LFBGA Microprocessors 641

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Address Bus Width	DAC Channels	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	ADC Channels	Terminal Position	DMA Channels	Maximum Seated Height	ROM Words	RAM Words	Width	Data EEPROM Size	Additional Features	Boundary Scan	Peripherals	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	RAM Bytes	Technology	Analog To Digital Convertors	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	PWM Channels	No. of Serial I/Os	Sub-Category	Connectivity	ROM Programmability	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code	No. of I/O Lines
MC9328MX1VM20R2	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	256	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	2 V		25		32	1.8,1.8/3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA256,16X16,32	1.8 V	70 Cel		0 Cel	TIN SILVER COPPER OVER NICKEL		BOTTOM		1.6 mm			14 mm		ALSO REQUIRES 3.3V SUPPLY	YES		32	16 MHz	40	260	14 mm		CMOS			1.9 V				Microprocessors			.8 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	200 rpm	YES
MC9328MX21CVK	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.65 V		26		32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.45 V	85 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		1.49 mm			14 mm		ALSO REQUIRES 3.3 V I/O SUPPLY; UNAVAILABLE FOR IMPORT OR SALE IN US	YES		32	32 MHz	40	260	14 mm		CMOS			1.5 V							.65 mm	FIXED POINT	S-PBGA-B289	3	Not Qualified	266 rpm	YES	e1
MPC8306VMADDCA	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	369	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES			0		32		GRID ARRAY, LOW PROFILE, FINE PITCH			105 Cel		0 Cel	TIN SILVER		BOTTOM		1.61 mm			19 mm			YES		0	66.67 MHz	40	260	19 mm		CMOS			1 V							.8 mm	FLOATING POINT	S-PBGA-B369	3	Not Qualified	266 rpm	YES	e2
MC9328MX1CVM15	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	256	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V		25		32	1.8,1.8/3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA256,16X16,32	1.7 V	85 Cel		-40 Cel	TIN SILVER COPPER OVER NICKEL		BOTTOM		1.6 mm			14 mm		ALSO REQUIRES 3.3V SUPPLY	YES		32	16 MHz	40	260	14 mm		CMOS			1.8 V				Microprocessors			.8 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	150 rpm	YES
MCIMX7D2DVM12SC	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	541	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.25 V		26		32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.2 V	85 Cel		0 Cel			BOTTOM		1.42 mm			19 mm			YES		16		40	260	19 mm		CMOS			1.225 V							.75 mm	FLOATING POINT	S-PBGA-B541	3		1200 rpm	YES
MPC8306VMAFFCA	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	369	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES			0		32		GRID ARRAY, LOW PROFILE, FINE PITCH			105 Cel		0 Cel	TIN SILVER COPPER		BOTTOM		1.61 mm			19 mm			YES		0	66.67 MHz			19 mm		CMOS			1 V							.8 mm	FLOATING POINT	S-PBGA-B369			333 rpm	YES	e1
MCIMX6S4AVM10AC	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.5 V						GRID ARRAY, LOW PROFILE, FINE PITCH		1.4 V	125 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		1.6 mm			21 mm		24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE					40	260	21 mm		CMOS										.8 mm		S-PBGA-B624	3				e1
MCIMX6U6AVM10AC	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.5 V						GRID ARRAY, LOW PROFILE, FINE PITCH		1.4 V	125 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		1.6 mm			21 mm		24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE					40	260	21 mm		CMOS										.8 mm		S-PBGA-B624	3				e1
