Freescale Semiconductor Microprocessors 46

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	CPU Family	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	RAM Bytes	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of Serial I/Os	Sub-Category	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code
MCF5372LCVM240J	Freescale Semiconductor	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	196	BGA	SQUARE	PLASTIC/EPOXY		YES			32	1.5,3.3	GRID ARRAY	BGA196,14X14,40		85 Cel		-40 Cel	TIN SILVER COPPER OVER NICKEL	BOTTOM							40	260			CMOS				Microprocessors	1 mm		S-PBGA-B196	3	Not Qualified	240 rpm
MCF5329CVM240J	Freescale Semiconductor	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY		YES			32	1.5,1.8/3.3	GRID ARRAY	BGA256,16X16,40		85 Cel		-40 Cel	TIN SILVER COPPER OVER NICKEL	BOTTOM							40	260							Microprocessors	1 mm		S-PBGA-B256	3	Not Qualified	240 rpm
KMPC8270CVRMIBA	Freescale Semiconductor	MICROPROCESSOR, RISC		BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V	32	32		GRID ARRAY		1.45 V				TIN SILVER	BOTTOM	2.55 mm	27 mm		YES	64	266 MHz	30	245	27 mm		CMOS		1.5 V			1 mm	FLOATING POINT	S-PBGA-B516	3	Not Qualified	66.67 rpm	NO	e2
MPC8569EVTAUNLB	Freescale Semiconductor	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.133 V	16	32	1.1,2.5/3.3	GRID ARRAY, HEAT SINK/SLUG	BGA783,28X28,40	1.067 V				TIN SILVER COPPER OVER NICKEL	BOTTOM	3.94 mm	29 mm		YES	64	133 MHz	30	245	29 mm		CMOS		1.1 V		Microprocessors	1 mm	FLOATING POINT	S-PBGA-B783	3	Not Qualified	1333 rpm	YES
MPC8321VRADDC	Freescale Semiconductor	MICROPROCESSOR, RISC	OTHER	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	0	32	1,1.8/2.5,3.3	GRID ARRAY	BGA516,26X26,40	.95 V	105 Cel		0 Cel	TIN SILVER	BOTTOM	2.55 mm	27 mm		YES	0	66.67 MHz	40	260	27 mm		CMOS		1 V		Microprocessors	1 mm	FIXED POINT	S-PBGA-B516	3	Not Qualified	266 rpm	YES	e2
MCF5328CVM240J	Freescale Semiconductor	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V	24	32	1.5,1.8/3.3	GRID ARRAY, LOW PROFILE	BGA256,16X16,40	1.4 V	85 Cel		-40 Cel	TIN SILVER COPPER OVER NICKEL	BOTTOM	1.6 mm	17 mm		YES	32	80 MHz	40	260	17 mm		CMOS		1.5 V		Microprocessors	1 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	240 rpm	YES
KMPC8270VRMIBA	Freescale Semiconductor	MICROPROCESSOR, RISC	COMMERCIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V	32	32		GRID ARRAY		1.45 V	70 Cel		0 Cel	TIN SILVER	BOTTOM	2.55 mm	27 mm		YES	64	266 MHz	30	245	27 mm		CMOS		1.5 V			1 mm	FLOATING POINT	S-PBGA-B516	3	Not Qualified	66.67 rpm	NO	e2
MPC823VR81B2T	Freescale Semiconductor	MICROPROCESSOR, RISC																			Tin/Silver/Copper (Sn/Ag/Cu)								40	260			CMOS								3				e1
MCF5373LCVM240J	Freescale Semiconductor	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	196	BGA	SQUARE	PLASTIC/EPOXY		YES			32	1.5,3.3	GRID ARRAY	BGA196,14X14,40		85 Cel		-40 Cel	TIN SILVER COPPER OVER NICKEL	BOTTOM							40	260			CMOS				Microprocessors	1 mm		S-PBGA-B196	3	Not Qualified	240 rpm
