Part | RoHS | Manufacturer | Other IC type | Temperature Grade | No. of Terminals | Package Code | Package Shape | Surface Mount | Total Dose (V) | Maximum Switching Frequency | Package Body Material | Maximum Supply Current (Isup) | No. of Functions | No. of Channels | Technology | Screening Level | Nominal Bandwidth | Terminal Form | Maximum Negative Supply Voltage (Vsup) | Nominal Negative Supply Voltage (Vsup) | Nominal Supply Voltage (Vsup) | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Control Mode | Minimum Operating Temperature | Terminal Finish | Terminal Position | JESD-30 Code | Output (V) | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Maximum Signal Current | Height | Width (mm) | Qualification | Normal Position (V) | Nominal Off-state Isolation | Minimum Supply Voltage (Vsup) | Additional Features | Minimum Input Voltage | Minimum Negative Supply Voltage (Vsup) | JESD-609 Code | Switching (V) | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Maximum Switch-on Time | Maximum On-state Resistance (Ron) | Nominal Threshold Voltage (V) | Maximum Switch-off Time | Maximum Positive Input Voltage | Nominal On-state Resistance Match | Length | Adjustable Threshold | Maximum Input Voltage |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Onsemi |
DPDT |
MILITARY |
16 |
HVQCCN |
SQUARE |
YES |
UNSPECIFIED |
2 |
2 |
CMOS |
NO LEAD |
2.5 V |
2.5/5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC16,.12SQ,20 |
Multiplexer or Switches |
.5 mm |
125 Cel |
-55 Cel |
NICKEL GOLD PALLADIUM |
QUAD |
S-XQCC-N16 |
SEPARATE OUTPUT |
1 |
5.5 V |
1 mm |
3 mm |
Not Qualified |
93 dB |
2 V |
BREAK-BEFORE-MAKE |
35 ns |
105 ohm |
12 ns |
3 mm |
|||||||||||||||||||||||
Onsemi |
DPDT |
INDUSTRIAL |
10 |
BCC |
RECTANGULAR |
YES |
UNSPECIFIED |
1 |
2 |
NO LEAD |
3 V |
CHIP CARRIER |
85 Cel |
-40 Cel |
QUAD |
R-XQCC-N10 |
5.5 V |
.55 mm |
1.6 mm |
2.7 V |
2000 ns |
6 ohm |
2000 ns |
.4 ohm |
2.1 mm |
||||||||||||||||||||||||||||||||||
|
Onsemi |
DPDT |
INDUSTRIAL |
10 |
VQCCN |
RECTANGULAR |
YES |
UNSPECIFIED |
1 |
2 |
CMOS |
NO LEAD |
3.3 V |
3.3 |
CHIP CARRIER, VERY THIN PROFILE |
LCC10,.06X.07,16 |
Multiplexer or Switches |
.4 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
R-XQCC-N10 |
SEPARATE OUTPUT |
1 |
3.6 V |
.8 mm |
1.4 mm |
Not Qualified |
28 dB |
3 V |
e4 |
BREAK-BEFORE-MAKE |
30 |
260 |
30 ns |
9 ohm |
25 ns |
.35 ohm |
1.8 mm |
|||||||||||||||||||
|
Onsemi |
DPDT |
MILITARY |
16 |
TSSOP |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
2 |
2 |
CMOS |
GULL WING |
2.5 V |
2.5/5 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP16,.25 |
Multiplexer or Switches |
.65 mm |
125 Cel |
-55 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G16 |
SEPARATE OUTPUT |
5.5 V |
1.2 mm |
4.4 mm |
Not Qualified |
93 dB |
2 V |
e4 |
BREAK-BEFORE-MAKE |
260 |
35 ns |
105 ohm |
