272 Microprocessors 49

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	Screening Level	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	Sub-Category	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code
MPC5200CVR400B	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	272	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.58 V		13			GRID ARRAY		1.42 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.65 mm	27 mm		YES	32	35 MHz	40	260	27 mm	CMOS		1.5 V		1.27 mm	FLOATING POINT	S-PBGA-B272	3		400 rpm	YES	e1
MPC5200CVR400BR2	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	272	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.58 V		32			GRID ARRAY		1.42 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.65 mm	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	35 MHz	40	260	27 mm	CMOS		1.5 V		1.27 mm	FLOATING POINT	S-PBGA-B272	3	Not Qualified	400 rpm	YES	e1
SPC5200CBV400B	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	272	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.58 V	AEC-Q100	32	32	1.5,3.3	GRID ARRAY	BGA272,20X20,50	1.42 V	85 Cel	-40 Cel	TIN LEAD SILVER	BOTTOM	2.65 mm	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	66 MHz	30	245	27 mm	CMOS		1.5 V	Microprocessors	1.27 mm	FLOATING POINT	S-PBGA-B272	3	Not Qualified	400 rpm	YES	e0
SPC5200CVR400B	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	272	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.58 V	AEC-Q100	32	32	1.5,3.3	GRID ARRAY	BGA272,20X20,50	1.42 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.65 mm	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	66 MHz	40	260	27 mm	CMOS		1.5 V	Microprocessors	1.27 mm	FLOATING POINT	S-PBGA-B272	3	Not Qualified	400 rpm	YES	e1
SPC5200CVR400BR2	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	272	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.58 V	AEC-Q100	32	32	1.5,3.3	GRID ARRAY	BGA272,20X20,50	1.42 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.65 mm	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	66 MHz	40	260	27 mm	CMOS		1.5 V	Microprocessors	1.27 mm	FLOATING POINT	S-PBGA-B272	3	Not Qualified	400 rpm	YES	e1
SPC5200CBV400BR2	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	272	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.58 V	AEC-Q100	32	32	1.5,3.3	GRID ARRAY	BGA272,20X20,50	1.42 V	85 Cel	-40 Cel	TIN LEAD SILVER	BOTTOM	2.65 mm	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	66 MHz	30	245	27 mm	CMOS		1.5 V	Microprocessors	1.27 mm	FLOATING POINT	S-PBGA-B272	3	Not Qualified	400 rpm	YES	e0
MPC5200VR400B	NXP Semiconductors	MICROPROCESSOR	COMMERCIAL	BALL	272	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.58 V		32	32		GRID ARRAY		1.42 V	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.65 mm	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	66 MHz	40	260	27 mm	CMOS		1.5 V		1.27 mm	FLOATING POINT	S-PBGA-B272	3	Not Qualified	400 rpm	YES	e1
MPC5200VR400BR2	NXP Semiconductors	MICROPROCESSOR	COMMERCIAL	BALL	272	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.58 V		13			GRID ARRAY		1.42 V	70 Cel	0 Cel		BOTTOM	2.65 mm	27 mm		YES	32	35 MHz	NOT SPECIFIED	NOT SPECIFIED	27 mm	CMOS		1.5 V		1.27 mm	FLOATING POINT	S-PBGA-B272			400 rpm	YES
MPC5200CBV266	Motorola	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	272	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.58 V		32			GRID ARRAY		1.42 V	85 Cel	-40 Cel		BOTTOM	2.65 mm	27 mm		YES	32	35 MHz			27 mm	CMOS		1.5 V		1.27 mm	FIXED POINT	S-PBGA-B272		Not Qualified	266 rpm	YES
S3C2410A20-YO80	Samsung	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	272	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.95 V		28	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.65 V	85 Cel	-40 Cel		BOTTOM	1.26 mm	14 mm		YES	32	20 MHz			14 mm	CMOS		1.8 V		.8 mm	FIXED POINT	S-PBGA-B272			200 rpm	YES
