Part | RoHS | Manufacturer | Other IC type | Temperature Grade | No. of Terminals | Package Code | Package Shape | Surface Mount | Total Dose (V) | Maximum Switching Frequency | Package Body Material | Maximum Supply Current (Isup) | No. of Functions | No. of Channels | Technology | Screening Level | Nominal Bandwidth | Terminal Form | Maximum Negative Supply Voltage (Vsup) | Nominal Negative Supply Voltage (Vsup) | Nominal Supply Voltage (Vsup) | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Control Mode | Minimum Operating Temperature | Terminal Finish | Terminal Position | JESD-30 Code | Output (V) | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Maximum Signal Current | Height | Width (mm) | Qualification | Normal Position (V) | Nominal Off-state Isolation | Minimum Supply Voltage (Vsup) | Additional Features | Minimum Input Voltage | Minimum Negative Supply Voltage (Vsup) | JESD-609 Code | Switching (V) | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Maximum Switch-on Time | Maximum On-state Resistance (Ron) | Nominal Threshold Voltage (V) | Maximum Switch-off Time | Maximum Positive Input Voltage | Nominal On-state Resistance Match | Length | Adjustable Threshold | Maximum Input Voltage |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Maxim Integrated |
DPDT |
INDUSTRIAL |
16 |
HVQCCN |
SQUARE |
YES |
CERAMIC, METAL-SEALED COFIRED |
2 |
2 |
CMOS |
NO LEAD |
3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.65 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-CQCC-N16 |
1 |
5.5 V |
1 mm |
4 mm |
Not Qualified |
76 dB |
1.8 V |
e0 |
245 |
35 ns |
75 ohm |
20 ns |
2 ohm |
4 mm |
||||||||||||||||||||||||||
Maxim Integrated |
DPDT |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
1 |
2 |
CMOS |
GULL WING |
-6 V |
-5 V |
5 V |
3/5/+-5 |
SMALL OUTLINE |
SOP8,.25 |
Multiplexer or Switches |
1.27 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G8 |
SEPARATE OUTPUT |
1 |
6 V |
1.75 mm |
3.9 mm |
Not Qualified |
2.7 V |
-2.7 V |
e0 |
BREAK-BEFORE-MAKE |
245 |
150 ns |
120 ohm |
100 ns |
4 ohm |
4.9 mm |
|||||||||||||||||||
Maxim Integrated |
DPDT |
NOT SPECIFIED |
NOT SPECIFIED |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Maxim Integrated |
DPDT |
INDUSTRIAL |
10 |
TSSOP |
SQUARE |
YES |
PLASTIC/EPOXY |
1 |
2 |
CMOS |
GULL WING |
3 V |
3/5 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP10,.19,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
S-PDSO-G10 |
SEPARATE OUTPUT |
1 |
12 V |
1.1 mm |
3 mm |
Not Qualified |
75 dB |
2 V |
ALSO OPERATE WITH 5V SINGLE SUPPLY |
e0 |
BREAK-BEFORE-MAKE |
300 ns |
400 ohm |
200 ns |
2 ohm |
3 mm |
|||||||||||||||||||||
|
Maxim Integrated |
DPDT |
NICKEL PALLADIUM GOLD |
1 |
e4 |
30 |
260 |
||||||||||||||||||||||||||||||||||||||||||||||||||||
Maxim Integrated |
