Part | RoHS | Manufacturer | Other IC type | Temperature Grade | No. of Terminals | Package Code | Package Shape | Surface Mount | Total Dose (V) | Maximum Switching Frequency | Package Body Material | Maximum Supply Current (Isup) | No. of Functions | No. of Channels | Technology | Screening Level | Nominal Bandwidth | Terminal Form | Maximum Negative Supply Voltage (Vsup) | Nominal Negative Supply Voltage (Vsup) | Nominal Supply Voltage (Vsup) | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Control Mode | Minimum Operating Temperature | Terminal Finish | Terminal Position | JESD-30 Code | Output (V) | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Maximum Signal Current | Height | Width (mm) | Qualification | Normal Position (V) | Nominal Off-state Isolation | Minimum Supply Voltage (Vsup) | Additional Features | Minimum Input Voltage | Minimum Negative Supply Voltage (Vsup) | JESD-609 Code | Switching (V) | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Maximum Switch-on Time | Maximum On-state Resistance (Ron) | Nominal Threshold Voltage (V) | Maximum Switch-off Time | Maximum Positive Input Voltage | Nominal On-state Resistance Match | Length | Adjustable Threshold | Maximum Input Voltage |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Analog Devices |
DPDT |
INDUSTRIAL |
10 |
VQCCN |
RECTANGULAR |
YES |
UNSPECIFIED |
1 |
2 |
BICMOS |
NO LEAD |
3 V |
3/5 |
CHIP CARRIER, VERY THIN PROFILE |
LCC10,.06X.07,16 |
Multiplexer or Switches |
.4 mm |
85 Cel |
-40 Cel |
QUAD |
R-XQCC-N10 |
1 |
5.5 V |
.55 mm |
1.4 mm |
Not Qualified |
84 dB |
2.7 V |
BREAK-BEFORE-MAKE |
120000 ns |
6 ohm |
40000 ns |
.2 ohm |
1.8 mm |
||||||||||||||||||||||||
|
Analog Devices |
DPDT |
INDUSTRIAL |
36 |
QCCN |
SQUARE |
YES |
UNSPECIFIED |
7 |
BICMOS |
NO LEAD |
3.3 V |
3.3 |
CHIP CARRIER |
LCC36,.25SQ,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
S-XQCC-N36 |
SEPARATE OUTPUT |
1 |
Not Qualified |
e3 |
30 |
260 |
50 ns |
6.5 ohm |
|||||||||||||||||||||||||||||
|
Analog Devices |
DPDT |
INDUSTRIAL |
42 |
HVQCCN |
RECTANGULAR |
YES |
UNSPECIFIED |
4 |
2 |
CMOS |
NO LEAD |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC42,.14X.35,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
R-XQCC-N42 |
SEPARATE OUTPUT |
1 |
3.6 V |
.8 mm |
3.5 mm |
Not Qualified |
15 dB |
3 V |
e3 |
BREAK-BEFORE-MAKE |
30 |
260 |
8.4 ohm |
.2 ohm |
9 mm |
|||||||||||||||||||||
|
Analog Devices |
DPDT |
INDUSTRIAL |
10 |
TSSOP |
SQUARE |
YES |
PLASTIC/EPOXY |
1 |
2 |
CMOS |
GULL WING |
12 V |
12 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP10,.19,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
S-PDSO-G10 |
SEPARATE OUTPUT |
1 |
12.6 V |
1.1 mm |
3 mm |
Not Qualified |
92 dB |
2 V |
e3 |
BREAK-BEFORE-MAKE |
30 |
260 |
150 ns |
80 ohm |
120 ns |
2 ohm |
3 mm |
|||||||||||||||||||
|
Analog Devices |
DPDT |
INDUSTRIAL |
42 |
HVQCCN |
RECTANGULAR |
YES |
UNSPECIFIED |
4 |
2 |
CMOS |
NO LEAD |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC42,.14X.35,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
R-XQCC-N42 |
SEPARATE OUTPUT |
1 |
3.6 V |
.8 mm |
3.5 mm |
Not Qualified |
15 dB |
3 V |
e3 |
BREAK-BEFORE-MAKE |
30 |
260 |
8.4 ohm |
.2 ohm |