12 ns |
5 mm |
||||||||||||||||||||||
|
Onsemi |
DPDT |
INDUSTRIAL |
10 |
VQCCN |
RECTANGULAR |
YES |
UNSPECIFIED |
1 |
2 |
CMOS |
NO LEAD |
3.3 V |
3.3 |
CHIP CARRIER, VERY THIN PROFILE |
LCC10,.06X.07,16 |
Multiplexer or Switches |
.4 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
R-XQCC-N10 |
SEPARATE OUTPUT |
1 |
4.5 V |
.6 mm |
1.4 mm |
Not Qualified |
22 dB |
1.65 V |
e4 |
BREAK-BEFORE-MAKE |
30 |
260 |
30 ns |
10 ohm |
20 ns |
.85 ohm |
1.8 mm |
|||||||||||||||||||
|
Onsemi |
DPDT |
INDUSTRIAL |
10 |
VQCCN |
RECTANGULAR |
YES |
UNSPECIFIED |
1 |
2 |
NO LEAD |
3 V |
CHIP CARRIER, VERY THIN PROFILE |
.4 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
R-XQCC-N10 |
1 |
3.7 V |
.6 mm |
1.4 mm |
25 dB |
2.7 V |
e4 |
30 |
260 |
6.63 ohm |
.2 ohm |
1.8 mm |
||||||||||||||||||||||||||||
|
Onsemi |
DPDT |
INDUSTRIAL |
16 |
VQCCN |
RECTANGULAR |
YES |
UNSPECIFIED |
2 |
2 |
NO LEAD |
3 V |
1.8/4 |
CHIP CARRIER, VERY THIN PROFILE |
LCC16,.07X.1,16 |
Multiplexer or Switches |
.4 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
R-XQCC-N16 |
SEPARATE OUTPUT |
1 |
4.5 V |
.8 mm |
1.8 mm |
Not Qualified |
69 dB |
1.65 V |
e4 |
BREAK-BEFORE-MAKE |
260 |
50 ns |
.5 ohm |
30 ns |
.05 ohm |
2.6 mm |
|||||||||||||||||||||
|
Onsemi |
DPDT |
INDUSTRIAL |
10 |
VQCCN |
RECTANGULAR |
YES |
UNSPECIFIED |
1 |
2 |
CMOS |
NO LEAD |
3.3 V |
3.3 |
CHIP CARRIER, VERY THIN PROFILE |
LCC10,.06X.07,16 |
Multiplexer or Switches |
.4 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
R-XQCC-N10 |
SEPARATE OUTPUT |
1 |
3.6 V |
.6 mm |
1.4 mm |
Not Qualified |
28 dB |
3 V |
e4 |
BREAK-BEFORE-MAKE |
30 |
260 |
30 ns |
9 ohm |
25 ns |
.35 ohm |
1.8 mm |
|||||||||||||||||||
|
Onsemi |
DPDT |
INDUSTRIAL |
16 |
HVQCCN |
SQUARE |
YES |
UNSPECIFIED |
2 |
2 |
NO LEAD |
2.5 V |
1.8/4 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC16,.12SQ,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
TIN |
QUAD |
S-XQCC-N16 |
SEPARATE OUTPUT |
1 |
4.5 V |
1 mm |
3 mm |
Not Qualified |
62 dB |
1.65 V |
e3 |
BREAK-BEFORE-MAKE |
30 |
260 |
60 ns |
.75 ohm |
40 ns |
.06 ohm |
3 mm |
||||||||||||||||||||
|
Onsemi |
DPDT |
INDUSTRIAL |
10 |
VQCCN |
RECTANGULAR |
YES |
UNSPECIFIED |
1 |
2 |
NO LEAD |
3.3 V |
1.8/4.3 |
CHIP CARRIER |
LCC10,.06X.07,16 |
Multiplexer or Switches |
.4 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
R-XQCC-N10 |
SEPARATE OUTPUT |
4.5 V |
.6 mm |
1.4 mm |
Not Qualified |
21 dB |
1.65 V |
e4 |
BREAK-BEFORE-MAKE |
260 |
30 ns |
25 ns |
.7 ohm |
1.8 mm |
|||||||||||||||||||||||
|
Onsemi |
DPDT |
INDUSTRIAL |
10 |
VQCCN |
RECTANGULAR |
YES |
UNSPECIFIED |
2 |
2 |
NO LEAD |
4.2 V |
3.3 |
CHIP CARRIER, VERY THIN PROFILE |
LCC10,.06X.07,16 |
Multiplexer or Switches |
.4 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
R-XQCC-N10 |
SEPARATE OUTPUT |
4.5 V |
.6 mm |
1.4 mm |
Not Qualified |
70 dB |
