AUTOMOTIVE Microprocessors 282

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Screening Level	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	No. of Serial I/Os	Sub-Category	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code
AM1707CZKBT3	Texas Instruments	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V			13	32	1.2,1.8/3.3	GRID ARRAY	BGA256,16X16,40	1.14 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.05 mm		17 mm		YES	32	50 MHz	30	260	17 mm	CMOS		1.2 V			Microprocessors	1 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	375 rpm	YES	e1
TDA2HGBRQAASQ1	Texas Instruments	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	625	FBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.2 V		AEC-Q100	16	32		GRID ARRAY, FINE PITCH		1.11 V	125 Cel		-40 Cel		BOTTOM	2.95 mm		17 mm		YES	32	38.4 MHz			17 mm	CMOS		1.15 V				.65 mm	FLOATING POINT	S-PBGA-B625			750 rpm	YES
TDA2HGBDQABCQ1	Texas Instruments	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	625	BGA	UNSPECIFIED	PLASTIC/EPOXY	NO	YES	1.2 V		AEC-Q100	16	32		GRID ARRAY		1.11 V	125 Cel		-40 Cel		BOTTOM					YES	32	38.4 MHz				CMOS		1.15 V					FLOATING POINT	X-PBGA-B625			500 rpm	YES
TDA2HGBDQAASRQ1	Texas Instruments	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	625	FBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.2 V		AEC-Q100	16	32		GRID ARRAY, FINE PITCH		1.11 V	125 Cel		-40 Cel		BOTTOM	2.95 mm		17 mm		YES	32	38.4 MHz			17 mm	CMOS		1.15 V				.65 mm	FLOATING POINT	S-PBGA-B625			500 rpm	YES
TDA2HABDQAASRQ1	Texas Instruments	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	625	FBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.2 V		AEC-Q100	16	32		GRID ARRAY, FINE PITCH		1.11 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.95 mm		17 mm		YES	32	38.4 MHz	30	250	17 mm	CMOS		1.15 V				.65 mm	FLOATING POINT	S-PBGA-B625	4		500 rpm	YES	e1
TDA2HGBRQABCQ1	Texas Instruments	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	625	BGA	UNSPECIFIED	PLASTIC/EPOXY	NO	YES	1.2 V		AEC-Q100	16	32		GRID ARRAY		1.11 V	125 Cel		-40 Cel		BOTTOM					YES	32	38.4 MHz				CMOS		1.15 V					FLOATING POINT	X-PBGA-B625			750 rpm	YES
XDRA804MX6GACDQ1	Texas Instruments	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	784	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		AEC-Q100	28			GRID ARRAY, LOW PROFILE, FINE PITCH		.95 V	125 Cel		-40 Cel		BOTTOM	1.63 mm		23 mm		YES	16				23 mm	CMOS		1 V				.8 mm	FLOATING POINT	S-PBGA-B784			1100 rpm	YES
TDA2LFBFQABCQ1	Texas Instruments	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	625	BGA	UNSPECIFIED	PLASTIC/EPOXY	NO	YES	1.2 V		AEC-Q100	16	32		GRID ARRAY		1.11 V	125 Cel		-40 Cel		BOTTOM					YES	32	38.4 MHz				CMOS		1.15 V					FLOATING POINT	X-PBGA-B625			650 rpm	YES
TDA2HGBRQAASRQ1	Texas Instruments	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	625	FBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.2 V		AEC-Q100	16	32		GRID ARRAY, FINE PITCH		1.11 V	125 Cel		-40 Cel		BOTTOM	2.95 mm		17 mm		YES	32	38.4 MHz			17 mm	CMOS		1.15 V				.65 mm	FLOATING POINT	S-PBGA-B625			750 rpm	YES
