||||||||||
Maxim Integrated |
NON-VOLATILE SRAM MODULE |
INDUSTRIAL |
32 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
85 mA |
131072 words |
5 |
5 |
8 |
IN-LINE |
DIP32,.6 |
SRAMs |
2.54 mm |
85 Cel |
128KX8 |
128K |
-40 Cel |
TIN LEAD |
DUAL |
R-PDIP-T32 |
5.5 V |
9.52 mm |
15.24 mm |
Not Qualified |
1048576 bit |
4.5 V |
10 YEAR DATA RETENTION |
e0 |
.005 Amp |
42.925 mm |
85 ns |
||||||||||||||||||
Maxim Integrated |
NON-VOLATILE SRAM |
INDUSTRIAL |
32 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
THROUGH-HOLE |
85 mA |
131072 words |
5 |
5 |
8 |
IN-LINE |
DIP32,.6 |
SRAMs |
2.54 mm |
85 Cel |
128KX8 |
128K |
-40 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDIP-T32 |
Not Qualified |
1048576 bit |
e0 |
.005 Amp |
70 ns |
|||||||||||||||||||||||||||
Maxim Integrated |
NON-VOLATILE SRAM |
COMMERCIAL |
32 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
THROUGH-HOLE |
85 mA |
131072 words |
5 |
5 |
8 |
IN-LINE |
DIP32,.6 |
SRAMs |
2.54 mm |
70 Cel |
128KX8 |
128K |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDIP-T32 |
Not Qualified |
1048576 bit |
e0 |
.004 Amp |
150 ns |
|||||||||||||||||||||||||||
Maxim Integrated |
NON-VOLATILE SRAM MODULE |
COMMERCIAL |
32 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
524288 words |
5 |
8 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
512KX8 |
512K |
0 Cel |
TIN LEAD |
DUAL |
R-PDMA-T32 |
5.5 V |
Not Qualified |
4194304 bit |
2.7 V |
BATTERY BACK-UP |
e0 |
70 ns |
||||||||||||||||||||||||||||
Maxim Integrated |
NON-VOLATILE SRAM MODULE |
COMMERCIAL |
32 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
524288 words |
5 |
8 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
512KX8 |
512K |
0 Cel |
TIN LEAD |
DUAL |
R-PDMA-T32 |
5.5 V |
Not Qualified |
4194304 bit |
2.7 V |
BATTERY BACK-UP |
e0 |
100 ns |
||||||||||||||||||||||||||||
Maxim Integrated |
NON-VOLATILE SRAM |
COMMERCIAL |
32 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
THROUGH-HOLE |
40 mA |
131072 words |
3/3.3 |
8 |
IN-LINE |
DIP32,.6 |
SRAMs |
2.54 mm |
70 Cel |
128KX8 |
128K |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDIP-T32 |
Not Qualified |
1048576 bit |
e0 |
.004 Amp |
200 ns |
||||||||||||||||||||||||||||
Maxim Integrated |
NON-VOLATILE SRAM |
COMMERCIAL |
32 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
THROUGH-HOLE |
40 mA |
131072 words |
3/3.3 |
8 |
IN-LINE |
DIP32,.6 |
SRAMs |
2.54 mm |
70 Cel |
128KX8 |
128K |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDIP-T32 |
Not Qualified |
1048576 bit |
e0 |
.004 Amp |
150 ns |
||||||||||||||||||||||||||||
Maxim Integrated |
NON-VOLATILE SRAM MODULE |
INDUSTRIAL |
32 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
40 mA |
131072 words |
3 |
3/3.3 |
8 |
IN-LINE |
DIP32,.6 |
SRAMs |
2.54 mm |
85 Cel |
128KX8 |
128K |
-40 Cel |
TIN LEAD |
DUAL |
R-PDIP-T32 |
3.6 V |
9.52 mm |
15.24 mm |
Not Qualified |
1048576 bit |
2.7 V |
DATA RETENTION = 10 YRS |
e0 |
.004 Amp |
42.925 mm |
150 ns |
||||||||||||||||||
Maxim Integrated |
NON-VOLATILE SRAM MODULE |
COMMERCIAL |
32 |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
CMOS |
PIN/PEG |
PARALLEL |
ASYNCHRONOUS |
262144 words |
3.3 |
8 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
256KX8 |
256K |
0 Cel |
TIN LEAD |
DUAL |
R-XDMA-P32 |
3.6 V |
Not Qualified |
2097152 bit |
3 V |
10 YEAR DATA RETENTION |
e0 |
100 ns |
||||||||||||||||||||||||||||
|
Maxim Integrated |
NON-VOLATILE SRAM MODULE |
INDUSTRIAL |
32 |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
CMOS |
PIN/PEG |
PARALLEL |
ASYNCHRONOUS |
262144 words |
5 |
8 |
MICROELECTRONIC ASSEMBLY |
85 Cel |
256KX8 |
256K |
-40 Cel |
DUAL |
R-XDMA-P32 |
5.25 V |
Not Qualified |
2097152 bit |
4.75 V |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||||||||||||||||
Maxim Integrated |
NON-VOLATILE SRAM MODULE |
COMMERCIAL |
32 |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
CMOS |
PIN/PEG |
PARALLEL |
ASYNCHRONOUS |
262144 words |
3.3 |
8 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
256KX8 |
256K |
0 Cel |
TIN LEAD |
DUAL |
R-XDMA-P32 |
3.6 V |
Not Qualified |
2097152 bit |
3 V |
10 YEAR DATA RETENTION |
e0 |
150 ns |
||||||||||||||||||||||||||||
Maxim Integrated |
