AUTOMOTIVE Microprocessors 282

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Screening Level	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	No. of Serial I/Os	Sub-Category	Bus Compatibility	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code	No. of I/O Lines
MIMXRT1176AVM8A	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.95 V	8					GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.71 V	125 Cel		-40 Cel		BOTTOM	1.52 mm	2097152	14 mm		YES		48 MHz	40	260	14 mm	CMOS	850 mA	1.8 V	32	1			.8 mm	FLOATING-POINT	S-PBGA-B289	3		800 rpm	YES
MCIMX537CVP8C2	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V	8		26	32		GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.05 V	125 Cel		-40 Cel		BOTTOM	1.85 mm	147456	19 mm		YES	32	27 MHz	40	260	19 mm	CMOS	800 mA	1.1 V	32	52			.8 mm	FLOATING POINT	S-PBGA-B529	3		800 rpm	YES
MIMXRT1171AVM8A	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.95 V	8					GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.71 V	125 Cel		-40 Cel		BOTTOM	1.52 mm	2097152	14 mm		YES		48 MHz	40	260	14 mm	CMOS	850 mA	1.8 V	32	1			.8 mm	FLOATING-POINT	S-PBGA-B289	3		800 rpm	YES
MCIMX537CVV8CR2	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V			16	32	1.1,1.3	GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.05 V	125 Cel		-40 Cel	TIN SILVER	BOTTOM	1.9 mm		19 mm		YES	32	27 MHz	40	260	19 mm	CMOS		1.1 V			Graphics Processors		.8 mm	FLOATING POINT	S-PBGA-B529	3	Not Qualified	800 rpm	YES	e2
MIMXRT1175AVM8A	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.95 V	8					GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.71 V	125 Cel		-40 Cel		BOTTOM	1.52 mm	2097152	14 mm		YES		48 MHz	40	260	14 mm	CMOS	850 mA	1.8 V	32	1			.8 mm	FLOATING-POINT	S-PBGA-B289	3		800 rpm	YES
MIMXRT1172AVM8A	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.95 V	8					GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.71 V	125 Cel		-40 Cel		BOTTOM	1.52 mm	2097152	14 mm		YES		48 MHz	40	260	14 mm	CMOS	850 mA	1.8 V	32	1			.8 mm	FLOATING-POINT	S-PBGA-B289	3		800 rpm	YES
MCIMX537CVV8C	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V			26	32		GRID ARRAY, FINE PITCH	BGA529,23X23,32	.9 V	125 Cel		-40 Cel	TIN SILVER	BOTTOM	1.85 mm	73728	19 mm	1.1V NOMIVAL AVAILABLE WITH 800MHZ	YES	32	27 MHz	40	260	19 mm	CMOS	1450 mA	.95 V		2		CAN; ETHERNET; I2C; I2S; IRDA; RS-232; SPI; UART; USB	.8 mm	FLOATING POINT	S-PBGA-B529	3	Not Qualified	800 rpm	YES	e2	19
MCIMX6S6AVM08AC	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V			16	64		GRID ARRAY, LOW PROFILE, FINE PITCH		1.275 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	YES	32	24 MHz	40	260	21 mm	CMOS		1.35 V					.8 mm	FIXED POINT	S-PBGA-B624	3		800 rpm	YES	e1
AM3352BZCZT60	Texas Instruments	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	324	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.248 V	8		28	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.152 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	131072	15 mm		YES	16	26 MHz	30	260	15 mm	CMOS	400 mA	1.2 V	64				.8 mm	FIXED POINT	S-PBGA-B324	3		600 rpm	YES	e1
MCIMX536AVV8CR2	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	529	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V			26	32	1.1,1.3,1.8/3.3	GRID ARRAY, HEAT SINK/SLUG	BGA529,23X23,32	1.05 V	125 Cel		-40 Cel	TIN SILVER	BOTTOM	1.85 mm		19 mm		YES	32	27 MHz	40	260	19 mm	CMOS	1450 mA	1.1 V			Graphics Processors		.8 mm	FLOATING POINT	S-PBGA-B529	3	Not Qualified	800 rpm	YES	e2
MCIMX6QP6AVT1AB	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.5 V						GRID ARRAY, FINE PITCH		1.35 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm		21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE				40	260	21 mm	CMOS							.8 mm		S-PBGA-B624	3				e1
