MICROPROCESSOR Microprocessors 2,400+

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Screening Level	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	No. of Serial I/Os	Sub-Category	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code
T1023NSE7PQA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V			16	64		GRID ARRAY, FINE PITCH	BGA525,23X23,32	.97 V	105 Cel	6	0 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm		19 mm		YES	32		40	260	19 mm	CMOS	5 mA	1 V	2	5		.8 mm	FIXED POINT	S-PBGA-B525	3		1400 rpm	YES	e1
ADSP-BF607BBCZ-5	Analog Devices	MICROPROCESSOR	INDUSTRIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V				32	1.8/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA349,22X22,32	1.19 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.5 mm		19 mm		YES		60 MHz			19 mm	CMOS		1.25 V			Microprocessors	.8 mm	FIXED POINT	S-PBGA-B349	3	Not Qualified	500 rpm	YES	e1
MCF54451CVM180	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.65 V			32	32	1.5,1.8,2.5,3.3	GRID ARRAY, LOW PROFILE	BGA256,16X16,40	1.35 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		17 mm		YES	32	60 MHz	40	260	17 mm	CMOS		1.5 V			Microprocessors	1 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	180 rpm	YES	e1
MPC8347VVAJFB	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	672	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V			32	32	1.2	GRID ARRAY, LOW PROFILE	BGA672,34X34,40	1.14 V	105 Cel		0 Cel	TIN SILVER	BOTTOM	1.69 mm		35 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz	40	260	35 mm	CMOS		1.2 V			Microprocessors	1 mm	FLOATING POINT	S-PBGA-B672	3	Not Qualified	533 rpm	YES	e2
MPC8540VT833LB	Freescale Semiconductor	MICROPROCESSOR	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V			64	32	1.2,2.5/3.3	GRID ARRAY	BGA783,28X28,40	1.14 V	105 Cel		0 Cel	Tin/Silver (Sn/Ag)	BOTTOM	3.85 mm		29 mm		YES	64	166 MHz	40	260	29 mm	CMOS		1.2 V			Microprocessors	1 mm	FIXED POINT	S-PBGA-B783	3	Not Qualified	667 rpm	YES	e2
XAM3517AZER	Texas Instruments	MICROPROCESSOR		BALL	484	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.248 V			16			GRID ARRAY, HEAT SINK/SLUG		1.152 V				TIN SILVER COPPER	BOTTOM	2.48 mm		23 mm		YES	16	26 MHz			23 mm	CMOS		1.2 V				1 mm	FLOATING POINT	S-PBGA-B484	3	Not Qualified	600 rpm	YES	e1
MIMXRT1061XVN5B	NXP Semiconductors	MICROPROCESSOR																														40	260											3
T1023NXE7MQA	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V			16	64		GRID ARRAY, FINE PITCH	BGA525,23X23,32	.97 V	105 Cel	6	-40 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm		19 mm		YES	32		40	260	19 mm	CMOS	5 mA	1 V	2	5		.8 mm	FIXED POINT	S-PBGA-B525	3		1200 rpm	YES	e1
MC68SEC000CFU20	Motorola	MICROPROCESSOR	INDUSTRIAL	GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	NO	YES				24	32		FLATPACK			85 Cel		-40 Cel		QUAD	2.45 mm		14 mm	CAN ALSO OPERATE WITH 5V SUPPLY		16	20 MHz			14 mm	CMOS		3.3 V				.8 mm	FIXED POINT	S-PQFP-G64		Not Qualified	20 rpm	YES
MC9328MXSVP10	NXP Semiconductors	MICROPROCESSOR	COMMERCIAL	BALL	225	LFBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.9 V			25	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.7 V	70 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		13 mm		YES	32	16 MHz	40	260	13 mm	CMOS		1.8 V				.8 mm	FIXED POINT	S-PBGA-B225	3	Not Qualified	100 rpm	YES	e1
MPC8343CVRAGDB	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	620	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V			32	32	1.2,2.5,3.3	GRID ARRAY	BGA620,28X28,40	1.14 V	105 Cel		-40 Cel	TIN SILVER	BOTTOM	2.46 mm		29 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz	40	260	29 mm	CMOS		1.2 V			Microprocessors	1 mm	FLOATING POINT	S-PBGA-B620	3	Not Qualified	400 rpm	YES	e2
