LFBGA Microprocessors 641

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Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Terminal Position DMA Channels Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Total Dose (V) RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode JESD-609 Code On Chip Program ROM Width No. of I/O Lines

AM5708BCBDJ

Texas Instruments

MICROPROCESSOR, RISC

OTHER

BALL

538

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.2 V

16

GRID ARRAY, LOW PROFILE, FINE PITCH

1.11 V

90 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

1.298 mm

17 mm

YES

32

38.4 MHz

30

260

17 mm

CMOS

1.15 V

.65 mm

FIXED POINT

S-PBGA-B538

3

1000 rpm

YES

e1

DM3730CUSA

Texas Instruments

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

423

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.2 V

8

26

32

1.2,1.8

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA423,24X24,25

1.08 V

105 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

1.4 mm

16384

16 mm

YES

16

54 MHz

NOT SPECIFIED

260

16 mm

CMOS

1400 mA

1.14 V

128

Digital Signal Processors

.65 mm

FLOATING POINT

S-PBGA-B423

3

Not Qualified

800 rpm

YES

e1

AM3352BZCE60

Texas Instruments

MICROPROCESSOR, RISC

OTHER

BALL

298

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.144 V

8

28

32

0.95/1.1

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA298,19X19,25

1.056 V

90 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.3 mm

131072

13 mm

YES

16

26 MHz

30

260

13 mm

CMOS

400 mA

1.1 V

64

Microprocessors

.65 mm

FIXED POINT

S-PBGA-B298

3

Not Qualified

600 rpm

YES

e1

AM3356BZCZ60

Texas Instruments

MICROPROCESSOR, RISC

OTHER

BALL

324

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.144 V

8

28

32

0.95/1.1

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA324,18X18,32

1.056 V

90 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.4 mm

131072

15 mm

YES

16

26 MHz

30

260

15 mm

CMOS

400 mA

1.1 V

64

Microprocessors

.8 mm

FIXED POINT

S-PBGA-B324

3

Not Qualified

600 rpm

YES

e1

AM6548BACDXEAF

Texas Instruments

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

784

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.15 V

8

28

32

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA784,28X28,32

1.05 V

105 Cel

1

-40 Cel

TIN SILVER COPPER

BOTTOM

1.63 mm

2097152

23 mm

YES

16

27 MHz

250

23 mm

CMOS

1.1 V

2

5

.8 mm

FIXED POINT

S-PBGA-B784

3

1100 rpm

YES

e1

MC9328MXSVP10

NXP Semiconductors

MICROPROCESSOR

COMMERCIAL

BALL

225

LFBGA

SQUARE

PLASTIC/EPOXY

NO

YES

1.9 V

25

32

GRID ARRAY, LOW PROFILE, FINE PITCH

1.7 V

70 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.6 mm

13 mm

YES

32

16 MHz

40

260

13 mm

CMOS

1.8 V

.8 mm

FIXED POINT

S-PBGA-B225

3

Not Qualified

100 rpm

YES

e1

STM32MP131DAE7

STMicroelectronics

MICROPROCESSOR, RISC

BALL

289

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.38 V

8

26

32

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA289,17X17,32

1.32 V

105 Cel

-40 Cel

BOTTOM

1.7 mm

172032

14 mm

YES

16

48 MHz

14 mm

CMOS

268 mA

1.35 V

56

8

.8 mm

FIXED POINT

S-PBGA-B289

1000 rpm

YES

STM32MP151AAB3T

STMicroelectronics

MICROPROCESSOR, RISC

BALL

354

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.25 V

8

26

32

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA354,19X19,32

1.18 V

125 Cel

-40 Cel

BOTTOM

1.29 mm

724992

16 mm

YES

16

48 MHz

NOT SPECIFIED

NOT SPECIFIED

16 mm

CMOS

940 mA

1.2 V

48

8

.8 mm

FLOATING POINT

S-PBGA-B354

650 rpm

YES

STM32MP157DAA1

STMicroelectronics

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

448

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.25 V

8

26

32

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA448,22X22,32

.85 V

105 Cel

-20 Cel

BOTTOM

1.32 mm

724992

18 mm

YES

0

64 MHz

18 mm

CMOS

865 mA

.9 V

48

.8 mm

FLOATING POINT

S-PBGA-B448

