Part | RoHS | Manufacturer | Other IC type | Temperature Grade | No. of Terminals | Package Code | Package Shape | Surface Mount | Total Dose (V) | Maximum Switching Frequency | Package Body Material | Maximum Supply Current (Isup) | No. of Functions | No. of Channels | Technology | Screening Level | Nominal Bandwidth | Terminal Form | Maximum Negative Supply Voltage (Vsup) | Nominal Negative Supply Voltage (Vsup) | Nominal Supply Voltage (Vsup) | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Control Mode | Minimum Operating Temperature | Terminal Finish | Terminal Position | JESD-30 Code | Output (V) | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Maximum Signal Current | Height | Width (mm) | Qualification | Normal Position (V) | Nominal Off-state Isolation | Minimum Supply Voltage (Vsup) | Additional Features | Minimum Input Voltage | Minimum Negative Supply Voltage (Vsup) | JESD-609 Code | Switching (V) | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Maximum Switch-on Time | Maximum On-state Resistance (Ron) | Nominal Threshold Voltage (V) | Maximum Switch-off Time | Maximum Positive Input Voltage | Nominal On-state Resistance Match | Length | Adjustable Threshold | Maximum Input Voltage |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Onsemi |
DPDT |
INDUSTRIAL |
10 |
TSSOP |
SQUARE |
YES |
PLASTIC/EPOXY |
1 |
4 |
GULL WING |
3.3 V |
3/4.3 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP10,.19,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
S-PDSO-G10 |
SEPARATE OUTPUT |
1 |
4.3 V |
1.1 mm |
3 mm |
Not Qualified |
30 dB |
3 V |
e4 |
BREAK-BEFORE-MAKE |
30 |
260 |
30 ns |
6.5 ohm |
25 ns |
.65 ohm |
3 mm |
||||||||||||||||||||
|
Onsemi |
DPDT |
INDUSTRIAL |
10 |
VQCCN |
RECTANGULAR |
YES |
UNSPECIFIED |
1 |
4 |
NO LEAD |
3.3 V |
3/4.3 |
CHIP CARRIER, VERY THIN PROFILE |
LCC10,.06X.07,16 |
Multiplexer or Switches |
.4 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
R-XQCC-N10 |
SEPARATE OUTPUT |
1 |
4.3 V |
.55 mm |
1.4 mm |
Not Qualified |
30 dB |
3 V |
e4 |
BREAK-BEFORE-MAKE |
30 |
260 |
30 ns |
6.5 ohm |
25 ns |
.65 ohm |
1.8 mm |
||||||||||||||||||||
|
Onsemi |
DPDT |
INDUSTRIAL |
10 |
TSSOP |
SQUARE |
YES |
PLASTIC/EPOXY |
1 |
2 |
GULL WING |
3.3 V |
3.3 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP10,.19,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
S-PDSO-G10 |
SEPARATE OUTPUT |
1 |
4.3 V |
1.1 mm |
3 mm |
Not Qualified |
30 dB |
3 V |
e4 |
BREAK-BEFORE-MAKE |
30 |
260 |
30 ns |
10 ohm |
25 ns |
.35 ohm |
3 mm |
||||||||||||||||||||
|
Onsemi |
DPDT |
INDUSTRIAL |
10 |
VQCCN |
RECTANGULAR |
YES |
UNSPECIFIED |
1 |
2 |
NO LEAD |
3.3 V |
3/4.2,5 |
CHIP CARRIER, VERY THIN PROFILE |
LCC10,.06X.08,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
R-XQCC-N10 |
SEPARATE OUTPUT |
1 |
3.6 V |
.55 mm |
1.6 mm |
Not Qualified |
37 dB |
3 V |
e4 |
BREAK-BEFORE-MAKE |
30 |
260 |
10000 ns |
5 ohm |
10000 ns |
.4 ohm |
2.1 mm |
||||||||||||||||||||
|
Onsemi |
DPDT |
INDUSTRIAL |
25 |
UFBGA |
SQUARE |
YES |
PLASTIC/EPOXY |
1 |
