624 Microprocessors 56

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	Sub-Category	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code
MCIMX6S6AVM08AC	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V	16	64		GRID ARRAY, LOW PROFILE, FINE PITCH		1.275 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	YES	32	24 MHz	40	260	21 mm	CMOS		1.35 V		.8 mm	FIXED POINT	S-PBGA-B624	3		800 rpm	YES	e1
MCIMX6U5EVM10ACR	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES		16	32		GRID ARRAY, LOW PROFILE, FINE PITCH			105 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.5 mm	21 mm		YES	64	24 MHz	40	260	21 mm	CMOS				.8 mm	FLOATING POINT	S-PBGA-B624	3		1000 rpm	YES	e1
MCIMX6QP6AVT1AB	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.5 V				GRID ARRAY, FINE PITCH		1.35 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm	21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE				40	260	21 mm	CMOS				.8 mm		S-PBGA-B624	3				e1
MCIMX6U6AVM08AC	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V	16	64		GRID ARRAY, LOW PROFILE, FINE PITCH		1.275 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	YES	64	24 MHz	40	260	21 mm	CMOS		1.35 V		.8 mm	FIXED POINT	S-PBGA-B624	3		800 rpm	YES	e1
MCIMX6U1AVM08AD	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V	16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.275 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	YES	64		40	260	21 mm	CMOS				.8 mm	FLOATING POINT	S-PBGA-B624	3		800 rpm	YES	e1
MCIMX6QP6AVT8AB	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.5 V				GRID ARRAY, FINE PITCH		1.225 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm	21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE				40	260	21 mm	CMOS				.8 mm		S-PBGA-B624	3				e1
MCIMX6QP6AVT1AA	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V	26	32		GRID ARRAY, FINE PITCH		1.35 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm	21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	YES	64		40	260	21 mm	CMOS				.8 mm	FLOATING POINT	S-PBGA-B624	3		1000 rpm	YES	e1
MCIMX6S6AVM08AB	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V	16	64		GRID ARRAY, LOW PROFILE, FINE PITCH		1.275 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	YES	32	24 MHz	40	260	21 mm	CMOS		1.35 V		.8 mm	FIXED POINT	S-PBGA-B624	3		800 rpm	YES	e1
MCIMX6S1AVM08AB	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V	16	64		GRID ARRAY, LOW PROFILE, FINE PITCH		1.275 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	YES	32	24 MHz	40	260	21 mm	CMOS		1.35 V		.8 mm	FIXED POINT	S-PBGA-B624	3		800 rpm	YES	e1
MCIMX6U6AVM08AB	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V	16	64		GRID ARRAY, LOW PROFILE, FINE PITCH		1.275 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	YES	64	24 MHz	40	260	21 mm	CMOS		1.35 V		.8 mm	FIXED POINT	S-PBGA-B624	3		800 rpm	YES	e1
MCIMX6S6AVM08AD	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V	16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.275 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	YES	32		40	260	21 mm	CMOS				.8 mm	FLOATING POINT	S-PBGA-B624	3		800 rpm	YES	e1
MCIMX6S4AVM08AB	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V	16	64		GRID ARRAY, LOW PROFILE, FINE PITCH		1.275 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	YES	32	24 MHz	40	260	21 mm	CMOS		1.35 V		.8 mm	FIXED POINT	S-PBGA-B624	3		800 rpm	YES	e1
MCIMX6S1AVM08AC	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V	16	64		GRID ARRAY, LOW PROFILE, FINE PITCH		1.275 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	YES	32	24 MHz	40	260	21 mm	CMOS		1.35 V		.8 mm	FIXED POINT	S-PBGA-B624	3		800 rpm	YES	e1
MCIMX6Q4AVT10ADR	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V	16	32		GRID ARRAY, FINE PITCH		1.35 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm	21 mm	PKG DETAIL: HTTP://CACHE.FREESCALE.COM/FILES/SHARED/DOC/PACKAGE_INFO/98ASA00330D.	YES	64		40	260	21 mm	CMOS				.8 mm	FLOATING POINT	S-PBGA-B624	3		1000 rpm	YES	e1
MCIMX6S6AVM10AC	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.5 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.4 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE				40	260	21 mm	CMOS				.8 mm		S-PBGA-B624	3				e1
MCIMX6U1AVM10AD	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V	16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.4 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	YES	64		40	260	21 mm	CMOS				.8 mm	FLOATING POINT	S-PBGA-B624	3		1000 rpm	YES	e1
