MICROPROCESSOR Microprocessors 2,400+

Reset All

Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	No. of Serial I/Os	Sub-Category	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code
MC8640DTHX1250HC	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	1023	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.1 V		32	32		GRID ARRAY		1 V	105 Cel		-40 Cel	Tin/Lead (Sn/Pb)	BOTTOM	2.97 mm		33 mm		YES	32	166.66 MHz	30	245	33 mm	CMOS		1.05 V				1 mm	FLOATING POINT	S-CBGA-B1023	3	Not Qualified	1250 rpm	YES	e0
MCF54453CVP200	NXP Semiconductors	MICROPROCESSOR																													40	260											3
MCF54455VP266	NXP Semiconductors	MICROPROCESSOR																													40	260											3
MPC8313VRAFFB	Freescale Semiconductor	MICROPROCESSOR	OTHER	BALL	516	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V		32	32	1,1.8/2.5,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA516,26X26,40	.95 V	105 Cel		0 Cel	TIN SILVER	BOTTOM	2.55 mm		27 mm	ALSO REQUIRES 3.3V I/O SUPPLY	YES	32	66.67 MHz	40	260	27 mm	CMOS		1 V			Microprocessors	1 mm	FLOATING POINT	S-PBGA-B516	3	Not Qualified	333 rpm	YES	e2
MPC8343VRADDB	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	620	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		32	32	1.2,2.5,3.3	GRID ARRAY	BGA620,28X28,40	1.14 V	105 Cel		0 Cel	TIN SILVER	BOTTOM	2.46 mm		29 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz	40	260	29 mm	CMOS		1.2 V			Microprocessors	1 mm	FLOATING POINT	S-PBGA-B620	3	Not Qualified	266 rpm	YES	e2
MPC8347ECZQAGDB	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	620	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		32	32	1.2,2.5,3.3	GRID ARRAY	BGA620,28X28,40	1.14 V	105 Cel		-40 Cel	TIN LEAD SILVER	BOTTOM	2.46 mm		29 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz	40	260	29 mm	CMOS		1.2 V			Microprocessors	1 mm	FLOATING POINT	S-PBGA-B620	3	Not Qualified	400 rpm	YES	e0
MPC8347EVVAJDB	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	672	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		32	32	1.2,2.5,3.3	GRID ARRAY, LOW PROFILE	BGA672,34X34,40	1.14 V	105 Cel		0 Cel		BOTTOM	1.69 mm		35 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz	40	260	35 mm	CMOS		1.2 V			Microprocessors	1 mm	FLOATING POINT	S-PBGA-B672	3	Not Qualified	533 rpm	YES
MPC8349EZUAJDB	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	672	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		32	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE	BGA672,34X34,40	1.14 V	105 Cel		0 Cel	TIN LEAD	BOTTOM	1.69 mm		35 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz	40	260	35 mm	CMOS		1.2 V			Microprocessors	1 mm	FLOATING POINT	S-PBGA-B672	3	Not Qualified	533 rpm	YES	e0
MPC8377VRAGDA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	689	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		15	32	1,1.8/2.5,2.5/3.3	GRID ARRAY, HEAT SINK/SLUG	BGA689,29X29,40	.95 V	125 Cel	8	0 Cel	TIN SILVER	BOTTOM	2.46 mm		31 mm		YES	64		40	260	31 mm	CMOS	.03 mA	1 V	4		Microprocessors	1 mm	FLOATING POINT	S-PBGA-B689	3	Not Qualified	400 rpm	YES	e2
N80C188-12	Rochester Electronics	MICROPROCESSOR	COMMERCIAL	J BEND	68	QCCJ	SQUARE	PLASTIC/EPOXY	NO	YES	5.5 V		20	16		CHIP CARRIER		4.5 V	70 Cel		0 Cel	TIN LEAD	QUAD	4.572 mm		24.2062 mm	DRAM REFRESH CONTROL UNIT; PROGRAMMABLE INTERRUPT CONTROLLER	NO	8	25 MHz			24.2062 mm	CMOS		5 V				1.27 mm	FIXED POINT	S-PQCC-J68		Not Qualified	12.5 rpm	YES	e0