DPDT |
INDUSTRIAL |
16 |
HVQCCN |
SQUARE |
YES |
UNSPECIFIED |
2 |
2 |
CMOS |
NO LEAD |
3 V |
3/5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC16,.16SQ,25 |
Multiplexer or Switches |
.65 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-XQCC-N16 |
SEPARATE OUTPUT |
1 |
5.5 V |
.8 mm |
4 mm |
Not Qualified |
76 dB |
1.8 V |
e0 |
BREAK-BEFORE-MAKE |
245 |
35 ns |
75 ohm |
20 ns |
2 ohm |
4 mm |
|||||||||||||||||||||
|
Maxim Integrated |
DPDT |
INDUSTRIAL |
10 |
VQCCN |
RECTANGULAR |
YES |
UNSPECIFIED |
1 |
2 |
BICMOS |
NO LEAD |
3 V |
CHIP CARRIER, VERY THIN PROFILE |
.4 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
R-XQCC-N10 |
1 |
5.5 V |
.55 mm |
1.4 mm |
Not Qualified |
2.4 V |
e4 |
30 |
260 |
1.8 mm |
|||||||||||||||||||||||||||||
|
Maxim Integrated |
DPDT |
TIN SILVER COPPER |
1 |
e1 |
30 |
260 |
||||||||||||||||||||||||||||||||||||||||||||||||||||
Maxim Integrated |
DPDT |
COMMERCIAL |
8 |
SOP |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
1 |
2 |
CMOS |
GULL WING |
-6 V |
-5 V |
5 V |
3/5/+-5 |
SMALL OUTLINE |
SOP8,.25 |
Multiplexer or Switches |
1.27 mm |
70 Cel |
0 Cel |
TIN LEAD |
DUAL |
R-PDSO-G8 |
SEPARATE OUTPUT |
1 |
6 V |
1.75 mm |
3.9 mm |
Not Qualified |
2.7 V |
-2.7 V |
e0 |
BREAK-BEFORE-MAKE |
150 ns |
120 ohm |
100 ns |
4 ohm |
4.9 mm |
||||||||||||||||||||
|
Maxim Integrated |
DPDT |
INDUSTRIAL |
10 |
VQCCN |
RECTANGULAR |
YES |
UNSPECIFIED |
1 |
2 |
BICMOS |
NO LEAD |
3 V |
CHIP CARRIER, VERY THIN PROFILE |
.4 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
R-XQCC-N10 |
1 |
5 V |
.55 mm |
1.4 mm |
65 dB |
2.7 V |
e4 |
30 |
260 |
60000 ns |
5 ohm |
5000 ns |
.2 ohm |
1.8 mm |
|||||||||||||||||||||||||
|
Maxim Integrated |
DPDT |
INDUSTRIAL |
36 |
VFBGA |
SQUARE |
YES |
PLASTIC/EPOXY |
4 |
2 |
CMOS |
BALL |
2.7 V |
3/5 |
GRID ARRAY |
BGA36,6X6,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
BOTTOM |
S-PBGA-B36 |
SEPARATE OUTPUT |
5.5 V |
.67 mm |
3.06 mm |
Not Qualified |
80 dB |
1.8 V |
BREAK-BEFORE-MAKE |
NOT SPECIFIED |
NOT SPECIFIED |
800 ns |
3.5 ohm |
800 ns |
.2 ohm |
3.06 mm |
||||||||||||||||||||||
Maxim Integrated |
DPDT |
INDUSTRIAL |
16 |
VQCCN |
SQUARE |
YES |
CERAMIC, METAL-SEALED COFIRED |
2 |
2 |
CMOS |
NO LEAD |
3 V |
3/5 |
CHIP CARRIER, VERY THIN PROFILE |
LCC16,.12SQ,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-CQCC-N16 |
SEPARATE OUTPUT |
1 |
5.5 V |
1 mm |
3 mm |
Not Qualified |
76 dB |
1.8 V |
e0 |
BREAK-BEFORE-MAKE |
245 |
35 ns |
75 ohm |
20 ns |
2 ohm |
3 mm |
|||||||||||||||||||||
|
Maxim Integrated |
DPDT |
INDUSTRIAL |
25 |
VFBGA |
SQUARE |
YES |
UNSPECIFIED |
3 |
3 |
CMOS |
BALL |
3 V |
3/5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA25,5X5,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-XBGA-B25 |
SEPARATE OUTPUT |
1 |
5.5 V |
.67 mm |
2.54 mm |
