AUTOMOTIVE Microprocessors 282

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	Sub-Category	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code
MCIMX6S4AVM10AD	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V	16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.4 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	YES	32		40	260	21 mm	CMOS					.8 mm	FLOATING POINT	S-PBGA-B624	3		1000 rpm	YES	e1
MPC8377CVRALD	NXP Semiconductors	MICROPROCESSOR	AUTOMOTIVE	BALL	689	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	15			GRID ARRAY, HEAT SINK/SLUG		.95 V	125 Cel		-40 Cel		BOTTOM	2.46 mm	31 mm		YES	64				31 mm	CMOS		1 V			1 mm	FLOATING POINT	S-PBGA-B689			667 rpm	YES
P1013SXE2EFA	NXP Semiconductors	MICROPROCESSOR	AUTOMOTIVE	BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	0	32		GRID ARRAY		.95 V	125 Cel		-40 Cel	TIN SILVER	BOTTOM	2.46 mm	31 mm		YES	0	133 MHz			31 mm	CMOS		1 V			1 mm	FLOATING POINT	S-PBGA-B689			600 rpm	YES	e2
MPC8379ECVRALD	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	689	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	15	32		GRID ARRAY, HEAT SINK/SLUG	BGA689,29X29,40	.95 V	125 Cel	8	-40 Cel		BOTTOM	2.46 mm	31 mm		YES	64				31 mm	CMOS		1 V	4		1 mm	FLOATING POINT	S-PBGA-B689			667 rpm	YES
P1021NXN2HFB	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	0	32		GRID ARRAY		.95 V	125 Cel		-40 Cel	TIN SILVER	BOTTOM	2.46 mm	31 mm		YES	0	100 MHz	40	260	31 mm	CMOS		1 V			1 mm	FIXED POINT	S-PBGA-B689	3		800 rpm	YES	e2
P1013NXN2EFA	NXP Semiconductors	MICROPROCESSOR	AUTOMOTIVE	BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	0	32		GRID ARRAY		.95 V	125 Cel		-40 Cel	TIN SILVER	BOTTOM	2.46 mm	31 mm		YES	0	133 MHz	40	260	31 mm	CMOS		1 V			1 mm	FLOATING POINT	S-PBGA-B689			600 rpm	YES	e2
MPC8379ECVRANG	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	689	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V	15	32		GRID ARRAY, HEAT SINK/SLUG	BGA689,29X29,40	1 V	125 Cel	8	-40 Cel		BOTTOM	2.46 mm	31 mm		YES	64				31 mm	CMOS		1.05 V	4		1 mm	FLOATING POINT	S-PBGA-B689			800 rpm	YES
MPC8377ECVRALGA	NXP Semiconductors	MICROPROCESSOR	AUTOMOTIVE	BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	32	32	1,1.8/2.5,2.5/3.3	GRID ARRAY	BGA689,29X29,40	.95 V	125 Cel		-40 Cel	TIN SILVER	BOTTOM	2.46 mm	31 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66.66 MHz	40	260	31 mm	CMOS		1 V		Microprocessors	1 mm	FLOATING POINT	S-PBGA-B689	3	Not Qualified	400 rpm	YES	e2
MPC8377ECVRANF	NXP Semiconductors	MICROPROCESSOR	AUTOMOTIVE	BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V				GRID ARRAY	BGA689,29X29,40	1 V	125 Cel		-40 Cel		BOTTOM	2.46 mm	31 mm		YES					31 mm	CMOS		1.05 V	4		1 mm		S-PBGA-B689
MPC8377ECVRAGGA	NXP Semiconductors	MICROPROCESSOR	AUTOMOTIVE	BALL	689	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	15	32		GRID ARRAY, HEAT SINK/SLUG	BGA689,29X29,40	.95 V	125 Cel	8	-40 Cel		BOTTOM	2.46 mm	31 mm		YES	64				31 mm	CMOS	.03 mA	1 V	4		1 mm	FLOATING POINT	S-PBGA-B689			400 rpm	YES
MPC8377ECVRAGG	NXP Semiconductors	MICROPROCESSOR	AUTOMOTIVE	BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V				GRID ARRAY	BGA689,29X29,40	.95 V	125 Cel		-40 Cel		BOTTOM	2.46 mm	31 mm		YES					31 mm	CMOS		1 V	4		1 mm		S-PBGA-B689
MCIMX6U4AVM10AC	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.5 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.4 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE				40	260	21 mm	CMOS					.8 mm		S-PBGA-B624	3				e1
MCIMX6DP6AVT1AB	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.5 V				GRID ARRAY, FINE PITCH		1.35 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm	21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE				40	260	21 mm	CMOS					.8 mm		S-PBGA-B624	3				e1
P1013SXE2HFA	NXP Semiconductors	MICROPROCESSOR	AUTOMOTIVE	BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	0	32		GRID ARRAY		.95 V	125 Cel		-40 Cel	TIN SILVER	BOTTOM	2.46 mm	31 mm		YES	0	133 MHz			31 mm	CMOS		1 V			1 mm	FLOATING POINT	S-PBGA-B689			800 rpm	YES	e2
