783 Digital Signal Processors (DSPs) 68

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Internal Bus Architecture	Length	Technology	Nominal Supply Voltage	Sub-Category	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Low Power Mode	Barrel Shifter	JESD-609 Code
MSC8156TAG1000B	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY		.97 V			TIN SILVER COPPER	BOTTOM	3.94 mm		29 mm	YES			30	245	SINGLE	29 mm	CMOS	1 V		1 mm	FIXED POINT	S-PBGA-B783	3		YES	NO	e1
MSC8156EETAG1000B	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY		.97 V				BOTTOM	3.94 mm		29 mm	YES					SINGLE	29 mm	CMOS	1 V		1 mm	FIXED POINT	S-PBGA-B783			YES	NO
MSC8154EETAG1000B	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY		.97 V				BOTTOM	3.94 mm		29 mm	YES					SINGLE	29 mm	CMOS	1 V		1 mm	FIXED POINT	S-PBGA-B783			YES	NO
MSC8157TAG1000A	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES			32	1,1.5,2.5	GRID ARRAY	BGA783,28X28,40				Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM		8192					30	245			CMOS		Digital Signal Processors	1 mm	FLOATING POINT	S-PBGA-B783	3	Not Qualified			e1
MSC8256SAG1000B	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		32	1,1.5/1.8,2.5	GRID ARRAY	BGA783,28X28,40	.97 V			TIN SILVER COPPER	BOTTOM	3.94 mm	8192	29 mm	YES			30	245	SINGLE	29 mm	CMOS	1 V	Digital Signal Processors	1 mm	FIXED POINT	S-PBGA-B783	3	Not Qualified	YES	NO	e1
MSC8144EVT1000A	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		32	1.2,2.5,3.3	GRID ARRAY	BGA783,28X28,40	.97 V	90 Cel	0 Cel	Tin/Silver (Sn/Ag)	BOTTOM	3.176 mm	32768	29 mm	YES		133 MHz	30	245	MULTIPLE	29 mm	CMOS	1 V	Digital Signal Processors	1 mm	FIXED POINT	S-PBGA-B783	3	Not Qualified	NO	NO	e2
MSC8252TVT1000B	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	0			GRID ARRAY		.97 V				BOTTOM	3.94 mm		29 mm	YES	0				MULTIPLE	29 mm	CMOS	1 V		1 mm	FIXED POINT	S-PBGA-B783			YES	NO
MSC8154ETAG1000B	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		32	1,2.5	GRID ARRAY	BGA783,28X28,40	.97 V			Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.94 mm	8192	29 mm	YES			30	245	SINGLE	29 mm	CMOS	1 V	Digital Signal Processors	1 mm	FIXED POINT	S-PBGA-B783	3	Not Qualified	YES	NO	e1
MSC8157ETVT1000A	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	0			GRID ARRAY		.97 V	105 Cel	-40 Cel	TIN SILVER COPPER OVER NICKEL	BOTTOM	3.94 mm		29 mm	YES	0	667 MHz	30	245	SINGLE	29 mm	CMOS	1 V		1 mm	FLOATING POINT	S-PBGA-B783	3		YES	NO
MSC8144TVT1000B	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY		.97 V				BOTTOM	3.176 mm		29 mm	YES		133 MHz			MULTIPLE	29 mm	CMOS	1 V		1 mm	FIXED POINT	S-PBGA-B783			NO	NO
MSC8144SVT1000B	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY		.97 V				BOTTOM	3.176 mm		29 mm	YES		133 MHz			MULTIPLE	29 mm	CMOS	1 V		1 mm	FIXED POINT	S-PBGA-B783			NO	NO
MSC8144EC	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	783	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	0			GRID ARRAY, FINE PITCH		.97 V	105 Cel	-40 Cel		BOTTOM	3.215 mm		29 mm	YES	0	133 MHz			MULTIPLE	29 mm	CMOS	1 V		.5 mm	FIXED POINT	S-PBGA-B783		Not Qualified	YES	NO
MSC8254SAG1000B	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		32	1,1.5/1.8,2.5	GRID ARRAY	BGA783,28X28,40	.97 V	105 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.94 mm	8192	29 mm	YES			30	245	SINGLE	29 mm	CMOS	1 V	Digital Signal Processors	1 mm	FIXED POINT	S-PBGA-B783	3	Not Qualified	YES	NO	e1
