DPDT Multiplexers & Switches 380

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Part	Manufacturer	Other IC type	Temperature Grade	No. of Terminals	Package Code	Package Shape	Surface Mount	Package Body Material	Maximum Supply Current (Isup)	No. of Functions	No. of Channels	Technology	Nominal Bandwidth	Terminal Form	Maximum Negative Supply Voltage (Vsup)	Nominal Negative Supply Voltage (Vsup)	Nominal Supply Voltage (Vsup)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Output (V)	Moisture Sensitivity Level (MSL)	Maximum Supply Voltage (Vsup)	Maximum Seated Height	Maximum Signal Current	Width (mm)	Qualification	Normal Position (V)	Nominal Off-state Isolation	Minimum Supply Voltage (Vsup)	Additional Features	Minimum Input Voltage	Minimum Negative Supply Voltage (Vsup)	JESD-609 Code	Switching (V)	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Maximum Switch-on Time	Maximum On-state Resistance (Ron)	Maximum Switch-off Time	Nominal On-state Resistance Match	Length	Maximum Input Voltage
FSUSB43L10X-F131	Fairchild Semiconductor	DPDT	INDUSTRIAL	10	QCCN	RECTANGULAR	YES	PLASTIC/EPOXY		1				NO LEAD				3/4.3	CHIP CARRIER	LCC10,.06X.08,20	Multiplexer or Switches	.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	R-PQCC-N10	SEPARATE OUTPUT	1					Not Qualified							e4	BREAK-BEFORE-MAKE	30	260		6.5 ohm
MAX14689EWL+	Analog Devices	DPDT	INDUSTRIAL	9	FBGA	SQUARE	YES	PLASTIC/EPOXY		1		BICMOS		BALL				1.8/5	GRID ARRAY, FINE PITCH	BGA9,3X3,16	Multiplexer or Switches	.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER NICKEL	BOTTOM	S-PBGA-B9	SEPARATE OUTPUT	1					Not Qualified							e2	BREAK-BEFORE-MAKE	30	260		.55 ohm
NLAS3799LMNR2G	Onsemi	DPDT	INDUSTRIAL	16	VQCCN	RECTANGULAR	YES	UNSPECIFIED		2	2			NO LEAD			3 V	1.8/3.3	CHIP CARRIER, VERY THIN PROFILE	LCC16,.07X.1,16	Multiplexer or Switches	.4 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	R-XQCC-N16	SEPARATE OUTPUT	1	3.6 V	.8 mm		1.8 mm	Not Qualified	NC	69 dB	1.65 V				e4	BREAK-BEFORE-MAKE		260	50 ns	.5 ohm	30 ns	.05 ohm	2.6 mm
NX3DV3899GU,115	NXP Semiconductors	DPDT	AUTOMOTIVE	16	QCCN	RECTANGULAR	YES	PLASTIC/EPOXY		2				NO LEAD				1.4/4.3	CHIP CARRIER	LCC16,.07X.1,16	Multiplexer or Switches	.4 mm	125 Cel	-40 Cel	MATTE TIN	QUAD	R-PQCC-N16	SEPARATE OUTPUT	1					Not Qualified							e3	BREAK-BEFORE-MAKE	30	260	90 ns	10 ohm
TS5USBA224RSWR	Texas Instruments	DPDT	INDUSTRIAL	10	VQCCN	RECTANGULAR	YES	UNSPECIFIED	.01 mA	1	2		650 kHz	NO LEAD			3.3 V		CHIP CARRIER, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	R-XQCC-N10	COMMON OUTPUT	1	5.5 V	1 mm		1.4 mm	Not Qualified	NO	83 dB	2.7 V		0 V		e4	BREAK-BEFORE-MAKE	30	260		7 ohm		4 ohm	1.8 mm	5.5 V
FSA3000L10X	Onsemi	DPDT	INDUSTRIAL	10	VQCCN	RECTANGULAR	YES	UNSPECIFIED		2	2			NO LEAD				3/4	CHIP CARRIER, VERY THIN PROFILE	LCC10,.06X.08,20	Multiplexer or Switches	.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	R-XQCC-N10	SEPARATE OUTPUT	1		.55 mm		1.6 mm	Not Qualified							e4	BREAK-BEFORE-MAKE	30	260		6 ohm			2.1 mm