14305R-2000	Dialog Semiconductor	MICROPROCESSOR	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	NO	YES	3.6 V			0			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		3 V	85 Cel		-40 Cel		QUAD	.9 mm		7 mm		YES	0	10 MHz		260	7 mm	CMOS		3.3 V				.5 mm	FIXED POINT	S-XQCC-N48			80 rpm	NO
MPC8347ECVRAGDB	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	620	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V			32	32	1.2,2.5,3.3	GRID ARRAY	BGA620,28X28,40	1.14 V	105 Cel		-40 Cel	TIN SILVER	BOTTOM	2.46 mm		29 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz	40	260	29 mm	CMOS		1.2 V			Microprocessors	1 mm	FLOATING POINT	S-PBGA-B620	3	Not Qualified	400 rpm	YES	e2
Z84C0006VEG	IXYS Corporation	MICROPROCESSOR	INDUSTRIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	NO	YES	5.5 V	0		16	8	5	CHIP CARRIER	LDCC44,.7SQ	4.5 V	100 Cel	2	-40 Cel	Matte Tin (Sn)	QUAD	4.57 mm	0	16.5862 mm	DRAM MEMORY REFRESH COUNTER	NO	8	6.17 MHz	40	260	16.5862 mm	CMOS	30 mA	5 V	0	0	Microprocessors	1.27 mm	FIXED POINT	S-PQCC-J44		Not Qualified	6.17 rpm	YES	e3
MPC8544CVTALF	Freescale Semiconductor	MICROPROCESSOR		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V			0	32		GRID ARRAY, HEAT SINK/SLUG		.95 V				TIN SILVER	BOTTOM	2.8 mm		29 mm		YES	0	133 MHz	40	260	29 mm	CMOS		1 V				1 mm	FLOATING POINT	S-PBGA-B783	3		667 rpm	YES	e2
MPC8544CVTAQG	Freescale Semiconductor	MICROPROCESSOR		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V			0	32		GRID ARRAY, HEAT SINK/SLUG		.95 V				TIN SILVER	BOTTOM	2.8 mm		29 mm		YES	0	133 MHz	40	260	29 mm	CMOS		1 V				1 mm	FLOATING POINT	S-PBGA-B783	3		1000 rpm	YES	e2
SPC5200CBV400BR2	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	272	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.58 V		AEC-Q100	32	32	1.5,3.3	GRID ARRAY	BGA272,20X20,50	1.42 V	85 Cel		-40 Cel	TIN LEAD SILVER	BOTTOM	2.65 mm		27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	66 MHz	30	245	27 mm	CMOS		1.5 V			Microprocessors	1.27 mm	FLOATING POINT	S-PBGA-B272	3	Not Qualified	400 rpm	YES	e0
Z8038018FSC	IXYS Corporation	MICROPROCESSOR	COMMERCIAL	GULL WING	100	QFP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	5.25 V	0		32	32	5	FLATPACK	QFP100,.7X.9	4.75 V	70 Cel	5	0 Cel	TIN LEAD	QUAD	3.1 mm	0	14 mm	DYNAMIC BUS SIZING; DRAM REFRESH CONTROLLER	NO	16	18 MHz		240	20 mm	CMOS		5 V	0	0	Microprocessors	.65 mm	FIXED POINT	R-PQFP-G100		Not Qualified	18 rpm	YES	e0
MC9328MXSVP10R2	NXP Semiconductors	MICROPROCESSOR	COMMERCIAL	BALL	225	LFBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.9 V			25	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.7 V	70 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		13 mm		YES	32	16 MHz	40	260	13 mm	CMOS		1.8 V				.8 mm	FIXED POINT	S-PBGA-B225	3	Not Qualified	100 rpm	YES	e1
BX8070110900KF	Intel	MICROPROCESSOR
FH8065301487918SR1X7	Intel	MICROPROCESSOR		BALL	1170	BGA	RECTANGULAR	UNSPECIFIED	YES	YES				16	64		GRID ARRAY							BOTTOM					YES	64		NOT SPECIFIED	NOT SPECIFIED		CMOS							FIXED POINT	R-XBGA-B1170			1750 rpm	YES
FH8065801974816SR267	Intel	MICROPROCESSOR		BALL	1168	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES					64		GRID ARRAY							BOTTOM					NO						CMOS							FIXED POINT	R-PBGA-B1168			3200 rpm	NO
BX8070110900F	Intel	MICROPROCESSOR
CM8064601538900SR183	Intel	MICROPROCESSOR
FH8065301487717SR3UT	Intel	MICROPROCESSOR	INDUSTRIAL	BALL	1170		RECTANGULAR	UNSPECIFIED	YES	YES					64		GRID ARRAY			110 Cel		-40 Cel		BOTTOM					NO						CMOS							FIXED POINT	R-XBGA-B1170			1910 rpm	NO