MSC8156ETAG1000B	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES			32	1,1.5/1.8,2.5	GRID ARRAY	BGA783,28X28,40				TIN SILVER COPPER	BOTTOM		8192					30	245			CMOS		Digital Signal Processors	1 mm	FIXED POINT	S-PBGA-B783	3	Not Qualified			e1
MSC8154ESAG1000B	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		32	1,2.5	GRID ARRAY	BGA783,28X28,40	.97 V			Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.94 mm	8192	29 mm	YES			30	245	SINGLE	29 mm	CMOS	1 V	Digital Signal Processors	1 mm	FIXED POINT	S-PBGA-B783	3	Not Qualified	YES	NO	e1
MSC8254TAG1000B	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		32	1,1.5/1.8,2.5	GRID ARRAY	BGA783,28X28,40	.97 V	105 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.94 mm	8192	29 mm	YES			30	245	SINGLE	29 mm	CMOS	1 V	Digital Signal Processors	1 mm	FIXED POINT	S-PBGA-B783	3	Not Qualified	YES	NO	e1
MSC8156VT1000B	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY		.97 V				BOTTOM	3.94 mm		29 mm	YES					SINGLE	29 mm	CMOS	1 V		1 mm	FIXED POINT	S-PBGA-B783			YES	NO
MSC8154TVT1000B	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	0			GRID ARRAY		.97 V				BOTTOM	3.94 mm		29 mm	YES	0				MULTIPLE	29 mm	CMOS	1 V		1 mm	FIXED POINT	S-PBGA-B783			YES	NO
MSC8144ETVT1000A	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY		.97 V			Tin/Silver (Sn/Ag)	BOTTOM	3.176 mm		29 mm	YES		133 MHz	30	245	MULTIPLE	29 mm	CMOS	1 V		1 mm	FIXED POINT	S-PBGA-B783	3	Not Qualified	NO	NO	e2
MSC8154EESVT1000B	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY		.97 V				BOTTOM	3.94 mm		29 mm	YES					SINGLE	29 mm	CMOS	1 V		1 mm	FIXED POINT	S-PBGA-B783			YES	NO
MSC8151TAG1000B	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		32	1,2.5	GRID ARRAY	BGA783,28X28,40	.97 V			Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.94 mm	8192	29 mm	YES			30	245	SINGLE	29 mm	CMOS	1 V	Digital Signal Processors	1 mm	FIXED POINT	S-PBGA-B783	3	Not Qualified	YES	NO	e1
MSC8251SAG1000B	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		32	1,1.5/1.8,2.5	GRID ARRAY	BGA783,28X28,40	.97 V			Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.94 mm	8192	29 mm	YES			30	245	SINGLE	29 mm	CMOS	1 V	Digital Signal Processors	1 mm	FIXED POINT	S-PBGA-B783	3	Not Qualified	YES	NO	e1
MSC8156SAG1000B	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		32	1,1.5/1.8,2.5	GRID ARRAY	BGA783,28X28,40	.97 V			TIN SILVER COPPER	BOTTOM	3.94 mm	8192	29 mm	YES			30	245	SINGLE	29 mm	CMOS	1 V	Digital Signal Processors	1 mm	FIXED POINT	S-PBGA-B783	3	Not Qualified	YES	NO	e1
MSC8144VT800A	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY		.97 V				BOTTOM	3.176 mm		29 mm	YES		133 MHz			MULTIPLE	29 mm	CMOS	1 V		1 mm	FIXED POINT	S-PBGA-B783			NO	NO
MSC8144E	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	783	FBGA	SQUARE	PLASTIC/EPOXY	YES	2.625 V	0			GRID ARRAY, FINE PITCH		2.375 V	105 Cel	-40 Cel		BOTTOM	3.215 mm		29 mm	YES	0	150 MHz			MULTIPLE	29 mm	CMOS	2.5 V		.5 mm	FIXED POINT	S-PBGA-B783		Not Qualified	NO	NO
MSC8156EEAG1000B	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY		.97 V				BOTTOM	3.94 mm		29 mm	YES					SINGLE	29 mm	CMOS	1 V		1 mm	FIXED POINT	S-PBGA-B783			YES	NO