FSA3000L10X_F131	Onsemi	DPDT	INDUSTRIAL	10	VQCCN	RECTANGULAR	YES	UNSPECIFIED		2	2			NO LEAD			3.3 V		CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		BOTTOM	R-XBCC-N10		1	4.3 V	.6 mm		1.6 mm			55 dB	2.7 V	SBG IS SPDT					30	260	600 ns	6 ohm	300 ns	.03 ohm	2.1 mm
NX3DV42GU10X	NXP Semiconductors	DPDT	AUTOMOTIVE	10	QCCN	RECTANGULAR	YES	PLASTIC/EPOXY		1				NO LEAD				3/4.3	CHIP CARRIER	LCC10,.05X.06,16	Multiplexer or Switches	.4 mm	125 Cel	-40 Cel		QUAD	R-PQCC-N10	SEPARATE OUTPUT	1					Not Qualified								BREAK-BEFORE-MAKE		260		10 ohm
MAX14589EEWL+T	Analog Devices	DPDT	INDUSTRIAL	9	VFBGA	SQUARE	YES	PLASTIC/EPOXY	.06 mA	1	2	BICMOS		BALL			2.5 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA9,3X3,16		.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER NICKEL	BOTTOM	S-PBGA-B9	COMMON OUTPUT	1	5.5 V	.69 mm		1.26 mm		NC	60 dB	1.6 V		-5.5 V		e2	BREAK-BEFORE-MAKE	30	260	10000000 ns	.38 ohm	2250000 ns	.005 ohm	1.26 mm	5.5 V
NX3L2467HR,115	NXP Semiconductors	DPDT	AUTOMOTIVE	16	QCCN	SQUARE	YES	PLASTIC/EPOXY		2		CMOS		NO LEAD				1.5/3.3	CHIP CARRIER	LCC16,.12SQ,20	Multiplexer or Switches	.5 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	S-PQCC-N16	SEPARATE OUTPUT	1					Not Qualified							e4	BREAK-BEFORE-MAKE	30	260	90 ns	4.1 ohm
BD11600NUX-E2	ROHM	DPDT	INDUSTRIAL	10	HVSON	RECTANGULAR	YES	PLASTIC/EPOXY		1	2			NO LEAD			5 V	5	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC10,.08,20	Multiplexers or Switches	.5 mm	85 Cel	-40 Cel		DUAL	R-PDSO-N10	SEPARATE OUTPUT		5.5 V	.6 mm		2 mm	Not Qualified			2.5 V						NOT SPECIFIED	NOT SPECIFIED		6 ohm			3 mm
HI1-5046A7	Thomson Consumer Electronics	DPDT	COMMERCIAL EXTENDED	16	DIP	RECTANGULAR	NO	CERAMIC, GLASS-SEALED		1	2	CMOS		THROUGH-HOLE		-15 V	15 V	5,+-15	IN-LINE	DIP16,.3	Multiplexer or Switches	2.54 mm	75 Cel	0 Cel	Tin/Lead (Sn/Pb)	DUAL	R-GDIP-T16	SEPARATE OUTPUT						Not Qualified							e0	BREAK-BEFORE-MAKE			1000 ns	50 ohm
TS3USB31ERSER	Texas Instruments	DPDT	INDUSTRIAL	8	VQCCN	SQUARE	YES	PLASTIC/EPOXY	.001 mA	1	2		1100 kHz	NO LEAD			2.5 V		CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD SILVER	QUAD	S-PQCC-N8	SEPARATE OUTPUT	1	4.3 V	.6 mm		1.5 mm	Not Qualified	NC	30 dB	2.25 V		0 V		e4	BREAK-BEFORE-MAKE	30	260	30 ns	10 ohm	25 ns	.4 ohm	1.5 mm	4.3 V
TS3USB3000RLSR	Texas Instruments	DPDT
TS3USB31RSERG4	Texas Instruments	DPDT	INDUSTRIAL	8	VQCCN	SQUARE	YES	PLASTIC/EPOXY	.001 mA	1	2		1220 kHz	NO LEAD			3.3 V		CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD SILVER	QUAD	S-PQCC-N8	SEPARATE OUTPUT	1	4.3 V	.6 mm		1.5 mm	Not Qualified	NC	30 dB	3 V		0 V		e4	BREAK-BEFORE-MAKE	30	260	30 ns	10 ohm	25 ns	.35 ohm	1.5 mm	4.3 V
TS3USB3000MRSER	Texas Instruments	DPDT	INDUSTRIAL	10	VQCCN	RECTANGULAR	YES	PLASTIC/EPOXY	.05 mA	1	2		6100 kHz	NO LEAD			3.3 V		CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	R-PQCC-N10	SEPARATE OUTPUT	1	4.3 V	.6 mm		1.5 mm			34 dB	2.7 V		0 V		e4	BREAK-BEFORE-MAKE	30	260		9 ohm		.1 ohm	2 mm	3.6 V
