Part | RoHS | Manufacturer | Peripheral IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Integrated Cache | Surface Mount | Maximum Supply Voltage | On Chip Data RAM Width | Screening Level | Address Bus Width | DAC Channels | Bit Size | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Minimum Supply Voltage | Maximum Operating Temperature | CPU Family | No. of External Interrupts | Minimum Operating Temperature | Terminal Finish | ADC Channels | Terminal Position | DMA Channels | Maximum Seated Height | ROM Words | RAM Words | Width | Data EEPROM Size | Additional Features | Boundary Scan | Peripherals | External Data Bus Width | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Total Dose (V) | RAM Bytes | Technology | Analog To Digital Convertors | Maximum Supply Current | Nominal Supply Voltage | No. of DMA Channels | PWM Channels | No. of Serial I/Os | Sub-Category | Connectivity | ROM Programmability | Bus Compatibility | Terminal Pitch | Format | JESD-30 Code | Moisture Sensitivity Level (MSL) | Qualification | Speed | Low Power Mode | JESD-609 Code | On Chip Program ROM Width | No. of I/O Lines |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Intel |
MICROPROCESSOR |
INDUSTRIAL |
J BEND |
68 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
5.5 V |
0 |
20 |
16 |
3/5 |
CHIP CARRIER |
LDCC68,1.0SQ |
2.7 V |
85 Cel |
5 |
-40 Cel |
TIN LEAD |
QUAD |
4.83 mm |
0 |
24.2 mm |
NO |
16 |
26 MHz |
24.2 mm |
CMOS |
65 mA |
5 V |
2 |
0 |
Microprocessors |
1.27 mm |
FIXED POINT |
S-PQCC-J68 |
Not Qualified |
13 rpm |
YES |
e0 |
|||||||||||||||||||||||
Atmel |
MICROPROCESSOR |
INDUSTRIAL |
THROUGH-HOLE |
64 |
DIP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
NO |
NO |
5.5 V |
24 |
32 |
5 |
IN-LINE |
DIP64,.9 |
4.5 V |
85 Cel |
-40 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
4.83 mm |
22.86 mm |
NO |
16 |
8 MHz |
81.28 mm |
HCMOS |
42 mA |
5 V |
Microprocessors |
2.54 mm |
FIXED POINT |
R-CDIP-T64 |
Not Qualified |
8 rpm |
NO |
e0 |
||||||||||||||||||||||||||||
Rochester Electronics |
MICROPROCESSOR |
INDUSTRIAL |
GULL WING |
80 |
QFP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
YES |
5.5 V |
20 |
16 |
FLATPACK |
4.5 V |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
3.15 mm |
14 mm |
DRAM REFRESH CONTROLLER; 3 PROGRAMMABLE TIMERS; EMULATION HARDWARE |
NO |
16 |
26 MHz |
20 mm |
CMOS |
5 V |
.8 mm |
FIXED POINT |
R-PQFP-G80 |
Not Qualified |
13 rpm |
YES |
e0 |
|||||||||||||||||||||||||||||||
Intel |
MICROPROCESSOR |
BALL |
592 |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
64 |
BOTTOM |
NO |
CMOS |
FIXED POINT |
S-PBGA-B592 |
1830 rpm |
NO |
||||||||||||||||||||||||||||||||||||||||||||||||||
Intersil |
MICROPROCESSOR |
COMMERCIAL |
J BEND |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
5.5 V |
20 |
16 |
5 |
CHIP CARRIER |
LDCC44,.7SQ |
