OTHER SRAM 1,787

Reset All
Part RoHS Manufacturer Memory IC Type Temperature Grade No. of Terminals Package Code Refresh Cycles Package Shape Total Dose (V) Package Body Material Surface Mount No. of Functions Technology Screening Level Nominal Negative Supply Voltage Terminal Form Parallel or Serial Operating Mode Maximum Supply Current No. of Words Self Refresh Input/Output Type Nominal Supply Voltage / Vsup (V) Power Supplies (V) Memory Width Package Style (Meter) Package Equivalence Code Alternate Memory Width Sub-Category Terminal Pitch Maximum Operating Temperature Reverse Pinout Output Characteristics Organization No. of Words Code Minimum Standby Voltage Minimum Operating Temperature Terminal Finish Terminal Position No. of Ports JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Supply Voltage (Vsup) Maximum Seated Height Maximum Clock Frequency (fCLK) Width Qualification Memory Density Minimum Supply Voltage (Vsup) Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Output Enable Maximum Standby Current Length Maximum Access Time

K6R4016C1C-JE10

Samsung

STANDARD SRAM

OTHER

44

SOJ

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

J BEND

PARALLEL

ASYNCHRONOUS

200 mA

262144 words

COMMON

5

5

16

SMALL OUTLINE

SOJ44,.44

SRAMs

1.27 mm

85 Cel

3-STATE

256KX16

256K

4.5 V

-25 Cel

TIN LEAD

DUAL

R-PDSO-J44

5.5 V

3.76 mm

10.16 mm

Not Qualified

4194304 bit

4.5 V

e0

.01 Amp

28.58 mm

10 ns

KM68U1000CLRGE-8L

Samsung

STANDARD SRAM

OTHER

32

TSOP1-R

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

35 mA

131072 words

COMMON

3

3

8

SMALL OUTLINE, THIN PROFILE

TSSOP32,.56,20

SRAMs

.5 mm

85 Cel

YES

3-STATE

128KX8

128K

2 V

-25 Cel

TIN LEAD

DUAL

R-PDSO-G32

3.3 V

1.2 mm

8 mm

Not Qualified

1048576 bit

2.7 V

BATTERY BACKUP

e0

.000005 Amp

11.8 mm

85 ns

KM684002CTE-1000

Samsung

STANDARD SRAM

OTHER

44

TSOP2

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

524288 words

5

8

SMALL OUTLINE, THIN PROFILE

.8 mm

85 Cel

512KX8

512K

-25 Cel

DUAL

R-PDSO-G44

5.5 V

1.2 mm

10.16 mm

Not Qualified

4194304 bit

4.5 V

18.41 mm

10 ns

K6R4016C1C-TE150

Samsung

STANDARD SRAM

OTHER

44

TSOP

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

180 mA

262144 words

COMMON

5

5

16

SMALL OUTLINE, THIN PROFILE

TSOP44,.46,32

SRAMs

.8 mm

85 Cel

3-STATE

256KX16

256K

4.5 V

-25 Cel

DUAL

R-PDSO-G44

3

Not Qualified

4194304 bit

240

.01 Amp

15 ns

KM684002AE-20

Samsung

STANDARD SRAM

OTHER

36

SOJ

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

J BEND

PARALLEL

ASYNCHRONOUS

524288 words

5

8

SMALL OUTLINE

1.27 mm

85 Cel

3-STATE

512KX8

512K

-25 Cel

DUAL

1

R-PDSO-J36

5.5 V

3.76 mm

10.16 mm

Not Qualified

4194304 bit

4.5 V

YES

23.5 mm

20 ns

KM68U1000CLTE-8

Samsung

STANDARD SRAM