ADG888YCBZ-REEL	Analog Devices	DPDT	AUTOMOTIVE	16	VFBGA	SQUARE	YES	UNSPECIFIED		2	1	CMOS		BALL			2.7 V	3/5	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA16,4X4,20	Multiplexer or Switches	.5 mm	125 Cel	-40 Cel		BOTTOM	S-XBGA-B16	SEPARATE OUTPUT		5.5 V	.65 mm		2 mm	Not Qualified		67 dB	1.8 V					BREAK-BEFORE-MAKE	30	235	50 ns	.7 ohm	22 ns	.045 ohm	2 mm
MAX4947ETG+	Analog Devices	DPDT	INDUSTRIAL	24	HVQCCN	SQUARE	YES	UNSPECIFIED		3	3	CMOS		NO LEAD			3 V	3/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Multiplexer or Switches	.5 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD	S-XQCC-N24	SEPARATE OUTPUT	1	5.5 V	.8 mm		4 mm	Not Qualified		70 dB	1.8 V				e3	BREAK-BEFORE-MAKE	30	260	800 ns	5.5 ohm	800 ns	.3 ohm	4 mm
MAX4885AEETI+T	Analog Devices	DPDT	INDUSTRIAL	28	QCCN	SQUARE	YES	PLASTIC/EPOXY	.005 mA	5	2	BICMOS		NO LEAD				2.5/5,5	CHIP CARRIER	LCC28,.16SQ,16	Multiplexer or Switches	.4 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD	S-PQCC-N28		1			.05 A		Not Qualified							e3		30	260		8 ohm
MAX4701EUE+T	Analog Devices	DPDT	INDUSTRIAL	16	TSSOP	RECTANGULAR	YES	PLASTIC/EPOXY		2	2	CMOS		GULL WING			3 V	3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP16,.25	Multiplexer or Switches	.65 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G16	SEPARATE OUTPUT	1	5.5 V	1.1 mm		4.4 mm	Not Qualified		76 dB	1.8 V				e3	BREAK-BEFORE-MAKE	30	260	35 ns	75 ohm	20 ns	2 ohm	5 mm
MAX14508EEVB+	Analog Devices	DPDT	INDUSTRIAL	10	VQCCN	RECTANGULAR	YES	UNSPECIFIED		1	2	BICMOS		NO LEAD			3 V		CHIP CARRIER, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel	NICKEL GOLD PALLADIUM	QUAD	R-XQCC-N10		1	5 V	.55 mm		1.4 mm			65 dB	2.7 V						30	260	60000 ns	5 ohm	5000 ns	.2 ohm	1.8 mm
MAX4984EEVB+T	Analog Devices	DPDT																							NICKEL GOLD PALLADIUM				1														30	260
MAX1602EEE+	Analog Devices	DPDT	INDUSTRIAL	16	SSOP	RECTANGULAR	YES	PLASTIC/EPOXY		1	2	CMOS		GULL WING					SMALL OUTLINE, SHRINK PITCH			.635 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G16		1	5.5 V	1.75 mm		3.9 mm	Not Qualified			3 V				e3		30	260		6 ohm			4.89 mm
MAX4528CSA+	Analog Devices	DPDT	COMMERCIAL	8	SOP	RECTANGULAR	YES	PLASTIC/EPOXY		1	2	CMOS		GULL WING	-6 V	-5 V	5 V	3/5/+-5	SMALL OUTLINE	SOP8,.25	Multiplexer or Switches	1.27 mm	70 Cel	0 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G8	SEPARATE OUTPUT	1	6 V	1.75 mm		3.9 mm	Not Qualified			2.7 V			-2.7 V	e3	BREAK-BEFORE-MAKE	30	260	150 ns	120 ohm	100 ns	4 ohm	4.9 mm
MAX14575BETA+	Analog Devices	DPDT																							Matte Tin (Sn) - annealed				1												e3		30	260
MAX4701EGE+T	Analog Devices	DPDT	INDUSTRIAL	16	VQCCN	SQUARE	YES	CERAMIC, METAL-SEALED COFIRED		2	2	CMOS		NO LEAD			3 V		CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD	S-CQCC-N16		1	5.5 V	1 mm		3 mm	Not Qualified		76 dB	1.8 V				e3				35 ns	75 ohm	20 ns	2 ohm	3 mm