800 rpm

YES

AM3351BZCEA30

Texas Instruments

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

298

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.144 V

8

16

32

GRID ARRAY, LOW PROFILE, FINE PITCH

1.056 V

105 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.3 mm

131072

13 mm

YES

16

26 MHz

30

260

13 mm

CMOS

400 mA

1.1 V

64

.65 mm

FIXED POINT

S-PBGA-B298

3

300 rpm

YES

e1

AM3351BZCEA30R

Texas Instruments

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

298

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.144 V

16

32

GRID ARRAY, LOW PROFILE, FINE PITCH

1.056 V

105 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.3 mm

13 mm

ALSO HAVING 28 GPMC ADDRESS AND 16 MULTIPLEXED ADDRESS AND DATA LINES

YES

16

30

260

13 mm

CMOS

1.1 V

.65 mm

FIXED POINT

S-PBGA-B298

3

300 rpm

YES

e1

AM1806BZCE4

Texas Instruments

MICROPROCESSOR, RISC

OTHER

BALL

361

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.35 V

23

32

1.3,1.8,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA361,19X19,25

1.25 V

90 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.4 mm

16 mm

YES

16

30 MHz

30

260

16 mm

CMOS

1.3 V

Microprocessors

.8 mm

FIXED POINT

S-PBGA-B361

3

Not Qualified

456 rpm

YES

e1

AM5706BCBDD

Texas Instruments

MICROPROCESSOR, RISC

OTHER

BALL

538

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.2 V

16

GRID ARRAY, LOW PROFILE, FINE PITCH

1.1 V

90 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

1.298 mm

17 mm

OPERATES AT 0.85V NOMINAL SUPPLY AFTER AVS ENABLE

YES

32

32 MHz

30

260

17 mm

CMOS

1.15 V

.65 mm

FIXED POINT

S-PBGA-B538

3

500 rpm

YES

e1

MC9328MXSVP10R2

NXP Semiconductors

MICROPROCESSOR

COMMERCIAL

BALL

225

LFBGA

SQUARE

PLASTIC/EPOXY

NO

YES

1.9 V

25

32

GRID ARRAY, LOW PROFILE, FINE PITCH

1.7 V

70 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.6 mm

13 mm

YES

32

16 MHz

40

260

13 mm

CMOS

1.8 V

.8 mm

FIXED POINT

S-PBGA-B225

3

Not Qualified

100 rpm

YES

e1

AM1808EZWT4

Texas Instruments

MICROPROCESSOR, RISC

OTHER

BALL

361

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.35 V

23

32

GRID ARRAY, LOW PROFILE, FINE PITCH

1.25 V

90 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.4 mm

16 mm

YES

16

30 MHz

30

260

16 mm

CMOS

1.3 V

.8 mm

FIXED POINT

S-PBGA-B361

3

456 rpm

YES

e1

DM388AAAR21F

Texas Instruments

MICROPROCESSOR, RISC

OTHER

BALL

609

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.42 V

8

28

32

GRID ARRAY, LOW PROFILE, FINE PITCH

1.28 V

95 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.32 mm

655360

16 mm

YES

16

30 MHz

30

260

16 mm

CMOS

1.35 V

72

.5 mm

FLOATING POINT

S-PBGA-B609

3

1000 rpm

YES

e1

DM388AAARD11FP

Texas Instruments

MICROPROCESSOR, RISC

BALL

609

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.42 V

8

28

32

GRID ARRAY, LOW PROFILE, FINE PITCH

1.28 V

TIN SILVER COPPER

BOTTOM

1.32 mm

655360

16 mm

YES

16

30 MHz

30

260

16 mm

CMOS

1.35 V

72

.5 mm

FLOATING POINT

S-PBGA-B609

3

970 rpm

YES

e1

DM388AAARD21FP

Texas Instruments

MICROPROCESSOR, RISC

BALL

609

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.42 V

8

28

32

GRID ARRAY, LOW PROFILE, FINE PITCH

1.28 V

TIN SILVER COPPER

BOTTOM

1.32 mm

655360

16 mm

YES

16

30 MHz

30

260

16 mm

CMOS

1.35 V

72

.5 mm

FLOATING POINT

S-PBGA-B609

3

1000 rpm

YES

e1

MPC8309CVMAHFCA

NXP Semiconductors

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

489

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

0

32

1

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA489,23X23,32

.95 V

105 Cel

-40 Cel

TIN SILVER

BOTTOM

1.61 mm

19 mm

YES

0

66.67 MHz

40

260

19 mm

CMOS

1 V

Microprocessors

.8 mm

FLOATING POINT

S-PBGA-B489

3

Not Qualified

417 rpm

YES

e2

STM32MP135FAE7T

STMicroelectronics

MICROPROCESSOR, RISC

BALL

289

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.38 V