FH8066802980002SR2YB	Intel	MICROPROCESSOR		BALL	1296	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES					64		GRID ARRAY							BOTTOM					NO						CMOS							FIXED POINT	R-PBGA-B1296			2400 rpm	NO
FH8066802980002SR2Z7	Intel	MICROPROCESSOR		BALL	1296	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES					64		GRID ARRAY							BOTTOM					NO						CMOS							FIXED POINT	R-PBGA-B1296			2400 rpm	NO
KMPC8347EVRAGDB	Freescale Semiconductor	MICROPROCESSOR		BALL	620	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V			32	32		GRID ARRAY		1.14 V				Tin/Silver (Sn/Ag)	BOTTOM	2.46 mm		29 mm		YES	32	66 MHz	40	260	29 mm	CMOS		1.2 V				1 mm	FLOATING POINT	S-PBGA-B620	3	Not Qualified	400 rpm	YES	e2
MPC8349CVVAJDB	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	672	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V			32	32	1.2,1.8/2.5,2.5/3.3	GRID ARRAY, LOW PROFILE	BGA672,34X34,40	1.14 V	105 Cel		-40 Cel	TIN SILVER	BOTTOM	1.69 mm		35 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz	40	260	35 mm	CMOS		1.2 V			Microprocessors	1 mm	FLOATING POINT	S-PBGA-B672	3	Not Qualified	533 rpm	YES	e2
MPC8349CZUAJDB	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	672	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V			32	32	1.2,1.8/2.5,2.5/3.3	GRID ARRAY, LOW PROFILE	BGA672,34X34,40	1.14 V	105 Cel		-40 Cel	TIN LEAD	BOTTOM	1.69 mm		35 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz	40	260	35 mm	CMOS		1.2 V			Microprocessors	1 mm	FLOATING POINT	S-PBGA-B672	3	Not Qualified	533 rpm	YES	e0
MPC8349ECVVAJFB	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	672	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V			32	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE	BGA672,34X34,40	1.14 V	105 Cel		-40 Cel	TIN SILVER	BOTTOM	1.69 mm		35 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz	40	260	35 mm	CMOS		1.2 V			Microprocessors	1 mm	FLOATING POINT	S-PBGA-B672	3	Not Qualified	533 rpm	YES	e2
ADSP-21489KSWZ-3B	Analog Devices	MICROPROCESSOR	COMMERCIAL	GULL WING	176	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V			24	40	1.1,3.3	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP176,1.0SQ,20	1.05 V	70 Cel		0 Cel	Matte Tin (Sn) - annealed	QUAD	1.6 mm	163840	24 mm		YES	16	25 MHz			24 mm	CMOS		1.1 V			Digital Signal Processors	.5 mm	FLOATING POINT	S-PQFP-G176	3	Not Qualified	350 rpm	NO	e3
APX81129UG-7	Diodes Incorporated	MICROPROCESSOR	INDUSTRIAL	GULL WING	4	VSOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	5.5 V			0			SMALL OUTLINE		1.1 V	85 Cel		-40 Cel	MATTE TIN	DUAL	1 mm		1.3 mm		NO	0		30	260	2.9 mm	CMOS		2.5 V				1.778 mm	FIXED POINT	R-PDSO-G4	1	Not Qualified		NO	e3
CM8070104282329SRH70	Intel	MICROPROCESSOR
FH8065301567313SR3UZ	Intel	MICROPROCESSOR	INDUSTRIAL	BALL	1170	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES					64		GRID ARRAY			110 Cel		-40 Cel		BOTTOM					NO						CMOS							FIXED POINT	R-PBGA-B1170			1330 rpm
MPC8349ECVVAJDB	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	672	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V			32	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE	BGA672,34X34,40	1.14 V	105 Cel		-40 Cel	TIN SILVER	BOTTOM	1.69 mm		35 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz	40	260	35 mm	CMOS		1.2 V			Microprocessors	1 mm	FLOATING POINT	S-PBGA-B672	3	Not Qualified	533 rpm	YES	e2