MAX14594EEWL+T	Analog Devices	DPDT	INDUSTRIAL	9	VFBGA	SQUARE	YES	PLASTIC/EPOXY	.06 mA	1	2	BICMOS		BALL			2.5 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA9,3X3,16		.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER NICKEL	BOTTOM	S-PBGA-B9	COMMON OUTPUT	1	5.5 V	.69 mm		1.26 mm		NC	60 dB	1.6 V		-5.5 V		e2	BREAK-BEFORE-MAKE	30	260	10000000 ns	.38 ohm	2250000 ns	.005 ohm	1.26 mm	5.5 V
5962-01-365-6027	Analog Devices	DPDT	INDUSTRIAL	16	DIP	RECTANGULAR	NO	CERAMIC	.2 mA	1	8	CMOS		THROUGH-HOLE		-15 V	15 V	+-15	IN-LINE	DIP16,.3	Multiplexer or Switches	2.54 mm	85 Cel	-40 Cel		DUAL	R-XDIP-T16		1			.05 A		Not Qualified								BREAK-BEFORE-MAKE			1000 ns	300 ohm
MAX4888BETI+TG3U	Analog Devices	DPDT																																									NOT SPECIFIED	NOT SPECIFIED
MAX4760ETX+T	Analog Devices	DPDT	INDUSTRIAL	36	HVQCCN	SQUARE	YES	UNSPECIFIED		4	2	CMOS		NO LEAD			3 V	3/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC36,.25SQ,20	Multiplexer or Switches	.5 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD	S-XQCC-N36	SEPARATE OUTPUT	1	5.5 V	.8 mm		6 mm	Not Qualified		80 dB	1.8 V				e3	BREAK-BEFORE-MAKE	30	260	150 ns	3.5 ohm	60 ns	.2 ohm	6 mm
MAX4996LETG+	Analog Devices	DPDT	INDUSTRIAL	24	HVQCCN	SQUARE	YES	UNSPECIFIED		3	2	BICMOS		NO LEAD			2.8 V	3/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.13SQ,16	Multiplexer or Switches	.4 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD	S-XQCC-N24	SEPARATE OUTPUT	1	5.5 V	.85 mm		3.5 mm	Not Qualified		60 dB	2.5 V				e3	BREAK-BEFORE-MAKE	30	260	10000 ns	4 ohm	6000 ns	.1 ohm	3.5 mm
MAX4984EEVB+	Analog Devices	DPDT	INDUSTRIAL	10	VQCCN	RECTANGULAR	YES	UNSPECIFIED		2	2	BICMOS		NO LEAD			3 V	3/5	CHIP CARRIER, VERY THIN PROFILE	LCC10,.06X.07,16	Multiplexer or Switches	.4 mm	85 Cel	-40 Cel	NICKEL GOLD PALLADIUM	QUAD	R-XQCC-N10	SEPARATE OUTPUT	1	5.5 V	.55 mm		1.4 mm	Not Qualified		48 dB	2.8 V	VIDEO APPLICATION					30	260	100000 ns	10 ohm	5000 ns	.1 ohm	1.8 mm
MAX4528C/D	Analog Devices	DPDT	COMMERCIAL	8	DIE	RECTANGULAR	YES	UNSPECIFIED		1	2	CMOS		NO LEAD	-6 V				UNCASED CHIP				70 Cel	0 Cel	TIN LEAD	UPPER	R-XUUC-N8		1	6 V				Not Qualified			2.7 V			-2.7 V	e0				150 ns		100 ns
MAX14575CETA+T	Analog Devices	DPDT	INDUSTRIAL	8	HVSON	SQUARE	YES	PLASTIC/EPOXY	.275 mA	1	2	BICMOS		NO LEAD			3.3 V	2.5/5	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.08,20	Power Management Circuits	.5 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL	S-PDSO-N8		1	5.5 V	.8 mm		2 mm	Not Qualified			2.3 V				e3		30	260		.05 ohm			2 mm
MAX14575AETA+	Analog Devices	DPDT	INDUSTRIAL	8	SON	RECTANGULAR	YES	PLASTIC/EPOXY	.275 mA			BICMOS		NO LEAD				2.5/5	SMALL OUTLINE	SOLCC8,.08,20	Power Management Circuits	.5 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-N8		1					Not Qualified							e3		30	260