P1013NXE2LFB	NXP Semiconductors	MICROPROCESSOR	AUTOMOTIVE	BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		0	32		GRID ARRAY		.95 V	125 Cel		-40 Cel	TIN SILVER	BOTTOM	2.46 mm		31 mm		YES	0	133 MHz	40	260	31 mm	CMOS		1 V				1 mm	FLOATING POINT	S-PBGA-B689	3		1067 rpm	YES	e2
T1013NSN7KNA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V		16	64		GRID ARRAY, FINE PITCH	BGA525,23X23,32	.97 V	105 Cel	6	0 Cel		BOTTOM	2.07 mm		19 mm		YES	32				19 mm	CMOS	5 mA	1 V	2	5		.8 mm	FIXED POINT	S-PBGA-B525			1000 rpm	YES
T1023NXE7PQA	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V		16	64		GRID ARRAY, FINE PITCH	BGA525,23X23,32	.97 V	105 Cel	6	-40 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm		19 mm		YES	32		40	260	19 mm	CMOS	5 mA	1 V	2	5		.8 mm	FIXED POINT	S-PBGA-B525	3		1400 rpm	YES	e1
Z84C0006PEG	IXYS Corporation	MICROPROCESSOR	INDUSTRIAL	THROUGH-HOLE	40	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	NO	5.5 V	0	16	8		IN-LINE		4.5 V	100 Cel	2	-40 Cel	MATTE TIN	DUAL	4.75 mm	0	15.24 mm	DRAM REFRESH COUNTER	NO	8	6.17 MHz			52.325 mm	CMOS	30 mA	5 V	0	0		2.54 mm	FIXED POINT	R-PDIP-T40		Not Qualified	6.17 rpm	YES	e3
BX806733104	Intel	MICROPROCESSOR
CM8066002189001	Intel	MICROPROCESSOR		NO LEAD	2011		RECTANGULAR	UNSPECIFIED	YES	YES				64									BOTTOM					NO						CMOS							FIXED POINT	R-XBGA-N2011			1800 rpm	NO
CM8068403358413SR3WX	Intel	MICROPROCESSOR
D8088-2	Rochester Electronics	MICROPROCESSOR	COMMERCIAL	THROUGH-HOLE	40	DIP	RECTANGULAR	CERAMIC, GLASS-SEALED	NO	NO	5.25 V		20	8		IN-LINE		4.75 V	70 Cel		0 Cel	TIN LEAD	DUAL	6.096 mm		15.24 mm		NO	8	8 MHz			52.2605 mm	NMOS		5 V				2.54 mm	FIXED POINT	R-GDIP-T40		Not Qualified	8 rpm	NO	e0
KMPC8347ECVRAGDB	Freescale Semiconductor	MICROPROCESSOR	INDUSTRIAL	BALL	620	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		32	32		GRID ARRAY		1.14 V	105 Cel		-40 Cel	Tin/Silver (Sn/Ag)	BOTTOM	2.46 mm		29 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz	40	260	29 mm	CMOS		1.2 V				1 mm	FLOATING POINT	S-PBGA-B620	3	Not Qualified	400 rpm	YES	e2
LE80537GF0484MSLGFV	Intel	MICROPROCESSOR		BALL	479	BGA	UNSPECIFIED	PLASTIC/EPOXY	YES	YES			0	64		GRID ARRAY							BOTTOM					NO	0					CMOS							FIXED POINT	X-PBGA-B479			2160 rpm	YES
MPC5200VR400B	NXP Semiconductors	MICROPROCESSOR	COMMERCIAL	BALL	272	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.58 V		32	32		GRID ARRAY		1.42 V	70 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	2.65 mm		27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	66 MHz	40	260	27 mm	CMOS		1.5 V				1.27 mm	FLOATING POINT	S-PBGA-B272	3	Not Qualified	400 rpm	YES	e1
MPC5200VR400BR2	NXP Semiconductors	MICROPROCESSOR	COMMERCIAL	BALL	272	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.58 V		13			GRID ARRAY		1.42 V	70 Cel		0 Cel		BOTTOM	2.65 mm		27 mm		YES	32	35 MHz	NOT SPECIFIED	NOT SPECIFIED	27 mm	CMOS		1.5 V				1.27 mm	FLOATING POINT	S-PBGA-B272			400 rpm	YES
MPC8349EVVAJDB	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	672	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		32	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE	BGA672,34X34,40	1.14 V	105 Cel		0 Cel	TIN SILVER	BOTTOM	1.69 mm		35 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz	40	260	35 mm	CMOS		1.2 V			Microprocessors	1 mm	FLOATING POINT	S-PBGA-B672	3	Not Qualified	533 rpm	YES	e2
