AUTOMOTIVE Microprocessors 282

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	Sub-Category	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code
MPC8379ECVRAGDA	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	689	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	15	32	1,1.8/2.5,2.5/3.3	GRID ARRAY, HEAT SINK/SLUG	BGA689,29X29,40	.95 V	125 Cel	8	-40 Cel	TIN SILVER	BOTTOM	2.46 mm	31 mm		YES	64				31 mm	CMOS		1 V	4	Microprocessors	1 mm	FLOATING POINT	S-PBGA-B689		Not Qualified	400 rpm	YES	e2
MPC8379ECVRAGD	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	689	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	15	32		GRID ARRAY, HEAT SINK/SLUG	BGA689,29X29,40	.95 V	125 Cel	8	-40 Cel		BOTTOM	2.46 mm	31 mm		YES	64				31 mm	CMOS		1 V	4		1 mm	FLOATING POINT	S-PBGA-B689			400 rpm	YES
MPC8379ECVRANGA	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	689	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V	15	32	1.05,1.8/2.5,2.5/3.3	GRID ARRAY, HEAT SINK/SLUG	BGA689,29X29,40	1 V	125 Cel	8	-40 Cel	TIN SILVER	BOTTOM	2.46 mm	31 mm		YES	64		40	260	31 mm	CMOS		1.05 V	4	Microprocessors	1 mm	FLOATING POINT	S-PBGA-B689	3	Not Qualified	800 rpm	YES	e2
P1013SXE2HFB	NXP Semiconductors	MICROPROCESSOR	AUTOMOTIVE	BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	0	32		GRID ARRAY		.95 V	125 Cel		-40 Cel	TIN SILVER	BOTTOM	2.46 mm	31 mm		YES	0	133 MHz			31 mm	CMOS		1 V			1 mm	FLOATING POINT	S-PBGA-B689			800 rpm	YES	e2
MPC8379ECVRANDA	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	689	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V	15	32		GRID ARRAY, HEAT SINK/SLUG	BGA689,29X29,40	1 V	125 Cel	8	-40 Cel		BOTTOM	2.46 mm	31 mm		YES	64				31 mm	CMOS		1.05 V	4		1 mm	FLOATING POINT	S-PBGA-B689			800 rpm	YES
MCIMX6QP4AVT8AA	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V	26	32		GRID ARRAY, FINE PITCH		1.225 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm	21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	YES	64		40	260	21 mm	CMOS		1.4 V			.8 mm	FLOATING POINT	S-PBGA-B624	3		852 rpm	YES	e1
P1021SXN2HFA	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	0	32		GRID ARRAY		.95 V	125 Cel		-40 Cel	TIN SILVER	BOTTOM	2.46 mm	31 mm		YES	0	100 MHz			31 mm	CMOS		1 V			1 mm	FIXED POINT	S-PBGA-B689			800 rpm	YES	e2
MPC8378CVRAGD	NXP Semiconductors	MICROPROCESSOR	AUTOMOTIVE	BALL	689	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	15			GRID ARRAY, HEAT SINK/SLUG		.95 V	125 Cel		-40 Cel		BOTTOM	2.46 mm	31 mm		YES	64		NOT SPECIFIED	NOT SPECIFIED	31 mm	CMOS		1 V			1 mm	FLOATING POINT	S-PBGA-B689			400 rpm	YES
P1013SXN2EFB	NXP Semiconductors	MICROPROCESSOR	AUTOMOTIVE	BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	0	32		GRID ARRAY		.95 V	125 Cel		-40 Cel	TIN SILVER	BOTTOM	2.46 mm	31 mm		YES	0	133 MHz			31 mm	CMOS		1 V			1 mm	FLOATING POINT	S-PBGA-B689			600 rpm	YES	e2