TDA2HVBDQABCQ1	Texas Instruments	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	625	BGA	UNSPECIFIED	PLASTIC/EPOXY	NO	YES	1.2 V		AEC-Q100	16	32		GRID ARRAY		1.11 V	125 Cel		-40 Cel		BOTTOM					YES	32	38.4 MHz				CMOS		1.15 V					FLOATING POINT	X-PBGA-B625			500 rpm	YES
TDA2HABDQAASQ1	Texas Instruments	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	625	FBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.2 V		AEC-Q100	16	32		GRID ARRAY, FINE PITCH		1.11 V	125 Cel		-40 Cel		BOTTOM	2.95 mm		17 mm		YES	32	38.4 MHz			17 mm	CMOS		1.15 V				.65 mm	FLOATING POINT	S-PBGA-B625			500 rpm	YES
XDRA821AXXGALM	Texas Instruments	MICROPROCESSOR	AUTOMOTIVE	BALL	433	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	.84 V	16		0	64		GRID ARRAY, FINE PITCH	BGA433,21X21,32	.76 V	125 Cel	1	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	2.57 mm	524288	17.2 mm		YES	32	27 MHz			17.2 mm	CMOS		.8 V				.8 mm	FIXED POINT	S-PBGA-B433			2000 rpm	YES	e1
TDA2HABRQAASRQ1	Texas Instruments	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	625	FBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.2 V		AEC-Q100	16	32		GRID ARRAY, FINE PITCH		1.11 V	125 Cel		-40 Cel		BOTTOM	2.95 mm		17 mm		YES	32	38.4 MHz			17 mm	CMOS		1.15 V				.65 mm	FLOATING POINT	S-PBGA-B625			750 rpm	YES
AM1707BZKBT3	Texas Instruments	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	256	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V			16	32	1.2,1.8/3.3	GRID ARRAY, FINE PITCH	BGA256,16X16,40	1.14 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.05 mm		17 mm		YES	16	20 MHz	30	260	17 mm	CMOS		1.2 V			Microprocessors	.5 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	375 rpm	YES	e1
TDA2HGBDQAASQ1	Texas Instruments	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	625	FBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.2 V		AEC-Q100	16	32		GRID ARRAY, FINE PITCH		1.11 V	125 Cel		-40 Cel		BOTTOM	2.95 mm		17 mm		YES	32	38.4 MHz			17 mm	CMOS		1.15 V				.65 mm	FLOATING POINT	S-PBGA-B625			500 rpm	YES
XDRA829VXXGALF	Texas Instruments	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	827	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	.84 V	8		0	64		GRID ARRAY, FINE PITCH	BGA827,29X29,32	.77 V	125 Cel		-40 Cel		BOTTOM	2.8 mm	524288	24 mm		YES	32	27 MHz			24 mm	CMOS		.8 V				.8 mm	FIXED POINT	S-PBGA-B827			2000 rpm	YES
ADSP-BF609-ENG	Analog Devices	MICROPROCESSOR	AUTOMOTIVE	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V						GRID ARRAY, LOW PROFILE, FINE PITCH		1.7 V	125 Cel		-40 Cel		BOTTOM	1.5 mm		19 mm	ALSO AVAILABLE IN 3.3V	YES					19 mm	CMOS		1.8 V				.8 mm		S-PBGA-B349			500 rpm	YES
STM32MP151AAD3T	STMicroelectronics	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	257	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.25 V	8			32		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA257,19X19,25/20	1.18 V	125 Cel		-40 Cel		BOTTOM	1.2 mm	724992	10 mm	"TERM PITCH-MAX"	YES		48 MHz	NOT SPECIFIED	NOT SPECIFIED	10 mm	CMOS	100 mA	1.2 V	48	8		.65 mm	FLOATING-POINT	S-PBGA-B257			650 rpm	YES