MCIMX6S4AVM10AD	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V		16				GRID ARRAY, LOW PROFILE, FINE PITCH		1.4 V	125 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		1.6 mm			21 mm		24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	YES		32		40	260	21 mm		CMOS										.8 mm	FLOATING POINT	S-PBGA-B624	3		1000 rpm	YES	e1
MC9328MXLVM20	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	256	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	2 V		25		32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.8 V	70 Cel		0 Cel	TIN SILVER COPPER		BOTTOM		1.6 mm			14 mm		ALSO REQUIRES 3.3V SUPPLY	YES		32	16 MHz	40	260	14 mm		CMOS			1.9 V							.8 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	200 rpm	YES	e1
MPC8306SCVMACDCA	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	369	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		0		32	1,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA369,23X23,32	.95 V	105 Cel		-40 Cel	TIN SILVER		BOTTOM		1.61 mm			19 mm			YES		0	66.67 MHz	40	260	19 mm		CMOS			1 V				Microprocessors			.8 mm	FLOATING POINT	S-PBGA-B369	3	Not Qualified	200 rpm	YES	e2
MC9328MX21SVM	NXP Semiconductors	MICROPROCESSOR	COMMERCIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.65 V		26		32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.45 V	70 Cel		0 Cel	TIN SILVER COPPER		BOTTOM		1.5 mm			17 mm			YES		32	32 MHz	40	260	17 mm		CMOS			1.5 V							.8 mm	FIXED POINT	S-PBGA-B289	3	Not Qualified	266 rpm	YES	e1
MCIMX6U4AVM10AC	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.5 V						GRID ARRAY, LOW PROFILE, FINE PITCH		1.4 V	125 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		1.6 mm			21 mm		24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE					40	260	21 mm		CMOS										.8 mm		S-PBGA-B624	3				e1
MPC8306VMABFCA	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	369	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES			0		32		GRID ARRAY, LOW PROFILE, FINE PITCH			105 Cel		0 Cel	TIN SILVER COPPER		BOTTOM		1.61 mm			19 mm			YES		0	66.67 MHz			19 mm		CMOS			1 V							.8 mm	FLOATING POINT	S-PBGA-B369			133 rpm	YES	e1
MPC8306VMACFCA	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	369	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES			0		32		GRID ARRAY, LOW PROFILE, FINE PITCH			105 Cel		0 Cel	TIN SILVER COPPER		BOTTOM		1.61 mm			19 mm			YES		0	66.67 MHz			19 mm		CMOS			1 V							.8 mm	FLOATING POINT	S-PBGA-B369			200 rpm	YES	e1
MCIMX6X2EVN10ABR	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY		YES					32		GRID ARRAY, LOW PROFILE, FINE PITCH						TIN SILVER COPPER		BOTTOM		1.27 mm			17 mm							40	260	17 mm		CMOS										.8 mm		S-PBGA-B400	3		800 rpm		e1
MPC8306SCVMAFDCA	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	369	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		0		32	1,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA369,23X23,32	.95 V	105 Cel		-40 Cel	TIN SILVER		BOTTOM		1.61 mm			19 mm			YES		0	66.67 MHz	40	260	19 mm		CMOS			1 V				Microprocessors			.8 mm	FLOATING POINT	S-PBGA-B369	3	Not Qualified	333 rpm	YES	e2
MPC8306VMADFCA	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	369	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES			0		32		GRID ARRAY, LOW PROFILE, FINE PITCH			105 Cel		0 Cel	TIN SILVER COPPER		BOTTOM		1.61 mm			19 mm			YES		0	66.67 MHz			19 mm		CMOS			1 V							.8 mm	FLOATING POINT	S-PBGA-B369			266 rpm	YES	e1
MPC8308CVMAFDA	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	473	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V				32		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA473,23X23,32	.95 V	105 Cel	4	-40 Cel	TIN SILVER		BOTTOM		1.54 mm			19 mm			YES				40	260	19 mm		CMOS			1 V							.8 mm	FLOATING POINT	S-PBGA-B473	3	Not Qualified	333 rpm	YES	e2