SCIMX6Q5EYM10CD	NXP Semiconductors	MICROPROCESSOR		BALL	624	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V	16	64		GRID ARRAY, HEAT SINK/SLUG		1.35 V				BOTTOM	1.6 mm	21 mm		YES	64	24 MHz			21 mm	CMOS				.8 mm	FIXED POINT	S-PBGA-B624			1000 rpm	YES
SCIMX6D5EYM12CC	NXP Semiconductors	MICROPROCESSOR		BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V	16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.4 V				BOTTOM	1.6 mm	21 mm		YES	64		NOT SPECIFIED	NOT SPECIFIED	21 mm	CMOS				.8 mm	FIXED POINT	S-PBGA-B624			1200 rpm	YES
SCIMX6Q5EYM12CD	NXP Semiconductors	MICROPROCESSOR		BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V	16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.4 V				BOTTOM	1.6 mm	21 mm		YES	64		NOT SPECIFIED	NOT SPECIFIED	21 mm	CMOS				.8 mm	FIXED POINT	S-PBGA-B624			1200 rpm	YES
PCIMX6Q6AVT10AB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	624	BGA	SQUARE	PLASTIC/EPOXY		YES			32		GRID ARRAY						BOTTOM										CMOS						S-PBGA-B624			1000 rpm
SCIMX6D5EYM10CC	NXP Semiconductors	MICROPROCESSOR		BALL	624	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V	16	64	1.05/1.5	GRID ARRAY, HEAT SINK/SLUG	BGA624,25X25,32	1.35 V				BOTTOM	1.6 mm	21 mm		YES	64	24 MHz	NOT SPECIFIED	NOT SPECIFIED	21 mm	CMOS	3920 mA		Graphics Processors	.8 mm	FIXED POINT	S-PBGA-B624		Not Qualified	1000 rpm	YES
PCIMX6Q6AVT10AC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	624	HBGA	SQUARE	PLASTIC/EPOXY		YES			32		GRID ARRAY, HEAT SINK/SLUG					TIN SILVER COPPER	BOTTOM	2.16 mm	21 mm					40	260	21 mm	CMOS				.8 mm		S-PBGA-B624	3		1000 rpm		e1
SCIMX6D5EYM10CD	NXP Semiconductors	MICROPROCESSOR		BALL	624	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V	16	64		GRID ARRAY, HEAT SINK/SLUG		1.35 V				BOTTOM	1.6 mm	21 mm		YES	64	24 MHz			21 mm	CMOS				.8 mm	FIXED POINT	S-PBGA-B624			1000 rpm	YES
SCIMX6Q5EYM12CE	NXP Semiconductors	MICROPROCESSOR		BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V	16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.4 V				BOTTOM	1.6 mm	21 mm		YES	64		NOT SPECIFIED	NOT SPECIFIED	21 mm	CMOS				.8 mm	FIXED POINT	S-PBGA-B624			1200 rpm	YES
SCIMX6D5EYM12CD	NXP Semiconductors	MICROPROCESSOR		BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V	16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.4 V				BOTTOM	1.6 mm	21 mm		YES	64		NOT SPECIFIED	NOT SPECIFIED	21 mm	CMOS				.8 mm	FIXED POINT	S-PBGA-B624			1200 rpm	YES
SCIMX6Q5EYM12CC	NXP Semiconductors	MICROPROCESSOR		BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V	16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.4 V				BOTTOM	1.6 mm	21 mm		YES	64		NOT SPECIFIED	NOT SPECIFIED	21 mm	CMOS				.8 mm	FIXED POINT	S-PBGA-B624			1200 rpm	YES
SCIMX6Q5EYM10CC	NXP Semiconductors	MICROPROCESSOR		BALL	624	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V	16	64	1.05/1.5	GRID ARRAY, HEAT SINK/SLUG	BGA624,25X25,32	1.35 V				BOTTOM	1.6 mm	21 mm		YES	64	24 MHz	NOT SPECIFIED	NOT SPECIFIED	21 mm	CMOS	3920 mA		Graphics Processors	.8 mm	FIXED POINT	S-PBGA-B624		Not Qualified	1000 rpm	YES
SCIMX6D5EYM12CE	NXP Semiconductors	MICROPROCESSOR		BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V	16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.4 V				BOTTOM	1.6 mm	21 mm		YES	64		NOT SPECIFIED	NOT SPECIFIED	21 mm	CMOS				.8 mm	FIXED POINT	S-PBGA-B624			1200 rpm	YES
MCIMX6D6AVT10ADR	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES			32		GRID ARRAY, FINE PITCH			125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm	21 mm	64-BIT BUS WIDTH AVAILABLE	YES			40	260	21 mm	CMOS				.8 mm	FIXED POINT	S-PBGA-B624	3		1000 rpm	NO	e1
MCIMX6U1AVM08AB	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V	16	64		GRID ARRAY, LOW PROFILE, FINE PITCH		1.275 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	YES	64	24 MHz	40	260	21 mm	CMOS		1.35 V		.8 mm	FIXED POINT	S-PBGA-B624	3		800 rpm	YES	e1
MCIMX6S4AVM08AD	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V	16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.275 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	YES	32		40	260	21 mm	CMOS				.8 mm	FLOATING POINT	S-PBGA-B624	3		800 rpm	YES	e1
MCIMX6U4AVM08AD	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V	16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.275 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	YES	64		40	260	21 mm	CMOS				.8 mm	FLOATING POINT	S-PBGA-B624	3		800 rpm	YES	e1
