LFBGA Microprocessors 641

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	Sub-Category	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code
AM1808EZCEA3	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V		23	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm		13 mm		YES	16	30 MHz	30	260	13 mm	CMOS		1.2 V			.65 mm	FIXED POINT	S-PBGA-B361	3		375 rpm	YES	e1
AM1806EZWT3	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8	23	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	90 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	172032	16 mm		YES	16	30 MHz	30	260	16 mm	CMOS		1.2 V	80		.8 mm	FIXED POINT	S-PBGA-B361	3		375 rpm	YES	e1
XAM3359ZCZA72	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	324	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V		0	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.06 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		15 mm		YES	0	26 MHz			15 mm	CMOS		1.1 V			.8 mm	FIXED POINT	S-PBGA-B324			720 rpm	YES	e1
AM1806EZCED4	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.35 V	8	23	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V	90 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	172032	13 mm		YES	16	30 MHz	30	260	13 mm	CMOS		1.3 V	80		.65 mm	FIXED POINT	S-PBGA-B361	3		456 rpm	YES	e1
AM3358ZCZ60	Texas Instruments	MICROPROCESSOR, RISC		BALL	324	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V		16	32	0.95/1.1,0.95/1.26	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA324,18X18,32	1.06 V				BOTTOM	1.4 mm		15 mm		YES	16	26 MHz			15 mm	CMOS		1.1 V		Microprocessors	.8 mm	FIXED POINT	S-PBGA-B324		Not Qualified	600 rpm	YES
AM1808BZCE3	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V		23	32	1.2,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA361,19X19,25	1.14 V	90 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm		13 mm	ALSO OPERATES AT 1V AND 1.1 V NOMINAL	YES	16	50 MHz	30	260	13 mm	CMOS		1.2 V		Microprocessors	.65 mm	FIXED POINT	S-PBGA-B361	3	Not Qualified	375 rpm	YES	e1
AM1806BZCE3	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V		23	32	1.2,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA361,19X19,25	1.14 V	90 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		16 mm		YES	16	30 MHz	30	260	16 mm	CMOS		1.2 V		Microprocessors	.8 mm	FIXED POINT	S-PBGA-B361	3	Not Qualified	375 rpm	YES	e1
AM3354ZCZ60	Texas Instruments	MICROPROCESSOR, RISC		BALL	324	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.248 V		28	32	0.95/1.1,0.95/1.26	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA324,18X18,32	1.152 V			TIN SILVER COPPER	BOTTOM	1.4 mm		15 mm		YES	16	26 MHz	30	260	15 mm	CMOS		1.2 V		Microprocessors	.8 mm	FIXED POINT	S-PBGA-B324	3	Not Qualified	600 rpm	YES	e1
AM1806EZCE4	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.35 V	8	23	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V	90 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	172032	13 mm		YES	16	30 MHz	30	260	13 mm	CMOS		1.3 V	80		.65 mm	FIXED POINT	S-PBGA-B361	3		456 rpm	YES	e1
XAM3359ZCZ50	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	324	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V		0	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.06 V	90 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		15 mm		YES	0	26 MHz			15 mm	CMOS		1.1 V			.8 mm	FIXED POINT	S-PBGA-B324			500 rpm	YES	e1
AM3356BZCZA30	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	324	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.144 V	8	28	32	0.95/1.1	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA324,18X18,32	1.056 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	131072	15 mm	ALSO OPERATES AT MIN 0.912 V	YES	16	26 MHz	30	260	15 mm	CMOS	400 mA	1.1 V	64	Microprocessors	.8 mm	FIXED POINT	S-PBGA-B324	3	Not Qualified	300 rpm	YES	e1
AM1808EZCE4	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.35 V		23	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V	90 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm		13 mm		YES	16	30 MHz	30	260	13 mm	CMOS		1.3 V			.65 mm	FIXED POINT	S-PBGA-B361	3		456 rpm	YES	e1