9 mm |
|||||||||||||||||||||
|
Analog Devices |
DPDT |
INDUSTRIAL |
28 |
HVQCCN |
RECTANGULAR |
YES |
UNSPECIFIED |
3 |
2 |
CMOS |
NO LEAD |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC28,.14X.22,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
R-XQCC-N28 |
SEPARATE OUTPUT |
1 |
3.6 V |
.85 mm |
3.5 mm |
Not Qualified |
28 dB |
3 V |
e3 |
BREAK-BEFORE-MAKE |
30 |
260 |
120 ns |
1.5 ohm |
50 ns |
1 ohm |
5.5 mm |
|||||||||||||||||||
|
Analog Devices |
DPDT |
INDUSTRIAL |
16 |
TSSOP |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
4 |
BICMOS |
GULL WING |
3.3,10/70/+-35 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP16,.25 |
Multiplexer or Switches |
.635 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
R-PDSO-G16 |
SEPARATE OUTPUT |
1 |
Not Qualified |
NO/NC |
e3 |
BREAK-BEFORE-MAKE |
30 |
260 |
60000 ns |
10 ohm |
||||||||||||||||||||||||||||
|
Analog Devices |
DPDT |
INDUSTRIAL |
36 |
HVQCCN |
SQUARE |
YES |
UNSPECIFIED |
4 |
2 |
CMOS |
NO LEAD |
3 V |
3/5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC36,.25SQ,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
S-XQCC-N36 |
SEPARATE OUTPUT |
1 |
5.5 V |
.8 mm |
6 mm |
Not Qualified |
100 dB |
1.8 V |
e3 |
BREAK-BEFORE-MAKE |
30 |
260 |
140 ns |
3.5 ohm |
50 ns |
.2 ohm |
6 mm |
|||||||||||||||||||
|
Analog Devices |
DPDT |
NICKEL GOLD PALLADIUM |
1 |
30 |
260 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
DPDT |
INDUSTRIAL |
28 |
HVQCCN |
RECTANGULAR |
YES |
UNSPECIFIED |
2 |
2 |
CMOS |
NO LEAD |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC28,.14X.22,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
R-XQCC-N28 |
SEPARATE OUTPUT |
1 |
3.6 V |
.8 mm |
3.5 mm |
Not Qualified |
15 dB |
3 V |
e3 |
BREAK-BEFORE-MAKE |
30 |
260 |
8.4 ohm |
.2 ohm |
5.5 mm |
|||||||||||||||||||||
|
Analog Devices |
DPDT |
INDUSTRIAL |
8 |
HVSON |
SQUARE |
YES |
PLASTIC/EPOXY |
.275 mA |
1 |
2 |
BICMOS |
NO LEAD |
3.3 V |
2.5/5 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.08,20 |
Power Management Circuits |
.5 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
S-PDSO-N8 |
1 |
5.5 V |
.8 mm |
2 mm |
Not Qualified |
2.3 V |
e3 |
30 |
260 |
.05 ohm |
2 mm |
||||||||||||||||||||||||
|
Analog Devices |
DPDT |
INDUSTRIAL |
10 |
VQCCN |
RECTANGULAR |
YES |
UNSPECIFIED |
1 |
2 |
BICMOS |
NO LEAD |
3 V |
CHIP CARRIER, VERY THIN PROFILE |
.4 mm |
85 Cel |
-40 Cel |
NICKEL GOLD PALLADIUM |
QUAD |
R-XQCC-N10 |
1 |
5.5 V |
.55 mm |
1.4 mm |
84 dB |
2.7 V |
30 |
260 |
120000 ns |
6 ohm |
40000 ns |
.2 ohm |
1.8 mm |
||||||||||||||||||||||||||
|
Analog Devices |
DPDT |
INDUSTRIAL |
9 |
FBGA |
SQUARE |
YES |
PLASTIC/EPOXY |
3 |
BICMOS |
BALL |
3/5 |
GRID ARRAY, FINE PITCH |
BGA9,3X3,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B9 |
SEPARATE OUTPUT |
1 |
Not Qualified |
NO |
e1 |
BREAK-BEFORE-MAKE |
30 |
260 |
100 ns |
.3 ohm |
||||||||||||||||||||||||||||
|
Analog Devices |
DPDT |
INDUSTRIAL |
10 |
TSSOP |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
1 |
CMOS |
GULL WING |
12 V |
12 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP10,.19,20 |
Multiplexers or Switches |
.5 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
R-PDSO-G10 |