8

26

32

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA289,17X17,32

1.32 V

105 Cel

-40 Cel

BOTTOM

1.7 mm

172032

14 mm

YES

16

48 MHz

14 mm

CMOS

268 mA

1.35 V

56

10

.8 mm

FIXED POINT

S-PBGA-B289

1000 rpm

YES

ATSAMA5D33A-CUR

Microchip Technology

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

324

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.32 V

8

26

32

1.2

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA324,18X18,32

1.08 V

85 Cel

1

-40 Cel

TIN SILVER COPPER

BOTTOM

1.4 mm

131072

15 mm

YES

16

48 MHz

15 mm

CMOS

1.2 V

39

10

Microprocessors

.8 mm

FLOATING POINT

S-PBGA-B324

Not Qualified

536 rpm

YES

e1

DM388AAAR11F

Texas Instruments

MICROPROCESSOR, RISC

OTHER

BALL

609

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.42 V

8

28

32

GRID ARRAY, LOW PROFILE, FINE PITCH

1.28 V

95 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.32 mm

655360

16 mm

YES

16

30 MHz

30

260

16 mm

CMOS

1.35 V

72

.5 mm

FLOATING POINT

S-PBGA-B609

3

970 rpm

YES

e1

MIMXRT1061DVJ6A

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

196

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.3 V

8

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA196,14X14,32

1.25 V

95 Cel

0 Cel

TIN SILVER

BOTTOM

1.52 mm

1048576

12 mm

YES

24 MHz

40

260

12 mm

CMOS

110 mA

32

8

.8 mm

FLOATING POINT

S-PBGA-B196

3

600 rpm

YES

e2

SMOMAPL138BGWTA3R

Texas Instruments

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

361

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.32 V

8

23

32

1.2,1.8/3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA361,19X19,32

1.14 V

105 Cel

-40 Cel

TIN LEAD

BOTTOM

1.4 mm

131072

16 mm

YES

16

30 MHz

20

220

16 mm

CMOS

.31 mA

1.2 V

64

Other uPs/uCs/Peripheral ICs

.8 mm

FLOATING POINT

S-PBGA-B361

3

Not Qualified

456 rpm

YES

e0

AM1802EZWTD3

Texas Instruments

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

361

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.32 V

8

23

32

GRID ARRAY, LOW PROFILE, FINE PITCH

1.14 V

90 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.4 mm

172032

16 mm

YES

16

30 MHz

30

260

16 mm

CMOS

1.2 V

80

.8 mm

FIXED POINT

S-PBGA-B361

3

300 rpm

YES

e1

AM1808EZWTA3

Texas Instruments

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

361

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.32 V

23

32

GRID ARRAY, LOW PROFILE, FINE PITCH

1.14 V

105 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.4 mm

16 mm

YES

16

30 MHz

30

260

16 mm

CMOS

1.2 V

.8 mm

FIXED POINT

S-PBGA-B361

3

375 rpm

YES

e1

AM3354BZCE60

Texas Instruments

MICROPROCESSOR, RISC

OTHER

BALL

298

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.144 V

8

28

32

0.95/1.1

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA298,19X19,25

1.056 V

90 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.3 mm

131072

13 mm

YES

16

26 MHz

30

260

13 mm

CMOS

400 mA

1.1 V

64

Microprocessors

.65 mm

FIXED POINT

S-PBGA-B298

3

Not Qualified

600 rpm

YES

e1

AM3357BZCZA60

Texas Instruments

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

324

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.144 V

8

28

32

0.95/1.1

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA324,18X18,32

1.056 V

105 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.4 mm

131072

15 mm

YES

16

26 MHz

30

260

15 mm

CMOS

400 mA

1.1 V

64

Microprocessors

.8 mm

FIXED POINT

S-PBGA-B324

3

Not Qualified

600 rpm

YES

e1

AM3357ZCZD27

Texas Instruments

MICROPROCESSOR, RISC

BALL

324

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.144 V

28

32

0.95/1.1,0.95/1.26

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA324,18X18,32

1.056 V

TIN SILVER COPPER

BOTTOM

1.4 mm

15 mm

YES

16

26 MHz

30

260

15 mm

CMOS

1.1 V

Microprocessors

.8 mm

FIXED POINT

S-PBGA-B324

3

Not Qualified

275 rpm

YES