4.5 V |
70 Cel |
0 Cel |
TIN LEAD |
QUAD |
4.57 mm |
16.585 mm |
NO |
8 |
5 MHz |
16.585 mm |
CMOS |
50.5 mA |
5 V |
Microprocessors |
1.27 mm |
FIXED POINT |
S-PQCC-J44 |
1 |
Not Qualified |
5 rpm |
YES |
e0 |
|||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR |
INDUSTRIAL |
BALL |
516 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.05 V |
32 |
32 |
1,1.8/2.5,3.3 |
GRID ARRAY, HEAT SINK/SLUG |
BGA516,26X26,40 |
.95 V |
105 Cel |
-40 Cel |
NICKEL GOLD |
BOTTOM |
2.55 mm |
27 mm |
ALSO REQUIRES 3.3V I/O SUPPLY |
YES |
32 |
66.67 MHz |
40 |
260 |
27 mm |
CMOS |
1 V |
Microprocessors |
1 mm |
FLOATING POINT |
S-PBGA-B516 |
3 |
Not Qualified |
333 rpm |
YES |
e4 |
||||||||||||||||||||||||
|
Digi International |
MICROPROCESSOR |
OTHER |
GULL WING |
128 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
3.6 V |
20 |
FLATPACK, LOW PROFILE, FINE PITCH |
1.8 V |
85 Cel |
-55 Cel |
QUAD |
1.6 mm |
14 mm |
NO |
8 |
14 mm |
CMOS |
3.3 V |
.4 mm |
FIXED POINT |
S-PQFP-G128 |
55 rpm |
YES |
||||||||||||||||||||||||||||||||||||
|
Analog Devices |
MICROPROCESSOR |
COMMERCIAL |
BALL |
349 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.32 V |
32 |
1.8/3.3 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA349,22X22,32 |
1.19 V |
70 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1.5 mm |
19 mm |
YES |
60 MHz |
30 |
260 |
19 mm |
CMOS |
1.25 V |
Microprocessors |
.8 mm |
FIXED POINT |
S-PBGA-B349 |
3 |
Not Qualified |
400 rpm |
YES |
e1 |
|||||||||||||||||||||||||||
|
Analog Devices |
MICROPROCESSOR |
COMMERCIAL |
BALL |
349 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.32 V |
32 |
1.8/3.3 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA349,22X22,32 |
1.19 V |
70 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1.5 mm |
19 mm |
YES |
60 MHz |
19 mm |
CMOS |
1.25 V |
Microprocessors |
.8 mm |
FIXED POINT |
S-PBGA-B349 |
3 |
Not Qualified |
500 rpm |
YES |
e1 |
|||||||||||||||||||||||||||||
Advanced Micro Devices |
MICROPROCESSOR |
INDUSTRIAL |
GULL WING |
208 |
FQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
3.6 V |
0 |
32 |
32 |
3.3 |
FLATPACK, FINE PITCH |
QFP208,1.2SQ,20 |
3 V |
100 Cel |
3 |
-40 Cel |
TIN LEAD |
QUAD |
3.7 mm |
0 |
28 mm |
YES |
32 |
33.33 MHz |
28 mm |
CMOS |
700 mA |
3.3 V |
0 |
0 |
Microprocessors |
.5 mm |
FLOATING POINT |
S-PQFP-G208 |
Not Qualified |
100 rpm |
YES |
e0 |
|||||||||||||||||||||||
Advanced Micro Devices |
MICROPROCESSOR |
OTHER |
GULL WING |
208 |
FQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
3.6 V |
0 |
32 |
32 |
3.3 |
FLATPACK, FINE PITCH |
QFP208,1.2SQ,20 |
3 V |
85 Cel |
3 |
0 Cel |
TIN LEAD |
QUAD |
3.7 mm |
0 |
28 mm |
YES |
32 |
33.33 MHz |
28 mm |
CMOS |
931 mA |
3.3 V |
0 |
0 |
Microprocessors |
.5 mm |
FLOATING POINT |
S-PQFP-G208 |
Not Qualified |
133 rpm |
YES |
e0 |
|||||||||||||||||||||||