SEPARATE OUTPUT |
1 |
Not Qualified |
e3 |
BREAK-BEFORE-MAKE |
30 |
260 |
150 ns |
100 ohm |
||||||||||||||||||||||||||||
|
Analog Devices |
DPDT |
INDUSTRIAL |
16 |
TSSOP |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
2 |
2 |
CMOS |
GULL WING |
3 V |
3/5 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP16,.25 |
Multiplexer or Switches |
.65 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-G16 |
SEPARATE OUTPUT |
5.5 V |
1.1 mm |
4.4 mm |
Not Qualified |
76 dB |
1.8 V |
BREAK-BEFORE-MAKE |
30 |
260 |
45 ns |
75 ohm |
25 ns |
2 ohm |
5 mm |
||||||||||||||||||||||
|
Analog Devices |
DPDT |
INDUSTRIAL |
36 |
VFBGA |
SQUARE |
YES |
PLASTIC/EPOXY |
4 |
2 |
CMOS |
BALL |
3 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B36 |
1 |
5.5 V |
.67 mm |
3.06 mm |
Not Qualified |
100 dB |
1.8 V |
e1 |
30 |
260 |
140 ns |
3.5 ohm |
50 ns |
.2 ohm |
3.06 mm |
||||||||||||||||||||||||
|
Analog Devices |
DPDT |
COMMERCIAL |
10 |
TSSOP |
SQUARE |
YES |
PLASTIC/EPOXY |
1 |
2 |
CMOS |
GULL WING |
3 V |
3/5 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP10,.19,20 |
Multiplexer or Switches |
.5 mm |
70 Cel |
0 Cel |
Matte Tin (Sn) - annealed |
DUAL |
S-PDSO-G10 |
SEPARATE OUTPUT |
1 |
12 V |
1.1 mm |
3 mm |
Not Qualified |
2 V |
e3 |
BREAK-BEFORE-MAKE |
30 |
260 |
300 ns |
400 ohm |
200 ns |
3 mm |
|||||||||||||||||||||
|
Analog Devices |
DPDT |
INDUSTRIAL |
36 |
HVQCCN |
SQUARE |
YES |
UNSPECIFIED |
4 |
2 |
CMOS |
NO LEAD |
3 V |
3/5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC36,.25SQ,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
S-XQCC-N36 |
SEPARATE OUTPUT |
1 |
5.5 V |
.8 mm |
6 mm |
Not Qualified |
100 dB |
1.8 V |
e3 |
BREAK-BEFORE-MAKE |
30 |
260 |
140 ns |
3.5 ohm |
50 ns |
.2 ohm |
6 mm |
|||||||||||||||||||
|
Analog Devices |
DPDT |
INDUSTRIAL |
16 |
SSOP |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
1 |
2 |
CMOS |
GULL WING |
SMALL OUTLINE, SHRINK PITCH |
.635 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
R-PDSO-G16 |
1 |
5.5 V |
1.75 mm |
3.9 mm |
Not Qualified |
3 V |
e3 |
30 |
260 |
6 ohm |
4.89 mm |
|||||||||||||||||||||||||||||
Analog Devices |
DPDT |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Analog Devices |
DPDT |
INDUSTRIAL |
36 |
VFBGA |
SQUARE |
YES |
PLASTIC/EPOXY |
4 |
2 |
CMOS |
BALL |
3 V |
3/5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA36,6X6,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
BOTTOM |
S-PBGA-B36 |
SEPARATE OUTPUT |
1 |
5.5 V |
.67 mm |
3.06 mm |
Not Qualified |
95 dB |
1.8 V |
e0 |
BREAK-BEFORE-MAKE |
245 |
140 ns |
.85 ohm |
50 ns |
.1 ohm |
3.06 mm |
|||||||||||||||||||||
Analog Devices |
DPDT |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
DPDT |
Matte Tin (Sn) - annealed |
1 |
e3 |
30 |
260 |
||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
DPDT |
INDUSTRIAL |
10 |
VQCCN |
RECTANGULAR |
YES |
UNSPECIFIED |
1 |
2 |
BICMOS |
NO LEAD |
2.7 V |
3/5 |
CHIP CARRIER, VERY THIN PROFILE |
LCC10,.06X.07,16 |
Multiplexer or Switches |
.4 mm |
85 Cel |
-40 Cel |
NICKEL GOLD PALLADIUM |
QUAD |
R-XQCC-N10 |
SEPARATE OUTPUT |
1 |
5.5 V |
.55 mm |
1.4 mm |
Not Qualified |
90 dB |
1.8 V |
BREAK-BEFORE-MAKE |
30 |
260 |
.6 ohm |
2000 ns |
.003 ohm |