2 |
BALL |
GRID ARRAY, ULTRA THIN PROFILE, FINE PITCH |
BGA24,5X5,20 |
.4 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B25 |
1 |
5.5 V |
.625 mm |
2 mm |
100 dB |
2.7 V |
e1 |
BREAK-BEFORE-MAKE |
30 |
260 |
2 mm |
|||||||||||||||||||||||||||||
|
Analog Devices |
DPDT |
INDUSTRIAL |
16 |
TSSOP |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
4 |
BICMOS |
GULL WING |
3.3,10/70/+-35 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP16,.25 |
Multiplexer or Switches |
.635 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
R-PDSO-G16 |
SEPARATE OUTPUT |
1 |
Not Qualified |
NO |
e3 |
BREAK-BEFORE-MAKE |
30 |
260 |
60000 ns |
10 ohm |
||||||||||||||||||||||||||||
|
Onsemi |
DPDT |
INDUSTRIAL |
10 |
VQCCN |
RECTANGULAR |
YES |
UNSPECIFIED |
1 |
2 |
NO LEAD |
3.3 V |
3/4.2,5 |
CHIP CARRIER, VERY THIN PROFILE |
LCC10,.06X.07,16 |
Multiplexer or Switches |
.4 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
R-XQCC-N10 |
SEPARATE OUTPUT |
1 |
3.6 V |
.55 mm |
1.4 mm |
Not Qualified |
37 dB |
3 V |
e4 |
BREAK-BEFORE-MAKE |
30 |
260 |
10000 ns |
5 ohm |
10000 ns |
.4 ohm |
1.8 mm |
||||||||||||||||||||
|
Analog Devices |
DPDT |
AUTOMOTIVE |
16 |
TSSOP |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
2 |
1 |
CMOS |
GULL WING |
2.7 V |
3/5 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP16,.25 |
Multiplexer or Switches |
.65 mm |
125 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G16 |
SEPARATE OUTPUT |
1 |
5.5 V |
1.2 mm |
4.4 mm |
Not Qualified |
67 dB |
1.8 V |
e3 |
BREAK-BEFORE-MAKE |
30 |
260 |
50 ns |
.7 ohm |
22 ns |
.045 ohm |
5 mm |
|||||||||||||||||||
|
Texas Instruments |
DPDT |
INDUSTRIAL |
10 |
VQCCN |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
.05 mA |
1 |
2 |
6100 kHz |
NO LEAD |
3.3 V |
CHIP CARRIER, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
R-PQCC-N10 |
SEPARATE OUTPUT |
1 |
4.3 V |
.6 mm |
1.5 mm |
34 dB |
2.7 V |
0 V |
e4 |
BREAK-BEFORE-MAKE |
30 |
260 |
9 ohm |
.1 ohm |
2 mm |
3.6 V |
||||||||||||||||||||||
|
Onsemi |
DPDT |
INDUSTRIAL |
10 |
VQCCN |
RECTANGULAR |
YES |
UNSPECIFIED |
1 |
2 |
NO LEAD |
3.3 V |
3.3 |
CHIP CARRIER, VERY THIN PROFILE |
LCC10,.06X.07,16 |
Multiplexer or Switches |
.4 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
R-XQCC-N10 |
SEPARATE OUTPUT |
1 |
4.3 V |
.55 mm |
1.4 mm |
Not Qualified |
30 dB |
3 V |
e4 |
BREAK-BEFORE-MAKE |
30 |
260 |
30 ns |
10 ohm |
25 ns |
.35 ohm |
1.8 mm |
||||||||||||||||||||
|
Onsemi |
DPDT |
INDUSTRIAL |
16 |
QCCN |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
1 |
CMOS |
NO LEAD |
1.8/4 |
CHIP CARRIER |
LCC16,.07X.1,16 |
Multiplexer or Switches |
.4 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
R-PQCC-N16 |
SEPARATE OUTPUT |
1 |
Not Qualified |
e4 |
BREAK-BEFORE-MAKE |
30 |
260 |
80 ns |
6 ohm |
|||||||||||||||||||||||||||||
|
Onsemi |
DPDT |
INDUSTRIAL |
10 |
TSSOP |
SQUARE |
YES |
PLASTIC/EPOXY |
1 |
2 |
GULL WING |
3.3 V |
3/4.2,5 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP10,.19,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