MPC5200CVR400	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	272	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.58 V		13			GRID ARRAY, HEAT SINK/SLUG		1.42 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.65 mm	27 mm		YES	32	35 MHz	40	260	27 mm	CMOS		1.5 V		1.27 mm	FIXED POINT	S-PBGA-B272	3		400 rpm	YES	e1
SC103335VR400B	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	272	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.58 V	AEC-Q100	32	32	1.5,3.3	GRID ARRAY	BGA272,20X20,50	1.42 V	85 Cel	-40 Cel	TIN SILVER	BOTTOM	2.65 mm	27 mm		YES	32	66 MHz			27 mm	CMOS		1.5 V	Microprocessors	1.27 mm	FLOATING POINT	S-PBGA-B272	3	Not Qualified	400 rpm	YES	e2
MGT5100TS/D	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	272	BGA	SQUARE	PLASTIC/EPOXY	YES	YES			32	32		GRID ARRAY			85 Cel	-40 Cel		BOTTOM				NO	32					CMOS					FLOATING POINT	S-PBGA-B272		Not Qualified	66 rpm	YES
SC103335VR400BR2	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	272	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.58 V	AEC-Q100	32	32	1.5,3.3	GRID ARRAY	BGA272,20X20,50	1.42 V	85 Cel	-40 Cel	TIN SILVER	BOTTOM	2.65 mm	27 mm		YES	32	66 MHz			27 mm	CMOS		1.5 V	Microprocessors	1.27 mm	FLOATING POINT	S-PBGA-B272	3	Not Qualified	400 rpm	YES	e2
SPC5200CBV400R2	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	272	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.58 V		32			GRID ARRAY		1.42 V	85 Cel	-40 Cel	Tin/Lead/Silver (Sn/Pb/Ag)	BOTTOM	2.65 mm	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	35 MHz	30	240	27 mm	CMOS		1.5 V		1.27 mm	FLOATING POINT	S-PBGA-B272	3	Not Qualified	400 rpm	YES	e0
MPC5200VR400	NXP Semiconductors	MICROPROCESSOR	COMMERCIAL	BALL	272	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.58 V		13			GRID ARRAY		1.42 V	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.65 mm	27 mm		YES	32		40	260	27 mm	CMOS		1.5 V		1.27 mm	FLOATING POINT	S-PBGA-B272	3		400 rpm	YES	e1
MPC5200CBV400	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	272	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.58 V		32			GRID ARRAY		1.42 V	85 Cel	-40 Cel	TIN LEAD SILVER	BOTTOM	2.65 mm	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	35 MHz	30	240	27 mm	CMOS		1.5 V		1.27 mm	FLOATING POINT	S-PBGA-B272	3	Not Qualified	400 rpm	YES	e0
SPC5200CBV400	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	272	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.58 V		32	32		GRID ARRAY		1.42 V	85 Cel	-40 Cel	Tin/Lead/Silver (Sn/Pb/Ag)	BOTTOM	2.65 mm	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	35 MHz	30	240	27 mm	CMOS		1.5 V		1.27 mm	FLOATING POINT	S-PBGA-B272	3	Not Qualified	400 rpm	YES	e0
SPC5200CVR400	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	272	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.58 V		13			GRID ARRAY		1.42 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.65 mm	27 mm	AEC QUALIFIED; BUT NOT GIVEN STANDARD	YES	32		40	260	27 mm	CMOS		1.5 V		1.27 mm	FLOATING POINT	S-PBGA-B272	3		400 rpm	YES	e1
MPC5200BV400	NXP Semiconductors	MICROPROCESSOR	COMMERCIAL	BALL	272	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.58 V		32			GRID ARRAY		1.42 V	70 Cel	0 Cel	TIN LEAD	BOTTOM	2.65 mm	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	35 MHz	30	240	27 mm	CMOS		1.5 V		1.27 mm	FLOATING POINT	S-PBGA-B272	3	Not Qualified	400 rpm	YES	e0
TX9956CXBG-600	Toshiba	MICROPROCESSOR, RISC		BALL	272	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V		64	64	1.25,2.5/3.3	GRID ARRAY	BGA272,20X20,50	1.118 V				BOTTOM	2.46 mm	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	133 MHz			27 mm	CMOS	3500 mA	1.25 V	Microprocessors	1.27 mm	FLOATING POINT	S-PBGA-B272		Not Qualified	600 rpm	YES