MPC8349VVAJDB	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	672	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		32	32	1.2,1.8/2.5,2.5/3.3	GRID ARRAY, LOW PROFILE	BGA672,34X34,40	1.14 V	105 Cel		0 Cel	TIN SILVER	BOTTOM	1.69 mm		35 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz	40	260	35 mm	CMOS		1.2 V			Microprocessors	1 mm	FLOATING POINT	S-PBGA-B672	3	Not Qualified	533 rpm	YES	e2
MPC8349VVAJFB	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	672	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		32	32	1.2,1.8/2.5,2.5/3.3	GRID ARRAY, LOW PROFILE	BGA672,34X34,40	1.14 V	105 Cel		0 Cel		BOTTOM	1.69 mm		35 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz	40	260	35 mm	CMOS		1.2 V			Microprocessors	1 mm	FLOATING POINT	S-PBGA-B672	3	Not Qualified	533 rpm	YES
RK80532KE0881M	Intel	MICROPROCESSOR		PIN/PEG	604	PGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	NO	1.463 V		36	32	1.4,3.3	GRID ARRAY	PGA604,25X31,50	1.34 V				TIN LEAD	PERPENDICULAR					YES	64					CMOS					Microprocessors	1.27 mm	FLOATING POINT	S-CPGA-P604		Not Qualified	3200 rpm	YES	e0
S9S08RNA16W2MLCR	NXP Semiconductors	MICROPROCESSOR																				TIN									40	260											3				e3
SB80C188-12	Rochester Electronics	MICROPROCESSOR	COMMERCIAL	GULL WING	80	TFQFP	SQUARE	PLASTIC/EPOXY	NO	YES	5.5 V		20	16		FLATPACK, THIN PROFILE, FINE PITCH		4.5 V	70 Cel		0 Cel	TIN LEAD	QUAD	1.2 mm		12 mm	DRAM REFRESH CONTROL UNIT; PROGRAMMABLE INTERRUPT CONTROLLER	NO	8	25 MHz			12 mm	CMOS		5 V				.5 mm	FIXED POINT	S-PQFP-G80		Not Qualified	12.5 rpm	YES	e0
TN80C188EA-20	Intel	MICROPROCESSOR	INDUSTRIAL	J BEND	68	QCCJ	SQUARE	PLASTIC/EPOXY	NO	YES	5.5 V	0	20	16	5	CHIP CARRIER	LDCC68,1.0SQ	4.5 V	85 Cel	5	-40 Cel	TIN LEAD	QUAD	4.83 mm	0	24.2 mm		NO	8	40 MHz			24.2 mm	CMOS	90 mA	5 V	2	0	Microprocessors	1.27 mm	FIXED POINT	S-PQCC-J68		Not Qualified	20 rpm	YES	e0
TN80C188EB20	Intel	MICROPROCESSOR	INDUSTRIAL	J BEND	84	QCCJ	SQUARE	PLASTIC/EPOXY	NO	YES	5.5 V	0	20	16	5	CHIP CARRIER	LDCC84,1.2SQ	4.5 V	85 Cel	6	-40 Cel	TIN LEAD	QUAD	4.83 mm	0	29.3116 mm	DRAM REFRESH CONTROLLER; 3 PROGRAMMABLE TIMERS; EMULATION HARDWARE	NO	8	40 MHz			29.3116 mm	CMOS	108 mA	5 V	0	2	Microprocessors	1.27 mm	FIXED POINT	S-PQCC-J84		Not Qualified	20 rpm	YES	e0
Z84C0010VEG	IXYS Corporation	MICROPROCESSOR	INDUSTRIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	NO	YES	5.5 V	0	16	8	5	CHIP CARRIER	LDCC44,.7SQ	4.5 V	100 Cel	2	-40 Cel	Matte Tin (Sn)	QUAD	4.57 mm	0	16.5862 mm	DRAM MEMORY REFRESH COUNTER	NO	8	10 MHz	40	260	16.5862 mm	CMOS	50 mA	5 V	0	0	Microprocessors	1.27 mm	FIXED POINT	S-PQCC-J44		Not Qualified	10 rpm	YES	e3
MPC8343ZQADDB	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	620	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		32	32		GRID ARRAY		1.14 V	105 Cel		0 Cel	TIN LEAD	BOTTOM	2.46 mm		29 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz			29 mm	CMOS		1.2 V				1 mm	FLOATING POINT	S-PBGA-B620	3	Not Qualified	266 rpm	YES	e0
TMP68HC000P-10	Toshiba	MICROPROCESSOR	COMMERCIAL	THROUGH-HOLE	64	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	NO	5.25 V	0	23	16		IN-LINE		4.75 V	70 Cel	7	0 Cel	TIN LEAD	DUAL	5.66 mm	0	22.86 mm		NO	16	10 MHz			81.5 mm	CMOS	30 mA	5 V	0	0		2.54 mm	FIXED POINT	R-PDIP-T64		Not Qualified	10 rpm	YES	e0