e1

AM3357ZCZD72

Texas Instruments

MICROPROCESSOR, RISC

BALL

324

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.326 V

28

32

0.95/1.1,0.95/1.26

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA324,18X18,32

1.21 V

TIN SILVER COPPER

BOTTOM

1.4 mm

15 mm

YES

16

26 MHz

30

260

15 mm

CMOS

1.26 V

Microprocessors

.8 mm

FIXED POINT

S-PBGA-B324

3

Not Qualified

720 rpm

YES

e1

AM5706BCBDJEA

Texas Instruments

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

538

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.2 V

16

GRID ARRAY, LOW PROFILE, FINE PITCH

1.11 V

105 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

1.298 mm

17 mm

YES

32

38.4 MHz

NOT SPECIFIED

260

17 mm

CMOS

1.15 V

.65 mm

FIXED POINT

S-PBGA-B538

3

1000 rpm

YES

e1

ATSAMA5D26C-CUR

Microchip Technology

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

289

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.32 V

8

26

32

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA289,17X17,32

1.2 V

85 Cel

1

-40 Cel

BOTTOM

1.4 mm

131072

14 mm

ALSO OPERATES WITH 1.2V NOM @ 400 MHZ SPEED

YES

16

24 MHz

NOT SPECIFIED

NOT SPECIFIED

14 mm

CMOS

1.25 V

32

.8 mm

FLOATING POINT

S-PBGA-B289

500 rpm

YES

STM32MP157AAA3T

STMicroelectronics

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

448

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.25 V

8

26

32

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA448,22X22,32

.85 V

125 Cel

-40 Cel

BOTTOM

1.32 mm

724992

18 mm

YES

0

64 MHz

NOT SPECIFIED

NOT SPECIFIED

18 mm

CMOS

1000 mA

.9 V

48

.8 mm

FLOATING POINT

S-PBGA-B448

650 rpm

YES

AM3352BZCE30R

Texas Instruments

MICROPROCESSOR, RISC

BALL

298

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.144 V

8

28

32

0.95/1.1

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA298,19X19,25

1.056 V

TIN SILVER COPPER

BOTTOM

1.3 mm

131072

13 mm

ALSO OPERATES AT MIN 0.912 V

YES

16

26 MHz

30

260

13 mm

CMOS

400 mA

1.1 V

64

Microprocessors

.65 mm

FIXED POINT

S-PBGA-B298

3

Not Qualified

300 rpm

YES

e1

AM3352BZCED60

Texas Instruments

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

298

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.144 V

8

28

32

0.95/1.1

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA298,19X19,25

1.056 V

90 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.3 mm

131072

13 mm

YES

16

26 MHz

30

260

13 mm

CMOS

400 mA

1.1 V

64

Microprocessors

.65 mm

FIXED POINT

S-PBGA-B298

3

Not Qualified

600 rpm

YES

e1

AM5708BCBDJEAR

Texas Instruments

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

538

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.2 V

16

GRID ARRAY, LOW PROFILE, FINE PITCH

1.11 V

105 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

1.298 mm

17 mm

YES

32

38.4 MHz

30

260

17 mm

CMOS

1.15 V

.65 mm

FIXED POINT

S-PBGA-B538

3

1000 rpm

YES

e1

ATSAMA5D27C-CNR

Microchip Technology

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

289

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.32 V

8

26

32

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA289,17X17,32

1.2 V

105 Cel

1

-40 Cel

BOTTOM

1.4 mm

131072

14 mm

ALSO OPERATES WITH 1.2V NOM @ 400 MHZ SPEED

YES

16

24 MHz

NOT SPECIFIED

NOT SPECIFIED

14 mm

CMOS

1.25 V

32

.8 mm

FLOATING POINT

S-PBGA-B289

500 rpm

YES

MPC8308CVMAGD

Freescale Semiconductor

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

473

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

1,1.8,2.5/3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA473,23X23,32

.95 V

105 Cel

-40 Cel

BOTTOM

1.54 mm

19 mm

YES

66.67 MHz

40

260

19 mm

CMOS

1 V

2

Microprocessors

.8 mm

FLOATING POINT

S-PBGA-B473

3

Not Qualified

400 rpm

YES

e2

MPC8309CVMAGDCA

NXP Semiconductors

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

489

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