P2041NXN1MMB	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	780	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.89 V	16			GRID ARRAY	BGA780,28X28,32	1.71 V	105 Cel	12	-40 Cel		BOTTOM	2.51 mm	23 mm	ALSO OPERATES WITH 2.5V NOM AND 3.3V NOM SUPPLY	YES	64				23 mm	CMOS		1.8 V	4		.8 mm	FIXED POINT	S-PBGA-B780			1200 rpm	YES
P2041NSN7PNC	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	780	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.89 V	16			GRID ARRAY	BGA780,28X28,32	1.71 V	105 Cel	12	0 Cel	TIN SILVER COPPER	BOTTOM	2.51 mm	23 mm	ALSO OPERATES WITH 2.5V NOM AND 3.3V NOM SUPPLY	YES	64		30	245	23 mm	CMOS		1.8 V	4		.8 mm	FIXED POINT	S-PBGA-B780	3		1500 rpm	YES	e1
P1021NXN2DFA	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	0	32		GRID ARRAY		.95 V	125 Cel		-40 Cel	TIN SILVER	BOTTOM	2.46 mm	31 mm		YES	0	100 MHz			31 mm	CMOS		1 V			1 mm	FIXED POINT	S-PBGA-B689			533 rpm	YES	e2
MPC8378ECVRAGD	NXP Semiconductors	MICROPROCESSOR	AUTOMOTIVE	BALL	689	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	15			GRID ARRAY, HEAT SINK/SLUG		.95 V	125 Cel		-40 Cel		BOTTOM	2.46 mm	31 mm		YES	64		NOT SPECIFIED	NOT SPECIFIED	31 mm	CMOS		1 V			1 mm	FLOATING POINT	S-PBGA-B689			400 rpm	YES
MPC8378ECVRALF	NXP Semiconductors	MICROPROCESSOR	AUTOMOTIVE	BALL	689	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		32		GRID ARRAY, HEAT SINK/SLUG		.95 V	125 Cel		-40 Cel		BOTTOM	2.46 mm	31 mm		YES		66.66 MHz	NOT SPECIFIED	NOT SPECIFIED	31 mm	CMOS		1 V			1 mm	FLOATING POINT	S-PBGA-B689			667 rpm	YES
MPC8379ECVRALG	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	689	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	15	32		GRID ARRAY, HEAT SINK/SLUG	BGA689,29X29,40	.95 V	125 Cel	8	-40 Cel		BOTTOM	2.46 mm	31 mm		YES	64				31 mm	CMOS		1 V	4		1 mm	FLOATING POINT	S-PBGA-B689			667 rpm	YES
P2041NSN1PNB	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	780	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.89 V	16			GRID ARRAY	BGA780,28X28,32	1.71 V	105 Cel	12	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	2.51 mm	23 mm	ALSO OPERATES WITH 2.5V NOM AND 3.3V NOM SUPPLY	YES	64		30	245	23 mm	CMOS		1.8 V	4		.8 mm	FIXED POINT	S-PBGA-B780	3		1500 rpm	YES	e1
MPC8377CVRALFA	NXP Semiconductors	MICROPROCESSOR	AUTOMOTIVE	BALL	689	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	15			GRID ARRAY, HEAT SINK/SLUG		.95 V	125 Cel		-40 Cel		BOTTOM	2.46 mm	31 mm		YES	64				31 mm	CMOS		1 V			1 mm	FLOATING POINT	S-PBGA-B689			667 rpm	YES
P2041NSE7MMC	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	780	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.89 V	16			GRID ARRAY	BGA780,28X28,32	1.71 V	105 Cel	12	0 Cel	TIN SILVER COPPER	BOTTOM	2.51 mm	23 mm	ALSO OPERATES WITH 2.5V NOM AND 3.3V NOM SUPPLY	YES	64		30	245	23 mm	CMOS		1.8 V	4		.8 mm	FIXED POINT	S-PBGA-B780	3		1200 rpm	YES	e1