OTHER

32

TSOP1

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

131072 words

3

8

SMALL OUTLINE, THIN PROFILE

.5 mm

85 Cel

128KX8

128K

-25 Cel

DUAL

R-PDSO-G32

3.3 V

1.2 mm

8 mm

Not Qualified

1048576 bit

2.7 V

18.4 mm

85 ns

KM681000BLTE-10L

Samsung

STANDARD SRAM

OTHER

32

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

70 mA

131072 words

COMMON

5

5

8

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP32,.8,20

SRAMs

.5 mm

85 Cel

3-STATE

128KX8

128K

2 V

-25 Cel

TIN LEAD

DUAL

1

R-PDSO-G32

5.5 V

1.2 mm

8 mm

Not Qualified

1048576 bit

4.5 V

e0

YES

.000025 Amp

20 mm

100 ns

KM68U1000CLRGE-7L

Samsung

STANDARD SRAM

OTHER

32

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

40 mA

131072 words

COMMON

3

3

8

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP32,.56,20

SRAMs

.5 mm

85 Cel

YES

3-STATE

128KX8

128K

2 V

-25 Cel

TIN LEAD

DUAL

R-PDSO-G32

3

Not Qualified

1048576 bit

e0

.00002 Amp

70 ns

K6R4016C1C-FE15

Samsung

STANDARD SRAM

OTHER

48

TFBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

180 mA

262144 words

COMMON

5

5

16

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA48,6X8,30

SRAMs

.75 mm

85 Cel

3-STATE

256KX16

256K

4.5 V

-25 Cel

TIN LEAD

BOTTOM

S-PBGA-B48

5.5 V

1.2 mm

9 mm

Not Qualified

4194304 bit

4.5 V

e0

.01 Amp

9 mm

15 ns

KM68U512ALGE-8L

Samsung

STANDARD SRAM

OTHER

32

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

40 mA

65536 words

COMMON

3

3

8

SMALL OUTLINE

SOP32,.56

SRAMs

1.27 mm

85 Cel

3-STATE

64KX8

64K

2 V

-25 Cel

TIN LEAD

DUAL

R-PDSO-G32

3.3 V

3 mm

11.43 mm

Not Qualified

524288 bit

2.7 V

e0

.00001 Amp

20.47 mm

85 ns

KM684002CTE-1200

Samsung

STANDARD SRAM

OTHER

44

TSOP2

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

524288 words

5

8

SMALL OUTLINE, THIN PROFILE

.8 mm

85 Cel

512KX8

512K

-25 Cel

DUAL

R-PDSO-G44

5.5 V

1.2 mm

10.16 mm

Not Qualified

4194304 bit

4.5 V

18.41 mm

12 ns

KM68U1000BLTE-10L

Samsung

STANDARD SRAM

OTHER

32

TSOP1

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

40 mA

131072 words

COMMON

3

3

8

SMALL OUTLINE, THIN PROFILE

TSSOP32,.56,20

SRAMs

.5 mm

85 Cel

3-STATE

128KX8

128K

2 V

-25 Cel

TIN LEAD

DUAL

1

R-PDSO-G32

3.3 V

1.2 mm

8 mm

Not Qualified

1048576 bit

2.7 V

e0

YES

.000015 Amp

18.4 mm

100 ns

K6R4016C1C-TE10

Samsung

STANDARD SRAM

OTHER

44

TSOP2

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

200 mA

262144 words

COMMON

5

5

16

SMALL OUTLINE, THIN PROFILE

TSOP44,.46,32

SRAMs

.8 mm

85 Cel

3-STATE

256KX16

256K

4.5 V

-25 Cel

TIN LEAD

DUAL

R-PDSO-G44

5.5 V

1.2 mm

10.16 mm

Not Qualified

4194304 bit

4.5 V

e0

.01 Amp

18.41 mm

10 ns

K6R4016C1C-JE120

Samsung

STANDARD SRAM

