LFBGA Microprocessors 641

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	No. of Serial I/Os	Sub-Category	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code
ATSAMA5D35A-CN	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	324	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8	26	32	1.2	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA324,18X18,32	1.08 V	105 Cel	1	-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	131072	15 mm		YES	16	48 MHz			15 mm	CMOS		1.2 V	39	10	Microprocessors	.8 mm	FLOATING POINT	S-PBGA-B324		Not Qualified	536 rpm	YES	e1
DM3730CUS100NEP	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	423	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V		26	32	1.2,1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA423,24X24,25	1.08 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	16384	16 mm		YES	16	54 MHz	30	260	16 mm	CMOS	37 mA	1.14 V			Digital Signal Processors	.65 mm	FLOATING POINT	S-PBGA-B423	3	Not Qualified	1000 rpm	YES	e1
ATSAMA5D35A-CNR	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	324	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8	26	32	1.2	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA324,18X18,32	1.08 V	105 Cel	1	-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	131072	15 mm		YES	16	48 MHz			15 mm	CMOS		1.2 V	39	10	Microprocessors	.8 mm	FLOATING POINT	S-PBGA-B324		Not Qualified	536 rpm	YES	e1
DM3730CUS100	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	423	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V	8	26	32	1.2,1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA423,24X24,25	1.08 V	90 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	1.4 mm	16384	16 mm		YES	16	54 MHz	NOT SPECIFIED	260	16 mm	CMOS	37 mA	1.14 V	128		Digital Signal Processors	.65 mm	FLOATING POINT	S-PBGA-B423	3	Not Qualified	1000 rpm	YES	e1
AM3703CUSA	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	423	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V	8	26	32	1.1,1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA423,24X24,25	.9 V	105 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	1.4 mm	65536	16 mm		YES	16	54 MHz	NOT SPECIFIED	260	16 mm	CMOS	800 mA	1.1 V			Microprocessors	.65 mm	FLOATING POINT	S-PBGA-B423	3	Not Qualified	800 rpm	YES	e1
AT91SAM9X25-CU	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	217	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V	8	26	32	1,1.8/3.3,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA217,17X17,32	.9 V	85 Cel	1	-40 Cel		BOTTOM	1.4 mm	32768	15 mm		YES	32	16 MHz			15 mm	CMOS		1 V	16		Microprocessors	.8 mm	FIXED POINT	S-PBGA-B217		Not Qualified	400 rpm	YES
AM3354BZCZA80R	Texas Instruments	MICROPROCESSOR, RISC		BALL	324	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.326 V	8	28	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.21 V				TIN SILVER COPPER	BOTTOM	1.4 mm	131072	15 mm		YES	16	26 MHz	30	260	15 mm	CMOS	400 mA	1.26 V	64			.8 mm	FIXED POINT	S-PBGA-B324	3		800 rpm	YES	e1
AM3351BZCE30	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	298	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.144 V	8	16	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.056 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	131072	13 mm		YES	16	26 MHz	30	260	13 mm	CMOS	400 mA	1.1 V	64			.65 mm	FIXED POINT	S-PBGA-B298	3		300 rpm	YES	e1
AM3351BZCEA60	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	298	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.144 V	8	16	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.056 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	131072	13 mm		YES	16	26 MHz	30	260	13 mm	CMOS	400 mA	1.1 V	64			.65 mm	FIXED POINT	S-PBGA-B298	3		600 rpm	YES	e1
AM3354BZCED60	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	298	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.144 V	8	28	32	0.95/1.1	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA298,19X19,25	1.056 V	90 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	131072	13 mm		YES	16	26 MHz	30	260	13 mm	CMOS	400 mA	1.1 V	64		Microprocessors	.65 mm	FIXED POINT	S-PBGA-B298	3	Not Qualified	600 rpm	YES	e1
AM3352BZCZ30	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	324	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.144 V	8	28	32	0.95/1.1	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA324,18X18,32	1.056 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	131072	15 mm	ALSO OPERATES AT MIN 0.912 V	YES	16	26 MHz	30	260	15 mm	CMOS	400 mA	1.1 V	64		Microprocessors	.8 mm	FIXED POINT	S-PBGA-B324	3	Not Qualified	300 rpm	YES	e1