0

32

1

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA489,23X23,32

.95 V

105 Cel

-40 Cel

TIN SILVER

BOTTOM

1.61 mm

19 mm

YES

0

66.67 MHz

40

260

19 mm

CMOS

1 V

Microprocessors

.8 mm

FLOATING POINT

S-PBGA-B489

3

Not Qualified

400 rpm

YES

e2

STM32MP133FAE7

STMicroelectronics

MICROPROCESSOR, RISC

BALL

289

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.38 V

8

26

32

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA289,17X17,32

1.32 V

105 Cel

-40 Cel

BOTTOM

1.7 mm

172032

14 mm

YES

16

48 MHz

14 mm

CMOS

268 mA

1.35 V

56

10

.8 mm

FIXED POINT

S-PBGA-B289

1000 rpm

YES

STM32MP151AAA3T

STMicroelectronics

MICROPROCESSOR, RISC

BALL

448

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.25 V

8

26

32

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA448,22X22,32

1.18 V

125 Cel

-40 Cel

Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)

BOTTOM

1.32 mm

724992

18 mm

YES

16

48 MHz

30

260

18 mm

CMOS

940 mA

1.2 V

48

8

.8 mm

FLOATING POINT

S-PBGA-B448

3

650 rpm

YES

e2

XAM5708BCBDJEA

Texas Instruments

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

538

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.2 V

16

GRID ARRAY, LOW PROFILE, FINE PITCH

1.11 V

105 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.298 mm

17 mm

YES

32

38.4 MHz

30

260

17 mm

CMOS

1.15 V

.65 mm

FIXED POINT

S-PBGA-B538

3

1000 rpm

YES

e1

XAM5749ABZXEA

Texas Instruments

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

760

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.2 V

16

GRID ARRAY, LOW PROFILE, FINE PITCH

1.11 V

105 Cel

-40 Cel

BOTTOM

1.63 mm

23 mm

YES

32

38.4 MHz

23 mm

CMOS

1.15 V

.8 mm

FIXED POINT

S-PBGA-B760

1500 rpm

YES

AM3703CUS100

Texas Instruments

MICROPROCESSOR, RISC

OTHER

BALL

423

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.2 V

8

26

32

1.1,1.8

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA423,24X24,25

.9 V

90 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

1.4 mm

65536

16 mm

YES

16

54 MHz

NOT SPECIFIED

260

16 mm

CMOS

740 mA

1.1 V

Microprocessors

.65 mm

FLOATING POINT

S-PBGA-B423

3

Not Qualified

1000 rpm

YES

e1

AM3715CUSA

Texas Instruments

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

423

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.2 V

8

26

32

1.1,1.8

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA423,24X24,25

.9 V

105 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

1.4 mm

65536

16 mm

YES

16

54 MHz

NOT SPECIFIED

260

16 mm

CMOS

800 mA

1.1 V

Microprocessors

.65 mm

FLOATING POINT

S-PBGA-B423

3

Not Qualified

800 rpm

YES

e1

AM5708BCBDJAR

Texas Instruments

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

538

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.2 V

16

GRID ARRAY, LOW PROFILE, FINE PITCH

1.11 V

105 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

1.298 mm

17 mm

YES

32

38.4 MHz

30

260

17 mm

CMOS

1.15 V

.65 mm

FIXED POINT

S-PBGA-B538

3

1000 rpm

YES

e1

AM5708BCBDJAS

Texas Instruments

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

538

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.2 V

16

GRID ARRAY, LOW PROFILE, FINE PITCH

1.11 V

105 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.298 mm

17 mm

GPMC CONSISTS OF 28-BIT ADDRESS LINES AND 16-BIT DATA LINES

YES

32

38.4 MHz

30

260

17 mm

CMOS

1.15 V

.65 mm

FIXED POINT

S-PBGA-B538

3

1000 rpm

YES

e1

FS32R274KSK2MMM

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

257

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.31 V

8

ISO 26262

32

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA257,17X17,32

1.19 V

125 Cel

1

-40 Cel

TIN SILVER

BOTTOM

1.51 mm

1572864

14 mm

YES

40 MHz

40

260

14 mm

CMOS

1642 mA

1.25 V

32

.8 mm

FLOATING-POINT

S-PBGA-B257

3

240 rpm

YES

e2

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.