MC9328MX21VMR2	NXP Semiconductors	MICROPROCESSOR	COMMERCIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.65 V		26		32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.45 V	70 Cel		0 Cel	TIN SILVER COPPER		BOTTOM		1.6 mm			17 mm		ALSO REQUIRES 3.3 V I/O SUPPLY; UNAVAILABLE FOR IMPORT OR SALE IN US	YES		32	32 MHz	40	260	17 mm		CMOS			1.5 V							.8 mm	FIXED POINT	S-PBGA-B289	3	Not Qualified	266 rpm	YES	e1
MCIMX6U1AVM10AC	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.5 V						GRID ARRAY, LOW PROFILE, FINE PITCH		1.4 V	125 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		1.6 mm			21 mm		24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE					40	260	21 mm		CMOS										.8 mm		S-PBGA-B624	3				e1
MCIMX6U6AVM10AD	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V		16				GRID ARRAY, LOW PROFILE, FINE PITCH		1.4 V	125 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		1.6 mm			21 mm		24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	YES		64		40	260	21 mm		CMOS										.8 mm	FLOATING POINT	S-PBGA-B624	3		1000 rpm	YES	e1
MC9328MX1DVM15R2	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	256	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V		25		32	1.8,1.8/3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA256,16X16,32	1.7 V	70 Cel		-30 Cel	TIN SILVER COPPER OVER NICKEL		BOTTOM		1.6 mm			14 mm		ALSO REQUIRES 3.3V SUPPLY	YES		32	16 MHz	40	260	14 mm		CMOS			1.8 V				Microprocessors			.8 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	150 rpm	YES
TZ1041MBG	Toshiba	MICROPROCESSOR, RISC	OTHER	BALL	136	LFBGA	RECTANGULAR	PLASTIC/EPOXY	NO	YES	3.6 V		0		32		GRID ARRAY, LOW PROFILE, FINE PITCH		2.1 V	70 Cel		-20 Cel			BOTTOM		1.59 mm			6.7 mm			YES		0				8 mm		CMOS			3.3 V							.5 mm	FLOATING POINT	R-PBGA-B136			48 rpm	YES
TMP1962F10AXB	Toshiba	MICROPROCESSOR, RISC	OTHER	BALL	281	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.3 V		24		32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.35 V	85 Cel		-20 Cel	TIN LEAD		BOTTOM		1.4 mm			13 mm			YES		16	13.5 MHz			13 mm		CMOS			1.65 V							.65 mm	FIXED POINT	S-PBGA-B281		Not Qualified	40.5 rpm	YES	e0
TMPR3911BXB	Toshiba	MICROPROCESSOR, RISC	COMMERCIAL	BALL	177	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.8 V		13		32		GRID ARRAY, LOW PROFILE, FINE PITCH		2.4 V	70 Cel		-20 Cel			BOTTOM		1.4 mm			13 mm		ALSO REQUIRES 3.3V SUPPLY	NO		32	7.3728 MHz	NOT SPECIFIED	NOT SPECIFIED	13 mm		CMOS			2.6 V							.8 mm	FIXED POINT	S-PBGA-B177		Not Qualified	58.9824 rpm	YES
TMP1962C10AXB	Toshiba	MICROPROCESSOR, RISC	OTHER	BALL	281	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.3 V		24		32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.35 V	85 Cel		-20 Cel	TIN LEAD		BOTTOM		1.4 mm			13 mm			YES		16	13.5 MHz			13 mm		CMOS			1.65 V							.65 mm	FIXED POINT	S-PBGA-B281		Not Qualified	40.5 rpm	YES	e0
TMPR3912XB-92	Toshiba	MICROPROCESSOR, RISC	COMMERCIAL	BALL	217	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.6 V		13		32		GRID ARRAY, LOW PROFILE, FINE PITCH		3 V	70 Cel		0 Cel			BOTTOM		1.4 mm			13 mm			NO		32	11.52 MHz	NOT SPECIFIED	NOT SPECIFIED	13 mm		CMOS			3.3 V							.8 mm	FIXED POINT	S-PBGA-B217		Not Qualified	92.16 rpm	YES
TMP19A64C1DXBG	Toshiba	MICROPROCESSOR, RISC	OTHER	BALL	281	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.65 V	8	24		32	1.8/3.3,3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA281,18X18,25	1.35 V	85 Cel	12	-20 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM		1.4 mm	1536	57344	13 mm			YES		16	13.5 MHz			13 mm	57344	CMOS		60 mA	1.5 V	8		7	Microcontrollers		MROM	.65 mm	FIXED POINT	S-PBGA-B281		Not Qualified	54 rpm	YES	e1