Not Qualified |
70 dB |
1.8 V |
e1 |
BREAK-BEFORE-MAKE |
30 |
260 |
800 ns |
5.5 ohm |
800 ns |
.3 ohm |
2.54 mm |
|||||||||||||||||||
|
Maxim Integrated |
DPDT |
INDUSTRIAL |
25 |
VFBGA |
SQUARE |
YES |
PLASTIC/EPOXY |
1 |
1 |
CMOS |
BALL |
3 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B25 |
1 |
5.5 V |
.69 mm |
2.56 mm |
70 dB |
1.8 V |
e1 |
30 |
260 |
800 ns |
5.5 ohm |
800 ns |
.3 ohm |
2.56 mm |
|||||||||||||||||||||||||
|
Maxim Integrated |
DPDT |
INDUSTRIAL |
36 |
HVQCCN |
SQUARE |
YES |
UNSPECIFIED |
4 |
2 |
CMOS |
NO LEAD |
3 V |
3/5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC36,.25SQ,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-XQCC-N36 |
SEPARATE OUTPUT |
5.5 V |
.8 mm |
6 mm |
Not Qualified |
80 dB |
1.8 V |
BREAK-BEFORE-MAKE |
NOT SPECIFIED |
NOT SPECIFIED |
800 ns |
3.5 ohm |
800 ns |
.2 ohm |
6 mm |
||||||||||||||||||||||
Maxim Integrated |
DPDT |
INDUSTRIAL |
36 |
VFBGA |
SQUARE |
YES |
PLASTIC/EPOXY |
4 |
2 |
CMOS |
BALL |
3 V |
3/5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA36,6X6,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
BOTTOM |
S-PBGA-B36 |
SEPARATE OUTPUT |
1 |
5.5 V |
.67 mm |
3.06 mm |
Not Qualified |
95 dB |
1.8 V |
e0 |
BREAK-BEFORE-MAKE |
245 |
140 ns |
.85 ohm |
50 ns |
.1 ohm |
3.06 mm |
|||||||||||||||||||||
Maxim Integrated |
DPDT |
INDUSTRIAL |
36 |
HVQCCN |
SQUARE |
YES |
UNSPECIFIED |
4 |
2 |
CMOS |
NO LEAD |
3 V |
3/5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC36,.25SQ,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-XQCC-N36 |
SEPARATE OUTPUT |
1 |
5.5 V |
.8 mm |
6 mm |
Not Qualified |
100 dB |
1.8 V |
e0 |
BREAK-BEFORE-MAKE |
140 ns |
3.5 ohm |
50 ns |
.2 ohm |
6 mm |
||||||||||||||||||||||
Maxim Integrated |
DPDT |
INDUSTRIAL |
9 |
FBGA |
SQUARE |
YES |
PLASTIC/EPOXY |
3 |
BICMOS |
BALL |
3/5 |
GRID ARRAY, FINE PITCH |
BGA9,3X3,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
BOTTOM |
S-PBGA-B9 |
SEPARATE OUTPUT |
Not Qualified |
NO |
e0 |
BREAK-BEFORE-MAKE |
100 ns |
.3 ohm |
||||||||||||||||||||||||||||||||
|
Maxim Integrated |
DPDT |
1 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Maxim Integrated |
DPDT |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
1 |
2 |
CMOS |
GULL WING |
-6 V |
-5 V |
5 V |
3/5/+-5 |
SMALL OUTLINE |
SOP8,.25 |
Multiplexer or Switches |
1.27 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G8 |
SEPARATE OUTPUT |
1 |
6 V |
1.75 mm |
3.9 mm |
Not Qualified |
2.7 V |
-2.7 V |
e0 |
BREAK-BEFORE-MAKE |
150 ns |
120 ohm |
100 ns |
4 ohm |
4.9 mm |
||||||||||||||||||||
Maxim Integrated |
DPDT |
INDUSTRIAL |
36 |
VFBGA |
SQUARE |
YES |
PLASTIC/EPOXY |
4 |
4 |
CMOS |
BALL |
3 V |
3/5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA36,6X6,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
BOTTOM |