MAX4996ETG+	Analog Devices	DPDT	INDUSTRIAL	24	HVQCCN	SQUARE	YES	UNSPECIFIED		3	2	BICMOS		NO LEAD			2.8 V	3/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.13SQ,16	Multiplexer or Switches	.4 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD	S-XQCC-N24	SEPARATE OUTPUT	1	5.5 V	.85 mm		3.5 mm	Not Qualified		60 dB	2.5 V				e3	BREAK-BEFORE-MAKE	30	260	10000 ns	4 ohm	6000 ns	.1 ohm	3.5 mm
MAX4947ETG+T	Analog Devices	DPDT	INDUSTRIAL	24	HVQCCN	SQUARE	YES	UNSPECIFIED		3	3	CMOS		NO LEAD			3 V	3/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Multiplexer or Switches	.5 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD	S-XQCC-N24	SEPARATE OUTPUT	1	5.5 V	.8 mm		4 mm	Not Qualified		70 dB	1.8 V				e3	BREAK-BEFORE-MAKE	30	260	800 ns	5.5 ohm	800 ns	.3 ohm	4 mm
ADG888YCBZ-REEL7	Analog Devices	DPDT	AUTOMOTIVE	16	VFBGA	SQUARE	YES	UNSPECIFIED		2	1	CMOS		BALL			2.7 V	3/5	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA16,4X4,20	Multiplexer or Switches	.5 mm	125 Cel	-40 Cel		BOTTOM	S-XBGA-B16	SEPARATE OUTPUT		5.5 V	.65 mm		2 mm	Not Qualified		67 dB	1.8 V					BREAK-BEFORE-MAKE	30	235	50 ns	.7 ohm	22 ns	.045 ohm	2 mm
MAX4928BETN+	Analog Devices	DPDT	INDUSTRIAL	56	HVQCCN	RECTANGULAR	YES	UNSPECIFIED		6	2	CMOS		NO LEAD			3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.19X.43,20	Multiplexer or Switches	.5 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD	R-XQCC-N56	SEPARATE OUTPUT	3	3.6 V	.8 mm		5 mm	Not Qualified		22 dB	3 V				e3		30	260	120 ns		50 ns	.1 ohm	11 mm
MAX4758ETX+T	Analog Devices	DPDT	INDUSTRIAL	36	VQCCN	SQUARE	YES	UNSPECIFIED		4	4	CMOS		NO LEAD			3 V	3/5	CHIP CARRIER, VERY THIN PROFILE	LCC36,.25SQ,20	Multiplexer or Switches	.5 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD	S-XQCC-N36	SEPARATE OUTPUT	1	5.5 V	.8 mm		6 mm	Not Qualified		95 dB	1.8 V				e3	BREAK-BEFORE-MAKE	30	260	140 ns	.85 ohm	50 ns	.35 ohm	6 mm
MAX4701ETE+	Analog Devices	DPDT	INDUSTRIAL	16	HVQCCN	SQUARE	YES	UNSPECIFIED		2	2	CMOS		NO LEAD			3 V	3/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.12SQ,20	Multiplexer or Switches	.5 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD	S-XQCC-N16	SEPARATE OUTPUT	1	5.5 V	.8 mm		3 mm	Not Qualified		76 dB	1.8 V				e3	BREAK-BEFORE-MAKE	30	260	45 ns	75 ohm	25 ns	2 ohm	3 mm
MAX4994EVB+	Analog Devices	DPDT	INDUSTRIAL	10	VQCCN	RECTANGULAR	YES	UNSPECIFIED		1	2	BICMOS		NO LEAD			2.7 V	3/5	CHIP CARRIER, VERY THIN PROFILE	LCC10,.06X.07,16	Multiplexer or Switches	.4 mm	85 Cel	-40 Cel		QUAD	R-XQCC-N10	SEPARATE OUTPUT	1	5.5 V	.55 mm		1.4 mm	Not Qualified		90 dB	1.8 V					BREAK-BEFORE-MAKE			150000 ns	.6 ohm	2000 ns	.003 ohm	1.8 mm
MAX4525CUB+	Analog Devices	DPDT	COMMERCIAL	10	TSSOP	SQUARE	YES	PLASTIC/EPOXY		1	2	CMOS		GULL WING			3 V	3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20	Multiplexer or Switches	.5 mm	70 Cel	0 Cel	Matte Tin (Sn) - annealed	DUAL	S-PDSO-G10	SEPARATE OUTPUT	1	12 V	1.1 mm		3 mm	Not Qualified			2 V				e3	BREAK-BEFORE-MAKE	30	260	300 ns	400 ohm	200 ns		3 mm