S-PDSO-G10 |
SEPARATE OUTPUT |
1 |
3.6 V |
1.1 mm |
3 mm |
Not Qualified |
37 dB |
3 V |
e4 |
BREAK-BEFORE-MAKE |
30 |
260 |
10000 ns |
5 ohm |
10000 ns |
.4 ohm |
3 mm |
||||||||||||||||||||
|
Analog Devices |
DPDT |
AUTOMOTIVE |
16 |
TSSOP |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
2 |
1 |
CMOS |
GULL WING |
2.7 V |
3/5 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP16,.25 |
Multiplexer or Switches |
.65 mm |
125 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G16 |
SEPARATE OUTPUT |
1 |
5.5 V |
1.2 mm |
4.4 mm |
Not Qualified |
67 dB |
1.8 V |
e3 |
BREAK-BEFORE-MAKE |
30 |
260 |
50 ns |
.7 ohm |
22 ns |
.045 ohm |
5 mm |
|||||||||||||||||||
|
Onsemi |
DPDT |
INDUSTRIAL |
10 |
VQCCN |
RECTANGULAR |
YES |
UNSPECIFIED |
1 |
2 |
NO LEAD |
3 V |
3/5 |
CHIP CARRIER, VERY THIN PROFILE |
LCC10,.06X.07,16 |
Multiplexer or Switches |
.4 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
R-XQCC-N10 |
SEPARATE OUTPUT |
1 |
5.5 V |
.55 mm |
1.4 mm |
Not Qualified |
2.7 V |
e4 |
30 |
260 |
2000 ns |
6 ohm |
2000 ns |
.4 ohm |
1.8 mm |
||||||||||||||||||||||
|
Analog Devices |
DPDT |
AUTOMOTIVE |
16 |
HVQCCN |
SQUARE |
YES |
UNSPECIFIED |
2 |
1 |
CMOS |
NO LEAD |
2.7 V |
3/5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC16,.16SQ,25 |
Multiplexer or Switches |
.65 mm |
125 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N16 |
SEPARATE OUTPUT |
3 |
5.5 V |
1 mm |
4 mm |
Not Qualified |
67 dB |
1.8 V |
e3 |
BREAK-BEFORE-MAKE |
260 |
50 ns |
.7 ohm |
22 ns |
.045 ohm |
4 mm |
||||||||||||||||||||
|
NXP Semiconductors |
DPDT |
AUTOMOTIVE |
10 |
VQCCN |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
1 |
2 |
NO LEAD |
3.3 V |
3/4.3 |
CHIP CARRIER, VERY THIN PROFILE |
LCC10,.06X.07,16 |
Multiplexer or Switches |
.4 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
R-PQCC-N10 |
SEPARATE OUTPUT |
1 |
4.3 V |
.5 mm |
1.4 mm |
Not Qualified |
30 dB |
3 V |
e4 |
BREAK-BEFORE-MAKE |
30 |
260 |
40 ns |
10 ohm |
30 ns |
.65 ohm |
1.8 mm |
||||||||||||||||||||
|
Analog Devices |
DPDT |
AUTOMOTIVE |
16 |
TSSOP |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
2 |
1 |
CMOS |
GULL WING |
2.7 V |
3/5 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP16,.25 |
Multiplexer or Switches |
.65 mm |
125 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G16 |
SEPARATE OUTPUT |
1 |
5.5 V |
1.2 mm |
4.4 mm |
Not Qualified |
67 dB |
1.8 V |
e3 |
BREAK-BEFORE-MAKE |
30 |
260 |
50 ns |
.7 ohm |
22 ns |
.045 ohm |
5 mm |
|||||||||||||||||||
|
Onsemi |
DPDT |
INDUSTRIAL |
10 |
TSSOP |
SQUARE |
YES |
PLASTIC/EPOXY |
1 |
2 |
GULL WING |
3.3 V |
3.3,5 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP10,.19,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
DUAL |
S-PDSO-G10 |
SEPARATE OUTPUT |
1 |
3.6 V |
1.1 mm |
3 mm |
Not Qualified |
37 dB |
2.7 V |
30 |
260 |
10000 ns |
1 ohm |
10000 ns |
.01 ohm |
3 mm |
|||||||||||||||||||||||
|
Onsemi |
DPDT |
INDUSTRIAL |
10 |
VQCCN |
RECTANGULAR |
YES |
UNSPECIFIED |
1 |
2 |
NO LEAD |
3 V |
CHIP CARRIER, VERY THIN PROFILE |