OTHER

44

SOJ

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

J BEND

PARALLEL

ASYNCHRONOUS

190 mA

262144 words

COMMON

5

5

16

SMALL OUTLINE

SOJ44,.44

SRAMs

1.27 mm

85 Cel

3-STATE

256KX16

256K

4.5 V

-25 Cel

DUAL

R-PDSO-J44

3

Not Qualified

4194304 bit

240

.01 Amp

12 ns

K6R4004C1A-JE15T

Samsung

STANDARD SRAM

OTHER

32

SOJ

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

J BEND

PARALLEL

ASYNCHRONOUS

150 mA

1048576 words

COMMON

5

5

4

SMALL OUTLINE

SOJ32,.44

SRAMs

1.27 mm

85 Cel

3-STATE

1MX4

1M

4.5 V

-25 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDSO-J32

Not Qualified

4194304 bit

e0

.01 Amp

15 ns

K6R4008C1C-TE20T

Samsung

STANDARD SRAM

OTHER

44

TSOP

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

155 mA

524288 words

COMMON

5

5

8

SMALL OUTLINE, THIN PROFILE

TSOP44,.46,32

SRAMs

.8 mm

85 Cel

3-STATE

512KX8

512K

4.5 V

-25 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDSO-G44

Not Qualified

4194304 bit

e0

.01 Amp

20 ns

KM68U512ALGE-10L

Samsung

STANDARD SRAM

OTHER

32

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

40 mA

65536 words

COMMON

3

3

8

SMALL OUTLINE

SOP32,.56

SRAMs

1.27 mm

85 Cel

3-STATE

64KX8

64K

2 V

-25 Cel

TIN LEAD

DUAL

1

R-PDSO-G32

3.3 V

3 mm

11.43 mm

Not Qualified

524288 bit

2.7 V

e0

YES

.000015 Amp

20.47 mm

100 ns

KM68U1000CLGE-10L

Samsung

STANDARD SRAM

OTHER

32

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

35 mA

131072 words

COMMON

3

3

8

SMALL OUTLINE

SOP32,.56

SRAMs

1.27 mm

85 Cel

3-STATE

128KX8

128K

2 V

-25 Cel

TIN LEAD

DUAL

R-PDSO-G32

3.3 V

3 mm

11.43 mm

Not Qualified

1048576 bit

2.7 V

e0

.000005 Amp

20.47 mm

100 ns

K6R4016C1C-TE120

Samsung

STANDARD SRAM

OTHER

44

TSOP

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

190 mA

262144 words

COMMON

5

5

16

SMALL OUTLINE, THIN PROFILE

TSOP44,.46,32

SRAMs

.8 mm

85 Cel

3-STATE

256KX16

256K

4.5 V

-25 Cel

DUAL

R-PDSO-G44

3

Not Qualified

4194304 bit

240

.01 Amp

12 ns

MT45W2ML16BABB-851WT

Micron Technology

PSEUDO STATIC RAM

OTHER

54

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

2097152 words

1.8

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.75 mm

85 Cel

2MX16

2M

-25 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B54

1.95 V

1 mm

6 mm

Not Qualified

33554432 bit

1.7 V

e1

8 mm

85 ns

MT45W2MW16PFA-60LWT

Micron Technology

PSEUDO STATIC RAM

OTHER

48

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

2097152 words

1.8

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.75 mm

85 Cel

2MX16

2M

-30 Cel

TIN LEAD SILVER

BOTTOM

R-PBGA-B48

1.95 V

1 mm

6 mm

Not Qualified

33554432 bit

1.7 V

e0

8 mm

60 ns

MT45W2ML16BFB-706LWT

Micron Technology

PSEUDO STATIC RAM