TMP1962F10AXBG	Toshiba	MICROPROCESSOR, RISC	OTHER	BALL	281	LFBGA	SQUARE	PLASTIC/EPOXY	NO	YES	3.3 V		24		32	2.5,3,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA281,18X18,25	2.2 V	85 Cel		-20 Cel	TIN SILVER COPPER		BOTTOM		1.4 mm			13 mm		LOW POWER TAKEN FROM STANDBY MODE	YES		16	13.5 MHz			13 mm		CMOS		110 mA	2.5 V				Microprocessors			.65 mm	FIXED POINT	S-PBGA-B281		Not Qualified	40.5 rpm	YES	e1
TMPR4956CXBG-400	Toshiba	MICROPROCESSOR, RISC		BALL	217	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.31 V		64		64	1.25,2.5/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA217,15X15,32	1.1875 V				Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM		1.4 mm			13 mm			YES		64	133 MHz			13 mm		CMOS		640 mA	1.25 V				Microprocessors			.8 mm	FLOATING POINT	S-PBGA-B217		Not Qualified	400 rpm	YES	e1
TMPR3912XB-75	Toshiba	MICROPROCESSOR, RISC	COMMERCIAL	BALL	217	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.6 V		13		32	3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA217,15X15,32	3 V	70 Cel		0 Cel	Tin/Lead (Sn/Pb)		BOTTOM		1.4 mm			13 mm			NO		32	9.216 MHz			13 mm		CMOS		130 mA	3.3 V				Microprocessors			.8 mm	FIXED POINT	S-PBGA-B217		Not Qualified	75 rpm	YES	e0
TMPA910CRAXBG	Toshiba	MICROPROCESSOR, RISC	COMMERCIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.6 V		26		32	1.5,1.8/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA361,19X19,32	3 V	70 Cel		0 Cel			BOTTOM		1.4 mm			16 mm		ALSO REQUIRES 1.8 V	YES		32	27 MHz	NOT SPECIFIED	NOT SPECIFIED	16 mm		CMOS		246 mA	3.3 V				Microprocessors			.8 mm	FIXED POINT	S-PBGA-B361		Not Qualified	200 rpm	YES
TMPR4956CXBG-450	Toshiba	MICROPROCESSOR, RISC		BALL	217	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.31 V		64		64	1.25,2.5/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA217,15X15,32	1.1875 V				Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM		1.4 mm			13 mm			YES		64	133 MHz			13 mm		CMOS		690 mA	1.25 V				Microprocessors			.8 mm	FLOATING POINT	S-PBGA-B217		Not Qualified	450 rpm	YES	e1
R7S721030VCBG	Renesas Electronics	MICROPROCESSOR, RISC		BALL	176	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	8	26				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA176,15X15,20	1.1 V	85 Cel	8	-40 Cel			BOTTOM		1.4 mm		3145728	8 mm			YES		32	13.33 MHz			8 mm		CMOS		492 mA	1.18 V	16		13				.5 mm	FLOATING POINT	S-PBGA-B176			400 rpm	YES
R7S721000VCBG	Renesas Electronics	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	256	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	8	26	NO	32		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA256,21X21,20	1.1 V	85 Cel	8	-40 Cel		YES	BOTTOM	YES	1.4 mm		10485760	11 mm	0		YES	DMA(16), LCD, POR, PWM(2), RTC, TIMER(7), WDT	32	48 MHz			11 mm	10485760	CMOS	8-Ch 12-Bit		1.18 V	16	YES	8		CAN(5), ETHERNET(2), I2C(4), IEB, LIN(2), SCI(10), SPDIF, SPI(7), SSI(6), UART, USB(2)		.5 mm	FLOATING POINT	S-PBGA-B256			400 rpm	YES		137
UPD800261F1-816-HN2-A	Renesas Electronics	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	304	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.65 V		24		32	1.5	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA304,22X22,32	1.35 V	85 Cel		-40 Cel			BOTTOM		1.58 mm			19 mm		IT ALSO OPERATES AT 3.3V I/O SUPPLY	YES		32	150 MHz			19 mm		MOS		535 mA	1.5 V				Serial IO/Communication Controllers			.8 mm	FIXED POINT	S-PBGA-B304		Not Qualified	150 rpm	NO
UPD30111S1-80-3C	Renesas Electronics	MICROPROCESSOR, RISC	COMMERCIAL	BALL	224	LFBGA	SQUARE	PLASTIC/EPOXY	NO	YES	2.7 V		26		64		GRID ARRAY, LOW PROFILE, FINE PITCH		2.3 V	70 Cel		-10 Cel	TIN LEAD		BOTTOM		1.46 mm			16 mm			NO		32	80 MHz			16 mm		MOS			2.5 V							.8 mm	FIXED POINT	S-PBGA-B224		Not Qualified	80 rpm	YES	e0