S-PBGA-B36 |
SEPARATE OUTPUT |
1 |
5.5 V |
.67 mm |
3.06 mm |
Not Qualified |
100 dB |
1.8 V |
e0 |
BREAK-BEFORE-MAKE |
245 |
140 ns |
3.5 ohm |
50 ns |
.2 ohm |
3.06 mm |
|||||||||||||||||||||
Maxim Integrated |
DPDT |
INDUSTRIAL |
36 |
HVQCCN |
SQUARE |
YES |
UNSPECIFIED |
4 |
2 |
CMOS |
NO LEAD |
3 V |
3/5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC36,.25SQ,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-XQCC-N36 |
SEPARATE OUTPUT |
1 |
5.5 V |
.8 mm |
6 mm |
Not Qualified |
95 dB |
1.8 V |
e0 |
BREAK-BEFORE-MAKE |
245 |
140 ns |
.85 ohm |
50 ns |
.1 ohm |
6 mm |
|||||||||||||||||||||
Maxim Integrated |
DPDT |
INDUSTRIAL |
9 |
FBGA |
SQUARE |
YES |
PLASTIC/EPOXY |
3 |
BICMOS |
BALL |
3/5 |
GRID ARRAY, FINE PITCH |
BGA9,3X3,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
BOTTOM |
S-PBGA-B9 |
SEPARATE OUTPUT |
Not Qualified |
NO |
e0 |
BREAK-BEFORE-MAKE |
100 ns |
.3 ohm |
||||||||||||||||||||||||||||||||
|
Maxim Integrated |
DPDT |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||
Maxim Integrated |
DPDT |
INDUSTRIAL |
16 |
TSSOP |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
2 |
2 |
CMOS |
GULL WING |
3 V |
3/5 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP16,.25 |
Multiplexer or Switches |
.65 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G16 |
SEPARATE OUTPUT |
1 |
5.5 V |
1.1 mm |
4.4 mm |
Not Qualified |
76 dB |
1.8 V |
e0 |
BREAK-BEFORE-MAKE |
35 ns |
75 ohm |
20 ns |
2 ohm |
5 mm |
||||||||||||||||||||||
|
Maxim Integrated |
DPDT |
INDUSTRIAL |
36 |
VFBGA |
SQUARE |
YES |
PLASTIC/EPOXY |
4 |
2 |
CMOS |
BALL |
3 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B36 |
1 |
5.5 V |
.67 mm |
3.06 mm |
Not Qualified |
80 dB |
1.8 V |
e1 |
30 |
260 |
800 ns |
3.5 ohm |
800 ns |
.2 ohm |
3.06 mm |
||||||||||||||||||||||||
Maxim Integrated |
DPDT |
INDUSTRIAL |
36 |
FBGA |
SQUARE |
YES |
PLASTIC/EPOXY |
4 |
CMOS |
BALL |
3/5 |
GRID ARRAY, FINE PITCH |
BGA36,6X6,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
BOTTOM |
S-PBGA-B36 |
SEPARATE OUTPUT |
1 |
Not Qualified |
e0 |
BREAK-BEFORE-MAKE |
140 ns |
4 ohm |
||||||||||||||||||||||||||||||||
|
Maxim Integrated |
DPDT |
INDUSTRIAL |
16 |
FBGA |
SQUARE |
YES |
PLASTIC/EPOXY |
4 |
CMOS |
BALL |
3/5 |
GRID ARRAY, FINE PITCH |
BGA16,4X4,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
BOTTOM |
S-PBGA-B16 |
Not Qualified |
NC |
e3 |
BREAK-BEFORE-MAKE |
150 ns |
60 ohm |
||||||||||||||||||||||||||||||||
Maxim Integrated |
DPDT |
INDUSTRIAL |
10 |
HVSON |
SQUARE |
YES |
UNSPECIFIED |
1 |
2 |
CMOS |
NO LEAD |
12 V |
12 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC10,.11,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
S-XDSO-N10 |
SEPARATE OUTPUT |
1 |
12.6 V |
.8 mm |
3 mm |
Not Qualified |
92 dB |
2 V |
e0 |
BREAK-BEFORE-MAKE |
150 ns |