|
Intel |
MICROPROCESSOR |
NO LEAD |
1366 |
LGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
64 |
0.75/1.35 |
GRID ARRAY |
LGA1366,41X43,40 |
BOTTOM |
NOT SPECIFIED |
NOT SPECIFIED |
CMOS |
150000 mA |
Microprocessors |
1 mm |
R-PBGA-N1366 |
Not Qualified |
2400 rpm |
|||||||||||||||||||||||||||||||||||||||||||
Intersil |
MICROPROCESSOR |
COMMERCIAL |
THROUGH-HOLE |
40 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
NO |
5.5 V |
20 |
16 |
5 |
IN-LINE |
DIP40,.6 |
4.5 V |
70 Cel |
0 Cel |
TIN LEAD |
DUAL |
5.72 mm |
15.24 mm |
NO |
8 |
5 MHz |
CMOS |
50.5 mA |
5 V |
Microprocessors |
2.54 mm |
FIXED POINT |
R-GDIP-T40 |
Not Qualified |
5 rpm |
YES |
e0 |
|||||||||||||||||||||||||||||
Intersil |
MICROPROCESSOR |
INDUSTRIAL |
THROUGH-HOLE |
40 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
NO |
6.5 V |
8 |
8 |
5 |
IN-LINE |
DIP40,.6 |
4 V |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
6.35 mm |
15.24 mm |
NO |
8 |
3.2 MHz |
51.75 mm |
CMOS |
4 mA |
5 V |
Microprocessors |
2.54 mm |
FIXED POINT |
R-PDIP-T40 |
Not Qualified |
3.2 rpm |
NO |
e0 |
||||||||||||||||||||||||||||
Intersil |
MICROPROCESSOR |
INDUSTRIAL |
THROUGH-HOLE |
40 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
NO |
6.5 V |
8 |
8 |
5/10 |
IN-LINE |
DIP40,.6 |
4 V |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
6.35 mm |
15.24 mm |
NO |
8 |
3.2 MHz |
51.75 mm |
CMOS |
4 mA |
10 V |
Microprocessors |
2.54 mm |
FIXED POINT |
R-PDIP-T40 |
Not Qualified |
3.2 rpm |
NO |
e0 |
||||||||||||||||||||||||||||
Intel |
MICROPROCESSOR |
NO LEAD |
2011 |
LGA |
RECTANGULAR |
UNSPECIFIED |
YES |
YES |
64 |
GRID ARRAY |
BOTTOM |
NO |
CMOS |
FIXED POINT |
R-XBGA-N2011 |
2100 rpm |
NO |
||||||||||||||||||||||||||||||||||||||||||||||||
Intersil |
MICROPROCESSOR |
COMMERCIAL |
THROUGH-HOLE |
40 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
NO |
5.5 V |
20 |
16 |
5 |
IN-LINE |
DIP40,.6 |
4.5 V |
70 Cel |
0 Cel |
TIN LEAD |
DUAL |
6.35 mm |
15.24 mm |
NO |
8 |
8 MHz |
51.75 mm |
CMOS |
80.5 mA |
5 V |
Microprocessors |
2.54 mm |
FIXED POINT |
R-PDIP-T40 |
Not Qualified |
8 rpm |
YES |
e0 |
||||||||||||||||||||||||||||
|
Intel |
MICROPROCESSOR |
INDUSTRIAL |
BALL |
676 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.15 V |
32 |
32 |
GRID ARRAY, FINE PITCH |
.75 V |
85 Cel |
-40 Cel |
BOTTOM |
2.35 mm |
22 mm |
NO |
32 |
14.318 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
22 mm |
CMOS |
1.05 V |
.8 mm |
FLOATING POINT |
S-PBGA-B676 |
1300 rpm |
YES |
||||||||||||||||||||||||||||||||
Intersil |
MICROPROCESSOR |
INDUSTRIAL |
J BEND |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
5.5 V |
20 |
16 |
5 |
CHIP CARRIER |
LDCC44,.7SQ |
4.5 V |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
4.57 mm |
16.585 mm |
NO |
8 |
5 MHz |
16.585 mm |
CMOS |
50.5 mA |
5 V |
Microprocessors |