AM5706BCBDJ	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	538	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V		16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.11 V	90 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	1.298 mm		17 mm		YES	32	38.4 MHz	30	260	17 mm	CMOS		1.15 V			.65 mm	FIXED POINT	S-PBGA-B538	3		1000 rpm	YES	e1
AM3352BZCEA30R	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	298	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.144 V	8	28	32	0.95/1.1	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA298,19X19,25	1.056 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	131072	13 mm	ALSO OPERATES AT MIN 0.912 V	YES	16	26 MHz	30	260	13 mm	CMOS	400 mA	1.1 V	64	Microprocessors	.65 mm	FIXED POINT	S-PBGA-B298	3	Not Qualified	300 rpm	YES	e1
AM3356BZCZ30	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	324	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.144 V	8	28	32	0.95/1.1	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA324,18X18,32	1.056 V	90 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	131072	15 mm	ALSO OPERATES AT MIN 0.912 V	YES	16	26 MHz	30	260	15 mm	CMOS	400 mA	1.1 V	64	Microprocessors	.8 mm	FIXED POINT	S-PBGA-B324	3	Not Qualified	300 rpm	YES	e1
AM3715CUSD100	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	423	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V	8	26	32	1.1,1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA423,24X24,25	.9 V	90 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	1.4 mm	65536	16 mm		YES	16	54 MHz	NOT SPECIFIED	260	16 mm	CMOS	900 mA	1.1 V		Microprocessors	.65 mm	FLOATING POINT	S-PBGA-B423	3	Not Qualified	1000 rpm	YES	e1
AM3358ZCZA72	Texas Instruments	MICROPROCESSOR, RISC		BALL	324	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V		0	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.06 V				BOTTOM	1.4 mm		15 mm		YES	16	26 MHz			15 mm	CMOS		1.1 V			.8 mm	FIXED POINT	S-PBGA-B324			720 rpm	YES
AM3356ZCZD60	Texas Instruments	MICROPROCESSOR, RISC		BALL	324	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V		16	32	0.95/1.1,0.95/1.26	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA324,18X18,32	1.06 V				BOTTOM	1.4 mm		15 mm		YES	16	26 MHz			15 mm	CMOS		1.1 V		Microprocessors	.8 mm	FIXED POINT	S-PBGA-B324		Not Qualified	600 rpm	YES
AM5749ABZX	Texas Instruments	MICROPROCESSOR, RISC	COMMERCIAL	BALL	760	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V		16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.11 V	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.63 mm		23 mm		YES	32	38.4 MHz	30	250	23 mm	CMOS		1.15 V			.8 mm	FIXED POINT	S-PBGA-B760	3		1500 rpm	YES	e1
AM3352ZZCZA60	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	324	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES			16	32		GRID ARRAY, LOW PROFILE, FINE PITCH			105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		15 mm		YES	16	26 MHz	30	260	15 mm	CMOS					.8 mm	FIXED POINT	S-PBGA-B324	3		600 rpm	YES	e1
AM3703CUSNEST	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	423	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V		26	32		GRID ARRAY, LOW PROFILE, FINE PITCH		.9 V	90 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		16 mm		YES	16	54 MHz	30	260	16 mm	CMOS		1.1 V			.65 mm	FLOATING POINT	S-PBGA-B423	3		800 rpm	YES	e1
AM3358ZCZA50	Texas Instruments	MICROPROCESSOR, RISC		BALL	324	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V		0	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.06 V				BOTTOM	1.4 mm		15 mm		YES	16	26 MHz			15 mm	CMOS		1.1 V			.8 mm	FIXED POINT	S-PBGA-B324			500 rpm	YES
XAM3359ZCZD50	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	324	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V		0	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.06 V	90 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		15 mm		YES	0	26 MHz			15 mm	CMOS		1.1 V			.8 mm	FIXED POINT	S-PBGA-B324			500 rpm	YES	e1