1.8 mm |
|||||||||||||||||||||
|
Analog Devices |
DPDT |
COMMERCIAL |
8 |
SOP |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
1 |
2 |
CMOS |
GULL WING |
-6 V |
-5 V |
5 V |
3/5/+-5 |
SMALL OUTLINE |
SOP8,.25 |
Multiplexer or Switches |
1.27 mm |
70 Cel |
0 Cel |
Matte Tin (Sn) - annealed |
DUAL |
R-PDSO-G8 |
SEPARATE OUTPUT |
1 |
6 V |
1.75 mm |
3.9 mm |
Not Qualified |
2.7 V |
-2.7 V |
e3 |
BREAK-BEFORE-MAKE |
30 |
260 |
150 ns |
120 ohm |
100 ns |
4 ohm |
4.9 mm |
|||||||||||||||||
|
Analog Devices |
DPDT |
INDUSTRIAL |
16 |
HVQCCN |
SQUARE |
YES |
UNSPECIFIED |
2 |
2 |
CMOS |
NO LEAD |
3 V |
3/5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC16,.12SQ,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
S-XQCC-N16 |
SEPARATE OUTPUT |
1 |
5.5 V |
.8 mm |
3 mm |
Not Qualified |
76 dB |
1.8 V |
e3 |
BREAK-BEFORE-MAKE |
30 |
260 |
45 ns |
75 ohm |
25 ns |
2 ohm |
3 mm |
|||||||||||||||||||
|
Analog Devices |
DPDT |
Matte Tin (Sn) - annealed |
1 |
e3 |
30 |
260 |
||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
DPDT |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
1 |
2 |
CMOS |
GULL WING |
-6 V |
-5 V |
5 V |
SMALL OUTLINE |
1.27 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
R-PDSO-G8 |
1 |
6 V |
1.75 mm |
3.9 mm |
Not Qualified |
2.7 V |
-2.7 V |
e3 |
30 |
260 |
150 ns |
120 ohm |
100 ns |
4 ohm |
4.9 mm |
||||||||||||||||||||||
|
Analog Devices |
DPDT |
INDUSTRIAL |
9 |
FBGA |
SQUARE |
YES |
PLASTIC/EPOXY |
3 |
BICMOS |
BALL |
3/5 |
GRID ARRAY, FINE PITCH |
BGA9,3X3,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B9 |
SEPARATE OUTPUT |
1 |
Not Qualified |
NO |
e1 |
BREAK-BEFORE-MAKE |
30 |
260 |
100 ns |
.3 ohm |
||||||||||||||||||||||||||||
Analog Devices |
DPDT |
INDUSTRIAL |
16 |
HVQCCN |
SQUARE |
YES |
UNSPECIFIED |
2 |
2 |
CMOS |
NO LEAD |
3 V |
3/5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC16,.12SQ,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-XQCC-N16 |
SEPARATE OUTPUT |
1 |
5.5 V |
.8 mm |
3 mm |
Not Qualified |
76 dB |
1.8 V |
e0 |
BREAK-BEFORE-MAKE |
245 |
35 ns |
75 ohm |
20 ns |
2 ohm |
3 mm |
|||||||||||||||||||||
|
Analog Devices |
DPDT |
INDUSTRIAL |
16 |
HVQCCN |
SQUARE |
YES |
UNSPECIFIED |
2 |
2 |
CMOS |
NO LEAD |
3 V |
3/5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC16,.16SQ,25 |
Multiplexer or Switches |
.65 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
S-XQCC-N16 |
SEPARATE OUTPUT |
1 |
5.5 V |
.8 mm |
4 mm |
Not Qualified |
76 dB |
1.8 V |
e3 |
BREAK-BEFORE-MAKE |
30 |
260 |
35 ns |
75 ohm |
20 ns |
2 ohm |
4 mm |
|||||||||||||||||||
|
Analog Devices |
DPDT |
Matte Tin (Sn) - annealed |
1 |
e3 |
30 |
260 |
||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
DPDT |
INDUSTRIAL |
10 |
HVSON |
SQUARE |
YES |
UNSPECIFIED |
.01 mA |
1 |
2 |
CMOS |
NO LEAD |
12 V |
12 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC10,.11,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
S-XDSO-N10 |
1 |
12.6 V |
.8 mm |
.02 A |
3 mm |
Not Qualified |
92 dB |
2 V |
e3 |
BREAK-BEFORE-MAKE |
150 ns |
80 ohm |
120 ns |
2 ohm |
3 mm |
||||||||||||||||||||
|
Analog Devices |
DPDT |
INDUSTRIAL |
10 |
VQCCN |
RECTANGULAR |
YES |
UNSPECIFIED |
1 |
2 |
BICMOS |