MPC8349ECZUAJDB	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	672	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V			32	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE	BGA672,34X34,40	1.14 V	105 Cel		-40 Cel	TIN LEAD	BOTTOM	1.69 mm		35 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz	40	260	35 mm	CMOS		1.2 V			Microprocessors	1 mm	FLOATING POINT	S-PBGA-B672	3	Not Qualified	533 rpm	YES	e0
ADSP-21489KCPZ-4	Analog Devices	MICROPROCESSOR	INDUSTRIAL	NO LEAD	88	HVQCCN	SQUARE	UNSPECIFIED	YES	YES	1.15 V	1		24	40		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC88,.47SQ,20	1.05 V	115 Cel	3	0 Cel		QUAD	.9 mm	5242880	12 mm		YES	16		30	260	12 mm	CMOS	500 mA	1.1 V	65			.5 mm	FLOATING POINT	S-XQCC-N88	3		400 rpm	NO
CL8068404164800SRFED	Intel	MICROPROCESSOR		BALL	1440		RECTANGULAR	PLASTIC/EPOXY	YES	YES					64			BGA1440(UNSPEC)						BOTTOM					NO						CMOS							FIXED POINT	R-PBGA-B1440			4400 rpm	NO
KMPC8347VVAJFB	Freescale Semiconductor	MICROPROCESSOR	OTHER	BALL	672	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V			32	32		GRID ARRAY, LOW PROFILE		1.14 V	105 Cel		0 Cel	Tin/Silver (Sn/Ag)	BOTTOM	1.69 mm		35 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz	40	260	35 mm	CMOS		1.2 V				1 mm	FLOATING POINT	S-PBGA-B672	3	Not Qualified	533 rpm	YES	e2
MPC8547ECHXAUJ	Freescale Semiconductor	MICROPROCESSOR		BALL	783	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.155 V			64	32	1.2,2.5/3.3	GRID ARRAY	BGA783,28X28,40	1.045 V				TIN LEAD SILVER	BOTTOM	3.38 mm		29 mm		YES	64	133 MHz	40	260	29 mm	CMOS		1.1 V			Microprocessors	1 mm	FLOATING POINT	S-CBGA-B783	1	Not Qualified	1333 rpm	YES	e0
T1013NSE7PQA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V			16	64		GRID ARRAY, FINE PITCH	BGA525,23X23,32	.97 V	105 Cel	6	0 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm		19 mm		YES	32		40	260	19 mm	CMOS	5 mA	1 V	2	5		.8 mm	FIXED POINT	S-PBGA-B525	3		1400 rpm	YES	e1
Z8038025FSC	Zilog	MICROPROCESSOR	COMMERCIAL	GULL WING	100	QFP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	5.5 V	0		32	32		FLATPACK		4.5 V	70 Cel	5	0 Cel		QUAD	3.1 mm	0	14 mm	16-BIT OR 32-BIT LINEAR ADDRESS SPACE; DYNAMIC REFRESH CONTROL	NO	16	25 MHz		240	20 mm	CMOS		5 V	0	0		.65 mm	FIXED POINT	R-PQFP-G100		Not Qualified	25 rpm	YES
Z84C0008VEG	IXYS Corporation	MICROPROCESSOR	INDUSTRIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	NO	YES	5.5 V	0		16	8	5	CHIP CARRIER	LDCC44,.7SQ	4.5 V	100 Cel	2	-40 Cel	Matte Tin (Sn)	QUAD	4.57 mm	0	16.5862 mm	DRAM MEMORY REFRESH COUNTER	NO	8	8 MHz	40	260	16.5862 mm	CMOS	40 mA	5 V	0	0	Microprocessors	1.27 mm	FIXED POINT	S-PQCC-J44		Not Qualified	8 rpm	YES	e3
AV8063801116903SR0T5	Intel	MICROPROCESSOR		BALL	1023	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES					64		GRID ARRAY	BGA1023(UNSPEC)						BOTTOM								NOT SPECIFIED	NOT SPECIFIED		CMOS					Microprocessors			R-PBGA-B1023		Not Qualified	3200 rpm
AV8063801149402SR0T6	Intel	MICROPROCESSOR		BALL	1023	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES					64		GRID ARRAY	BGA1023(UNSPEC)						BOTTOM					NO						CMOS					Microprocessors		FIXED POINT	R-PBGA-B1023		Not Qualified	2800 rpm	NO
FH8065301567313	Intel	MICROPROCESSOR	INDUSTRIAL	BALL	1170	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES					64		GRID ARRAY			110 Cel		-40 Cel		BOTTOM					NO						CMOS							FIXED POINT	R-PBGA-B1170			1330 rpm
MC68HC000EI16	Freescale Semiconductor	MICROPROCESSOR	COMMERCIAL	J BEND	68	QCCJ	SQUARE	PLASTIC/EPOXY	NO	YES	5.25 V			24	16		CHIP CARRIER		4.75 V	70 Cel		0 Cel	MATTE TIN	QUAD	4.57 mm		24.2 mm		NO	16	20 MHz	30	245	24.2 mm	HCMOS		5 V				1.27 mm	FIXED POINT	S-PQCC-J68	3		20 rpm	YES	e3

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.