R7S721034VCBG	Renesas Electronics	MICROPROCESSOR, RISC		BALL	176	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	8	26				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA176,15X15,20	1.1 V	85 Cel	8	-40 Cel			BOTTOM		1.4 mm		3145728	8 mm			YES		32	13.33 MHz			8 mm		CMOS		492 mA	1.18 V	16		13				.5 mm	FLOATING POINT	S-PBGA-B176			400 rpm	YES
R7S721030VCBG#AC0	Renesas Electronics	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	176	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	8	26				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA176,15X15,20	1.1 V	85 Cel	8	-40 Cel			BOTTOM		1.4 mm		3145728	8 mm			YES		32	13.33 MHz			8 mm		CMOS		492 mA	1.18 V	16		13				.5 mm	FLOATING POINT	S-PBGA-B176	3		400 rpm	YES
R7S721020VCBG	Renesas Electronics	MICROPROCESSOR, RISC		BALL	176	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	8	26				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA176,15X15,20	1.1 V	85 Cel	8	-40 Cel			BOTTOM		1.4 mm		3145728	8 mm			YES		32	13.33 MHz			8 mm		CMOS		492 mA	1.18 V	16		13				.5 mm	FLOATING POINT	S-PBGA-B176			400 rpm	YES
R7S721031VCBG	Renesas Electronics	MICROPROCESSOR, RISC		BALL	233	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	8	26				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA233,17X17,32	1.1 V	85 Cel	8	-40 Cel			BOTTOM		1.9 mm		3145728	15 mm			YES		32	13.33 MHz			15 mm		CMOS		492 mA	1.18 V	16		13				.8 mm	FLOATING POINT	S-PBGA-B233			400 rpm	YES
UPD30111S1-100-3C	Renesas Electronics	MICROPROCESSOR, RISC	COMMERCIAL	BALL	224	LFBGA	SQUARE	PLASTIC/EPOXY	NO	YES	2.7 V		26		64		GRID ARRAY, LOW PROFILE, FINE PITCH		2.3 V	70 Cel		-10 Cel	TIN LEAD		BOTTOM		1.46 mm			16 mm			NO		32	100 MHz			16 mm		MOS			2.5 V							.8 mm	FIXED POINT	S-PBGA-B224		Not Qualified	100 rpm	YES	e0
HD6417750SVBT133	Renesas Electronics	MICROPROCESSOR, RISC	COMMERCIAL EXTENDED	BALL	264	LFBGA	SQUARE	UNSPECIFIED	YES	YES	1.7 V		26		32	1.5,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA264,17X17,32	1.4 V	75 Cel		-20 Cel	TIN SILVER COPPER		BOTTOM		1.4 mm			15 mm			YES		64	34 MHz	20	260	15 mm		CMOS			1.5 V				Microprocessors			.8 mm	FLOATING POINT	S-XBGA-B264	3	Not Qualified	133 rpm	YES	e1
HD6417727BP100C	Renesas Electronics	MICROPROCESSOR, RISC	COMMERCIAL EXTENDED	BALL	240	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.05 V	8	26		32		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA240,19X19,25	1.6 V	75 Cel	6	-20 Cel			BOTTOM		1.4 mm		16384	13 mm			YES		32	50 MHz			13 mm		CMOS		450 mA	1.9 V	4		3				.65 mm	FIXED POINT	S-PBGA-B240	3	Not Qualified	100 rpm	YES
R7S721031VLBG	Renesas Electronics	MICROPROCESSOR, RISC		BALL	233	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	8	26				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA233,17X17,32	1.1 V	85 Cel	8	-40 Cel			BOTTOM		1.9 mm		3145728	15 mm			YES		32	13.33 MHz			15 mm		CMOS		492 mA	1.18 V	16		13				.8 mm	FLOATING POINT	S-PBGA-B233			400 rpm	YES
HD6417727BP160CV	Renesas Electronics	MICROPROCESSOR, RISC	COMMERCIAL EXTENDED	BALL	240	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.05 V	8	26		32	1.9,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA240,19X19,25	1.7 V	75 Cel	6	-20 Cel			BOTTOM		1.4 mm		16384	13 mm			YES		32	66.67 MHz			13 mm		CMOS		650 mA	1.9 V	4		3	Microprocessors			.65 mm	FIXED POINT	S-PBGA-B240		Not Qualified	160 rpm	YES
R9A07G084M04GBA	Renesas Electronics	MICROPROCESSOR, RISC		BALL	121	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V	8	26		32		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA121,11X11,32	1.05 V	125 Cel	11	-40 Cel			BOTTOM		1.4 mm		1572864	10 mm			YES		16	25 MHz			10 mm		CMOS		310 mA	1.1 V	16		9				.8 mm	FLOATING POINT	S-PBGA-B121			400 rpm	YES

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.