.4 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
R-XQCC-N10 |
1 |
3.7 V |
.6 mm |
1.4 mm |
25 dB |
2.7 V |
e4 |
30 |
260 |
6.63 ohm |
.2 ohm |
1.8 mm |
||||||||||||||||||||||||||||
|
Onsemi |
DPDT |
INDUSTRIAL |
12 |
VQCCN |
RECTANGULAR |
YES |
UNSPECIFIED |
2 |
2 |
NO LEAD |
3.3 V |
3.3 |
CHIP CARRIER, VERY THIN PROFILE |
LCC12,.07X.08,16 |
Multiplexer or Switches |
.4 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
R-XQCC-N12 |
SEPARATE OUTPUT |
1 |
4.5 V |
.55 mm |
1.7 mm |
Not Qualified |
60 dB |
1.65 V |
e4 |
BREAK-BEFORE-MAKE |
30 |
260 |
30 ns |
6 ohm |
25 ns |
.35 ohm |
2 mm |
||||||||||||||||||||
|
Onsemi |
DPDT |
INDUSTRIAL |
10 |
VQCCN |
RECTANGULAR |
YES |
UNSPECIFIED |
1 |
2 |
NO LEAD |
3.3 V |
3.3 |
CHIP CARRIER, VERY THIN PROFILE |
LCC10,.06X.08,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
R-XQCC-N10 |
SEPARATE OUTPUT |
1 |
4.3 V |
.55 mm |
1.6 mm |
Not Qualified |
30 dB |
3 V |
e4 |
BREAK-BEFORE-MAKE |
30 |
260 |
30 ns |
10 ohm |
25 ns |
.35 ohm |
2.1 mm |
||||||||||||||||||||
|
Analog Devices |
DPDT |
INDUSTRIAL |
10 |
VQCCN |
RECTANGULAR |
YES |
UNSPECIFIED |
1 |
2 |
BICMOS |
NO LEAD |
3 V |
CHIP CARRIER, VERY THIN PROFILE |
.4 mm |
85 Cel |
-40 Cel |
NICKEL GOLD PALLADIUM |
QUAD |
R-XQCC-N10 |
1 |
5 V |
.55 mm |
1.4 mm |
65 dB |
2.7 V |
30 |
260 |
60000 ns |
5 ohm |
5000 ns |
.2 ohm |
1.8 mm |
||||||||||||||||||||||||||
|
Analog Devices |
DPDT |
INDUSTRIAL |
10 |
HVSSOP |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
1 |
2 |
BICMOS |
GULL WING |
2.5 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE, SHRINK PITCH |
.4 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
R-PDSO-G10 |
1 |
5.5 V |
.8 mm |
2 mm |
60 dB |
1.6 V |
e3 |
30 |
260 |
250000 ns |
.55 ohm |
30000 ns |
.005 ohm |
2.5 mm |
|||||||||||||||||||||||||
|
Onsemi |
DPDT |
INDUSTRIAL |
16 |
VQCCN |
RECTANGULAR |
YES |
UNSPECIFIED |
2 |
2 |
NO LEAD |
3 V |
1.8/4 |
CHIP CARRIER, VERY THIN PROFILE |
LCC16,.07X.1,16 |
Multiplexer or Switches |
.4 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
R-XQCC-N16 |
SEPARATE OUTPUT |
1 |
4.3 V |
.8 mm |
1.8 mm |
Not Qualified |
67 dB |
1.65 V |
e4 |
BREAK-BEFORE-MAKE |
30 |
260 |
40 ns |
3 ohm |
30 ns |
.8 ohm |
2.6 mm |
||||||||||||||||||||
|
Texas Instruments |
DPDT |
INDUSTRIAL |
16 |
VQCCN |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
.07 mA |
1 |
2 |
5500 kHz |
NO LEAD |
3.3 V |
CHIP CARRIER, VERY THIN PROFILE |
.4 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
R-PQCC-N16 |
SEPARATE OUTPUT |
1 |
4.3 V |
.55 mm |
1.8 mm |
37 dB |
2.7 V |
0 V |
e4 |
30 |
260 |
400 ns |
400 ns |
.4 ohm |
2.6 mm |
3.6 V |
||||||||||||||||||||||
|
Analog Devices |
DPDT |
INDUSTRIAL |
8 |
HVSON |
SQUARE |
YES |
PLASTIC/EPOXY |
.275 mA |
1 |
2 |
BICMOS |
NO LEAD |
3.3 V |
2.5/5 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.08,20 |
Power Management Circuits |
.5 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
S-PDSO-N8 |
1 |
5.5 V |
.8 mm |
2 mm |
Not Qualified |
2.3 V |
e3 |
30 |
260 |
.05 ohm |