TX9956CXBG-533	Toshiba	MICROPROCESSOR, RISC		BALL	272	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V		64	64	1.25,2.5/3.3	GRID ARRAY	BGA272,20X20,50	1.118 V				BOTTOM	2.46 mm	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	133 MHz			27 mm	CMOS	3000 mA	1.25 V	Microprocessors	1.27 mm	FLOATING POINT	S-PBGA-B272		Not Qualified	533 rpm	YES
UPD30500S2-150	Renesas Electronics	MICROPROCESSOR, RISC		BALL	272	BGA	SQUARE	PLASTIC/EPOXY		YES				64	3.3	GRID ARRAY	BGA272,21X21,50					BOTTOM										CMOS	2160 mA	3.3 V	Microprocessors	1.27 mm		S-PBGA-B272		Not Qualified	150 rpm
UPD30550AF2-300-NN1	Renesas Electronics	MICROPROCESSOR, RISC		BALL	272	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.575 V		64	64		GRID ARRAY		1.425 V			TIN SILVER COPPER	BOTTOM	2.05 mm	29 mm		YES	64	133 MHz	10	260	29 mm	MOS		1.5 V		1.27 mm	FLOATING POINT	S-PBGA-B272		Not Qualified	300 rpm	YES	e1
IDT79RV5000200BS272I	Renesas Electronics	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	272	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V		64	64		GRID ARRAY, LOW PROFILE		3.135 V	85 Cel	-40 Cel	TIN LEAD	BOTTOM	1.65 mm	29 mm		YES	64	100 MHz			29 mm	CMOS		3.3 V		1.27 mm	FLOATING POINT	S-PBGA-B272		Not Qualified	200 rpm	YES	e0
UPD30500AS2-250	Renesas Electronics	MICROPROCESSOR, RISC		BALL	272	BGA	SQUARE	PLASTIC/EPOXY		YES				64	2.5,3.3	GRID ARRAY	BGA272,21X21,50					BOTTOM										CMOS	1800 mA		Microprocessors	1.27 mm		S-PBGA-B272		Not Qualified	250 rpm
UPD30550AF2-300-NN1-A	Renesas Electronics	MICROPROCESSOR, RISC		BALL	272	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.575 V		64	64		GRID ARRAY		1.425 V				BOTTOM	2.05 mm	29 mm		YES	64	133 MHz	NOT SPECIFIED	NOT SPECIFIED	29 mm	MOS		1.5 V		1.27 mm	FLOATING POINT	S-PBGA-B272		Not Qualified	300 rpm	YES
UPD30550AF2-400-NN1	Renesas Electronics	MICROPROCESSOR, RISC		BALL	272	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.7 V		64	64		GRID ARRAY		1.6 V			TIN SILVER COPPER	BOTTOM	2.05 mm	29 mm		YES	64	133 MHz	10	260	29 mm	MOS				1.27 mm	FLOATING POINT	S-PBGA-B272		Not Qualified	400 rpm	YES	e1
79RV5000200BS272I	Renesas Electronics	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	272	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V		64	64		GRID ARRAY		3.135 V	85 Cel	-40 Cel	TIN LEAD	BOTTOM				YES	64	100 MHz				CMOS		3.3 V			FLOATING POINT	S-PBGA-B272		Not Qualified	200 rpm	YES	e0
UPD30550F2-300-NN1	Renesas Electronics	MICROPROCESSOR, RISC		BALL	272	BGA	SQUARE	PLASTIC/EPOXY		YES				64	2.5/3.3,1.5	GRID ARRAY	BGA272,21X21,50					BOTTOM										CMOS			Microprocessors	1.27 mm		S-PBGA-B272		Not Qualified	300 rpm
UPD30500AS2-266	Renesas Electronics	MICROPROCESSOR, RISC		BALL	272	BGA	SQUARE	PLASTIC/EPOXY		YES				64	2.6,3.3	GRID ARRAY	BGA272,21X21,50					BOTTOM										CMOS	1900 mA		Microprocessors	1.27 mm		S-PBGA-B272		Not Qualified	266 rpm
UPD30550F2-400-NN1	Renesas Electronics	MICROPROCESSOR, RISC		BALL	272	BGA	SQUARE	PLASTIC/EPOXY		YES				64	1.65,2.5/3.3	GRID ARRAY	BGA272,21X21,50					BOTTOM										CMOS			Microprocessors	1.27 mm		S-PBGA-B272		Not Qualified	400 rpm
UPD30550AF2-400-NN1-A	Renesas Electronics	MICROPROCESSOR, RISC		BALL	272	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.7 V		64	64		GRID ARRAY		1.6 V				BOTTOM	2.05 mm	29 mm		YES	64	133 MHz	NOT SPECIFIED	NOT SPECIFIED	29 mm	MOS				1.27 mm	FLOATING POINT	S-PBGA-B272		Not Qualified	400 rpm	YES
UPD30500BS2-250	Renesas Electronics	MICROPROCESSOR, RISC	OTHER	BALL	272	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V		64	64		GRID ARRAY, LOW PROFILE		3.135 V	85 Cel	0 Cel	TIN LEAD	BOTTOM	1.7 mm	29 mm		YES	64	250 MHz			29 mm	MOS		3.3 V		1.27 mm	FLOATING POINT	S-PBGA-B272		Not Qualified	250 rpm	YES	e0