S9S08RN16W2MLC	NXP Semiconductors	MICROPROCESSOR	AUTOMOTIVE	GULL WING	32	LQFP	SQUARE	PLASTIC/EPOXY	NO	YES	5.5 V	8		0	8		FLATPACK, LOW PROFILE	QFP32,.35SQ,32	2.7 V	125 Cel	8	-40 Cel	TIN	QUAD	1.6 mm	2048	7 mm		NO	0	20 MHz	40	260	7 mm	CMOS	14 mA	3 V		2		.8 mm	FIXED POINT	S-PQFP-G32	3		20 rpm	YES	e3
PCIMX536AVV8C	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V			26	32		GRID ARRAY, FINE PITCH		1.05 V	125 Cel		-40 Cel		BOTTOM	1.85 mm		19 mm		YES	32	27 MHz			19 mm	CMOS		1.1 V				.8 mm	FLOATING POINT	S-PBGA-B529	3	Not Qualified	800 rpm	YES
S9S08RN48W1MLF	NXP Semiconductors	MICROPROCESSOR	AUTOMOTIVE	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	NO	YES	5.5 V	8		0	8		FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	2.7 V	125 Cel	16	-40 Cel	MATTE TIN	QUAD	1.6 mm	4096	7 mm		NO	0	20 MHz	40	260	7 mm	CMOS	14.8 mA	3 V		3		.5 mm	FIXED POINT	S-PQFP-G48	3		20 rpm	YES	e3
S9S08RN16W2MTG	NXP Semiconductors	MICROPROCESSOR	AUTOMOTIVE	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	5.5 V	8		0	8		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP16,.25	2.7 V	125 Cel	8	-40 Cel	TIN	DUAL	1.2 mm	2048	4.4 mm		NO	0	20 MHz	40	260	5 mm	CMOS	14 mA	3 V		1		.65 mm	FIXED POINT	R-PDSO-G16	3		20 rpm	YES	e3
S9S08RN8W2MLF	NXP Semiconductors	MICROPROCESSOR	AUTOMOTIVE	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	NO	YES	5.5 V	8		0	8		FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	2.7 V	125 Cel	8	-40 Cel	TIN	QUAD	1.6 mm	2048	7 mm		NO	0	20 MHz	40	260	7 mm	CMOS	14 mA	3 V		2		.5 mm	FIXED POINT	S-PQFP-G48	3		20 rpm	YES	e3
S9S08RN32W1MLF	NXP Semiconductors	MICROPROCESSOR	AUTOMOTIVE	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	NO	YES	5.5 V	8		0	8		FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	2.7 V	125 Cel	16	-40 Cel	MATTE TIN	QUAD	1.6 mm	4096	7 mm		NO	0	20 MHz	40	260	7 mm	CMOS	14.8 mA	3 V		3		.5 mm	FIXED POINT	S-PQFP-G48	3		20 rpm	YES	e3
S9S08RN16W2MTJ	NXP Semiconductors	MICROPROCESSOR	AUTOMOTIVE	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	5.5 V	8		0	8		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP20,.25	2.7 V	125 Cel	8	-40 Cel	TIN	DUAL	1.2 mm	2048	4.4 mm		NO	0	20 MHz	40	260	6.5 mm	CMOS	14 mA	3 V		1		.65 mm	FIXED POINT	R-PDSO-G20	3		20 rpm	YES	e3
P2010NXN2HFC	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V			32			GRID ARRAY		1 V	125 Cel		-40 Cel	TIN SILVER	BOTTOM	2.46 mm		31 mm		YES	16	100 MHz	40	260	31 mm	CMOS		1.05 V				1 mm	FLOATING POINT	S-PBGA-B689	3		800 rpm	YES	e2
S9S08RN48W1MLH	NXP Semiconductors	MICROPROCESSOR	AUTOMOTIVE	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	NO	YES	5.5 V	8		0	8		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	2.7 V	125 Cel	16	-40 Cel	MATTE TIN	QUAD	1.6 mm	4096	10 mm		NO	0	20 MHz	40	260	10 mm	CMOS	14.8 mA	3 V		3		.5 mm	FIXED POINT	S-PQFP-G64	3		20 rpm	YES	e3
S9S08RN8W2MLC	NXP Semiconductors	MICROPROCESSOR	AUTOMOTIVE	GULL WING	32	LQFP	SQUARE	PLASTIC/EPOXY	NO	YES	5.5 V	8		0	8		FLATPACK, LOW PROFILE	QFP32,.35SQ,32	2.7 V	125 Cel	8	-40 Cel	TIN	QUAD	1.6 mm	2048	7 mm		NO	0	20 MHz	40	260	7 mm	CMOS	14 mA	3 V		2		.8 mm	FIXED POINT	S-PQFP-G32	3		20 rpm	YES	e3