80 ohm |
120 ns |
2 ohm |
3 mm |
||||||||||||||||||||||
Maxim Integrated |
DPDT |
INDUSTRIAL |
32 |
BGA |
SQUARE |
YES |
PLASTIC/EPOXY |
4 |
1 |
CMOS |
BALL |
3 V |
3/5 |
GRID ARRAY |
BGA36,6X6,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
BOTTOM |
S-PBGA-B32 |
SEPARATE OUTPUT |
1 |
5.5 V |
.67 mm |
3.06 mm |
Not Qualified |
100 dB |
1.8 V |
e0 |
BREAK-BEFORE-MAKE |
245 |
140 ns |
3.5 ohm |
50 ns |
.2 ohm |
3.06 mm |
|||||||||||||||||||||
Maxim Integrated |
DPDT |
MILITARY |
16 |
DIP |
RECTANGULAR |
NO |
CERAMIC |
.7 mA |
1 |
8 |
CMOS |
THROUGH-HOLE |
-15 V |
15 V |
+-15 |
IN-LINE |
DIP16,.3 |
Multiplexer or Switches |
2.54 mm |
125 Cel |
-55 Cel |
DUAL |
R-XDIP-T16 |
1 |
.02 A |
Not Qualified |
BREAK-BEFORE-MAKE |
500 ns |
1800 ohm |
||||||||||||||||||||||||||||||
Maxim Integrated |
DPDT |
INDUSTRIAL |
10 |
TSSOP |
SQUARE |
YES |
PLASTIC/EPOXY |
1 |
2 |
CMOS |
GULL WING |
3 V |
3/5 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP10,.19,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
S-PDSO-G10 |
SEPARATE OUTPUT |
1 |
12 V |
1.1 mm |
3 mm |
Not Qualified |
75 dB |
2 V |
ALSO OPERATE WITH 5V SINGLE SUPPLY |
e0 |
BREAK-BEFORE-MAKE |
300 ns |
400 ohm |
200 ns |
2 ohm |
3 mm |
|||||||||||||||||||||
Maxim Integrated |
DPDT |
INDUSTRIAL |
36 |
VFBGA |
SQUARE |
YES |
PLASTIC/EPOXY |
4 |
2 |
CMOS |
BALL |
3 V |
3/5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA36,6X6,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
BOTTOM |
S-PBGA-B36 |
SEPARATE OUTPUT |
1 |
5.5 V |
.67 mm |
3.06 mm |
Not Qualified |
95 dB |
1.8 V |
e0 |
BREAK-BEFORE-MAKE |
245 |
140 ns |
.85 ohm |
50 ns |
.1 ohm |
3.06 mm |
|||||||||||||||||||||
Maxim Integrated |
DPDT |
INDUSTRIAL |
16 |
VQCCN |
SQUARE |
YES |
CERAMIC, METAL-SEALED COFIRED |
2 |
2 |
CMOS |
NO LEAD |
3 V |
3/5 |
CHIP CARRIER, VERY THIN PROFILE |
LCC16,.12SQ,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-CQCC-N16 |
SEPARATE OUTPUT |
1 |
5.5 V |
1 mm |
3 mm |
Not Qualified |
76 dB |
1.8 V |
e0 |
BREAK-BEFORE-MAKE |
245 |
35 ns |
75 ohm |
20 ns |
2 ohm |
3 mm |
|||||||||||||||||||||
|
Maxim Integrated |
DPDT |
INDUSTRIAL |
25 |
VFBGA |
SQUARE |
YES |
UNSPECIFIED |
3 |
3 |
CMOS |
BALL |
3 V |
3/5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA25,5X5,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-XBGA-B25 |
SEPARATE OUTPUT |
1 |
5.5 V |
.67 mm |
2.54 mm |
Not Qualified |
70 dB |
1.8 V |
e1 |
BREAK-BEFORE-MAKE |
30 |
260 |
800 ns |
5.5 ohm |
800 ns |
.3 ohm |
2.54 mm |
|||||||||||||||||||
Maxim Integrated |
DPDT |
INDUSTRIAL |
16 |
HVQCCN |
SQUARE |
YES |
CERAMIC, METAL-SEALED COFIRED |
2 |
2 |
CMOS |
NO LEAD |
3 V |
3/5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC16,.12SQ,20 |
Multiplexer or Switches |
.65 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-CQCC-N16 |