NO LEAD |
3 V |
CHIP CARRIER, VERY THIN PROFILE |
.4 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
R-XQCC-N10 |
1 |
5.5 V |
.55 mm |
1.4 mm |
84 dB |
2.7 V |
e4 |
30 |
260 |
120000 ns |
6 ohm |
40000 ns |
.2 ohm |
1.8 mm |
|||||||||||||||||||||||||
Analog Devices |
DPDT |
COMMERCIAL |
14 |
DIP |
RECTANGULAR |
NO |
PLASTIC/EPOXY |
1 |
CMOS |
THROUGH-HOLE |
-15 V |
15 V |
+-15 |
IN-LINE |
DIP14,.3 |
Multiplexer or Switches |
2.54 mm |
70 Cel |
0 Cel |
DUAL |
R-PDIP-T14 |
1 |
Not Qualified |
BREAK-BEFORE-MAKE |
300 ns |
75 ohm |
|||||||||||||||||||||||||||||||||
|
Analog Devices |
DPDT |
INDUSTRIAL |
36 |
HVQCCN |
SQUARE |
YES |
UNSPECIFIED |
4 |
2 |
CMOS |
NO LEAD |
3 V |
3/5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC36,.25SQ,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-XQCC-N36 |
SEPARATE OUTPUT |
5.5 V |
.8 mm |
6 mm |
Not Qualified |
80 dB |
1.8 V |
BREAK-BEFORE-MAKE |
NOT SPECIFIED |
NOT SPECIFIED |
800 ns |
3.5 ohm |
800 ns |
.2 ohm |
6 mm |
||||||||||||||||||||||
Analog Devices |
DPDT |
INDUSTRIAL |
16 |
HVQCCN |
SQUARE |
YES |
UNSPECIFIED |
2 |
2 |
CMOS |
NO LEAD |
3 V |
3/5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC16,.12SQ,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N16 |
SEPARATE OUTPUT |
1 |
5.5 V |
.8 mm |
3 mm |
Not Qualified |
76 dB |
1.8 V |
e3 |
BREAK-BEFORE-MAKE |
30 |
260 |
45 ns |
75 ohm |
25 ns |
2 ohm |
3 mm |
||||||||||||||||||||
|
Analog Devices |
DPDT |
INDUSTRIAL |
42 |
HVQCCN |
RECTANGULAR |
YES |
UNSPECIFIED |
6 |
2 |
CMOS |
NO LEAD |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC42,.14X.35,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
R-XQCC-N42 |
SEPARATE OUTPUT |
1 |
3.6 V |
.8 mm |
3.5 mm |
Not Qualified |
28 dB |
3 V |
e3 |
BREAK-BEFORE-MAKE |
30 |
260 |
120 ns |
1.5 ohm |
50 ns |
1 ohm |
9 mm |
|||||||||||||||||||
|
Analog Devices |
DPDT |
INDUSTRIAL |
32 |
VFBGA |
SQUARE |
YES |
PLASTIC/EPOXY |
4 |
2 |
CMOS |
BALL |
3 V |
3/5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA36,6X6,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B32 |
SEPARATE OUTPUT |
1 |
5.5 V |
.67 mm |
3.06 mm |
Not Qualified |
80 dB |
1.8 V |
e1 |
BREAK-BEFORE-MAKE |
30 |
260 |
150 ns |
3.5 ohm |
60 ns |
.2 ohm |
3.06 mm |
|||||||||||||||||||
|
Analog Devices |
DPDT |
INDUSTRIAL |
10 |
VQCCN |
RECTANGULAR |
YES |
UNSPECIFIED |
1 |
2 |
BICMOS |
NO LEAD |
3 V |
CHIP CARRIER, VERY THIN PROFILE |
.4 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
R-XQCC-N10 |
1 |
5 V |
.55 mm |
1.4 mm |
65 dB |
2.7 V |
e4 |
30 |
260 |
60000 ns |
5 ohm |
5000 ns |
.2 ohm |
1.8 mm |
|||||||||||||||||||||||||
|
Analog Devices |
DPDT |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
DPDT |
NICKEL GOLD PALLADIUM |
1 |
30 |
260 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
DPDT |
INDUSTRIAL |
8 |
HVSON |
SQUARE |
YES |
PLASTIC/EPOXY |
.275 mA |
1 |
2 |
BICMOS |
NO LEAD |
3.3 V |
2.5/5 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.08,20 |
Power Management Circuits |
.5 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
S-PDSO-N8 |
1 |
5.5 V |
.8 mm |
2 mm |
Not Qualified |
2.3 V |
e3 |
30 |
260 |
.05 ohm |
2 mm |
||||||||||||||||||||||||
|
Analog Devices |
DPDT |
INDUSTRIAL |