OTHER

54

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

30 mA

2097152 words

COMMON

1.8

1.8,3

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA54,6X9,30

Other Memory ICs

.75 mm

85 Cel

3-STATE

2MX16

2M

-25 Cel

TIN LEAD SILVER

BOTTOM

R-PBGA-B54

1.95 V

1 mm

6 mm

Not Qualified

33554432 bit

1.7 V

SYNCHRONOUS BURST MODE POSSIBLE

e0

.00009 Amp

8 mm

70 ns

MT45W2MW16BBB-708WT

Micron Technology

PSEUDO STATIC RAM

OTHER

54

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

35 mA

2097152 words

COMMON

1.8

1.8,1.8/3

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA54,6X9,30

Other Memory ICs

.75 mm

85 Cel

3-STATE

2MX16

2M

-30 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B54

1.95 V

1 mm

6 mm

Not Qualified

33554432 bit

1.7 V

e1

260

.00011 Amp

8 mm

70 ns

MT45W2MV16BFB-601LWT

Micron Technology

PSEUDO STATIC RAM

OTHER

54

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

2097152 words

1.8

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.75 mm

85 Cel

2MX16

2M

-25 Cel

TIN LEAD SILVER

BOTTOM

R-PBGA-B54

1.95 V

1 mm

6 mm

Not Qualified

33554432 bit

1.7 V

e0

8 mm

60 ns

MT45W2MV16BABB-601WT

Micron Technology

PSEUDO STATIC RAM

OTHER

54

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

2097152 words

1.8

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.75 mm

85 Cel

2MX16

2M

-25 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B54

1.95 V

1 mm

6 mm

Not Qualified

33554432 bit

1.7 V

e1

8 mm

60 ns

MT45W4MV16PFA-60LWT

Micron Technology

PSEUDO STATIC RAM

OTHER

48

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

4194304 words

1.8

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.75 mm

85 Cel

4MX16

4M

-25 Cel

TIN LEAD SILVER

BOTTOM

R-PBGA-B48

1.95 V

1 mm

6 mm

Not Qualified

67108864 bit

1.7 V

e0

8 mm

60 ns

MT45W2ML16BAFB-701LWT

Micron Technology

PSEUDO STATIC RAM

OTHER

54

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

2097152 words

1.8

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.75 mm

85 Cel

2MX16

2M

-25 Cel

TIN LEAD SILVER

BOTTOM

R-PBGA-B54

1.95 V

1 mm

6 mm

Not Qualified

33554432 bit

1.7 V

e0

8 mm

70 ns

MT45W4MW16PFA-60WT

Micron Technology

PSEUDO STATIC RAM

OTHER

48

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

4194304 words

1.8

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.75 mm

85 Cel

4MX16

4M

-30 Cel

TIN LEAD SILVER

BOTTOM

R-PBGA-B48

1.95 V

1 mm

6 mm

Not Qualified

67108864 bit

1.7 V

e0

8 mm

60 ns

MT45W2MW16PABA-60LWT

Micron Technology

PSEUDO STATIC RAM

OTHER

48

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

2097152 words

1.8

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.75 mm

85 Cel

2MX16

2M

-25 Cel

Tin/Silver/Copper (Sn98.5Ag1.0Cu0.5)