MSC8144SVT800A	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY		.97 V				BOTTOM	3.176 mm		29 mm	YES		133 MHz			MULTIPLE	29 mm	CMOS	1 V		1 mm	FIXED POINT	S-PBGA-B783			NO	NO
MSC8252SVT1000B	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	0			GRID ARRAY		.97 V				BOTTOM	3.94 mm		29 mm	YES	0				MULTIPLE	29 mm	CMOS	1 V		1 mm	FIXED POINT	S-PBGA-B783			YES	NO
MSC8144TVT800B	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY		.97 V				BOTTOM	3.176 mm		29 mm	YES		133 MHz			MULTIPLE	29 mm	CMOS	1 V		1 mm	FIXED POINT	S-PBGA-B783			NO	NO
MSC8156AG1000B	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY		.97 V			TIN SILVER COPPER	BOTTOM	3.94 mm		29 mm	YES			30	245	SINGLE	29 mm	CMOS	1 V		1 mm	FIXED POINT	S-PBGA-B783	3		YES	NO	e1
MSC8156EVT1000B	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY		.97 V				BOTTOM	3.94 mm		29 mm	YES					SINGLE	29 mm	CMOS	1 V		1 mm	FIXED POINT	S-PBGA-B783			YES	NO
MSC8157ETAG1000A	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES			32	1,1.5,2.5	GRID ARRAY	BGA783,28X28,40				Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM		8192					30	245			CMOS		Digital Signal Processors	1 mm	FLOATING POINT	S-PBGA-B783	3	Not Qualified			e1
MSC8144ESVT800A	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		32	1.2,2.5,3.3	GRID ARRAY	BGA783,28X28,40	.97 V	105 Cel	0 Cel	Tin/Silver (Sn/Ag)	BOTTOM	3.176 mm	32768	29 mm	YES		133 MHz	30	245	MULTIPLE	29 mm	CMOS	1 V	Digital Signal Processors	1 mm	FIXED POINT	S-PBGA-B783	3	Not Qualified	NO	NO	e2
MSC8252SAG1000B	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		32	1,1.5/1.8,2.5	GRID ARRAY	BGA783,28X28,40	.97 V	105 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.94 mm	8192	29 mm	YES			30	245	SINGLE	29 mm	CMOS	1 V	Digital Signal Processors	1 mm	FIXED POINT	S-PBGA-B783	3	Not Qualified	YES	NO	e1
MSC8154EETVT1000B	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY		.97 V				BOTTOM	3.94 mm		29 mm	YES					SINGLE	29 mm	CMOS	1 V		1 mm	FIXED POINT	S-PBGA-B783			YES	NO
MSC8144ESVT1000A	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		32	1.2,2.5,3.3	GRID ARRAY	BGA783,28X28,40	.97 V	90 Cel	0 Cel		BOTTOM	3.176 mm	32768	29 mm	YES		133 MHz	30	245	MULTIPLE	29 mm	CMOS	1 V	Digital Signal Processors	1 mm	FIXED POINT	S-PBGA-B783	3	Not Qualified	NO	NO
MSC8256TAG1000B	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		32	1,1.5/1.8,2.5	GRID ARRAY	BGA783,28X28,40	.97 V			TIN SILVER COPPER	BOTTOM	3.94 mm	8192	29 mm	YES			30	245	SINGLE	29 mm	CMOS	1 V	Digital Signal Processors	1 mm	FIXED POINT	S-PBGA-B783	3	Not Qualified	YES	NO	e1
MSC8144ETVT800A	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY		.97 V			Tin/Silver (Sn/Ag)	BOTTOM	3.176 mm		29 mm	YES		133 MHz	30	245	MULTIPLE	29 mm	CMOS	1 V		1 mm	FIXED POINT	S-PBGA-B783	3	Not Qualified	NO	NO	e2
MSC8156ESAG1000B	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		32	1,1.5/1.8,2.5	GRID ARRAY	BGA783,28X28,40	.97 V			TIN SILVER COPPER	BOTTOM	3.94 mm	8192	29 mm	YES			30	245	SINGLE	29 mm	CMOS	1 V	Digital Signal Processors	1 mm	FIXED POINT	S-PBGA-B783	3	Not Qualified	YES	NO	e1
MSC8144EVT1000B	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY		.97 V			Tin/Silver (Sn/Ag)	BOTTOM	3.176 mm		29 mm	YES		133 MHz	30	245	MULTIPLE	29 mm	CMOS	1 V		1 mm	FIXED POINT	S-PBGA-B783	3	Not Qualified	NO	NO	e2