2 mm |
||||||||||||||||||||||||
|
Analog Devices |
DPDT |
INDUSTRIAL |
9 |
FBGA |
SQUARE |
YES |
PLASTIC/EPOXY |
1 |
BICMOS |
BALL |
1.8/5 |
GRID ARRAY, FINE PITCH |
BGA9,3X3,16 |
Multiplexer or Switches |
.4 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER NICKEL |
BOTTOM |
S-PBGA-B9 |
SEPARATE OUTPUT |
1 |
Not Qualified |
e2 |
BREAK-BEFORE-MAKE |
30 |
260 |
250000 ns |
.55 ohm |
|||||||||||||||||||||||||||||
|
Onsemi |
DPDT |
INDUSTRIAL |
10 |
VQCCN |
RECTANGULAR |
YES |
UNSPECIFIED |
1 |
2 |
NO LEAD |
3.3 V |
3/4.3 |
CHIP CARRIER, VERY THIN PROFILE |
LCC10,.06X.07,16 |
Multiplexer or Switches |
.4 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
R-XQCC-N10 |
SEPARATE OUTPUT |
1 |
4.3 V |
.55 mm |
1.4 mm |
Not Qualified |
30 dB |
3 V |
e4 |
BREAK-BEFORE-MAKE |
30 |
260 |
30 ns |
6.5 ohm |
25 ns |
.65 ohm |
1.8 mm |
||||||||||||||||||||
|
Vishay Intertechnology |
DPDT |
INDUSTRIAL |
8 |
TSSOP |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
2 |
CMOS |
GULL WING |
3/5 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.1 |
Multiplexer or Switches |
.635 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G8 |
SEPARATE OUTPUT |
1 |
Not Qualified |
NO |
e3 |
BREAK-BEFORE-MAKE |
30 |
260 |
35 ns |
7 ohm |
||||||||||||||||||||||||||||
|
Analog Devices |
DPDT |
INDUSTRIAL |
16 |
VFBGA |
SQUARE |
YES |
PLASTIC/EPOXY |
2 |
1 |
CMOS |
BALL |
2.7 V |
3/5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA16,4X4,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B16 |
SEPARATE OUTPUT |
1 |
5.5 V |
.65 mm |
2 mm |
Not Qualified |
67 dB |
1.8 V |
e1 |
BREAK-BEFORE-MAKE |
260 |
50 ns |
.7 ohm |
22 ns |
.045 ohm |
2 mm |
||||||||||||||||||||
|
Analog Devices |
DPDT |
INDUSTRIAL |
16 |
VFBGA |
SQUARE |
YES |
PLASTIC/EPOXY |
2 |
1 |
CMOS |
BALL |
2.7 V |
3/5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA16,4X4,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B16 |
SEPARATE OUTPUT |
1 |
5.5 V |
.65 mm |
2 mm |
Not Qualified |
67 dB |
1.8 V |
e1 |
BREAK-BEFORE-MAKE |
30 |
260 |
50 ns |
.7 ohm |
22 ns |
.045 ohm |
2 mm |
|||||||||||||||||||
|
Analog Devices |
DPDT |
AUTOMOTIVE |
16 |
HVQCCN |
SQUARE |
YES |
UNSPECIFIED |
2 |
1 |
CMOS |
NO LEAD |
2.7 V |
3/5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC16,.16SQ,25 |
Multiplexer or Switches |
.65 mm |
125 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N16 |
SEPARATE OUTPUT |
3 |
5.5 V |
1 mm |
4 mm |
Not Qualified |
67 dB |
1.8 V |
e3 |
BREAK-BEFORE-MAKE |
260 |
50 ns |
.7 ohm |
22 ns |
.045 ohm |
4 mm |
||||||||||||||||||||
|
Onsemi |
DPDT |
INDUSTRIAL |
10 |
VQCCN |
RECTANGULAR |
YES |
UNSPECIFIED |
1 |
2 |
NO LEAD |
3.3 V |
3.3,5 |
CHIP CARRIER, VERY THIN PROFILE |
LCC10,.06X.08,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
R-XQCC-N10 |
SEPARATE OUTPUT |
1 |
3.6 V |
.55 mm |
1.6 mm |
Not Qualified |
37 dB |
2.7 V |
e4 |
30 |
260 |
10000 ns |
1 ohm |
10000 ns |
.01 ohm |
2.1 mm |
|||||||||||||||||||||
|
Maxim Integrated |
DPDT |
NICKEL GOLD PALLADIUM |
1 |
30 |
260 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