MCIMX6S1AVM10AD	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V	16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.4 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	YES	32		40	260	21 mm	CMOS				.8 mm	FLOATING POINT	S-PBGA-B624	3		1000 rpm	YES	e1
MCIMX6U1AVM08AC	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V	16	64		GRID ARRAY, LOW PROFILE, FINE PITCH		1.275 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	YES	64	24 MHz	40	260	21 mm	CMOS		1.35 V		.8 mm	FIXED POINT	S-PBGA-B624	3		800 rpm	YES	e1
MCIMX6S4AVM08AC	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V	16	64		GRID ARRAY, LOW PROFILE, FINE PITCH		1.275 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	YES	32	24 MHz	40	260	21 mm	CMOS		1.35 V		.8 mm	FIXED POINT	S-PBGA-B624	3		800 rpm	YES	e1
MCIMX6U4AVM08AB	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V	16	64		GRID ARRAY, LOW PROFILE, FINE PITCH		1.275 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	YES	64	24 MHz	40	260	21 mm	CMOS		1.35 V		.8 mm	FIXED POINT	S-PBGA-B624	3		800 rpm	YES	e1
MCIMX6U4AVM08AC	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V	16	64		GRID ARRAY, LOW PROFILE, FINE PITCH		1.275 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	YES	64	24 MHz	40	260	21 mm	CMOS		1.35 V		.8 mm	FIXED POINT	S-PBGA-B624	3		800 rpm	YES	e1
MCIMX6S1AVM08AD	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V	16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.275 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	YES	32		40	260	21 mm	CMOS				.8 mm	FLOATING POINT	S-PBGA-B624	3		800 rpm	YES	e1
MCIMX6DP6AVT1AA	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V	26	32		GRID ARRAY, FINE PITCH		1.35 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm	21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	YES	64		40	260	21 mm	CMOS				.8 mm	FLOATING POINT	S-PBGA-B624	3		1000 rpm	YES	e1
MCIMX6U4AVM10AD	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V	16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.4 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	YES	64		40	260	21 mm	CMOS				.8 mm	FLOATING POINT	S-PBGA-B624	3		1000 rpm	YES	e1
MCIMX6QP4AVT1AB	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.5 V				GRID ARRAY, FINE PITCH		1.35 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm	21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE				40	260	21 mm	CMOS				.8 mm		S-PBGA-B624	3				e1
MCIMX6QP4AVT1AA	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V	26	32		GRID ARRAY, FINE PITCH		1.35 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm	21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	YES	64		40	260	21 mm	CMOS				.8 mm	FLOATING POINT	S-PBGA-B624	3		1000 rpm	YES	e1
MCIMX6QP4AVT8AA	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V	26	32		GRID ARRAY, FINE PITCH		1.225 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm	21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	YES	64		40	260	21 mm	CMOS		1.4 V		.8 mm	FLOATING POINT	S-PBGA-B624	3		852 rpm	YES	e1
MCIMX6S1AVM10AC	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.5 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.4 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE				40	260	21 mm	CMOS				.8 mm		S-PBGA-B624	3				e1
MCIMX6U6AVM08AD	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V	16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.275 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	YES	64		40	260	21 mm	CMOS				.8 mm	FLOATING POINT	S-PBGA-B624	3		800 rpm	YES	e1
MCIMX6S6AVM10AD	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V	16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.4 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	YES	32		40	260	21 mm	CMOS				.8 mm	FLOATING POINT	S-PBGA-B624	3		1000 rpm	YES	e1
MCIMX6DP4AVT1AA	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V	26	32		GRID ARRAY, FINE PITCH		1.35 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm	21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	YES	64		40	260	21 mm	CMOS				.8 mm	FLOATING POINT	S-PBGA-B624	3		1000 rpm	YES	e1
MCIMX6S4AVM10AC	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.5 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.4 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE				40	260	21 mm	CMOS				.8 mm		S-PBGA-B624	3				e1

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.