MC68HC000EI8	Freescale Semiconductor	MICROPROCESSOR, RISC	COMMERCIAL	J BEND	68	QCCJ	SQUARE	PLASTIC/EPOXY		YES			32	5	CHIP CARRIER	LDCC68,1.0SQ		70 Cel		0 Cel	MATTE TIN	QUAD							30	245			CMOS	25 mA	5 V		Microprocessors	1.27 mm		S-PQCC-J68	3	Not Qualified	8 rpm		e3
MCF5206AB33A	Freescale Semiconductor	MICROPROCESSOR, RISC	COMMERCIAL	GULL WING	160	QFP	SQUARE	PLASTIC/EPOXY	YES	YES	5.25 V	28	32		FLATPACK		4.75 V	70 Cel		0 Cel	MATTE TIN	QUAD	3.85 mm	28 mm		YES	32	33.33 MHz	30	245	28 mm		CMOS		5 V			.65 mm	FIXED POINT	S-PQFP-G160	3	Not Qualified	33.33 rpm	YES	e3
MPC8540VT833LB	Freescale Semiconductor	MICROPROCESSOR	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	64	32	1.2,2.5/3.3	GRID ARRAY	BGA783,28X28,40	1.14 V	105 Cel		0 Cel	Tin/Silver (Sn/Ag)	BOTTOM	3.85 mm	29 mm		YES	64	166 MHz	40	260	29 mm		CMOS		1.2 V		Microprocessors	1 mm	FIXED POINT	S-PBGA-B783	3	Not Qualified	667 rpm	YES	e2
MCF53281CVM240J	Freescale Semiconductor	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY		YES			32	1.5,1.8/3.3	GRID ARRAY	BGA256,16X16,40		85 Cel		-40 Cel	TIN SILVER COPPER OVER NICKEL	BOTTOM							40	260							Microprocessors	1 mm		S-PBGA-B256	3	Not Qualified	240 rpm
KMPC8270CZUQLDA	Freescale Semiconductor	MICROPROCESSOR, RISC		BALL	480	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V	32	32		GRID ARRAY, LOW PROFILE		1.45 V					BOTTOM	1.65 mm	37.5 mm		YES	64	83.33 MHz	40	260	37.5 mm		CMOS		1.5 V			1.27 mm	FLOATING POINT	S-PBGA-B480	4	Not Qualified	333 rpm	NO
MPC8544CVTALF	Freescale Semiconductor	MICROPROCESSOR		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	0	32		GRID ARRAY, HEAT SINK/SLUG		.95 V				TIN SILVER	BOTTOM	2.8 mm	29 mm		YES	0	133 MHz	40	260	29 mm		CMOS		1 V			1 mm	FLOATING POINT	S-PBGA-B783	3		667 rpm	YES	e2
MPC8544CVTAQG	Freescale Semiconductor	MICROPROCESSOR		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	0	32		GRID ARRAY, HEAT SINK/SLUG		.95 V				TIN SILVER	BOTTOM	2.8 mm	29 mm		YES	0	133 MHz	40	260	29 mm		CMOS		1 V			1 mm	FLOATING POINT	S-PBGA-B783	3		1000 rpm	YES	e2
KMPC852TVR100A	Freescale Semiconductor	MICROPROCESSOR, RISC		BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V	32	32		GRID ARRAY		1.7 V				TIN SILVER COPPER	BOTTOM	2.54 mm	23 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	66 MHz	30	245	23 mm		CMOS		1.8 V			1.27 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	100 rpm	YES	e1
KMPC8347EVRAGDB	Freescale Semiconductor	MICROPROCESSOR		BALL	620	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	32	32		GRID ARRAY		1.14 V				Tin/Silver (Sn/Ag)	BOTTOM	2.46 mm	29 mm		YES	32	66 MHz	40	260	29 mm		CMOS		1.2 V			1 mm	FLOATING POINT	S-PBGA-B620	3	Not Qualified	400 rpm	YES	e2
KMPC885VR133	Freescale Semiconductor	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V	32	32	1.8,3.3	GRID ARRAY	BGA357,19X19,50	1.7 V				TIN SILVER COPPER	BOTTOM	2.52 mm	25 mm		YES	32		40	260	25 mm		CMOS		1.8 V		Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	133 rpm	YES	e1