1.27 mm |
FIXED POINT |
S-PQCC-J44 |
Not Qualified |
5 rpm |
YES |
e0 |
||||||||||||||||||||||||||||
Rochester Electronics |
MICROPROCESSOR |
INDUSTRIAL |
GULL WING |
132 |
QFP |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
5.5 V |
26 |
32 |
FLATPACK |
4.5 V |
117 Cel |
-40 Cel |
QUAD |
4.57 mm |
24.13 mm |
YES |
16 |
66 MHz |
24.13 mm |
CMOS |
5 V |
.635 mm |
FIXED POINT |
S-PQFP-G132 |
33 rpm |
YES |
|||||||||||||||||||||||||||||||||||
Motorola |
MICROPROCESSOR |
COMMERCIAL |
J BEND |
68 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
5.25 V |
0 |
23 |
32 |
5 |
CHIP CARRIER |
LDCC68,1.0SQ |
4.75 V |
70 Cel |
7 |
0 Cel |
TIN LEAD |
QUAD |
0 |
NO |
16 |
8 MHz |
CMOS |
25 mA |
5 V |
0 |
0 |
Microprocessors |
1.27 mm |
FIXED POINT |
S-PQCC-J68 |
Not Qualified |
8 rpm |
NO |
e0 |
||||||||||||||||||||||||||
Motorola |
MICROPROCESSOR |
COMMERCIAL |
THROUGH-HOLE |
64 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
NO |
5.25 V |
0 |
23 |
32 |
IN-LINE |
4.75 V |
70 Cel |
7 |
0 Cel |
TIN LEAD |
DUAL |
5.84 mm |
0 |
22.86 mm |
NO |
16 |
10 MHz |
81.535 mm |
CMOS |
30 mA |
5 V |
0 |
0 |
2.54 mm |
FIXED POINT |
R-PDIP-T64 |
Not Qualified |
10 rpm |
NO |
e0 |
||||||||||||||||||||||||||
Motorola |
MICROPROCESSOR |
COMMERCIAL |
PIN/PEG |
68 |
PGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
NO |
NO |
5.25 V |
0 |
23 |
32 |
GRID ARRAY |
PGA68,10X10 |
4.75 V |
70 Cel |
7 |
0 Cel |
TIN LEAD |
PERPENDICULAR |
5.16 mm |
0 |
26.92 mm |
NO |
16 |
10 MHz |
26.92 mm |
CMOS |
30 mA |
5 V |
0 |
0 |
Microprocessors |
2.54 mm |
FIXED POINT |
S-CPGA-P68 |
Not Qualified |
10 rpm |
NO |
e0 |
||||||||||||||||||||||||
Motorola |
MICROPROCESSOR |
COMMERCIAL |
THROUGH-HOLE |
40 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
NO |
5.25 V |
0 |
16 |
8 |
5 |
IN-LINE |
DIP40,.6 |
4.75 V |
70 Cel |
3 |
0 Cel |
TIN LEAD |
DUAL |
5.08 mm |
0 |
15.24 mm |
NO |
8 |
4 MHz |
52.07 mm |
NMOS |
5 V |
0 |
0 |
Microprocessors |
2.54 mm |
FIXED POINT |
R-PDIP-T40 |
Not Qualified |
1 rpm |
NO |
e0 |
||||||||||||||||||||||||
Motorola |
MICROPROCESSOR |
INDUSTRIAL |
GULL WING |
64 |
QFP |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
24 |
32 |
FLATPACK |
85 Cel |
-40 Cel |
QUAD |
2.45 mm |
14 mm |
CAN ALSO OPERATE WITH 5V SUPPLY |
16 |
10 MHz |
14 mm |
CMOS |
3.3 V |
.8 mm |
FIXED POINT |
S-PQFP-G64 |
Not Qualified |
10 rpm |
YES |
||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR |
INDUSTRIAL |
BALL |
196 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.32 V |
0 |
GRID ARRAY |
1.14 V |
85 Cel |
-40 Cel |
BOTTOM |
YES |
0 |
CMOS |
1.2 V |
FIXED POINT |
S-PBGA-B196 |
250 rpm |
YES |
|||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR |
COMMERCIAL |
BALL |
256 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.65 V |
32 |
32 |
1.5,1.8,2.5,3.3 |
GRID ARRAY, LOW PROFILE |
BGA256,16X16,40 |