2.7 V |
e4 |
BREAK-BEFORE-MAKE |
260 |
.55 ohm |
.19 ohm |
1.8 mm |
||||||||||||||||||||||||
Onsemi |
DPDT |
INDUSTRIAL |
12 |
VFBGA |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
1 |
2 |
CMOS |
BALL |
1.95 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
BOTTOM |
R-PBGA-B12 |
5.5 V |
.625 mm |
1.41 mm |
60 dB |
1.65 V |
75 ns |
5 ohm |
50 ns |
.15 ohm |
1.91 mm |
|||||||||||||||||||||||||||||||
|
Onsemi |
DPDT |
MILITARY |
16 |
VQCCN |
RECTANGULAR |
YES |
UNSPECIFIED |
2 |
2 |
CMOS |
NO LEAD |
2.5 V |
2.5/5 |
CHIP CARRIER, VERY THIN PROFILE |
LCC16,.07X.1,16 |
Multiplexer or Switches |
.4 mm |
125 Cel |
-55 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
R-XQCC-N16 |
SEPARATE OUTPUT |
1 |
5.5 V |
.8 mm |
1.8 mm |
Not Qualified |
93 dB |
2 V |
CAN BE USED AS QUAD 2-TO-1 MULTIPLEXER-DEMULTIPLEXER |
e4 |
BREAK-BEFORE-MAKE |
260 |
41 ns |
105 ohm |
18 ns |
2.6 mm |
||||||||||||||||||||
|
Onsemi |
DPDT |
INDUSTRIAL |
10 |
QCCN |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
1 |
NO LEAD |
3/4.3 |
CHIP CARRIER |
LCC10,.06X.07,16 |
Multiplexer or Switches |
.4 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
R-PQCC-N10 |
SEPARATE OUTPUT |
1 |
Not Qualified |
e4 |
BREAK-BEFORE-MAKE |
30 |
260 |
30 ns |
6.5 ohm |
||||||||||||||||||||||||||||||
|
Onsemi |
DPDT |
INDUSTRIAL |
16 |
VQCCN |
RECTANGULAR |
YES |
UNSPECIFIED |
2 |
2 |
NO LEAD |
3 V |
1.8/4 |
CHIP CARRIER, VERY THIN PROFILE |
LCC16,.07X.1,16 |
Multiplexer or Switches |
.4 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
R-XQCC-N16 |
SEPARATE OUTPUT |
1 |
4.5 V |
.8 mm |
1.8 mm |
Not Qualified |
69 dB |
1.65 V |
e4 |
BREAK-BEFORE-MAKE |
260 |
50 ns |
.5 ohm |
30 ns |
.05 ohm |
2.6 mm |
|||||||||||||||||||||
|
Onsemi |
DPDT |
INDUSTRIAL |
10 |
VQCCN |
RECTANGULAR |
YES |
UNSPECIFIED |
2 |
2 |
NO LEAD |
4.2 V |
CHIP CARRIER, VERY THIN PROFILE |
.4 mm |
85 Cel |
-40 Cel |
QUAD |
R-XQCC-N10 |
4.5 V |
.6 mm |
1.4 mm |
Not Qualified |
70 dB |
2.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
.55 ohm |
1.8 mm |
|||||||||||||||||||||||||||||||
|
Onsemi |
DPDT |
INDUSTRIAL |
16 |
HVQCCN |
SQUARE |
YES |
UNSPECIFIED |
2 |
2 |
CMOS |
NO LEAD |
2.3 V |
1.8/4.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC16,.12SQ,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-XQCC-N16 |
SEPARATE OUTPUT |
1 |
4.3 V |
.8 mm |
3 mm |
Not Qualified |
75 dB |
1.65 V |
e4 |
BREAK-BEFORE-MAKE |
30 |
260 |
80 ns |
.55 ohm |
52 ns |
.03 ohm |
3 mm |
|||||||||||||||||||
|
Onsemi |
DPDT |
MILITARY |
16 |
TSSOP |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
2 |
2 |
CMOS |
GULL WING |
2.5 V |
2.5/5 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP16,.25 |
Multiplexer or Switches |
.65 mm |
125 Cel |
-55 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G16 |
SEPARATE OUTPUT |
1 |
5.5 V |
1.2 mm |
4.4 mm |
Not Qualified |