DM3725CUSD100	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	423	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V		26	32	1.2,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA423,24X24,25	1.08 V	90 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	1.4 mm	16384	16 mm		YES	16	54 MHz	NOT SPECIFIED	260	16 mm	CMOS	37 mA	1.14 V	128		Digital Signal Processors	.65 mm	FLOATING POINT	S-PBGA-B423	3	Not Qualified	1000 rpm	YES	e1
MIMXRT1051DVL6A	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.3 V	8	0	32		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,25	1.25 V	95 Cel	0	0 Cel		BOTTOM	1.43 mm	524288	10 mm		YES	0	24 MHz			10 mm	CMOS	105 mA		32	29		.65 mm	FLOATING-POINT	S-PBGA-B196			600 rpm	YES
DM3730CUS	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	423	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V	8	26	32	1.2,1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA423,24X24,25	1.08 V	90 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	1.4 mm	16384	16 mm		YES	16	54 MHz	NOT SPECIFIED	260	16 mm	CMOS	37 mA	1.14 V	128		Digital Signal Processors	.65 mm	FLOATING POINT	S-PBGA-B423	3	Not Qualified	800 rpm	YES	e1
DM3730CUSD100	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	423	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V	8	26	32	1.2,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA423,24X24,25	1.08 V	90 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	1.4 mm	16384	16 mm		YES	16	54 MHz	NOT SPECIFIED	260	16 mm	CMOS	37 mA	1.14 V	128		Digital Signal Processors	.65 mm	FLOATING POINT	S-PBGA-B423	3	Not Qualified	1000 rpm	YES	e1
AM3356BZCZD60	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	324	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.144 V	8	28	32	0.95/1.1	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA324,18X18,32	1.056 V	90 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	131072	15 mm		YES	16	26 MHz	30	260	15 mm	CMOS	400 mA	1.1 V	64		Microprocessors	.8 mm	FIXED POINT	S-PBGA-B324	3	Not Qualified	600 rpm	YES	e1
MCIMX6U6AVM08AC	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V		16	64		GRID ARRAY, LOW PROFILE, FINE PITCH		1.275 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	YES	64	24 MHz	40	260	21 mm	CMOS		1.35 V				.8 mm	FIXED POINT	S-PBGA-B624	3		800 rpm	YES	e1
AM3351BZCE30R	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	298	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.144 V	8	28	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.056 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	131072	13 mm	ALSO OPERATES AT MIN 0.912 V	YES	16	26 MHz	30	260	13 mm	CMOS	400 mA	1.1 V	64			.65 mm	FIXED POINT	S-PBGA-B298	3		300 rpm	YES	e1
MCIMX6U1AVM08AD	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V		16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.275 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	YES	64		40	260	21 mm	CMOS						.8 mm	FLOATING POINT	S-PBGA-B624	3		800 rpm	YES	e1
AM3354BZCZA80	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	324	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.326 V	8	28	32	0.95/1.1	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA324,18X18,32	1.21 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	131072	15 mm		YES	16	26 MHz	30	260	15 mm	CMOS	400 mA	1.26 V	64		Microprocessors	.8 mm	FIXED POINT	S-PBGA-B324	3	Not Qualified	800 rpm	YES	e1
AM3356BZCZA60	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	324	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.144 V	8	28	32	0.95/1.1	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA324,18X18,32	1.056 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	131072	15 mm		YES	16	26 MHz	30	260	15 mm	CMOS	400 mA	1.1 V	64		Microprocessors	.8 mm	FIXED POINT	S-PBGA-B324	3	Not Qualified	600 rpm	YES	e1
AM5748ABZXA	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	760	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V		16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.11 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.63 mm		23 mm		YES	32	38.4 MHz	30	250	23 mm	CMOS		1.15 V				.8 mm	FIXED POINT	S-PBGA-B760	3		1500 rpm	YES	e1
AT91SAM9G35-CU-999	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	217	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V	8	26	32	1,1.8/3.3,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA217,17X17,32	.9 V	85 Cel	1	-40 Cel		BOTTOM	1.4 mm	32768	15 mm		YES	32	50 MHz			15 mm	CMOS		1 V	16		Microprocessors	.8 mm	FIXED POINT	S-PBGA-B217		Not Qualified	400 rpm	YES