MAX4701EGE+	Analog Devices	DPDT	INDUSTRIAL	16	VQCCN	SQUARE	YES	CERAMIC, METAL-SEALED COFIRED		2	2	CMOS		NO LEAD			3 V		CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD	S-CQCC-N16		1	5.5 V	1 mm		3 mm	Not Qualified		76 dB	1.8 V				e3		30	260	35 ns	75 ohm	20 ns	2 ohm	3 mm
MAX4889BETO+T	Analog Devices	DPDT	INDUSTRIAL	42	HVQCCN	RECTANGULAR	YES	UNSPECIFIED	1 mA	4	2	CMOS		NO LEAD			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC42,.14X.35,20		.5 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD	R-XQCC-N42	SEPARATE OUTPUT	1	3.6 V	.8 mm		3.5 mm			15 dB	3 V		-.3 V		e3	BREAK-BEFORE-MAKE	30	260		8.4 ohm		.2 ohm	9 mm	1.8 V
MAX4761EWX+	Analog Devices	DPDT																							TIN SILVER COPPER				1												e1		30	260
MAX14585EVB+T	Analog Devices	DPDT	INDUSTRIAL	10	VQCCN	RECTANGULAR	YES	UNSPECIFIED		1	2	BICMOS		NO LEAD			3 V	3/5	CHIP CARRIER, VERY THIN PROFILE	LCC10,.06X.07,16	Multiplexer or Switches	.4 mm	85 Cel	-40 Cel	NICKEL GOLD PALLADIUM	QUAD	R-XQCC-N10		1	5.5 V	.55 mm		1.4 mm	Not Qualified		84 dB	2.7 V					BREAK-BEFORE-MAKE	30	260	120000 ns	6 ohm	40000 ns	.2 ohm	1.8 mm
MAX4701EUE+	Analog Devices	DPDT	INDUSTRIAL	16	TSSOP	RECTANGULAR	YES	PLASTIC/EPOXY		2	2	CMOS		GULL WING			3 V	3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP16,.25	Multiplexer or Switches	.65 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G16	SEPARATE OUTPUT	1	5.5 V	1.1 mm		4.4 mm	Not Qualified		76 dB	1.8 V				e3	BREAK-BEFORE-MAKE	30	260	35 ns	75 ohm	20 ns	2 ohm	5 mm

Multiplexers & Switches

Multiplexers and switches are electronic components used in digital and analog circuits to route signals between different inputs and outputs. They allow a single input signal to be sent to multiple output channels or vice versa.

A multiplexer, also known as a "mux," is a digital component that selects one of several input signals and forwards it to a single output. Multiplexers are often used in data communication systems to transmit multiple signals over a single communication channel. They can also be used in digital circuits to route control signals and address lines.

A switch is an electronic component that connects or disconnects two or more circuits. Switches can be mechanical or electronic and are used to control the flow of current in a circuit. In digital circuits, switches are used to connect or disconnect components and can be used to create logic gates and other digital components.

Multiplexers and switches are important components in various electronic systems, including communication systems, data processing systems, and control systems. They can be used to route signals between different parts of a circuit and to switch between different modes of operation. Multiplexers and switches can also be used to improve the efficiency of a system by reducing the number of components needed to perform a particular function.