93 dB |
2 V |
e4 |
BREAK-BEFORE-MAKE |
30 |
260 |
41 ns |
105 ohm |
18 ns |
5 mm |
||||||||||||||||||||
Onsemi |
DPDT |
MILITARY |
16 |
HVQCCN |
SQUARE |
YES |
UNSPECIFIED |
2 |
2 |
CMOS |
NO LEAD |
2.5 V |
2.5/5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC16,.12SQ,20 |
Multiplexer or Switches |
.5 mm |
125 Cel |
-55 Cel |
TIN LEAD |
QUAD |
S-XQCC-N16 |
SEPARATE OUTPUT |
5.5 V |
1 mm |
3 mm |
Not Qualified |
93 dB |
2 V |
e0 |
BREAK-BEFORE-MAKE |
235 |
35 ns |
105 ohm |
12 ns |
3 mm |
|||||||||||||||||||||||
|
Onsemi |
DPDT |
INDUSTRIAL |
16 |
VQCCN |
RECTANGULAR |
YES |
UNSPECIFIED |
2 |
2 |
CMOS |
NO LEAD |
2.3 V |
1.8/4.3 |
CHIP CARRIER, VERY THIN PROFILE |
LCC16,.07X.1,16 |
Multiplexer or Switches |
.4 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
R-XQCC-N16 |
SEPARATE OUTPUT |
1 |
4.3 V |
.55 mm |
1.8 mm |
Not Qualified |
75 dB |
1.65 V |
e4 |
BREAK-BEFORE-MAKE |
30 |
260 |
80 ns |
.55 ohm |
52 ns |
.03 ohm |
2.6 mm |
|||||||||||||||||||
|
STMicroelectronics |
DPDT |
INDUSTRIAL |
30 |
FBGA |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
4 |
CMOS |
BALL |
1.65/4.3 |
GRID ARRAY |
BGA30,5X6,16 |
Multiplexer or Switches |
.4 mm |
85 Cel |
-40 Cel |
BOTTOM |
R-PBGA-B30 |
SEPARATE OUTPUT |
Not Qualified |
BREAK-BEFORE-MAKE |
NOT SPECIFIED |
NOT SPECIFIED |
23 ns |
7.3 ohm |
||||||||||||||||||||||||||||||||
NXP Semiconductors |
DPDT |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
DPDT |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
DPDT |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
DPDT |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
DPDT |
NICKEL PALLADIUM GOLD SILVER |
1 |
e4 |
30 |
260 |
||||||||||||||||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
DPDT |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
DPDT |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
DPDT |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
DPDT |
NICKEL PALLADIUM GOLD SILVER |
1 |
e4 |
30 |
260 |
||||||||||||||||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
DPDT |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
DPDT |
AUTOMOTIVE |
16 |
TSSOP |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
2 |
2 |
CMOS |
GULL WING |
1.65 V |
1.5/3.3 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP16,.25 |
Multiplexer or Switches |
.65 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G16 |
SEPARATE OUTPUT |
1 |
4.3 V |
1.1 mm |
4.4 mm |
Not Qualified |
90 dB |
1.4 V |
e4 |
BREAK-BEFORE-MAKE |
30 |
260 |
120 ns |
1.7 ohm |
90 ns |
.18 ohm |
5 mm |
|||||||||||||||||||
|
NXP Semiconductors |
DPDT |
AUTOMOTIVE |
16 |
TSSOP |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
2 |
CMOS |
GULL WING |
1.5/3.3 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP16,.25 |
Multiplexer or Switches |
.635 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G16 |