P1021NXE2HFB	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V			0	32		GRID ARRAY		.95 V	125 Cel		-40 Cel	TIN SILVER	BOTTOM	2.46 mm		31 mm		YES	0	100 MHz	40	260	31 mm	CMOS		1 V					1 mm	FIXED POINT	S-PBGA-B689	3		800 rpm	YES	e2
TDA4VM88TGBALFRQ1	Texas Instruments	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	827	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	.84 V	8	AEC-Q100	0	64		GRID ARRAY, FINE PITCH	BGA827,29X29,32	.76 V	125 Cel	1	-40 Cel	TIN SILVER COPPER	BOTTOM	2.8 mm	9961472	24 mm		YES	32	27 MHz		250	24 mm	CMOS		.8 V		26			.8 mm	FLOATING-POINT	S-PBGA-B827	3		2000 rpm	YES	e1
MCIMX6U6AVM08AC	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V			16	64		GRID ARRAY, LOW PROFILE, FINE PITCH		1.275 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	YES	64	24 MHz	40	260	21 mm	CMOS		1.35 V					.8 mm	FIXED POINT	S-PBGA-B624	3		800 rpm	YES	e1
MCIMX6U1AVM08AD	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V			16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.275 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	YES	64		40	260	21 mm	CMOS							.8 mm	FLOATING POINT	S-PBGA-B624	3		800 rpm	YES	e1
MCIMX6QP6AVT8AB	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.5 V						GRID ARRAY, FINE PITCH		1.225 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm		21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE				40	260	21 mm	CMOS							.8 mm		S-PBGA-B624	3				e1
MCIMX6QP6AVT1AA	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V			26	32		GRID ARRAY, FINE PITCH		1.35 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm		21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	YES	64		40	260	21 mm	CMOS							.8 mm	FLOATING POINT	S-PBGA-B624	3		1000 rpm	YES	e1
MCIMX6S6AVM08AB	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V			16	64		GRID ARRAY, LOW PROFILE, FINE PITCH		1.275 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	YES	32	24 MHz	40	260	21 mm	CMOS		1.35 V					.8 mm	FIXED POINT	S-PBGA-B624	3		800 rpm	YES	e1
MCIMX6S1AVM08AB	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V			16	64		GRID ARRAY, LOW PROFILE, FINE PITCH		1.275 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	YES	32	24 MHz	40	260	21 mm	CMOS		1.35 V					.8 mm	FIXED POINT	S-PBGA-B624	3		800 rpm	YES	e1
MCIMX6U6AVM08AB	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V			16	64		GRID ARRAY, LOW PROFILE, FINE PITCH		1.275 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	YES	64	24 MHz	40	260	21 mm	CMOS		1.35 V					.8 mm	FIXED POINT	S-PBGA-B624	3		800 rpm	YES	e1
AM3352BZCZT60R	Texas Instruments	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	324	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.248 V	8		28	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.152 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	131072	15 mm		YES	16	26 MHz	30	260	15 mm	CMOS	400 mA	1.2 V	64				.8 mm	FIXED POINT	S-PBGA-B324	3		600 rpm	YES	e1
MCIMX6S6AVM08AD	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V			16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.275 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	YES	32		40	260	21 mm	CMOS							.8 mm	FLOATING POINT	S-PBGA-B624	3		800 rpm	YES	e1
MCIMX6S4AVM08AB	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V			16	64		GRID ARRAY, LOW PROFILE, FINE PITCH		1.275 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	YES	32	24 MHz	40	260	21 mm	CMOS		1.35 V					.8 mm	FIXED POINT	S-PBGA-B624	3		800 rpm	YES	e1
MCIMX6S1AVM08AC	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V			16	64		GRID ARRAY, LOW PROFILE, FINE PITCH		1.275 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	YES	32	24 MHz	40	260	21 mm	CMOS		1.35 V					.8 mm	FIXED POINT	S-PBGA-B624	3		800 rpm	YES	e1
P2041NXE7PNC	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	780	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.89 V			16			GRID ARRAY	BGA780,28X28,32	1.71 V	105 Cel	12	-40 Cel	TIN SILVER COPPER	BOTTOM	2.51 mm		23 mm	ALSO OPERATES WITH 2.5V NOM AND 3.3V NOM SUPPLY	YES	64		30	245	23 mm	CMOS		1.8 V	4				.8 mm	FIXED POINT	S-PBGA-B780	3		1500 rpm	YES	e1