1.35 V |
70 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1.6 mm |
17 mm |
YES |
32 |
60 MHz |
40 |
260 |
17 mm |
CMOS |
1.5 V |
Microprocessors |
1 mm |
FIXED POINT |
S-PBGA-B256 |
3 |
Not Qualified |
240 rpm |
YES |
e1 |
|||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR |
BALL |
388 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.58 V |
8 |
32 |
32 |
GRID ARRAY |
BGA388,26X26,40 |
1.43 V |
70 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
2.55 mm |
32768 |
27 mm |
YES |
32 |
66.67 MHz |
40 |
260 |
27 mm |
CMOS |
1.5 V |
16 |
4 |
1 mm |
FLOATING POINT |
S-PBGA-B388 |
3 |
YES |
e1 |
||||||||||||||||||||||||||
Rochester Electronics |
MICROPROCESSOR |
MILITARY |
PIN/PEG |
68 |
PGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
NO |
NO |
5.5 V |
20 |
16 |
GRID ARRAY |
4.5 V |
125 Cel |
-55 Cel |
TIN LEAD |
PERPENDICULAR |
4.57 mm |
29.464 mm |
NO |
16 |
40 MHz |
29.464 mm |
CMOS |
5 V |
2.54 mm |
FIXED POINT |
S-CPGA-P68 |
Not Qualified |
20 rpm |
YES |
e0 |
||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR |
INDUSTRIAL |
BALL |
272 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.58 V |
13 |
GRID ARRAY, HEAT SINK/SLUG |
1.42 V |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
2.65 mm |
27 mm |
YES |
32 |
35 MHz |
40 |
260 |
27 mm |
CMOS |
1.5 V |
1.27 mm |
FIXED POINT |
S-PBGA-B272 |
3 |
400 rpm |
YES |
e1 |
||||||||||||||||||||||||||||||
|
Freescale Semiconductor |
MICROPROCESSOR |
OTHER |
BALL |
516 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.5 V |
32 |
32 |
1,1.8/2.5,3.3 |
GRID ARRAY, HEAT SINK/SLUG |
BGA516,26X26,40 |
.95 V |
105 Cel |
0 Cel |
TIN SILVER |
BOTTOM |
2.55 mm |
27 mm |
ALSO REQUIRES 3.3V I/O SUPPLY |
YES |
32 |
66.67 MHz |
40 |
260 |
27 mm |
CMOS |
1 V |
Microprocessors |
1 mm |
FLOATING POINT |
S-PBGA-B516 |
3 |
Not Qualified |
333 rpm |
YES |
e2 |
||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR |
INDUSTRIAL |
BALL |
620 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.26 V |
32 |
32 |
1.2,2.5,3.3 |
GRID ARRAY |
BGA620,28X28,40 |
1.14 V |
105 Cel |
-40 Cel |
TIN LEAD SILVER |
BOTTOM |
2.46 mm |
29 mm |
ALSO REQUIRES 2.5V AND 3.3V SUPPLY |
YES |
32 |
66 MHz |
40 |
260 |
29 mm |
CMOS |
1.2 V |
Microprocessors |
1 mm |
FLOATING POINT |
S-PBGA-B620 |
3 |
Not Qualified |
266 rpm |
YES |
e0 |
|||||||||||||||||||||||||
Rochester Electronics |
MICROPROCESSOR |
COMMERCIAL |
J BEND |
68 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
5.5 V |
20 |
16 |
CHIP CARRIER |
4.5 V |
70 Cel |
0 Cel |
TIN LEAD |
QUAD |
4.572 mm |
24.2062 mm |
DRAM REFRESH CONTROL UNIT; PROGRAMMABLE INTERRUPT CONTROLLER |
NO |
16 |
32 MHz |
24.2062 mm |
CMOS |
5 V |
1.27 mm |
FIXED POINT |
S-PQCC-J68 |
Not Qualified |
16 rpm |
YES |
e0 |
|||||||||||||||||||||||||||||||
Rochester Electronics |
MICROPROCESSOR |
COMMERCIAL |
J BEND |