MSC8144EVT800A	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		32	1.2,2.5,3.3	GRID ARRAY	BGA783,28X28,40	.97 V	105 Cel	0 Cel	Tin/Silver (Sn/Ag)	BOTTOM	3.176 mm	32768	29 mm	YES		133 MHz	30	245	MULTIPLE	29 mm	CMOS	1 V	Digital Signal Processors	1 mm	FIXED POINT	S-PBGA-B783	3	Not Qualified	NO	NO	e2
MSC8151SAG1000B	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		32	1,2.5	GRID ARRAY	BGA783,28X28,40	.97 V			Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.94 mm	8192	29 mm	YES			30	245	SINGLE	29 mm	CMOS	1 V	Digital Signal Processors	1 mm	FIXED POINT	S-PBGA-B783	3	Not Qualified	YES	NO	e1
MSC8154SAG1000B	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		32	1,2.5	GRID ARRAY	BGA783,28X28,40	.97 V			Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.94 mm	8192	29 mm	YES			30	245	SINGLE	29 mm	CMOS	1 V	Digital Signal Processors	1 mm	FIXED POINT	S-PBGA-B783	3	Not Qualified	YES	NO	e1
MSC8144ESVT1000B	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY		.97 V			Tin/Silver (Sn/Ag)	BOTTOM	3.176 mm		29 mm	YES		133 MHz	30	245	MULTIPLE	29 mm	CMOS	1 V		1 mm	FIXED POINT	S-PBGA-B783	3	Not Qualified	NO	NO	e2
MSC8156EESVT1000B	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY		.97 V				BOTTOM	3.94 mm		29 mm	YES					SINGLE	29 mm	CMOS	1 V		1 mm	FIXED POINT	S-PBGA-B783			YES	NO
MSC8144TVT1000A	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY		.97 V				BOTTOM	3.176 mm		29 mm	YES		133 MHz			MULTIPLE	29 mm	CMOS	1 V		1 mm	FIXED POINT	S-PBGA-B783			NO	NO
MSC8144EVT800B	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY		.97 V			Tin/Silver (Sn/Ag)	BOTTOM	3.176 mm		29 mm	YES		133 MHz	30	245	MULTIPLE	29 mm	CMOS	1 V		1 mm	FIXED POINT	S-PBGA-B783	3	Not Qualified	NO	NO	e2
MSC8144VT800B	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY		.97 V				BOTTOM	3.176 mm		29 mm	YES		133 MHz			MULTIPLE	29 mm	CMOS	1 V		1 mm	FIXED POINT	S-PBGA-B783			NO	NO

Digital Signal Processors (DSPs)

Digital Signal Processors (DSPs) are specialized microprocessors that are designed to perform mathematical operations on digital signals. They are used in a variety of applications that require real-time signal processing, such as audio and video processing, telecommunications, and image processing. DSPs are capable of performing complex mathematical operations, such as filtering, convolution, and correlation, on digital signals at high speeds, making them an essential component of modern signal processing systems.

DSPs are optimized for digital signal processing tasks and are designed to handle large amounts of data at high speeds. They typically have a specialized architecture that includes dedicated hardware for performing mathematical operations on digital signals, as well as specialized memory and I/O interfaces that are optimized for signal processing applications.

DSPs are used in a wide range of applications, including audio and video compression, speech recognition, image and video processing, and radar and sonar systems. They are also used in telecommunications systems, such as cell phones and modems, to process signals in real time. DSPs are also used in scientific and engineering applications, such as biomedical research and industrial automation.