P2041NXN7NNC	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	780	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.89 V			16			GRID ARRAY	BGA780,28X28,32	1.71 V	105 Cel	12	-40 Cel	TIN SILVER COPPER	BOTTOM	2.51 mm		23 mm	ALSO OPERATES WITH 2.5V NOM AND 3.3V NOM SUPPLY	YES	64		30	245	23 mm	CMOS		1.8 V	4				.8 mm	FIXED POINT	S-PBGA-B780	3		1333 rpm	YES	e1
XTDA4VMXXXGALF	Texas Instruments	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	827	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	.84 V	8		0	64		GRID ARRAY, FINE PITCH	BGA827,29X29,32	.77 V	125 Cel		-40 Cel		BOTTOM	2.8 mm	5242880	24 mm		YES	32	27 MHz			24 mm	CMOS		.8 V					.8 mm	FLOATING POINT	S-PBGA-B827			1000 rpm	YES
MCIMX6Q4AVT10ADR	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V			16	32		GRID ARRAY, FINE PITCH		1.35 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm		21 mm	PKG DETAIL: HTTP://CACHE.FREESCALE.COM/FILES/SHARED/DOC/PACKAGE_INFO/98ASA00330D.	YES	64		40	260	21 mm	CMOS							.8 mm	FLOATING POINT	S-PBGA-B624	3		1000 rpm	YES	e1
P1013NXE2LFB	NXP Semiconductors	MICROPROCESSOR	AUTOMOTIVE	BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V			0	32		GRID ARRAY		.95 V	125 Cel		-40 Cel	TIN SILVER	BOTTOM	2.46 mm		31 mm		YES	0	133 MHz	40	260	31 mm	CMOS		1 V					1 mm	FLOATING POINT	S-PBGA-B689	3		1067 rpm	YES	e2
P1021NXE2FFB	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V			0	32		GRID ARRAY		.95 V	125 Cel		-40 Cel	TIN SILVER	BOTTOM	2.46 mm		31 mm		YES	0	100 MHz	40	260	31 mm	CMOS		1 V					1 mm	FIXED POINT	S-PBGA-B689	3		667 rpm	YES	e2
TA80960KB-16	Intel	MICROPROCESSOR, RISC	AUTOMOTIVE	PIN/PEG	132	PGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	NO	5.5 V	0		32	32	5	GRID ARRAY	PGA132,14X14	4.5 V	125 Cel	4	-40 Cel		PERPENDICULAR	4.57 mm	0	37.08 mm	OPTEMP SPECIFIED AS TC; REGISTER SCOREBOARDING; BURST BUS	NO	32	32 MHz			37.08 mm	CMOS	315 mA	5 V	0	0	Microprocessors		2.54 mm	FLOATING POINT	S-CPGA-P132		Not Qualified	16 rpm	NO
TA80960KB-25	Intel	MICROPROCESSOR, RISC	AUTOMOTIVE	PIN/PEG	132	PGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	NO	5.25 V	0		32	32	5	GRID ARRAY	PGA132,14X14	4.75 V	125 Cel	4	-40 Cel		PERPENDICULAR	4.57 mm	0	37.08 mm	OPTEMP SPECIFIED AS TC; REGISTER SCOREBOARDING; 25 MIPS MAX; 9.4 MIPS SUSTAINED; BURST BUS	NO	32	50 MHz			37.08 mm	CMOS	420 mA	5 V	0	0	Microprocessors		2.54 mm	FLOATING POINT	S-CPGA-P132		Not Qualified	25 rpm	NO
P2041NSE7PNC	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	780	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.89 V			16			GRID ARRAY	BGA780,28X28,32	1.71 V	105 Cel	12	0 Cel	TIN SILVER COPPER	BOTTOM	2.51 mm		23 mm	ALSO OPERATES WITH 2.5V NOM AND 3.3V NOM SUPPLY	YES	64		30	245	23 mm	CMOS		1.8 V	4				.8 mm	FIXED POINT	S-PBGA-B780	3		1500 rpm	YES	e1
MCIMX6S6AVM10AC	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.5 V						GRID ARRAY, LOW PROFILE, FINE PITCH		1.4 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE				40	260	21 mm	CMOS							.8 mm		S-PBGA-B624	3				e1
MCIMX6U1AVM10AD	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V			16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.4 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	YES	64		40	260	21 mm	CMOS							.8 mm	FLOATING POINT	S-PBGA-B624	3		1000 rpm	YES	e1
P2041NSE1PNB	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	780	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.89 V			16			GRID ARRAY	BGA780,28X28,32	1.71 V	105 Cel	12	0 Cel		BOTTOM	2.51 mm		23 mm	ALSO OPERATES WITH 2.5V NOM AND 3.3V NOM SUPPLY	YES	64				23 mm	CMOS		1.8 V	4				.8 mm	FIXED POINT	S-PBGA-B780			1500 rpm	YES