36 |
HVQCCN |
SQUARE |
YES |
UNSPECIFIED |
4 |
2 |
CMOS |
NO LEAD |
3 V |
3/5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC36,.25SQ,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
S-XQCC-N36 |
SEPARATE OUTPUT |
1 |
5.5 V |
.8 mm |
6 mm |
Not Qualified |
80 dB |
1.8 V |
e3 |
BREAK-BEFORE-MAKE |
30 |
260 |
150 ns |
3.5 ohm |
60 ns |
.2 ohm |
6 mm |
|||||||||||||||||||
|
Analog Devices |
DPDT |
INDUSTRIAL |
10 |
VQCCN |
RECTANGULAR |
YES |
UNSPECIFIED |
1 |
2 |
BICMOS |
NO LEAD |
3 V |
CHIP CARRIER, VERY THIN PROFILE |
.4 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
R-XQCC-N10 |
1 |
5.5 V |
.55 mm |
1.4 mm |
Not Qualified |
2.4 V |
e4 |
30 |
260 |
1.8 mm |
|||||||||||||||||||||||||||||
|
Analog Devices |
DPDT |
INDUSTRIAL |
10 |
TSSOP |
SQUARE |
YES |
PLASTIC/EPOXY |
1 |
2 |
CMOS |
GULL WING |
3 V |
3/5 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP10,.19,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
S-PDSO-G10 |
SEPARATE OUTPUT |
1 |
12 V |
1.1 mm |
3 mm |
Not Qualified |
2 V |
e3 |
BREAK-BEFORE-MAKE |
30 |
260 |
300 ns |
400 ohm |
200 ns |
3 mm |
|||||||||||||||||||||
|
Analog Devices |
DPDT |
INDUSTRIAL |
10 |
VQCCN |
RECTANGULAR |
YES |
UNSPECIFIED |
1 |
2 |
BICMOS |
NO LEAD |
3 V |
CHIP CARRIER, VERY THIN PROFILE |
.4 mm |
85 Cel |
-40 Cel |
QUAD |
R-XQCC-N10 |
5.5 V |
.55 mm |
1.4 mm |
Not Qualified |
2.4 V |
NOT SPECIFIED |
NOT SPECIFIED |
1.8 mm |
||||||||||||||||||||||||||||||||
|
Analog Devices |
DPDT |
INDUSTRIAL |
36 |
HVQCCN |
SQUARE |
YES |
UNSPECIFIED |
4 |
2 |
CMOS |
NO LEAD |
3 V |
3/5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC36,.25SQ,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
S-XQCC-N36 |
SEPARATE OUTPUT |
1 |
5.5 V |
.8 mm |
6 mm |
Not Qualified |
95 dB |
1.8 V |
e3 |
BREAK-BEFORE-MAKE |
30 |
260 |
140 ns |
.85 ohm |
50 ns |
.1 ohm |
6 mm |
Multiplexers and switches are electronic components used in digital and analog circuits to route signals between different inputs and outputs. They allow a single input signal to be sent to multiple output channels or vice versa.
A multiplexer, also known as a "mux," is a digital component that selects one of several input signals and forwards it to a single output. Multiplexers are often used in data communication systems to transmit multiple signals over a single communication channel. They can also be used in digital circuits to route control signals and address lines.
A switch is an electronic component that connects or disconnects two or more circuits. Switches can be mechanical or electronic and are used to control the flow of current in a circuit. In digital circuits, switches are used to connect or disconnect components and can be used to create logic gates and other digital components.
Multiplexers and switches are important components in various electronic systems, including communication systems, data processing systems, and control systems. They can be used to route signals between different parts of a circuit and to switch between different modes of operation. Multiplexers and switches can also be used to improve the efficiency of a system by reducing the number of components needed to perform a particular function.