SEPARATE OUTPUT |
1 |
5.5 V |
1 mm |
4 mm |
Not Qualified |
76 dB |
1.8 V |
e0 |
BREAK-BEFORE-MAKE |
245 |
35 ns |
75 ohm |
20 ns |
2 ohm |
4 mm |
|||||||||||||||||||||
Maxim Integrated |
DPDT |
INDUSTRIAL |
36 |
FBGA |
SQUARE |
YES |
PLASTIC/EPOXY |
4 |
CMOS |
BALL |
3/5 |
GRID ARRAY, FINE PITCH |
BGA36,6X6,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
BOTTOM |
S-PBGA-B36 |
SEPARATE OUTPUT |
1 |
Not Qualified |
e0 |
BREAK-BEFORE-MAKE |
140 ns |
1 ohm |
||||||||||||||||||||||||||||||||
Toshiba |
DPDT |
INDUSTRIAL |
16 |
TSSOP |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
1 |
4 |
CMOS |
GULL WING |
-6 V |
-4.5 V |
4.5 V |
2/6,GND/-6 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP16,.25 |
Multiplexer or Switches |
.65 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-G16 |
6 V |
1.2 mm |
.025 A |
4.4 mm |
Not Qualified |
50 dB |
2 V |
IT CAN ALSO OPERATE WITH 2 TO 12 V SUPPLY |
0 V |
BREAK-BEFORE-MAKE |
280 ns |
120 ohm |
315 ns |
5 ohm |
5 mm |
|||||||||||||||||||||
Toshiba |
DPDT |
INDUSTRIAL |
16 |
TSSOP |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
1 |
8 |
CMOS |
GULL WING |
-6 V |
-4.5 V |
4.5 V |
2/6,GND/-6 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP16,.25 |
Multiplexer or Switches |
.65 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-G16 |
6 V |
1.2 mm |
.025 A |
4.4 mm |
Not Qualified |
50 dB |
2 V |
IT CAN ALSO OPERATE WITH 2 TO 12 V SUPPLY |
0 V |
BREAK-BEFORE-MAKE |
280 ns |
120 ohm |
315 ns |
5 ohm |
5 mm |
|||||||||||||||||||||
Toshiba |
DPDT |
INDUSTRIAL |
5 |
LSSOP |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
1 |
1 |
CMOS |
GULL WING |
5 V |
3/18 |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
TSOP6,.11,37 |
Multiplexer or Switches |
.95 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-G5 |
18 V |
1.4 mm |
1.6 mm |
Not Qualified |
NO |
3 V |
120 ns |
950 ohm |
80 ns |
2.9 mm |
||||||||||||||||||||||||||||
Toshiba |
DPDT |
INDUSTRIAL |
16 |
TSSOP |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
1 |
6 |
CMOS |
GULL WING |
-6 V |
-4.5 V |
4.5 V |
2/6,GND/-6 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP16,.25 |
Multiplexer or Switches |
.65 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-G16 |
6 V |
1.2 mm |
.025 A |
4.4 mm |
Not Qualified |
50 dB |
2 V |
IT CAN ALSO OPERATE WITH 2 TO 12 V SUPPLY |
0 V |
BREAK-BEFORE-MAKE |
280 ns |
120 ohm |
280 ns |
5 ohm |
5 mm |
|||||||||||||||||||||
Renesas Electronics |
DPDT |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Renesas Electronics |
DPDT |
INDUSTRIAL |
10 |
HVSON |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
1 |
2 |
CMOS |
NO LEAD |
3.3 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
105 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-N10 |
2 |
5.5 V |
.85 mm |
3 mm |
98 dB |