P2041NXE1PNB	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	780	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.89 V			16			GRID ARRAY	BGA780,28X28,32	1.71 V	105 Cel	12	-40 Cel		BOTTOM	2.51 mm		23 mm	ALSO OPERATES WITH 2.5V NOM AND 3.3V NOM SUPPLY	YES	64				23 mm	CMOS		1.8 V	4				.8 mm	FIXED POINT	S-PBGA-B780			1500 rpm	YES
PC7448FGH1267ND	Teledyne E2v (Uk)	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.1 V			36	32	1.05,1.5/2.5	GRID ARRAY	BGA360,19X19,50	1 V	125 Cel		-40 Cel		BOTTOM	2.8 mm		25 mm		YES	64	200 MHz			25 mm	CMOS		1.05 V			Microprocessors		1.27 mm	FLOATING POINT	S-CBGA-B360		Not Qualified	1267 rpm	NO
R7S910026CBG#AC0	Renesas Electronics	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	320	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V			26	32		GRID ARRAY		1.14 V	125 Cel		-40 Cel		BOTTOM					YES	32					CMOS		1.2 V						FLOATING POINT	S-PBGA-B320	3		450 rpm	YES
S9S08RN32W1MLC	NXP Semiconductors	MICROPROCESSOR	AUTOMOTIVE	GULL WING	32	LQFP	SQUARE	PLASTIC/EPOXY	NO	YES	5.5 V	8		0	8		FLATPACK, LOW PROFILE	QFP32,.35SQ,32	2.7 V	125 Cel	12	-40 Cel	MATTE TIN	QUAD	1.6 mm	4096	7 mm		NO	0	20 MHz	40	260	7 mm	CMOS	14.8 mA	3 V		2			.8 mm	FIXED POINT	S-PQFP-G32	3		20 rpm	YES	e3
TDA2LFBTQABCQ1	Texas Instruments	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	625	BGA	UNSPECIFIED	PLASTIC/EPOXY	NO	YES	1.2 V		AEC-Q100	16	32		GRID ARRAY		1.11 V	125 Cel		-40 Cel		BOTTOM					YES	32	38.4 MHz				CMOS		1.15 V						FLOATING POINT	X-PBGA-B625			1176 rpm	YES
66AK2G02ZBBA60	Texas Instruments	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	625	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	.95 V			16			GRID ARRAY, LOW PROFILE, FINE PITCH		.85 V	125 Cel		-40 Cel		BOTTOM	1.7 mm		21 mm		YES	32	26 MHz			21 mm	CMOS		.9 V					.8 mm	FLOATING POINT	S-PBGA-B625			600 rpm	YES
7700201QX	Texas Instruments	MICROPROCESSOR	AUTOMOTIVE	THROUGH-HOLE	40	DIP	RECTANGULAR	CERAMIC, METAL-SEALED COFIRED	NO	NO	5.25 V		38535Q/M;38534H;883B	25	32	+-5,12	GRID ARRAY	DIP40,.6	4.75 V	125 Cel		-40 Cel		PERPENDICULAR	4.57 mm		44.7 mm		YES	16				44.7 mm	CMOS		5 V			Microprocessors		2.54 mm	FIXED POINT	R-XDIP-T40		Not Qualified	25 rpm
TDA2HABRQAASQ1	Texas Instruments	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	625	FBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.2 V		AEC-Q100	16	32		GRID ARRAY, FINE PITCH		1.11 V	125 Cel		-40 Cel		BOTTOM	2.95 mm		17 mm		YES	32	38.4 MHz			17 mm	CMOS		1.15 V					.65 mm	FLOATING POINT	S-PBGA-B625			750 rpm	YES
TDA2SXBTQABCQ1	Texas Instruments	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	760	HBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.2 V		AEC-Q100	16	32		GRID ARRAY, HEAT SINK/SLUG		1.11 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.96 mm		23 mm		YES	32	38.4 MHz	30	250	23 mm	CMOS		1.15 V					.8 mm	FLOATING POINT	S-PBGA-B760	3		1176 rpm	YES	e1
XDRA829JXXGALF	Texas Instruments	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	827	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	.84 V	16		0	64		GRID ARRAY, FINE PITCH	BGA827,29X29,32	.76 V	125 Cel	1	-40 Cel		BOTTOM	2.8 mm	1048576	24 mm		YES	32	27 MHz			24 mm	CMOS		.8 V					.8 mm	FIXED POINT	S-PBGA-B827			2000 rpm	YES
TDA2HGBDQABCRQ1	Texas Instruments	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	625	BGA	UNSPECIFIED	PLASTIC/EPOXY	NO	YES	1.2 V		AEC-Q100	16	32		GRID ARRAY		1.11 V	125 Cel		-40 Cel		BOTTOM					YES	32	38.4 MHz				CMOS		1.15 V						FLOATING POINT	X-PBGA-B625			500 rpm	YES
AM1707DZKBT3	Texas Instruments	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	256	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V			13	32	1.2,1.8/3.3	GRID ARRAY, FINE PITCH	BGA256,16X16,40	1.14 V	125 Cel		-40 Cel		BOTTOM	2.05 mm		17 mm		YES	16	30 MHz	NOT SPECIFIED	NOT SPECIFIED	17 mm	CMOS		1.2 V			Microprocessors		.5 mm	FIXED POINT	S-PBGA-B256		Not Qualified	375 rpm	YES

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.