SEPARATE OUTPUT |
1 |
Not Qualified |
e4 |
BREAK-BEFORE-MAKE |
30 |
260 |
90 ns |
4.1 ohm |
|||||||||||||||||||||||||||||
|
NXP Semiconductors |
DPDT |
AUTOMOTIVE |
16 |
VQCCN |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
2 |
2 |
CMOS |
NO LEAD |
1.65 V |
CHIP CARRIER, VERY THIN PROFILE |
.4 mm |
125 Cel |
-40 Cel |
QUAD |
R-PQCC-N16 |
1 |
4.3 V |
.5 mm |
1.8 mm |
Not Qualified |
90 dB |
1.4 V |
120 ns |
1.7 ohm |
90 ns |
.18 ohm |
2.6 mm |
||||||||||||||||||||||||||||
|
NXP Semiconductors |
DPDT |
NICKEL PALLADIUM GOLD SILVER |
1 |
e4 |
30 |
260 |
||||||||||||||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
DPDT |
AUTOMOTIVE |
10 |
VQCCN |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
1 |
2 |
NO LEAD |
3.3 V |
CHIP CARRIER, VERY THIN PROFILE |
.5 mm |
125 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
R-PQCC-N10 |
1 |
4.3 V |
.5 mm |
1.55 mm |
30 dB |
3 V |
e4 |
30 |
260 |
40 ns |
10 ohm |
30 ns |
.65 ohm |
2 mm |
||||||||||||||||||||||||||
|
NXP Semiconductors |
DPDT |
AUTOMOTIVE |
10 |
VQCCN |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
1 |
2 |
NO LEAD |
3.3 V |
CHIP CARRIER, VERY THIN PROFILE |
.4 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
R-PQCC-N10 |
1 |
4.3 V |
.5 mm |
1.4 mm |
30 dB |
3 V |
e4 |
30 |
260 |
40 ns |
10 ohm |
30 ns |
.65 ohm |
1.8 mm |
||||||||||||||||||||||||||
|
NXP Semiconductors |
DPDT |
AUTOMOTIVE |
16 |
QCCN |
SQUARE |
YES |
PLASTIC/EPOXY |
2 |
NO LEAD |
1.4/4.3 |
CHIP CARRIER |
LCC16,.12SQ,20 |
Multiplexer or Switches |
.5 mm |
125 Cel |
-40 Cel |
Matte Tin (Sn) |
QUAD |
S-PQCC-N16 |
SEPARATE OUTPUT |
1 |
Not Qualified |
e3 |
BREAK-BEFORE-MAKE |
30 |
260 |
90 ns |
10 ohm |
||||||||||||||||||||||||||||||
|
NXP Semiconductors |
DPDT |
AUTOMOTIVE |
16 |
QCCN |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
2 |
CMOS |
NO LEAD |
1.5/3.3 |
CHIP CARRIER |
LCC16,.07X.1,16 |
Multiplexer or Switches |
.4 mm |
125 Cel |
-40 Cel |
QUAD |
R-PQCC-N16 |
SEPARATE OUTPUT |
1 |
Not Qualified |
BREAK-BEFORE-MAKE |
30 |
260 |
90 ns |
4.1 ohm |
|||||||||||||||||||||||||||||||
|
NXP Semiconductors |
DPDT |
AUTOMOTIVE |
16 |
HVQCCN |
SQUARE |
YES |
PLASTIC/EPOXY |
2 |
2 |
CMOS |
NO LEAD |
1.65 V |
1.5/3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC16,.12SQ,20 |
Multiplexer or Switches |
.5 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N16 |
SEPARATE OUTPUT |
1 |
4.3 V |
.5 mm |
3 mm |
Not Qualified |
90 dB |
1.4 V |
e4 |
BREAK-BEFORE-MAKE |
30 |
260 |
120 ns |
1.7 ohm |
90 ns |
.18 ohm |
3 mm |
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|
NXP Semiconductors |
DPDT |
NICKEL PALLADIUM GOLD SILVER |
1 |
e4 |
30 |
260 |
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NXP Semiconductors |
DPDT |
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|
NXP Semiconductors |
DPDT |
AUTOMOTIVE |
16 |