S9S08RN60W1MLF	NXP Semiconductors	MICROPROCESSOR	AUTOMOTIVE	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	NO	YES	5.5 V	8		0	8		FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	2.7 V	125 Cel	16	-40 Cel	MATTE TIN	QUAD	1.6 mm	4096	7 mm		NO	0	20 MHz	40	260	7 mm	CMOS	14.8 mA	3 V		3		.5 mm	FIXED POINT	S-PQFP-G48	3		20 rpm	YES	e3
S9S08RN48W1MLC	NXP Semiconductors	MICROPROCESSOR	AUTOMOTIVE	GULL WING	32	LQFP	SQUARE	PLASTIC/EPOXY	NO	YES	5.5 V	8		0	8		FLATPACK, LOW PROFILE	QFP32,.35SQ,32	2.7 V	125 Cel	12	-40 Cel	MATTE TIN	QUAD	1.6 mm	4096	7 mm		NO	0	20 MHz	40	260	7 mm	CMOS	14.8 mA	3 V		2		.8 mm	FIXED POINT	S-PQFP-G32	3		20 rpm	YES	e3
S9S08RN8W2MTG	NXP Semiconductors	MICROPROCESSOR	AUTOMOTIVE	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	5.5 V	8		0	8		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP16,.25	2.7 V	125 Cel	8	-40 Cel	TIN	DUAL	1.2 mm	2048	4.4 mm		NO	0	20 MHz	40	260	5 mm	CMOS	14 mA	3 V		1		.65 mm	FIXED POINT	R-PDSO-G16	3		20 rpm	YES	e3
S9S08RN60W1MLC	NXP Semiconductors	MICROPROCESSOR	AUTOMOTIVE	GULL WING	32	LQFP	SQUARE	PLASTIC/EPOXY	NO	YES	5.5 V	8		0	8		FLATPACK, LOW PROFILE	QFP32,.35SQ,32	2.7 V	125 Cel	12	-40 Cel	MATTE TIN	QUAD	1.6 mm	4096	7 mm		NO	0	20 MHz	40	260	7 mm	CMOS	14.8 mA	3 V		2		.8 mm	FIXED POINT	S-PQFP-G32	3		20 rpm	YES	e3
S9S08RN60W1MLH	NXP Semiconductors	MICROPROCESSOR	AUTOMOTIVE	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	NO	YES	5.5 V	8		0	8		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	2.7 V	125 Cel	16	-40 Cel	MATTE TIN	QUAD	1.6 mm	4096	10 mm		NO	0	20 MHz	40	260	10 mm	CMOS	14.8 mA	3 V		3		.5 mm	FIXED POINT	S-PQFP-G64	3		20 rpm	YES	e3
S9S08RN8W2MTJ	NXP Semiconductors	MICROPROCESSOR	AUTOMOTIVE	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	5.5 V	8		0	8		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP20,.25	2.7 V	125 Cel	8	-40 Cel	TIN	DUAL	1.2 mm	2048	4.4 mm		NO	0	20 MHz	40	260	6.5 mm	CMOS	14 mA	3 V		1		.65 mm	FIXED POINT	R-PDSO-G20	3		20 rpm	YES	e3
S9S08RN16W2MLF	NXP Semiconductors	MICROPROCESSOR	AUTOMOTIVE	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	NO	YES	5.5 V	8		0	8		FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	2.7 V	125 Cel	8	-40 Cel	TIN	QUAD	1.6 mm	2048	7 mm		NO	0	20 MHz	40	260	7 mm	CMOS	14 mA	3 V		2		.5 mm	FIXED POINT	S-PQFP-G48	3		20 rpm	YES	e3
S9S08RN32W1MLH	NXP Semiconductors	MICROPROCESSOR	AUTOMOTIVE	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	NO	YES	5.5 V	8		0	8		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	2.7 V	125 Cel	16	-40 Cel	MATTE TIN	QUAD	1.6 mm	4096	10 mm		NO	0	20 MHz	40	260	10 mm	CMOS	14.8 mA	3 V		3		.5 mm	FIXED POINT	S-PQFP-G64	3		20 rpm	YES	e3
C5ENPA1-DS/D	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	840	HBGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	YES	1.26 V			12	32		GRID ARRAY, HEAT SINK/SLUG		1.14 V	125 Cel		-40 Cel		BOTTOM	3.55 mm		30.8 mm		YES	139	266 MHz			30.8 mm	CMOS		1.2 V				1 mm	FIXED POINT	S-CBGA-B840			266 rpm	NO
C3ENPB0-DS	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	728	HBGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	YES	1.26 V			12	32		GRID ARRAY, HEAT SINK/SLUG		1.14 V	125 Cel		-40 Cel		BOTTOM	3.39 mm		28.8 mm		YES	139	180 MHz			28.8 mm	CMOS		1.2 V				1 mm	FIXED POINT	S-CBGA-B728			180 rpm	NO