MCIMX6S6AVM08AB	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V		16	64		GRID ARRAY, LOW PROFILE, FINE PITCH		1.275 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	YES	32	24 MHz	40	260	21 mm	CMOS		1.35 V				.8 mm	FIXED POINT	S-PBGA-B624	3		800 rpm	YES	e1
STM32MP131AAE3	STMicroelectronics	MICROPROCESSOR, RISC		BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.38 V	8	26	32		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.21 V	125 Cel		-40 Cel		BOTTOM	1.7 mm	172032	14 mm		YES	16	48 MHz			14 mm	CMOS	239 mA	1.25 V	56	8		.8 mm	FIXED POINT	S-PBGA-B289			650 rpm	YES
AM5749ABZXEA	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	760	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V		16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.11 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.63 mm		23 mm		YES	32	38.4 MHz	30	250	23 mm	CMOS		1.15 V				.8 mm	FIXED POINT	S-PBGA-B760	3		1500 rpm	YES	e1
AM3352BZCZA30	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	324	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.144 V	8	28	32	0.95/1.1	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA324,18X18,32	1.056 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	131072	15 mm	ALSO OPERATES AT MIN 0.912 V	YES	16	26 MHz	30	260	15 mm	CMOS	400 mA	1.1 V	64		Microprocessors	.8 mm	FIXED POINT	S-PBGA-B324	3	Not Qualified	300 rpm	YES	e1
AM3357BZCZD60	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	324	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.144 V	8	28	32	0.95/1.1	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA324,18X18,32	1.056 V	90 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	131072	15 mm		YES	16	26 MHz	30	260	15 mm	CMOS	400 mA	1.1 V	64		Microprocessors	.8 mm	FIXED POINT	S-PBGA-B324	3	Not Qualified	600 rpm	YES	e1
AM3703CUSD100	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	423	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V	8	26	32	1.1,1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA423,24X24,25	.9 V	90 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	1.4 mm	65536	16 mm		YES	16	54 MHz	NOT SPECIFIED	260	16 mm	CMOS	900 mA	1.1 V			Microprocessors	.65 mm	FLOATING POINT	S-PBGA-B423	3	Not Qualified	1000 rpm	YES	e1
MCIMX6S1AVM08AB	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V		16	64		GRID ARRAY, LOW PROFILE, FINE PITCH		1.275 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	YES	32	24 MHz	40	260	21 mm	CMOS		1.35 V				.8 mm	FIXED POINT	S-PBGA-B624	3		800 rpm	YES	e1
MCIMX6U6AVM08AB	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V		16	64		GRID ARRAY, LOW PROFILE, FINE PITCH		1.275 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	YES	64	24 MHz	40	260	21 mm	CMOS		1.35 V				.8 mm	FIXED POINT	S-PBGA-B624	3		800 rpm	YES	e1
VCBU3730GSCUS100	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	423	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V		26			GRID ARRAY, LOW PROFILE, FINE PITCH		1.08 V	90 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	1.4 mm		16 mm		YES	16	54 MHz	30	260	16 mm	CMOS		1.14 V				.65 mm	FLOATING POINT	S-PBGA-B423	3		1000 rpm	YES	e1
AM3352BZCZT60R	Texas Instruments	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	324	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.248 V	8	28	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.152 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	131072	15 mm		YES	16	26 MHz	30	260	15 mm	CMOS	400 mA	1.2 V	64			.8 mm	FIXED POINT	S-PBGA-B324	3		600 rpm	YES	e1
AM5706BCBDJA	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	538	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V		16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.11 V	105 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	1.298 mm		17 mm		YES	32	38.4 MHz	30	260	17 mm	CMOS		1.15 V				.65 mm	FIXED POINT	S-PBGA-B538	3		1000 rpm	YES	e1
AM5708BCBDJA	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	538	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V		16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.11 V	105 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	1.298 mm		17 mm		YES	32	38.4 MHz	30	260	17 mm	CMOS		1.15 V				.65 mm	FIXED POINT	S-PBGA-B538	3		1000 rpm	YES	e1