AT80612002931ABSLBWG	Intel	MICROPROCESSOR		NO LEAD	1366	LGA	RECTANGULAR	PLASTIC/EPOXY		YES				64	0.75/1.35	GRID ARRAY	LGA1366,41X43,40						BOTTOM								NOT SPECIFIED	NOT SPECIFIED		CMOS	100000 mA				Microprocessors	1 mm		R-PBGA-N1366		Not Qualified	1730 rpm
N80C186XL20	Rochester Electronics	MICROPROCESSOR	COMMERCIAL	J BEND	68	QCCJ	SQUARE	PLASTIC/EPOXY	NO	YES	5.5 V		20	16		CHIP CARRIER		4.5 V	70 Cel		0 Cel		QUAD	4.83 mm		24.2316 mm	DRAM REFRESH CONTROLLER; 3 PROGRAMMABLE TIMERS; NUMERIC COPROCESSOR INTERFACE	NO	16	40 MHz	NOT SPECIFIED	NOT SPECIFIED	24.2316 mm	CMOS		5 V				1.27 mm	FIXED POINT	S-PQCC-J68		Not Qualified	20 rpm	YES
MCF54452CVP200	NXP Semiconductors	MICROPROCESSOR																													40	260											3
MPC8313CVRADDC	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		32	32	1,1.8/2.5,3.3	GRID ARRAY	BGA516,26X26,40	.95 V	105 Cel		-40 Cel	TIN SILVER	BOTTOM	2.55 mm		27 mm		YES	32	66.67 MHz	40	260	27 mm	CMOS		1 V			Microprocessors	1 mm	FLOATING POINT	S-PBGA-B516	3	Not Qualified	266 rpm	YES	e2
RH80536GC0332MSL8U6	Intel	MICROPROCESSOR		PIN/PEG	478	SPGA	SQUARE	PLASTIC/EPOXY	YES	NO			28	32	1.3	GRID ARRAY, SHRINK PITCH	PGA478,26X26,50						PERPENDICULAR	4.13 mm		35 mm	ITS ALSO OPERATES AT TYPICAL CORE VOLTAGE 0.988 V AT 600MHZ	YES	64				35 mm	CMOS	21000 mA	1.34 V			Microprocessors	1.27 mm	FLOATING POINT	S-PPGA-P478		Not Qualified	1800 rpm	YES
I5-3470	Intel	MICROPROCESSOR																																CMOS
MCF54454CVP200	NXP Semiconductors	MICROPROCESSOR																													40	260											3
CS80C286-25	Renesas Electronics	MICROPROCESSOR	COMMERCIAL	J BEND	68	QCCJ	SQUARE	PLASTIC/EPOXY	NO	YES	5.25 V		24			CHIP CARRIER		4.75 V	70 Cel		0 Cel		QUAD	4.57 mm		24.23 mm		NO	16				24.23 mm	CMOS		5 V				1.27 mm	FIXED POINT	S-PQCC-J68			20 rpm	YES
MC68000P10	Motorola	MICROPROCESSOR	COMMERCIAL	THROUGH-HOLE	64	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	NO	5.25 V	0	23	32		IN-LINE		4.75 V	70 Cel	7	0 Cel	TIN LEAD	DUAL	5.84 mm	0	22.86 mm		NO	16	10 MHz			81.535 mm	CMOS	30 mA	5 V	0	0		2.54 mm	FIXED POINT	R-PDIP-T64		Not Qualified	10 rpm	NO	e0
MCF54452VP266	NXP Semiconductors	MICROPROCESSOR																													40	260											3
CL8068404165200SRFEH	Intel	MICROPROCESSOR		BALL	1440		RECTANGULAR	PLASTIC/EPOXY	YES	YES				64			BGA1440(UNSPEC)						BOTTOM					NO						CMOS							FIXED POINT	R-PBGA-B1440			4100 rpm	NO
CM8067702868416SR339	Intel	MICROPROCESSOR
LH8066803102701SREKA	Intel	MICROPROCESSOR		BALL	1296		RECTANGULAR	PLASTIC/EPOXY	YES	YES				64					85 Cel		-40 Cel		BOTTOM					NO						CMOS							FIXED POINT	R-PBGA-B1296			1800 rpm	NO
MC6809EP	Motorola	MICROPROCESSOR	COMMERCIAL	THROUGH-HOLE	40	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	NO	5.25 V	0	16	8	5	IN-LINE	DIP40,.6	4.75 V	70 Cel	3	0 Cel	TIN LEAD	DUAL	5.08 mm	0	15.24 mm		NO	8	1 MHz			52.07 mm	NMOS		5 V	0	0	Microprocessors	2.54 mm	FIXED POINT	R-PDIP-T40		Not Qualified	1 rpm	NO	e0
AF82801JIRSLB8S	Intel	MICROPROCESSOR		BALL	676	BGA	SQUARE	PLASTIC/EPOXY		YES					1.1,1.5,3.3,5	GRID ARRAY	BGA676,30X30,40						BOTTOM											CMOS					Other uPs/uCs/Peripheral ICs	1 mm		S-PBGA-B676		Not Qualified

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.