MPC8377ECVRAJDA	NXP Semiconductors	MICROPROCESSOR	AUTOMOTIVE	BALL	689	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	15			GRID ARRAY, HEAT SINK/SLUG		.95 V	125 Cel		-40 Cel		BOTTOM	2.46 mm	31 mm		YES	64				31 mm	CMOS		1 V			1 mm	FLOATING POINT	S-PBGA-B689			533 rpm	YES
MPC8377ECVRAJG	NXP Semiconductors	MICROPROCESSOR	AUTOMOTIVE	BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V				GRID ARRAY	BGA689,29X29,40	.95 V	125 Cel		-40 Cel		BOTTOM	2.46 mm	31 mm		YES					31 mm	CMOS		1 V	4		1 mm		S-PBGA-B689
P1013SXN2LFA	NXP Semiconductors	MICROPROCESSOR	AUTOMOTIVE	BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	0	32		GRID ARRAY		.95 V	125 Cel		-40 Cel	TIN SILVER	BOTTOM	2.46 mm	31 mm		YES	0	133 MHz			31 mm	CMOS		1 V			1 mm	FLOATING POINT	S-PBGA-B689			1067 rpm	YES	e2
P1013NXN2HFA	NXP Semiconductors	MICROPROCESSOR	AUTOMOTIVE	BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	0	32		GRID ARRAY		.95 V	125 Cel		-40 Cel	TIN SILVER	BOTTOM	2.46 mm	31 mm		YES	0	133 MHz	40	260	31 mm	CMOS		1 V			1 mm	FLOATING POINT	S-PBGA-B689			800 rpm	YES	e2
MCIMX6S1AVM10AC	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.5 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.4 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE				40	260	21 mm	CMOS					.8 mm		S-PBGA-B624	3				e1
MPC8377ECVRAJGA	NXP Semiconductors	MICROPROCESSOR	AUTOMOTIVE	BALL	689	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	15			GRID ARRAY, HEAT SINK/SLUG		.95 V	125 Cel		-40 Cel		BOTTOM	2.46 mm	31 mm		YES	64				31 mm	CMOS		1 V			1 mm	FLOATING POINT	S-PBGA-B689			533 rpm	YES
MPC8379ECVRALF	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	689	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	15	32		GRID ARRAY, HEAT SINK/SLUG	BGA689,29X29,40	.95 V	125 Cel	8	-40 Cel		BOTTOM	2.46 mm	31 mm		YES	64				31 mm	CMOS		1 V	4		1 mm	FLOATING POINT	S-PBGA-B689			667 rpm	YES
P2041NXN7PNC	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	780	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.89 V	16			GRID ARRAY	BGA780,28X28,32	1.71 V	105 Cel	12	-40 Cel		BOTTOM	2.51 mm	23 mm	ALSO OPERATES WITH 2.5V NOM AND 3.3V NOM SUPPLY	YES	64		30	245	23 mm	CMOS		1.8 V	4		.8 mm	FIXED POINT	S-PBGA-B780	3		1500 rpm	YES
P1021NXN2HFA	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	0	32		GRID ARRAY		.95 V	125 Cel		-40 Cel	TIN SILVER	BOTTOM	2.46 mm	31 mm		YES	0	100 MHz			31 mm	CMOS		1 V			1 mm	FIXED POINT	S-PBGA-B689			800 rpm	YES	e2
MPC8378ECVRANGA	NXP Semiconductors	MICROPROCESSOR	AUTOMOTIVE	BALL	689	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V	15	32	1.05,1.8/2.5,2.5/3.3	GRID ARRAY, HEAT SINK/SLUG	BGA689,29X29,40	1 V	125 Cel		-40 Cel	TIN SILVER	BOTTOM	2.46 mm	31 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	64	66.66 MHz	40	260	31 mm	CMOS		1.05 V		Microprocessors	1 mm	FLOATING POINT	S-PBGA-B689	3	Not Qualified	800 rpm	YES	e2