AM5706BCBDDA	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	538	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V		16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.11 V	105 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	1.298 mm		17 mm	OPERATES AT 0.85V NOMINAL SUPPLY AFTER AVS ENABLE	YES	32	32 MHz	NOT SPECIFIED	260	17 mm	CMOS		1.15 V				.65 mm	FIXED POINT	S-PBGA-B538	3		500 rpm	YES	e1
AM5706BCBDDEA	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	538	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V		16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.11 V	105 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	1.298 mm		17 mm		YES	32	38.4 MHz	NOT SPECIFIED	260	17 mm	CMOS		1.15 V				.65 mm	FIXED POINT	S-PBGA-B538	3		500 rpm	YES	e1
AM3359ZCZD72	Texas Instruments	MICROPROCESSOR, RISC		BALL	324	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.326 V		28	32	0.95/1.1,0.95/1.26	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA324,18X18,32	1.21 V				TIN SILVER COPPER	BOTTOM	1.4 mm		15 mm		YES	16	26 MHz	30	260	15 mm	CMOS		1.26 V			Microprocessors	.8 mm	FIXED POINT	S-PBGA-B324	3	Not Qualified	720 rpm	YES	e1
AM5746ABZXA	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	760	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V		16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.11 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.63 mm		23 mm		YES	32	38.4 MHz	30	250	23 mm	CMOS		1.15 V				.8 mm	FIXED POINT	S-PBGA-B760	3		1500 rpm	YES	e1
MCIMX6S6AVM08AD	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V		16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.275 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	YES	32		40	260	21 mm	CMOS						.8 mm	FLOATING POINT	S-PBGA-B624	3		800 rpm	YES	e1
OMAP3530ECUSA	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	423	LFBGA	SQUARE	PLASTIC/EPOXY		YES					1.1,1.2,1.8,1.8/3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA423,24X24,25		105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		16 mm					30	260	16 mm	CMOS					Graphics Processors	.65 mm		S-PBGA-B423	4	Not Qualified	720 rpm		e1
STM32MP131CAE3	STMicroelectronics	MICROPROCESSOR, RISC		BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.38 V	8	26	32		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.21 V	125 Cel		-40 Cel		BOTTOM	1.7 mm	172032	14 mm		YES	16	48 MHz			14 mm	CMOS	239 mA	1.25 V	56	8		.8 mm	FIXED POINT	S-PBGA-B289			650 rpm	YES
AM3357BZCZD30	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	324	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.144 V	8	28	32	0.95/1.1	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA324,18X18,32	1.056 V	90 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	131072	15 mm	ALSO OPERATES AT MIN 0.912 V	YES	16	26 MHz	30	260	15 mm	CMOS	400 mA	1.1 V	64		Microprocessors	.8 mm	FIXED POINT	S-PBGA-B324	3	Not Qualified	300 rpm	YES	e1
MCIMX6S4AVM08AB	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V		16	64		GRID ARRAY, LOW PROFILE, FINE PITCH		1.275 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	YES	32	24 MHz	40	260	21 mm	CMOS		1.35 V				.8 mm	FIXED POINT	S-PBGA-B624	3		800 rpm	YES	e1
ADSP-BF607BBCZ-5	Analog Devices	MICROPROCESSOR	INDUSTRIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V			32	1.8/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA349,22X22,32	1.19 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.5 mm		19 mm		YES		60 MHz			19 mm	CMOS		1.25 V			Microprocessors	.8 mm	FIXED POINT	S-PBGA-B349	3	Not Qualified	500 rpm	YES	e1
AM3354BZCZ30	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	324	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.144 V	8	28	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.056 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	131072	15 mm		YES	16	26 MHz	30	260	15 mm	CMOS	400 mA	1.1 V	64			.8 mm	FIXED POINT	S-PBGA-B324	3		300 rpm	YES	e1
MCIMX6S1AVM08AC	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V		16	64		GRID ARRAY, LOW PROFILE, FINE PITCH		1.275 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	YES	32	24 MHz	40	260	21 mm	CMOS		1.35 V				.8 mm	FIXED POINT	S-PBGA-B624	3		800 rpm	YES	e1
AM3357BZCZA30	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	324	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.144 V	8	28	32	0.95/1.1	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA324,18X18,32	1.056 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	131072	15 mm	ALSO OPERATES AT MIN 0.912 V	YES	16	26 MHz	30	260	15 mm	CMOS	400 mA	1.1 V	64		Microprocessors	.8 mm	FIXED POINT	S-PBGA-B324	3	Not Qualified	300 rpm	YES	e1

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.