BOTTOM

R-PBGA-B48

1.95 V

1 mm

6 mm

Not Qualified

33554432 bit

1.7 V

e8

30

260

8 mm

60 ns

MT45W2MV16PAFA-70WT

Micron Technology

PSEUDO STATIC RAM

OTHER

48

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

2097152 words

1.8

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.75 mm

85 Cel

2MX16

2M

-25 Cel

TIN LEAD SILVER

BOTTOM

R-PBGA-B48

1.95 V

1 mm

6 mm

Not Qualified

33554432 bit

1.7 V

e0

8 mm

70 ns

MT45W2MW16BAFB-708WT

Micron Technology

PSEUDO STATIC RAM

OTHER

54

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

35 mA

2097152 words

COMMON

1.8

1.8,1.8/3

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA54,6X9,30

Other Memory ICs

.75 mm

85 Cel

3-STATE

2MX16

2M

-30 Cel

TIN LEAD

BOTTOM

R-PBGA-B54

1.95 V

1 mm

6 mm

Not Qualified

33554432 bit

1.7 V

e0

.00011 Amp

8 mm

70 ns

MT45W2ML16BAFB-856WT

Micron Technology

PSEUDO STATIC RAM

OTHER

54

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

2097152 words

1.8

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.75 mm

85 Cel

2MX16

2M

-25 Cel

TIN LEAD SILVER

BOTTOM

R-PBGA-B54

1.95 V

1 mm

6 mm

Not Qualified

33554432 bit

1.7 V

e0

8 mm

85 ns

MT45W2ML16BFB-706WT

Micron Technology

PSEUDO STATIC RAM

OTHER

54

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

30 mA

2097152 words

COMMON

1.8

1.8,3

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA54,6X9,30

Other Memory ICs

.75 mm

85 Cel

3-STATE

2MX16

2M

-25 Cel

TIN LEAD SILVER

BOTTOM

R-PBGA-B54

1.95 V

1 mm

6 mm

Not Qualified

33554432 bit

1.7 V

SYNCHRONOUS BURST MODE POSSIBLE

e0

.00011 Amp

8 mm

70 ns

MT45W4MV16BFB-858WT

Micron Technology

PSEUDO STATIC RAM

OTHER

54

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

35 mA

4194304 words

COMMON

1.8

1.8,2.5

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA54,6X9,30

Other Memory ICs

.75 mm

85 Cel

3-STATE

4MX16

4M

-25 Cel

TIN LEAD SILVER

BOTTOM

R-PBGA-B54

1.95 V

1 mm

6 mm

Not Qualified

67108864 bit

1.7 V

e0

.00012 Amp

8 mm

85 ns

TTS92256GK-25C-12

Micron Technology

STANDARD SRAM

OTHER

28

QCCN

RECTANGULAR

CERAMIC

YES

CMOS

NO LEAD

PARALLEL

ASYNCHRONOUS

110 mA

65536 words

COMMON

5

5

4

CHIP CARRIER

LCC28,.35X.55

SRAMs

1.27 mm

85 Cel

3-STATE

64KX4

64K

2 V

-55 Cel

QUAD

R-XQCC-N28

Not Qualified

262144 bit

.0003 Amp

25 ns

MT45W4ML16BBB-856LWT

Micron Technology

PSEUDO STATIC RAM

OTHER

54

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

30 mA

4194304 words

COMMON

1.8

1.8,3

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA54,6X9,30

Other Memory ICs

.75 mm

85 Cel

3-STATE

4MX16

4M

-25 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B54

1.95 V

1 mm

6 mm

Not Qualified

67108864 bit

1.7 V

SYNCHRONOUS BURST MODE POSSIBLE

e1

260

.0001 Amp

8 mm

85 ns

MT45W2ML16PFA-85LWT

Micron Technology

PSEUDO STATIC RAM

OTHER

48

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

20 mA

2097152 words

COMMON

1.8

1.8,3

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA48,6X8,30

Other Memory ICs

.75 mm

85 Cel

3-STATE

2MX16

2M

-25 Cel

TIN LEAD SILVER

BOTTOM

R-PBGA-B48

1.95 V

1 mm

6 mm

Not Qualified

33554432 bit

1.7 V

e0

.00009 Amp

8 mm

85 ns

MT45W1MV16PABA-85WT

Micron Technology

PSEUDO STATIC RAM

OTHER

48

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

1048576 words

1.8

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.75 mm

85 Cel

1MX16

1M

-25 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B48

1.95 V

1 mm

6 mm

Not Qualified

16777216 bit

1.7 V

e1

8 mm

85 ns

MT45W2MW16BFB-706LWT

Micron Technology

PSEUDO STATIC RAM

OTHER

54

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

30 mA

2097152 words

COMMON

1.8

1.8,1.8/3

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA54,6X9,30

Other Memory ICs

.75 mm

85 Cel

3-STATE

2MX16

2M

-30 Cel

TIN LEAD

BOTTOM

R-PBGA-B54

1.95 V

1 mm

6 mm

Not Qualified

33554432 bit

1.7 V

SYNCHRONOUS BURST MODE POSSIBLE

e0

.00009 Amp

8 mm

70 ns

MT45W2MV16BFB-606LWT

Micron Technology

PSEUDO STATIC RAM

OTHER

54

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

2097152 words

1.8

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.75 mm

85 Cel

2MX16

2M

-25 Cel

TIN LEAD SILVER

BOTTOM

R-PBGA-B54

1.95 V

1 mm

6 mm

Not Qualified

33554432 bit

1.7 V

e0

8 mm

60 ns

MT45W4MW16BFB-706LWT

Micron Technology