AM1806BZWT3	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V		23	32	1.2,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA361,19X19,32	1.14 V	90 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		16 mm		YES	16	30 MHz	30	260	16 mm	CMOS		1.2 V		Microprocessors	.8 mm	FIXED POINT	S-PBGA-B361	3	Not Qualified	375 rpm	YES	e1
AM1806EZWTD4	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.35 V	8	23	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V	90 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	172032	16 mm		YES	16	30 MHz	30	260	16 mm	CMOS		1.3 V	80		.8 mm	FIXED POINT	S-PBGA-B361	3		456 rpm	YES	e1
AM3517BZNCA	Texas Instruments	MICROPROCESSOR		BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V		26	32		GRID ARRAY, LOW PROFILE, FINE PITCH		.5 V				BOTTOM	1.3 mm		17 mm		YES	16	54 MHz			17 mm	CMOS		1.2 V			.65 mm	FLOATING POINT	S-PBGA-B491		Not Qualified		NO
AM3715CUS	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	423	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V	8	26	32	1.1,1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA423,24X24,25	.9 V	90 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	1.4 mm	65536	16 mm		YES	16	54 MHz	NOT SPECIFIED	260	16 mm	CMOS	740 mA	1.1 V		Microprocessors	.65 mm	FLOATING POINT	S-PBGA-B423	3	Not Qualified	800 rpm	YES	e1
ADSP-BF608BBCZ-5	Analog Devices	MICROPROCESSOR	INDUSTRIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V			32	1.8/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA349,22X22,32	1.19 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.5 mm		19 mm		YES		60 MHz	30	260	19 mm	CMOS		1.25 V		Microprocessors	.8 mm	FIXED POINT	S-PBGA-B349	3	Not Qualified	500 rpm	YES	e1
ADSP-BF608BBCZ-5X	Analog Devices	MICROPROCESSOR	INDUSTRIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V		25			GRID ARRAY, LOW PROFILE, FINE PITCH		1.7 V	85 Cel	-40 Cel		BOTTOM	1.5 mm		19 mm	ALSO AVAILABLE IN 3.3V AND 14 BIT ADDRESS	YES	16				19 mm	CMOS		1.8 V			.8 mm	FIXED POINT	S-PBGA-B349			500 rpm	YES
ADSP-BF606BBCZ-5X	Analog Devices	MICROPROCESSOR	INDUSTRIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V		25			GRID ARRAY, LOW PROFILE, FINE PITCH		1.7 V	85 Cel	-40 Cel		BOTTOM	1.5 mm		19 mm	ALSO AVAILABLE IN 3.3V AND 14 BIT ADDRESS	YES	16				19 mm	CMOS		1.8 V			.8 mm	FIXED POINT	S-PBGA-B349			400 rpm	YES
ADSP-BF607BBCZ-5X	Analog Devices	MICROPROCESSOR	INDUSTRIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V		25			GRID ARRAY, LOW PROFILE, FINE PITCH		1.7 V	85 Cel	-40 Cel		BOTTOM	1.5 mm		19 mm	ALSO AVAILABLE IN 3.3V AND 14 BIT ADDRESS	YES	16				19 mm	CMOS		1.8 V			.8 mm	FIXED POINT	S-PBGA-B349			500 rpm	YES
ADSP-CM419F-BCZENG	Analog Devices	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	210	LFBGA	SQUARE	PLASTIC/EPOXY	NO	YES			0			GRID ARRAY, LOW PROFILE, FINE PITCH			105 Cel	-40 Cel		BOTTOM	1.5 mm		15 mm		YES	0	60 MHz			15 mm	CMOS		3.3 V			.8 mm	FLOATING POINT	S-PBGA-B210			240 rpm	YES
ADSP-BF608KBCZ-5	Analog Devices	MICROPROCESSOR	COMMERCIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V			32	1.8/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA349,22X22,32	1.19 V	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.5 mm		19 mm		YES		60 MHz	30	260	19 mm	CMOS		1.25 V		Microprocessors	.8 mm	FIXED POINT	S-PBGA-B349	3	Not Qualified	500 rpm	YES	e1
ADSP-BF609KBCZ-5	Analog Devices	MICROPROCESSOR	COMMERCIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V			32	1.8/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA349,22X22,32	1.19 V	70 Cel	0 Cel		BOTTOM	1.5 mm		19 mm		YES		60 MHz	NOT SPECIFIED	NOT SPECIFIED	19 mm	CMOS		1.25 V		Microprocessors	.8 mm	FIXED POINT	S-PBGA-B349		Not Qualified	500 rpm	YES
ADSP-BF609-ENG	Analog Devices	MICROPROCESSOR	AUTOMOTIVE	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V					GRID ARRAY, LOW PROFILE, FINE PITCH		1.7 V	125 Cel	-40 Cel		BOTTOM	1.5 mm		19 mm	ALSO AVAILABLE IN 3.3V	YES					19 mm	CMOS		1.8 V			.8 mm		S-PBGA-B349			500 rpm	YES