VQCCN |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
2 |
2 |
CMOS |
NO LEAD |
1.65 V |
CHIP CARRIER, VERY THIN PROFILE |
.4 mm |
125 Cel |
-40 Cel |
QUAD |
R-PQCC-N16 |
1 |
4.3 V |
.5 mm |
1.8 mm |
Not Qualified |
70 dB |
1.4 V |
120 ns |
8 ohm |
90 ns |
2.6 mm |
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|
NXP Semiconductors |
DPDT |
AUTOMOTIVE |
10 |
QCCN |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
1 |
NO LEAD |
3/4.3 |
CHIP CARRIER |
LCC10,.06X.08,20 |
Multiplexer or Switches |
.5 mm |
125 Cel |
-40 Cel |
QUAD |
R-PQCC-N10 |
SEPARATE OUTPUT |
1 |
Not Qualified |
BREAK-BEFORE-MAKE |
260 |
10 ohm |
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|
NXP Semiconductors |
DPDT |
AUTOMOTIVE |
10 |
VQCCN |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
1 |
2 |
NO LEAD |
3.3 V |
CHIP CARRIER, VERY THIN PROFILE |
.4 mm |
125 Cel |
-40 Cel |
QUAD |
R-PQCC-N10 |
1 |
4.3 V |
.5 mm |
1.3 mm |
30 dB |
3 V |
40 ns |
10 ohm |
30 ns |
.65 ohm |
1.6 mm |
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|
NXP Semiconductors |
DPDT |
AUTOMOTIVE |
16 |
HVQCCN |
SQUARE |
YES |
PLASTIC/EPOXY |
2 |
2 |
CMOS |
NO LEAD |
1.65 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
125 Cel |
-40 Cel |
QUAD |
S-PQCC-N16 |
1 |
4.3 V |
.5 mm |
3 mm |
Not Qualified |
70 dB |
1.4 V |
120 ns |
8 ohm |
90 ns |
3 mm |
|||||||||||||||||||||||||||||
|
NXP Semiconductors |
DPDT |
1 |
260 |
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|
Infineon Technologies |
DPDT |
Multiplexers and switches are electronic components used in digital and analog circuits to route signals between different inputs and outputs. They allow a single input signal to be sent to multiple output channels or vice versa.
A multiplexer, also known as a "mux," is a digital component that selects one of several input signals and forwards it to a single output. Multiplexers are often used in data communication systems to transmit multiple signals over a single communication channel. They can also be used in digital circuits to route control signals and address lines.
A switch is an electronic component that connects or disconnects two or more circuits. Switches can be mechanical or electronic and are used to control the flow of current in a circuit. In digital circuits, switches are used to connect or disconnect components and can be used to create logic gates and other digital components.
Multiplexers and switches are important components in various electronic systems, including communication systems, data processing systems, and control systems. They can be used to route signals between different parts of a circuit and to switch between different modes of operation. Multiplexers and switches can also be used to improve the efficiency of a system by reducing the number of components needed to perform a particular function.