68 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
5.5 V |
20 |
16 |
CHIP CARRIER |
4.5 V |
70 Cel |
0 Cel |
TIN LEAD |
QUAD |
4.572 mm |
24.2062 mm |
DRAM REFRESH CONTROL UNIT; PROGRAMMABLE INTERRUPT CONTROLLER |
NO |
8 |
40 MHz |
24.2062 mm |
CMOS |
5 V |
1.27 mm |
FIXED POINT |
S-PQCC-J68 |
Not Qualified |
20 rpm |
YES |
e0 |
|||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR |
AUTOMOTIVE |
GULL WING |
32 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
5.5 V |
8 |
0 |
8 |
FLATPACK, LOW PROFILE |
QFP32,.35SQ,32 |
2.7 V |
125 Cel |
12 |
-40 Cel |
MATTE TIN |
QUAD |
1.6 mm |
4096 |
7 mm |
NO |
0 |
20 MHz |
40 |
260 |
7 mm |
CMOS |
14.8 mA |
3 V |
2 |
.8 mm |
FIXED POINT |
S-PQFP-G32 |
3 |
20 rpm |
YES |
e3 |
|||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR |
BALL |
624 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.5 V |
16 |
64 |
GRID ARRAY, HEAT SINK/SLUG |
1.35 V |
BOTTOM |
1.6 mm |
21 mm |
YES |
64 |
24 MHz |
21 mm |
CMOS |
.8 mm |
FIXED POINT |
S-PBGA-B624 |
1000 rpm |
YES |
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|
IXYS Corporation |
MICROPROCESSOR |
COMMERCIAL |
GULL WING |
80 |
QFP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
YES |
20 |
8 |
FLATPACK |
70 Cel |
0 Cel |
MATTE TIN |
QUAD |
3.1 mm |
14 mm |
DYNAMIC REFRESH CONTROL; 1M BYTE PHYSICAL MEMORY |
NO |
8 |
20 mm |
CMOS |
60 mA |
5 V |
.8 mm |
FIXED POINT |
R-PQFP-G80 |
Not Qualified |
10 rpm |
YES |
e3 |
||||||||||||||||||||||||||||||||
Texas Instruments |
MICROPROCESSOR |
COMMERCIAL |
PIN/PEG |
68 |
PGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
NO |
NO |
5.25 V |
0 |
24 |
32 |
GRID ARRAY |
PGA68,11X11 |
4.75 V |
70 Cel |
2 |
0 Cel |
PERPENDICULAR |
0 |
NO |
32 |
10 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
NMOS |
300 mA |
5 V |
0 |
0 |
Microprocessors |
2.54 mm |
FIXED POINT |
S-CPGA-P68 |
Not Qualified |
10 rpm |
NO |
|||||||||||||||||||||||||||
Texas Instruments |
MICROPROCESSOR |
BALL |
684 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
15 |
32 |
GRID ARRAY, FINE PITCH |
BOTTOM |
3.06 mm |
23 mm |
YES |
32 |
30 MHz |
23 mm |
CMOS |
.8 mm |
FLOATING POINT |
S-PBGA-B684 |
Not Qualified |
1000 rpm |
YES |
||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
MICROPROCESSOR |
BALL |
684 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
15 |
32 |
GRID ARRAY, FINE PITCH |
BOTTOM |
3.06 mm |
23 mm |
YES |
32 |
30 MHz |
23 mm |
CMOS |
.8 mm |
FLOATING POINT |
S-PBGA-B684 |
Not Qualified |
1000 rpm |
YES |
||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
MICROPROCESSOR |
MILITARY |
UNSPECIFIED |
CERAMIC, METAL-SEALED COFIRED |
NO |
5.5 V |
16 |
8 |
4.5 V |
125 Cel |
-55 Cel |
NO |
8 |
CMOS |
5 V |
FIXED POINT |
4 rpm |
YES |
|||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
MICROPROCESSOR |
BALL |
515 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.33 V |