NON-VOLATILE SRAM MODULE |
COMMERCIAL |
32 |
DIP |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
CMOS |
PIN/PEG |
PARALLEL |
ASYNCHRONOUS |
50 mA |
131072 words |
3.3 |
3.3 |
8 |
MICROELECTRONIC ASSEMBLY |
DIP32,.6 |
SRAMs |
2.54 mm |
70 Cel |
128KX8 |
128K |
0 Cel |
TIN LEAD |
DUAL |
R-XDMA-P32 |
1 |
3.6 V |
Not Qualified |
1048576 bit |
3 V |
10 YEAR DATA RETENTION |
e0 |
.00015 Amp |
150 ns |
||||||||||||||||||||
Maxim Integrated |
NON-VOLATILE SRAM MODULE |
INDUSTRIAL |
32 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
85 mA |
262144 words |
5 |
5 |
8 |
IN-LINE |
DIP32,.6 |
SRAMs |
2.54 mm |
85 Cel |
256KX8 |
256K |
-40 Cel |
TIN LEAD |
DUAL |
R-PDIP-T32 |
5.5 V |
10.29 mm |
15.24 mm |
Not Qualified |
2097152 bit |
4.5 V |
DATA RETENTION = 10 YRS |
e0 |
.00015 Amp |
53.085 mm |
100 ns |
||||||||||||||||||
Maxim Integrated |
NON-VOLATILE SRAM MODULE |
COMMERCIAL |
32 |
DIP |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
CMOS |
PIN/PEG |
PARALLEL |
ASYNCHRONOUS |
85 mA |
524288 words |
3.3 |
3.3 |
8 |
MICROELECTRONIC ASSEMBLY |
DIP32,.6 |
SRAMs |
2.54 mm |
70 Cel |
512KX8 |
512K |
0 Cel |
TIN LEAD |
DUAL |
R-XDMA-P32 |
3.6 V |
Not Qualified |
4194304 bit |
3 V |
e0 |
.00015 Amp |
150 ns |
||||||||||||||||||||||
Maxim Integrated |
NON-VOLATILE SRAM MODULE |
INDUSTRIAL |
32 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
85 mA |
262144 words |
5 |
5 |
8 |
IN-LINE |
DIP32,.6 |
SRAMs |
2.54 mm |
85 Cel |
256KX8 |
256K |
-40 Cel |
TIN LEAD |
DUAL |
R-PDIP-T32 |
5.5 V |
9.27 mm |
15.24 mm |
Not Qualified |
2097152 bit |
4.5 V |
DATA RETENTION > 10 YEARS |
e0 |
.005 Amp |
53.085 mm |
85 ns |
||||||||||||||||||
Maxim Integrated |
NON-VOLATILE SRAM MODULE |
COMMERCIAL |
32 |
DIP |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
CMOS |
PIN/PEG |
PARALLEL |
ASYNCHRONOUS |
50 mA |
524288 words |
3.3 |
3.3 |
8 |
MICROELECTRONIC ASSEMBLY |
DIP32,.6 |
SRAMs |
2.54 mm |
70 Cel |
512KX8 |
512K |
0 Cel |
TIN LEAD |
DUAL |
R-XDMA-P32 |
3.6 V |
Not Qualified |
4194304 bit |
3 V |
e0 |
.00015 Amp |
100 ns |
||||||||||||||||||||||
Maxim Integrated |
NON-VOLATILE SRAM MODULE |
COMMERCIAL |
32 |
DIP |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
85 mA |
131072 words |
5 |
5 |
8 |
MICROELECTRONIC ASSEMBLY |
DIP32,.6 |
SRAMs |
2.54 mm |
70 Cel |
128KX8 |
128K |
0 Cel |
TIN LEAD |
DUAL |
R-XDMA-T32 |
5.5 V |
Not Qualified |
1048576 bit |
4.5 V |
e0 |
.005 Amp |
100 ns |
||||||||||||||||||||||
Maxim Integrated |
NON-VOLATILE SRAM MODULE |
INDUSTRIAL |
32 |
DIP |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
CMOS |
PIN/PEG |
PARALLEL |
ASYNCHRONOUS |
50 mA |
131072 words |
3.3 |
3.3 |
8 |
MICROELECTRONIC ASSEMBLY |
DIP32,.6 |
SRAMs |
2.54 mm |
85 Cel |
128KX8 |
128K |
-40 Cel |
TIN LEAD |
DUAL |
R-XDMA-P32 |
3.6 V |
Not Qualified |
1048576 bit |
3 V |
10 YEAR DATA RETENTION |
e0 |
.00015 Amp |
100 ns |
SRAM, or Static Random-Access Memory, is a type of volatile computer memory that stores data as a flip-flop, which retains the data as long as power is supplied to the system. SRAM is commonly used as cache memory and in other applications where high-speed access to data is required.
SRAM is a type of memory that is faster and more expensive than DRAM (Dynamic Random-Access Memory). It is commonly used as cache memory in computer systems and other digital devices to improve the speed of data access. SRAM is also used in applications where high-speed data processing is required, such as in networking equipment, video games, and other high-performance computing applications.
One of the advantages of using SRAM is that it provides faster access to data than other types of memory, such as DRAM. This is because SRAM does not need to be refreshed like DRAM, which makes it faster and more reliable. Additionally, SRAM uses less power than other types of memory, which makes it ideal for use in battery-powered devices.
One of the disadvantages of using SRAM is that it is more expensive and less dense than other types of memory, such as DRAM or flash memory. This means that it is not suitable for applications that require large amounts of memory at a low cost. Additionally, SRAM is volatile, which means that it cannot store data permanently.