MPC8378ECVRAJG	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	689	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	15			GRID ARRAY, HEAT SINK/SLUG	BGA689,29X29,40	.95 V	125 Cel	8	-40 Cel		BOTTOM	2.46 mm	31 mm		YES	64				31 mm	CMOS		1 V	4		1 mm	FLOATING POINT	S-PBGA-B689			533 rpm	YES
MPC8377ECVRANFA	NXP Semiconductors	MICROPROCESSOR	AUTOMOTIVE	BALL	689	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V	15			GRID ARRAY, HEAT SINK/SLUG		1 V	125 Cel		-40 Cel		BOTTOM	2.46 mm	31 mm		YES	64				31 mm	CMOS		1.05 V			1 mm	FLOATING POINT	S-PBGA-B689			800 rpm	YES
MPC8377ECVRALG	NXP Semiconductors	MICROPROCESSOR	AUTOMOTIVE	BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V				GRID ARRAY	BGA689,29X29,40	.95 V	125 Cel		-40 Cel		BOTTOM	2.46 mm	31 mm		YES					31 mm	CMOS		1 V	4		1 mm		S-PBGA-B689
P1013SXE2EFB	NXP Semiconductors	MICROPROCESSOR	AUTOMOTIVE	BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	0	32		GRID ARRAY		.95 V	125 Cel		-40 Cel	TIN SILVER	BOTTOM	2.46 mm	31 mm		YES	0	133 MHz			31 mm	CMOS		1 V			1 mm	FLOATING POINT	S-PBGA-B689			600 rpm	YES	e2
MPC8377CVRALG	NXP Semiconductors	MICROPROCESSOR	AUTOMOTIVE	BALL	689	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	15	32		GRID ARRAY, HEAT SINK/SLUG	BGA689,29X29,40	.95 V	125 Cel	8	-40 Cel		BOTTOM	2.46 mm	31 mm		YES	64				31 mm	CMOS	.03 mA	1 V	4		1 mm	FLOATING POINT	S-PBGA-B689			667 rpm	YES
MCIMX6QP4AVT8AB	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.5 V				GRID ARRAY, FINE PITCH		1.225 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm	21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE				40	260	21 mm	CMOS					.8 mm		S-PBGA-B624	3				e1
MPC8377CVRANG	NXP Semiconductors	MICROPROCESSOR	AUTOMOTIVE	BALL	689	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V	15	32		GRID ARRAY, HEAT SINK/SLUG	BGA689,29X29,40	1 V	125 Cel	8	-40 Cel		BOTTOM	2.46 mm	31 mm		YES	64				31 mm	CMOS	.03 mA	1.05 V	4		1 mm	FLOATING POINT	S-PBGA-B689			800 rpm	YES
MPC8379ECVRAGFA	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	689	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	15	32		GRID ARRAY, HEAT SINK/SLUG	BGA689,29X29,40	.95 V	125 Cel	8	-40 Cel		BOTTOM	2.46 mm	31 mm		YES	64				31 mm	CMOS		1 V	4		1 mm	FLOATING POINT	S-PBGA-B689			400 rpm	YES
P1013PXE2LFB	NXP Semiconductors	MICROPROCESSOR	AUTOMOTIVE	BALL	689	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16	32		GRID ARRAY, HEAT SINK/SLUG		.95 V	125 Cel		-40 Cel	Tin/Silver (Sn/Ag)	BOTTOM	2.46 mm	31 mm		YES	64		40	260	31 mm	CMOS		1 V			1 mm	FIXED POINT	S-PBGA-B689	3		1067 rpm	YES	e2
MPC8377ECVRALFA	NXP Semiconductors	MICROPROCESSOR	AUTOMOTIVE	BALL	689	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	15			GRID ARRAY, HEAT SINK/SLUG		.95 V	125 Cel		-40 Cel		BOTTOM	2.46 mm	31 mm		YES	64				31 mm	CMOS		1 V			1 mm	FLOATING POINT	S-PBGA-B689			667 rpm	YES
MPC8377CVRALF	NXP Semiconductors	MICROPROCESSOR	AUTOMOTIVE	BALL	689	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	15			GRID ARRAY, HEAT SINK/SLUG		.95 V	125 Cel		-40 Cel		BOTTOM	2.46 mm	31 mm		YES	64				31 mm	CMOS		1 V			1 mm	FLOATING POINT	S-PBGA-B689			667 rpm	YES
MCIMX6DP4AVT1AB	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.5 V				GRID ARRAY, FINE PITCH		1.35 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm	21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE				40	260	21 mm	CMOS					.8 mm		S-PBGA-B624	3				e1
MPC8378ECVRAJFA	NXP Semiconductors	MICROPROCESSOR	AUTOMOTIVE	BALL	689	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	15	32	1,1.8/2.5,2.5/3.3	GRID ARRAY, HEAT SINK/SLUG	BGA689,29X29,40	.95 V	125 Cel		-40 Cel	TIN SILVER	BOTTOM	2.46 mm	31 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	64	66.66 MHz	40	260	31 mm	CMOS		1 V		Microprocessors	1 mm	FLOATING POINT	S-PBGA-B689	3	Not Qualified	533 rpm	YES	e2
P1021SXE2DFB	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	0	32		GRID ARRAY		.95 V	125 Cel		-40 Cel	TIN SILVER	BOTTOM	2.46 mm	31 mm		YES	0	100 MHz			31 mm	CMOS		1 V			1 mm	FIXED POINT	S-PBGA-B689			533 rpm	YES	e2