Onsemi |
DPDT |
MILITARY |
16 |
HVQCCN |
SQUARE |
YES |
UNSPECIFIED |
2 |
2 |
CMOS |
NO LEAD |
2.5 V |
2/5.5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC16,.12SQ,20 |
Multiplexer or Switches |
.5 mm |
125 Cel |
-55 Cel |
TIN LEAD |
QUAD |
S-XQCC-N16 |
SEPARATE OUTPUT |
5.5 V |
1 mm |
3 mm |
Not Qualified |
93 dB |
2 V |
e0 |
BREAK-BEFORE-MAKE |
235 |
41 ns |
105 ohm |
18 ns |
3 mm |
|||||||||||||||||||||||
Onsemi |
DPDT |
MILITARY |
16 |
HVQCCN |
SQUARE |
YES |
UNSPECIFIED |
2 |
2 |
CMOS |
NO LEAD |
2.5 V |
2.5/5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC16,.12SQ,20 |
Multiplexer or Switches |
.5 mm |
125 Cel |
-55 Cel |
TIN LEAD |
QUAD |
S-XQCC-N16 |
SEPARATE OUTPUT |
5.5 V |
1 mm |
3 mm |
Not Qualified |
NC |
93 dB |
2 V |
e0 |
BREAK-BEFORE-MAKE |
235 |
35 ns |
105 ohm |
12 ns |
3 mm |
||||||||||||||||||||||
|
Onsemi |
DPDT |
INDUSTRIAL |
16 |
VQCCN |
RECTANGULAR |
YES |
UNSPECIFIED |
2 |
1 |
NO LEAD |
3.3 V |
3/3.3 |
CHIP CARRIER, VERY THIN PROFILE |
LCC16,.07X.1,16 |
Multiplexer or Switches |
.4 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
R-XQCC-N16 |
SEPARATE OUTPUT |
1 |
3.6 V |
.55 mm |
1.8 mm |
Not Qualified |
45 dB |
2.7 V |
e4 |
BREAK-BEFORE-MAKE |
30 |
260 |
7 ns |
7 ohm |
4 ns |
.3 ohm |
2.6 mm |
||||||||||||||||||||
|
Analog Devices |
DPDT |
NICKEL GOLD PALLADIUM |
1 |
30 |
260 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Onsemi |
DPDT |
MILITARY |
16 |
VQCCN |
RECTANGULAR |
YES |
UNSPECIFIED |
2 |
2 |
CMOS |
NO LEAD |
2.5 V |
2/5.5 |
CHIP CARRIER, VERY THIN PROFILE |
LCC16,.07X.1,16 |
Multiplexer or Switches |
.4 mm |
125 Cel |
-55 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
R-XQCC-N16 |
SEPARATE OUTPUT |
1 |
5.5 V |
.8 mm |
1.8 mm |
Not Qualified |
93 dB |
2 V |
CAN BE USED AS QUAD 2-TO-1 MULTIPLEXER-DEMULTIPLEXER |
e4 |
BREAK-BEFORE-MAKE |
260 |
41 ns |
105 ohm |
18 ns |
2.6 mm |
||||||||||||||||||||
|
Diodes Incorporated |
DPDT |
16 |
VQCCN |
RECTANGULAR |
YES |
UNSPECIFIED |
2 |
2 |
NO LEAD |
2.7 V |
CHIP CARRIER, VERY THIN PROFILE |
LCC16,.1X.07,16 |
.4 mm |
85 Cel |
-40 Cel |
QUAD |
R-XQCC-N16 |
SEPARATE OUTPUT |
4.3 V |
.55 mm |
.4 A |
1.8 mm |
67 dB |
1.65 V |
0 V |
BREAK-BEFORE-MAKE |
3.6 ohm |
.2 ohm |
2.6 mm |
4.3 V |
||||||||||||||||||||||||||||
|
Texas Instruments |
DPDT |
INDUSTRIAL |
16 |
VQCCN |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
.07 mA |
1 |
2 |
5500 kHz |
NO LEAD |
3.3 V |
CHIP CARRIER, VERY THIN PROFILE |
.4 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
R-PQCC-N16 |
SEPARATE OUTPUT |
1 |
4.3 V |
.55 mm |
1.8 mm |
37 dB |
2.7 V |
0 V |
e4 |
30 |
260 |
400 ns |
400 ns |
.4 ohm |
2.6 mm |
3.6 V |
||||||||||||||||||||||
Vishay Intertechnology |
DPDT |
INDUSTRIAL |
16 |
HVQCCN |
SQUARE |
YES |
UNSPECIFIED |
1 |
4 |
NO LEAD |
3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-XQCC-N16 |
5.5 V |
1 mm |
3 mm |
82 dB |
1.8 V |
70000 ns |
.55 ohm |
3000 ns |
.05 ohm |
3 mm |
||||||||||||||||||||||||||||||||
|
Analog Devices |
DPDT |
INDUSTRIAL |
10 |
VQCCN |