ADSP-21478KBCZ-ENG	Analog Devices	MICROPROCESSOR	COMMERCIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES			24			GRID ARRAY, LOW PROFILE, FINE PITCH			70 Cel	0 Cel		BOTTOM	1.5 mm		12 mm		YES	16				12 mm	CMOS					.8 mm	FLOATING POINT	S-PBGA-B196		Not Qualified	266 rpm	YES
ADSP-BF606BBCZ-4	Analog Devices	MICROPROCESSOR	INDUSTRIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V			32	1.8/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA349,22X22,32	1.19 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.5 mm		19 mm		YES		60 MHz	30	260	19 mm	CMOS		1.25 V		Microprocessors	.8 mm	FIXED POINT	S-PBGA-B349	3	Not Qualified	400 rpm	YES	e1
ADSP-21479KBCZ-ENG	Analog Devices	MICROPROCESSOR	COMMERCIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES			24	32		GRID ARRAY, LOW PROFILE, FINE PITCH			70 Cel	0 Cel		BOTTOM	1.5 mm		12 mm		YES	16				12 mm	CMOS					.8 mm	FLOATING POINT	S-PBGA-B196		Not Qualified	266 rpm	YES
STA1095HOA	STMicroelectronics	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V					GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	85 Cel	-40 Cel		BOTTOM	1.7 mm		16 mm		YES			NOT SPECIFIED	NOT SPECIFIED	16 mm	CMOS					.8 mm	FIXED POINT	S-PBGA-B361			533 rpm	NO
STA1080EOA	STMicroelectronics	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V					GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	85 Cel	-40 Cel		BOTTOM	1.7 mm		16 mm		YES			NOT SPECIFIED	NOT SPECIFIED	16 mm	CMOS					.8 mm	FIXED POINT	S-PBGA-B361			450 rpm	NO
STA1095POA	STMicroelectronics	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V					GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	85 Cel	-40 Cel		BOTTOM	1.7 mm		16 mm		YES			NOT SPECIFIED	NOT SPECIFIED	16 mm	CMOS					.8 mm	FIXED POINT	S-PBGA-B361			600 rpm	NO
SPEAR320S-2	STMicroelectronics	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.3 V		24	32	1.2,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.14 V	85 Cel	-40 Cel	TIN SILVER	BOTTOM	1.7 mm		15 mm		YES	16	33 MHz			15 mm	CMOS	400 mA	1.2 V		Microprocessors	.8 mm	FIXED POINT	S-PBGA-B289	3	Not Qualified	333 rpm	YES	e2
STA1090HOA	STMicroelectronics	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V					GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	85 Cel	-40 Cel		BOTTOM	1.7 mm		16 mm		YES			NOT SPECIFIED	NOT SPECIFIED	16 mm	CMOS					.8 mm	FIXED POINT	S-PBGA-B361			533 rpm	NO
STA1080POCTR	STMicroelectronics	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V					GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	85 Cel	-40 Cel		BOTTOM	1.7 mm		16 mm		YES			NOT SPECIFIED	NOT SPECIFIED	16 mm	CMOS					.8 mm	FIXED POINT	S-PBGA-B361			600 rpm	NO
STN8810BES12HPBE	STMicroelectronics	MICROPROCESSOR, RISC		BALL	26	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES			0	32		GRID ARRAY, LOW PROFILE, FINE PITCH						BOTTOM	1.4 mm		14 mm		YES	0	19.2 MHz			14 mm	CMOS		1.2 V			.5 mm	FIXED POINT	S-PBGA-B26		Not Qualified	264 rpm	YES
SPEAR310-2	STMicroelectronics	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		0	32	1.2,1.8,3.3	GRID ARRAY	BGA289,17X17,32	1.14 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm		15 mm		YES	0		30	260	15 mm	CMOS		1.2 V		Microprocessors	.8 mm	FIXED POINT	S-PBGA-B289	3	Not Qualified	333 rpm	YES	e1
STA1080HOCTR	STMicroelectronics	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V					GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	85 Cel	-40 Cel		BOTTOM	1.7 mm		16 mm		YES			NOT SPECIFIED	NOT SPECIFIED	16 mm	CMOS					.8 mm	FIXED POINT	S-PBGA-B361			533 rpm	NO
STN8810B2S12HPI	STMicroelectronics	MICROPROCESSOR, RISC		BALL	26	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES			0	32		GRID ARRAY, LOW PROFILE, FINE PITCH						BOTTOM	1.4 mm		14 mm		YES	0	19.2 MHz			14 mm	CMOS		1.2 V			.5 mm	FIXED POINT	S-PBGA-B26		Not Qualified	264 rpm	YES

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.