MPC8377CVRAGFA	NXP Semiconductors	MICROPROCESSOR	AUTOMOTIVE	BALL	689	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	15	32		GRID ARRAY, HEAT SINK/SLUG	BGA689,29X29,40	.95 V	125 Cel	8	-40 Cel		BOTTOM	2.46 mm	31 mm		YES	64				31 mm	CMOS	.03 mA	1 V	4		1 mm	FLOATING POINT	S-PBGA-B689			400 rpm	YES
MCIMX6U1AVM10AC	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.5 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.4 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE				40	260	21 mm	CMOS					.8 mm		S-PBGA-B624	3				e1
P1021NXN2FFB	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	0	32		GRID ARRAY		.95 V	125 Cel		-40 Cel	TIN SILVER	BOTTOM	2.46 mm	31 mm		YES	0	100 MHz	40	260	31 mm	CMOS		1 V			1 mm	FIXED POINT	S-PBGA-B689	3		667 rpm	YES	e2
P2041NXE7MMC	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	780	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.89 V	16			GRID ARRAY	BGA780,28X28,32	1.71 V	105 Cel	12	-40 Cel	TIN SILVER COPPER	BOTTOM	2.51 mm	23 mm	ALSO OPERATES WITH 2.5V NOM AND 3.3V NOM SUPPLY	YES	64		30	245	23 mm	CMOS		1.8 V	4		.8 mm	FIXED POINT	S-PBGA-B780	3		1200 rpm	YES	e1
P1021NXN2DFB	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	0	32		GRID ARRAY		.95 V	125 Cel		-40 Cel	TIN SILVER	BOTTOM	2.46 mm	31 mm		YES	0	100 MHz	40	260	31 mm	CMOS		1 V			1 mm	FIXED POINT	S-PBGA-B689	3		533 rpm	YES	e2
MCIMX6U6AVM10AD	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V	16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.4 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	YES	64		40	260	21 mm	CMOS					.8 mm	FLOATING POINT	S-PBGA-B624	3		1000 rpm	YES	e1
P1021SXN2DFB	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	0	32		GRID ARRAY		.95 V	125 Cel		-40 Cel	TIN SILVER	BOTTOM	2.46 mm	31 mm		YES	0	100 MHz			31 mm	CMOS		1 V			1 mm	FIXED POINT	S-PBGA-B689			533 rpm	YES	e2
MPC8377CVRANF	NXP Semiconductors	MICROPROCESSOR	AUTOMOTIVE	BALL	689	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V	15			GRID ARRAY, HEAT SINK/SLUG		1 V	125 Cel		-40 Cel		BOTTOM	2.46 mm	31 mm		YES	64				31 mm	CMOS		1.05 V			1 mm	FLOATING POINT	S-PBGA-B689			800 rpm	YES
MPC8378ECVRAND	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	689	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V	15			GRID ARRAY, HEAT SINK/SLUG	BGA689,29X29,40	1 V	125 Cel	8	-40 Cel		BOTTOM	2.46 mm	31 mm		YES	64				31 mm	CMOS		1.05 V	4		1 mm	FLOATING POINT	S-PBGA-B689			800 rpm	YES
XMC4300-F100K256	Infineon Technologies	MICROPROCESSOR, RISC	AUTOMOTIVE	GULL WING	100	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	YES			32		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH			125 Cel		-40 Cel		QUAD	1.6 mm	14 mm		YES		40 MHz			14 mm	CMOS		1.3 V			.5 mm	FLOATING POINT	S-PQFP-G100			144 rpm	YES
R7S910015CBG#AC0	Renesas Electronics	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	320	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	26	32		GRID ARRAY		1.14 V	125 Cel		-40 Cel		BOTTOM				YES	32					CMOS		1.2 V				FLOATING POINT	S-PBGA-B320	3		450 rpm	YES
R7S910002CBG#AC0	Renesas Electronics	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	320	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	26	32		GRID ARRAY		1.14 V	125 Cel		-40 Cel		BOTTOM				YES	32					CMOS		1.2 V				FLOATING POINT	S-PBGA-B320	3		450 rpm	YES
R7S910035CBG#AC0	Renesas Electronics	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	320	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	26	32		GRID ARRAY		1.14 V	125 Cel		-40 Cel		BOTTOM				YES	32					CMOS		1.2 V				FLOATING POINT	S-PBGA-B320	3		300 rpm	YES
R7S910018CBG#AC0	Renesas Electronics	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	320	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	26	32		GRID ARRAY		1.14 V	125 Cel		-40 Cel		BOTTOM				YES	32					CMOS		1.2 V				FLOATING POINT	S-PBGA-B320	3		600 rpm	YES

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.