UPD30500S2-200	Renesas Electronics	MICROPROCESSOR, RISC		BALL	272	BGA	SQUARE	PLASTIC/EPOXY		YES				64	3.3	GRID ARRAY	BGA272,21X21,50					BOTTOM										CMOS	2800 mA	3.3 V	Microprocessors	1.27 mm		S-PBGA-B272		Not Qualified	200 rpm
UPD30500S2-180	Renesas Electronics	MICROPROCESSOR, RISC		BALL	272	BGA	SQUARE	PLASTIC/EPOXY		YES				64	3.3	GRID ARRAY	BGA272,21X21,50					BOTTOM										CMOS	2540 mA	3.3 V	Microprocessors	1.27 mm		S-PBGA-B272		Not Qualified	180 rpm
S3C2410X01-YOR0	Samsung	MICROPROCESSOR, RISC	COMMERCIAL	BALL	272	FBGA	SQUARE	PLASTIC/EPOXY		YES				32	1.8,3.3	GRID ARRAY, FINE PITCH	BGA272,17X17,32		70 Cel	0 Cel		BOTTOM										CMOS			Microprocessors	.8 mm		S-PBGA-B272		Not Qualified	203 rpm
S3C2412X20-YO80	Samsung	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	272	FBGA	SQUARE	PLASTIC/EPOXY		YES				32	1.8/3.3	GRID ARRAY, FINE PITCH	BGA272,17X17,32		85 Cel	-40 Cel		BOTTOM							NOT SPECIFIED	NOT SPECIFIED		CMOS	.1 mA		Microprocessors	.8 mm		S-PBGA-B272		Not Qualified	20 rpm
S3C2410A01-YOR0	Samsung	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	272	FBGA	SQUARE	PLASTIC/EPOXY		YES				32	1.8/3.3	GRID ARRAY, FINE PITCH	BGA272,17X17,32		85 Cel	-40 Cel		BOTTOM										CMOS			Microprocessors	.8 mm		S-PBGA-B272		Not Qualified	266 rpm
S3C2501X-GA	Samsung	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	272	BGA	SQUARE	PLASTIC/EPOXY		YES				32	1.8,3.3	GRID ARRAY	BGA272,20X20,50		85 Cel	-40 Cel		BOTTOM										CMOS			Microprocessors	1.27 mm		S-PBGA-B272		Not Qualified	166 rpm
S3C2412X26-YO8N	Samsung	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	272	FBGA	SQUARE	PLASTIC/EPOXY		YES				32	1.8/3.3	GRID ARRAY, FINE PITCH	BGA272,17X17,32		85 Cel	-40 Cel		BOTTOM										CMOS	.1 mA		Microprocessors	.8 mm		S-PBGA-B272		Not Qualified	20 rpm
S3C2412X26-YO80	Samsung	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	272	FBGA	SQUARE	PLASTIC/EPOXY		YES				32	1.8/3.3	GRID ARRAY, FINE PITCH	BGA272,17X17,32		85 Cel	-40 Cel		BOTTOM										CMOS	.1 mA		Microprocessors	.8 mm		S-PBGA-B272		Not Qualified	20 rpm
S3C2410AXX-YO-20	Samsung	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	272	FBGA	SQUARE	PLASTIC/EPOXY		YES				32	1.8,3.3	GRID ARRAY, FINE PITCH	BGA272,17X17,32		85 Cel	-40 Cel		BOTTOM										CMOS			Microprocessors	.8 mm		S-PBGA-B272		Not Qualified	200 rpm
S3C2410AXX-YO	Samsung	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	272	FBGA	SQUARE	PLASTIC/EPOXY		YES				32	1.8/3.3	GRID ARRAY, FINE PITCH	BGA272,17X17,32		85 Cel	-40 Cel		BOTTOM										CMOS			Microprocessors	.8 mm		S-PBGA-B272		Not Qualified	266 rpm
S3C2410AXX-YO-26	Samsung	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	272	FBGA	SQUARE	PLASTIC/EPOXY		YES				32	2,3.3	GRID ARRAY, FINE PITCH	BGA272,17X17,32		85 Cel	-40 Cel		BOTTOM										CMOS			Microprocessors	.8 mm		S-PBGA-B272		Not Qualified	266 rpm
S3C2412X20-YO8N	Samsung	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	272	FBGA	SQUARE	PLASTIC/EPOXY		YES				32	1.8/3.3	GRID ARRAY, FINE PITCH	BGA272,17X17,32		85 Cel	-40 Cel		BOTTOM										CMOS	.1 mA		Microprocessors	.8 mm		S-PBGA-B272		Not Qualified	20 rpm
S3C2410X-YO	Samsung	MICROPROCESSOR, RISC	COMMERCIAL	BALL	272	FBGA	SQUARE	PLASTIC/EPOXY		YES				32	1.8,3.3	GRID ARRAY, FINE PITCH	BGA272,17X17,32		70 Cel	0 Cel		BOTTOM										CMOS			Microprocessors	.8 mm		S-PBGA-B272		Not Qualified	203 rpm
S3C2410XX-YO	Samsung	MICROPROCESSOR, RISC	COMMERCIAL	BALL	272	FBGA	SQUARE	PLASTIC/EPOXY		YES				32	1.8,3.3	GRID ARRAY, FINE PITCH	BGA272,17X17,32		70 Cel	0 Cel		BOTTOM										CMOS			Microprocessors	.8 mm		S-PBGA-B272		Not Qualified	203 rpm

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.