MPC8377CVRAGDA	NXP Semiconductors	MICROPROCESSOR	AUTOMOTIVE	BALL	689	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	15	32		GRID ARRAY, HEAT SINK/SLUG	BGA689,29X29,40	.95 V	125 Cel	8	-40 Cel		BOTTOM	2.46 mm	31 mm		YES	64				31 mm	CMOS	.03 mA	1 V	4		1 mm	FLOATING POINT	S-PBGA-B689			400 rpm	YES
P1021NXE2HFA	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	0	32		GRID ARRAY		.95 V	125 Cel		-40 Cel	TIN SILVER	BOTTOM	2.46 mm	31 mm		YES	0	100 MHz			31 mm	CMOS		1 V			1 mm	FIXED POINT	S-PBGA-B689			800 rpm	YES	e2
MPC8378CVRALF	NXP Semiconductors	MICROPROCESSOR	AUTOMOTIVE	BALL	689	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	15			GRID ARRAY, HEAT SINK/SLUG		.95 V	125 Cel		-40 Cel		BOTTOM	2.46 mm	31 mm		YES	64		NOT SPECIFIED	NOT SPECIFIED	31 mm	CMOS		1 V			1 mm	FLOATING POINT	S-PBGA-B689			667 rpm	YES
MCIMX6U6AVM08AD	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V	16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.275 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	YES	64		40	260	21 mm	CMOS					.8 mm	FLOATING POINT	S-PBGA-B624	3		800 rpm	YES	e1
MCIMX6S6AVM10AD	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V	16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.4 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	YES	32		40	260	21 mm	CMOS					.8 mm	FLOATING POINT	S-PBGA-B624	3		1000 rpm	YES	e1
MPC8379ECVRAJF	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	689	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	15	32		GRID ARRAY, HEAT SINK/SLUG	BGA689,29X29,40	.95 V	125 Cel	8	-40 Cel		BOTTOM	2.46 mm	31 mm		YES	64				31 mm	CMOS		1 V	4		1 mm	FLOATING POINT	S-PBGA-B689			533 rpm	YES
MPC8377CVRAND	NXP Semiconductors	MICROPROCESSOR	AUTOMOTIVE	BALL	689	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V	15			GRID ARRAY, HEAT SINK/SLUG		1 V	125 Cel		-40 Cel		BOTTOM	2.46 mm	31 mm		YES	64				31 mm	CMOS		1.05 V			1 mm	FLOATING POINT	S-PBGA-B689			800 rpm	YES
MPC8378CVRAGDA	NXP Semiconductors	MICROPROCESSOR	AUTOMOTIVE	BALL	689	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	15	32	1,1.8/2.5,2.5/3.3	GRID ARRAY, HEAT SINK/SLUG	BGA689,29X29,40	.95 V	125 Cel		-40 Cel	TIN SILVER	BOTTOM	2.46 mm	31 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	64	66.66 MHz	40	260	31 mm	CMOS		1 V		Microprocessors	1 mm	FLOATING POINT	S-PBGA-B689	3	Not Qualified	400 rpm	YES	e2
MPC8377CVRALDA	NXP Semiconductors	MICROPROCESSOR	AUTOMOTIVE	BALL	689	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	15			GRID ARRAY, HEAT SINK/SLUG		.95 V	125 Cel		-40 Cel		BOTTOM	2.46 mm	31 mm		YES	64				31 mm	CMOS		1 V			1 mm	FLOATING POINT	S-PBGA-B689			667 rpm	YES
P1013SXE2LFB	NXP Semiconductors	MICROPROCESSOR	AUTOMOTIVE	BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	0	32		GRID ARRAY		.95 V	125 Cel		-40 Cel	TIN SILVER	BOTTOM	2.46 mm	31 mm		YES	0	133 MHz			31 mm	CMOS		1 V			1 mm	FLOATING POINT	S-PBGA-B689			1067 rpm	YES	e2