RECTANGULAR |
YES |
UNSPECIFIED |
1 |
2 |
BICMOS |
NO LEAD |
3 V |
CHIP CARRIER, VERY THIN PROFILE |
.4 mm |
85 Cel |
-40 Cel |
NICKEL GOLD PALLADIUM |
QUAD |
R-XQCC-N10 |
1 |
5 V |
.55 mm |
1.4 mm |
65 dB |
2.7 V |
30 |
260 |
60000 ns |
5 ohm |
5000 ns |
.2 ohm |
1.8 mm |
||||||||||||||||||||||||||
|
Analog Devices |
DPDT |
INDUSTRIAL |
10 |
VQCCN |
RECTANGULAR |
YES |
UNSPECIFIED |
2 |
2 |
BICMOS |
NO LEAD |
3 V |
3/5 |
CHIP CARRIER, VERY THIN PROFILE |
LCC10,.06X.07,16 |
Multiplexer or Switches |
.4 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
R-XQCC-N10 |
SEPARATE OUTPUT |
1 |
5.5 V |
.55 mm |
1.4 mm |
Not Qualified |
48 dB |
2.8 V |
VIDEO APPLICATION |
e4 |
30 |
260 |
100000 ns |
10 ohm |
5000 ns |
.1 ohm |
1.8 mm |
|||||||||||||||||||
|
Maxim Integrated |
DPDT |
NICKEL GOLD PALLADIUM |
1 |
30 |
260 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Onsemi |
DPDT |
INDUSTRIAL |
10 |
VQCCN |
RECTANGULAR |
YES |
UNSPECIFIED |
2 |
2 |
NO LEAD |
3.3 V |
CHIP CARRIER, VERY THIN PROFILE |
.4 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
R-XQCC-N10 |
1 |
3.6 V |
.6 mm |
1.4 mm |
70 dB |
3 V |
e4 |
30 |
260 |
.046 ohm |
1.8 mm |
|||||||||||||||||||||||||||||
|
Texas Instruments |
DPDT |
INDUSTRIAL |
8 |
VQCCN |
SQUARE |
YES |
PLASTIC/EPOXY |
.001 mA |
1 |
2 |
1220 kHz |
NO LEAD |
3.3 V |
CHIP CARRIER, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD SILVER |
QUAD |
S-PQCC-N8 |
SEPARATE OUTPUT |
1 |
4.3 V |
.6 mm |
1.5 mm |
Not Qualified |
NC |
30 dB |
3 V |
0 V |
e4 |
BREAK-BEFORE-MAKE |
30 |
260 |
30 ns |
10 ohm |
25 ns |
.35 ohm |
1.5 mm |
4.3 V |
||||||||||||||||||
|
Vishay Intertechnology |
DPDT |
NOT SPECIFIED |
NOT SPECIFIED |
Multiplexers and switches are electronic components used in digital and analog circuits to route signals between different inputs and outputs. They allow a single input signal to be sent to multiple output channels or vice versa.
A multiplexer, also known as a "mux," is a digital component that selects one of several input signals and forwards it to a single output. Multiplexers are often used in data communication systems to transmit multiple signals over a single communication channel. They can also be used in digital circuits to route control signals and address lines.
A switch is an electronic component that connects or disconnects two or more circuits. Switches can be mechanical or electronic and are used to control the flow of current in a circuit. In digital circuits, switches are used to connect or disconnect components and can be used to create logic gates and other digital components.
Multiplexers and switches are important components in various electronic systems, including communication systems, data processing systems, and control systems. They can be used to route signals between different parts of a circuit and to switch between different modes of operation. Multiplexers and switches can also be used to improve the efficiency of a system by reducing the number of components needed to perform a particular function.