PSEUDO STATIC RAM

OTHER

54

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

30 mA

4194304 words

COMMON

1.8

1.8,1.8/3

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA54,6X9,30

Other Memory ICs

.75 mm

85 Cel

3-STATE

4MX16

4M

-30 Cel

TIN LEAD

BOTTOM

R-PBGA-B54

1.95 V

1 mm

6 mm

Not Qualified

67108864 bit

1.7 V

SYNCHRONOUS BURST MODE POSSIBLE

e0

.0001 Amp

8 mm

70 ns

MT45W4MV16BFB-851WT

Micron Technology

PSEUDO STATIC RAM

OTHER

54

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

35 mA

4194304 words

COMMON

1.8

1.8,2.5

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA54,6X9,30

Other Memory ICs

.75 mm

85 Cel

3-STATE

4MX16

4M

-25 Cel

TIN LEAD SILVER

BOTTOM

R-PBGA-B54

1.95 V

1 mm

6 mm

Not Qualified

67108864 bit

1.7 V

e0

.00012 Amp

8 mm

85 ns

MT45W2MV16BABB-851LWT

Micron Technology

PSEUDO STATIC RAM

OTHER

54

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

2097152 words

1.8

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.75 mm

85 Cel

2MX16

2M

-25 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B54

1.95 V

1 mm

6 mm

Not Qualified

33554432 bit

1.7 V

e1

8 mm

85 ns

MT45W2MV16PFA-85WT

Micron Technology

PSEUDO STATIC RAM

OTHER

48

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

20 mA

2097152 words

COMMON

1.8

1.8,2.5

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA48,6X8,30

Other Memory ICs

.75 mm

85 Cel

3-STATE

2MX16

2M

-25 Cel

TIN LEAD

BOTTOM

R-PBGA-B48

1.95 V

1 mm

6 mm

Not Qualified

33554432 bit

1.7 V

e0

.00011 Amp

8 mm

85 ns

MT45W2MW16BAFB-701WT

Micron Technology

PSEUDO STATIC RAM

OTHER

54

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

2097152 words

1.8

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.75 mm

85 Cel

2MX16

2M

-30 Cel

TIN LEAD SILVER

BOTTOM

R-PBGA-B54

1.95 V

1 mm

6 mm

Not Qualified

33554432 bit

1.7 V

e0

8 mm

70 ns

MT45W4MV16BBB-851WT

Micron Technology

PSEUDO STATIC RAM

OTHER

54

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

35 mA

4194304 words

COMMON

1.8

1.8,2.5

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA54,6X9,30

Other Memory ICs

.75 mm

85 Cel

3-STATE

4MX16

4M

-25 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B54

1.95 V

1 mm

6 mm

Not Qualified

67108864 bit

1.7 V

e1

260

.00012 Amp

8 mm

85 ns

MT45W2MV16PABA-85WT

Micron Technology

PSEUDO STATIC RAM

OTHER

48

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

2097152 words

1.8

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.75 mm

85 Cel

2MX16

2M

-25 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B48

1.95 V

1 mm

6 mm

Not Qualified

33554432 bit

1.7 V

e1

8 mm

85 ns

MT45W2MW16BABB-606LWT

Micron Technology

PSEUDO STATIC RAM

OTHER

54

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

2097152 words

1.8

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.75 mm

85 Cel

2MX16

2M

-30 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B54

1.95 V

1 mm

6 mm

Not Qualified

33554432 bit

1.7 V

e1

260

8 mm

60 ns

SRAM

SRAM, or Static Random-Access Memory, is a type of volatile computer memory that stores data as a flip-flop, which retains the data as long as power is supplied to the system. SRAM is commonly used as cache memory and in other applications where high-speed access to data is required.

SRAM is a type of memory that is faster and more expensive than DRAM (Dynamic Random-Access Memory). It is commonly used as cache memory in computer systems and other digital devices to improve the speed of data access. SRAM is also used in applications where high-speed data processing is required, such as in networking equipment, video games, and other high-performance computing applications.

One of the advantages of using SRAM is that it provides faster access to data than other types of memory, such as DRAM. This is because SRAM does not need to be refreshed like DRAM, which makes it faster and more reliable. Additionally, SRAM uses less power than other types of memory, which makes it ideal for use in battery-powered devices.

One of the disadvantages of using SRAM is that it is more expensive and less dense than other types of memory, such as DRAM or flash memory. This means that it is not suitable for applications that require large amounts of memory at a low cost. Additionally, SRAM is volatile, which means that it cannot store data permanently.