15 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
1.21 V |
BOTTOM |
1 mm |
14 mm |
YES |
32 |
38.4 MHz |
14 mm |
CMOS |
1.27 V |
.65 mm |
FLOATING POINT |
S-PBGA-B515 |
Not Qualified |
800 rpm |
YES |
||||||||||||||||||||||||||||||||||||||
Texas Instruments |
MICROPROCESSOR |
MILITARY |
THROUGH-HOLE |
64 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
MIL-STD-883 Class B (Modified) |
15 |
NO |
16 |
IN-LINE |
DIP64,.9 |
125 Cel |
-55 Cel |
NO |
DUAL |
5.72 mm |
22.86 mm |
16 |
4.4 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
80.285 mm |
BIPOLAR |
NO |
Microprocessors |
2.54 mm |
R-GDIP-T64 |
Not Qualified |
4.4 rpm |
|||||||||||||||||||||||||||||||||
Texas Instruments |
MICROPROCESSOR |
BALL |
423 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.33 V |
15 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
1.21 V |
BOTTOM |
1.4 mm |
16 mm |
YES |
32 |
38.4 MHz |
16 mm |
CMOS |
1.27 V |
.65 mm |
FLOATING POINT |
S-PBGA-B423 |
Not Qualified |
800 rpm |
YES |
||||||||||||||||||||||||||||||||||||||
Texas Instruments |
MICROPROCESSOR |
PIN/PEG |
168 |
PGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
NO |
0 |
32 |
32 |
3.45 |
GRID ARRAY |
PGA168,17X17 |
3 |
PERPENDICULAR |
0 |
NO |
32 |
66 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
CMOS |
850 mA |
3.45 V |
0 |
0 |
Microprocessors |
2.54 mm |
FLOATING POINT |
S-CPGA-P168 |
Not Qualified |
66 rpm |
YES |
|||||||||||||||||||||||||||||||
Texas Instruments |
MICROPROCESSOR |
AUTOMOTIVE |
THROUGH-HOLE |
40 |
DIP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
NO |
NO |
5.25 V |
38535Q/M;38534H;883B |
25 |
32 |
+-5,12 |
GRID ARRAY |
DIP40,.6 |
4.75 V |
125 Cel |
-40 Cel |
PERPENDICULAR |
4.57 mm |
44.7 mm |
YES |
16 |
44.7 mm |
CMOS |
5 V |
Microprocessors |
2.54 mm |
FIXED POINT |
R-XDIP-T40 |
Not Qualified |
25 rpm |
||||||||||||||||||||||||||||||||
Texas Instruments |
MICROPROCESSOR |
BALL |
684 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
15 |
32 |
GRID ARRAY, FINE PITCH |
BOTTOM |
3.06 mm |
23 mm |
YES |
32 |
30 MHz |
23 mm |
CMOS |
.8 mm |
FLOATING POINT |
S-PBGA-B684 |
Not Qualified |
800 rpm |
YES |
||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
MICROPROCESSOR |
COMMERCIAL |
NO LEAD |
68 |
QCCN |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
NO |
YES |
5.25 V |
0 |
24 |
32 |
CHIP CARRIER |
LCC68,.95SQ |
4.75 V |
70 Cel |
2 |
0 Cel |
QUAD |
0 |
NO |
32 |
10 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
NMOS |
300 mA |
5 V |
0 |
0 |
Microprocessors |
1.27 mm |
FIXED POINT |
S-CQCC-N68 |
Not Qualified |
10 rpm |
NO |
A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.
Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.
Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.
One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.