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| Manufacturer | NXP Semiconductors |
|---|---|
| Manufacturer's Part Number | PCIMX6Q6AVT10AC |
| Description | MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 624; Package Code: HBGA; Package Shape: SQUARE; Length: 21 mm; |
| Datasheet | PCIMX6Q6AVT10AC Datasheet |
| In Stock | 4,478 |
| NAME | DESCRIPTION |
|---|---|
| Other Names: |
2156-PCIMX6Q6AVT10AC FREFREPCIMX6Q6AVT10AC |
| Package Body Material: | PLASTIC/EPOXY |
| Speed: | 1000 rpm |
| Peripheral IC Type: | MICROPROCESSOR, RISC |
| Maximum Time At Peak Reflow Temperature (s): | 40 |
| Maximum Seated Height: | 2.16 mm |
| Surface Mount: | YES |
| Bit Size: | 32 |
| Terminal Finish: | TIN SILVER COPPER |
| JESD-609 Code: | e1 |
| No. of Terminals: | 624 |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, HEAT SINK/SLUG |
| Length: | 21 mm |
| Technology: | CMOS |
| JESD-30 Code: | S-PBGA-B624 |
| Package Shape: | SQUARE |
| Terminal Form: | BALL |
| Peak Reflow Temperature (C): | 260 |
| Package Code: | HBGA |
| Width: | 21 mm |
| Terminal Pitch: | .8 mm |
| Moisture Sensitivity Level (MSL): | 3 |