2.7 V |
e3 |
10 ohm |
.1 ohm |
3 mm |
|||||||||||||||||||||||||||||
|
Renesas Electronics |
DPDT |
MATTE TIN |
2 |
e3 |
30 |
260 |
||||||||||||||||||||||||||||||||||||||||||||||||||||
Renesas Electronics |
DPDT |
MILITARY |
16 |
DIP |
RECTANGULAR |
NO |
CERAMIC |
1 |
CMOS |
THROUGH-HOLE |
5,+-15 |
IN-LINE |
DIP16,.3 |
Multiplexer or Switches |
2.54 mm |
125 Cel |
-55 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-XDIP-T16 |
SEPARATE OUTPUT |
Not Qualified |
e0 |
BREAK-BEFORE-MAKE |
1000 ns |
150 ohm |
|||||||||||||||||||||||||||||||||
|
Renesas Electronics |
DPDT |
INDUSTRIAL |
10 |
HVSON |
SQUARE |
YES |
PLASTIC/EPOXY |
2 |
2 |
CMOS |
NO LEAD |
3.3 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
105 Cel |
-40 Cel |
MATTE TIN |
DUAL |
S-PDSO-N10 |
2 |
5.5 V |
.85 mm |
3 mm |
98 dB |
2.7 V |
e3 |
10 ohm |
.1 ohm |
3 mm |
|||||||||||||||||||||||||||||
Renesas Electronics |
DPDT |
INDUSTRIAL |
10 |
HVSON |
SQUARE |
YES |
PLASTIC/EPOXY |
2 |
2 |
CMOS |
NO LEAD |
3.3 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
105 Cel |
-40 Cel |
DUAL |
S-PDSO-N10 |
5.5 V |
.85 mm |
3 mm |
98 dB |
2.7 V |
10 ohm |
.1 ohm |
3 mm |
|||||||||||||||||||||||||||||||||
Renesas Electronics |
DPDT |
MILITARY |
16 |
DIP |
RECTANGULAR |
NO |
CERAMIC, METAL-SEALED COFIRED |
1 |
1 |
CMOS |
MIL-STD-883 |
THROUGH-HOLE |
-15 V |
15 V |
IN-LINE |
125 Cel |
-55 Cel |
TIN LEAD |
DUAL |
R-CDIP-T16 |
Qualified |
e0 |
450 ns |
45 ohm |
350 ns |
Multiplexers and switches are electronic components used in digital and analog circuits to route signals between different inputs and outputs. They allow a single input signal to be sent to multiple output channels or vice versa.
A multiplexer, also known as a "mux," is a digital component that selects one of several input signals and forwards it to a single output. Multiplexers are often used in data communication systems to transmit multiple signals over a single communication channel. They can also be used in digital circuits to route control signals and address lines.
A switch is an electronic component that connects or disconnects two or more circuits. Switches can be mechanical or electronic and are used to control the flow of current in a circuit. In digital circuits, switches are used to connect or disconnect components and can be used to create logic gates and other digital components.
Multiplexers and switches are important components in various electronic systems, including communication systems, data processing systems, and control systems. They can be used to route signals between different parts of a circuit and to switch between different modes of operation. Multiplexers and switches can also be used to improve the efficiency of a system by reducing the number of components needed to perform a particular function.