C3ENPA1-DS/D	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	728	HBGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	YES	1.2 V			12	32		GRID ARRAY, HEAT SINK/SLUG		1.04 V	125 Cel		-40 Cel		BOTTOM	3.39 mm		28 mm		YES	139	180 MHz			28 mm	CMOS		1.16 V				1 mm	FIXED POINT	S-CBGA-B728			180 rpm	NO
C5ENPB0-DS	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	840	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	YES	1.31 V			12	32		GRID ARRAY		1.19 V	125 Cel		-40 Cel		BOTTOM	3.55 mm		30.8 mm		YES	139	300 MHz			30.8 mm	CMOS		1.25 V				1 mm	FIXED POINT	S-CBGA-B840			300 rpm	NO
MPC8379CVRAJFA	NXP Semiconductors	MICROPROCESSOR	AUTOMOTIVE	BALL	689	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V			15	32	1,1.8/2.5,2.5/3.3	GRID ARRAY, HEAT SINK/SLUG	BGA689,29X29,40	.95 V	125 Cel		-40 Cel		BOTTOM	2.46 mm		31 mm		YES	64				31 mm	CMOS		1 V			Microprocessors	1 mm	FLOATING POINT	S-PBGA-B689		Not Qualified	533 rpm	YES
MPC8379ECVRALGA	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	689	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V			15	32	1,1.8/2.5,2.5/3.3	GRID ARRAY, HEAT SINK/SLUG	BGA689,29X29,40	.95 V	125 Cel	8	-40 Cel	TIN SILVER	BOTTOM	2.46 mm		31 mm		YES	64		40	260	31 mm	CMOS		1 V	4		Microprocessors	1 mm	FLOATING POINT	S-PBGA-B689	3	Not Qualified	667 rpm	YES	e2
MPC8377CVRALGA	NXP Semiconductors	MICROPROCESSOR	AUTOMOTIVE	BALL	689	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V			15	32	1,1.8/2.5,2.5/3.3	GRID ARRAY, HEAT SINK/SLUG	BGA689,29X29,40	.95 V	125 Cel		-40 Cel	TIN SILVER	BOTTOM	2.46 mm		31 mm		YES	64		40	260	31 mm	CMOS		1 V			Microprocessors	1 mm	FLOATING POINT	S-PBGA-B689	3	Not Qualified	667 rpm	YES	e2
P1013SXN2HFB	NXP Semiconductors	MICROPROCESSOR	AUTOMOTIVE	BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V			0	32		GRID ARRAY		.95 V	125 Cel		-40 Cel	TIN SILVER	BOTTOM	2.46 mm		31 mm		YES	0	133 MHz			31 mm	CMOS		1 V				1 mm	FLOATING POINT	S-PBGA-B689			800 rpm	YES	e2
MCIMX6D6AVT10ADR	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES					32		GRID ARRAY, FINE PITCH			125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm		21 mm	64-BIT BUS WIDTH AVAILABLE	YES			40	260	21 mm	CMOS						.8 mm	FIXED POINT	S-PBGA-B624	3		1000 rpm	NO	e1
P2041NSE1NNB	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	780	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.89 V			16			GRID ARRAY	BGA780,28X28,32	1.71 V	105 Cel	12	0 Cel		BOTTOM	2.51 mm		23 mm	ALSO OPERATES WITH 2.5V NOM AND 3.3V NOM SUPPLY	YES	64				23 mm	CMOS		1.8 V	4			.8 mm	FIXED POINT	S-PBGA-B780			1333 rpm	YES
P1013SXN2HFA	NXP Semiconductors	MICROPROCESSOR	AUTOMOTIVE	BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V			0	32		GRID ARRAY		.95 V	125 Cel		-40 Cel	TIN SILVER	BOTTOM	2.46 mm		31 mm		YES	0	133 MHz			31 mm	CMOS		1 V				1 mm	FLOATING POINT	S-PBGA-B689			800 rpm	YES	e2
MPC8378ECVRALG	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	689	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V			15			GRID ARRAY, HEAT SINK/SLUG	BGA689,29X29,40	.95 V	125 Cel	8	-40 Cel		BOTTOM	2.46 mm		31 mm		YES	64				31 mm	CMOS		1 V	4			1 mm	FLOATING POINT	S-PBGA-B689			667 rpm	YES

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.