MPC8378CVRALD	NXP Semiconductors	MICROPROCESSOR	AUTOMOTIVE	BALL	689	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	15			GRID ARRAY, HEAT SINK/SLUG		.95 V	125 Cel		-40 Cel		BOTTOM	2.46 mm	31 mm		YES	64		NOT SPECIFIED	NOT SPECIFIED	31 mm	CMOS		1 V			1 mm	FLOATING POINT	S-PBGA-B689			667 rpm	YES
P1021NXE2DFA	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	0	32		GRID ARRAY		.95 V	125 Cel		-40 Cel	TIN SILVER	BOTTOM	2.46 mm	31 mm		YES	0	100 MHz			31 mm	CMOS		1 V			1 mm	FIXED POINT	S-PBGA-B689			533 rpm	YES	e2
MPC8378ECVRALGA	NXP Semiconductors	MICROPROCESSOR	AUTOMOTIVE	BALL	689	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	15	32	1,1.8/2.5,2.5/3.3	GRID ARRAY, HEAT SINK/SLUG	BGA689,29X29,40	.95 V	125 Cel		-40 Cel	TIN SILVER	BOTTOM	2.46 mm	31 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	64	66.66 MHz	40	260	31 mm	CMOS		1 V		Microprocessors	1 mm	FLOATING POINT	S-PBGA-B689	3	Not Qualified	667 rpm	YES	e2
MCIMX6DP4AVT1AA	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V	26	32		GRID ARRAY, FINE PITCH		1.35 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm	21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	YES	64		40	260	21 mm	CMOS					.8 mm	FLOATING POINT	S-PBGA-B624	3		1000 rpm	YES	e1
MPC8377CVRANFA	NXP Semiconductors	MICROPROCESSOR	AUTOMOTIVE	BALL	689	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V	15			GRID ARRAY, HEAT SINK/SLUG		1 V	125 Cel		-40 Cel		BOTTOM	2.46 mm	31 mm		YES	64				31 mm	CMOS		1.05 V			1 mm	FLOATING POINT	S-PBGA-B689			800 rpm	YES
MPC8377ECVRANGA	NXP Semiconductors	MICROPROCESSOR	AUTOMOTIVE	BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	32	32	1.05,1.8/2.5,2.5/3.3	GRID ARRAY	BGA689,29X29,40	.95 V	125 Cel		-40 Cel	TIN SILVER	BOTTOM	2.46 mm	31 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66.66 MHz	40	260	31 mm	CMOS		1 V		Microprocessors	1 mm	FLOATING POINT	S-PBGA-B689	3	Not Qualified	400 rpm	YES	e2
MPC8378ECVRAJF	NXP Semiconductors	MICROPROCESSOR	AUTOMOTIVE	BALL	689	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	15			GRID ARRAY, HEAT SINK/SLUG		.95 V	125 Cel		-40 Cel		BOTTOM	2.46 mm	31 mm		YES	64		NOT SPECIFIED	NOT SPECIFIED	31 mm	CMOS		1 V			1 mm	FLOATING POINT	S-PBGA-B689			533 rpm	YES
P1013NXE2HFA	NXP Semiconductors	MICROPROCESSOR	AUTOMOTIVE	BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	0	32		GRID ARRAY		.95 V	125 Cel		-40 Cel	TIN SILVER	BOTTOM	2.46 mm	31 mm		YES	0	133 MHz	40	260	31 mm	CMOS		1 V			1 mm	FLOATING POINT	S-PBGA-B689			800 rpm	YES	e2
MCIMX6S4AVM10AC	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.5 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.4 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE				40	260	21 mm	CMOS					.8 mm		S-PBGA-B624	3				e1
MCIMX6U6AVM10AC	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.5 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.4 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE				40	260	21 mm	CMOS					.8 mm		S-PBGA-B624	3				e1

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.