KMC7448VU1267ND	Freescale Semiconductor	MICROPROCESSOR, RISC	OTHER	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.15 V	36	32		GRID ARRAY		1.05 V	105 Cel		0 Cel		BOTTOM	2.8 mm	25 mm	LOW POWER TAKEN FROM SLEEP MODE	YES	64	200 MHz	40	260	25 mm		CMOS		1.1 V			1.27 mm	FLOATING POINT	S-CBGA-B360	1	Not Qualified	1267 rpm	YES
KMPC8270CZQMIBA	Freescale Semiconductor	MICROPROCESSOR, RISC		BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V	32	32		GRID ARRAY		1.45 V				Tin/Lead/Silver (Sn/Pb/Ag)	BOTTOM	2.55 mm	27 mm		YES	64	266 MHz	30	245	27 mm		CMOS		1.5 V			1 mm	FLOATING POINT	S-PBGA-B516	3	Not Qualified	66.67 rpm	NO	e0
MC68EC000EI10	Freescale Semiconductor	MICROPROCESSOR, RISC	COMMERCIAL	J BEND	68	QCCJ	SQUARE	PLASTIC/EPOXY		YES			32	5	CHIP CARRIER	LDCC68,1.0SQ		70 Cel		0 Cel	MATTE TIN	QUAD							30	245			CMOS	30 mA	5 V		Microprocessors	1.27 mm		S-PQCC-J68	2	Not Qualified	10 rpm		e3
KMPC8347VVAJFB	Freescale Semiconductor	MICROPROCESSOR	OTHER	BALL	672	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	32	32		GRID ARRAY, LOW PROFILE		1.14 V	105 Cel		0 Cel	Tin/Silver (Sn/Ag)	BOTTOM	1.69 mm	35 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz	40	260	35 mm		CMOS		1.2 V			1 mm	FLOATING POINT	S-PBGA-B672	3	Not Qualified	533 rpm	YES	e2
MCF5270VM100J	Freescale Semiconductor	MICROPROCESSOR, RISC	COMMERCIAL	BALL	196	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V	24	32	1.5,3.3	GRID ARRAY, LOW PROFILE	BGA196,14X14,40	1.4 V	70 Cel		0 Cel	TIN SILVER COPPER OVER NICKEL	BOTTOM	1.6 mm	15 mm		YES	32		40	260	15 mm		CMOS				Microprocessors	1 mm	FIXED POINT	S-PBGA-B196	3	Not Qualified	100 rpm	YES
MCF5271CVM100J	Freescale Semiconductor	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	196	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V	24	32	1.5,3.3	GRID ARRAY, LOW PROFILE	BGA196,14X14,40	1.4 V	85 Cel		-40 Cel	TIN SILVER COPPER OVER NICKEL	BOTTOM	1.6 mm	15 mm		YES	32		40	260	15 mm		CMOS				Microprocessors	1 mm	FIXED POINT	S-PBGA-B196	3	Not Qualified	100 rpm	YES
MPC8547ECHXAUJ	Freescale Semiconductor	MICROPROCESSOR		BALL	783	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.155 V	64	32	1.2,2.5/3.3	GRID ARRAY	BGA783,28X28,40	1.045 V				TIN LEAD SILVER	BOTTOM	3.38 mm	29 mm		YES	64	133 MHz	40	260	29 mm		CMOS		1.1 V		Microprocessors	1 mm	FLOATING POINT	S-CBGA-B783	1	Not Qualified	1333 rpm	YES	e0
KMPC8275CVRMIBA	Freescale Semiconductor	MICROPROCESSOR, RISC		BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V	32	32		GRID ARRAY		1.45 V				TIN SILVER	BOTTOM	2.55 mm	27 mm		YES	64	266 MHz	30	245	27 mm		CMOS		1.5 V			1 mm	FLOATING POINT	S-PBGA-B516	3	Not Qualified	66.67 rpm	NO	e2
KMPC8343CVRAGDB	Freescale Semiconductor	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	620	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	32	32		GRID ARRAY		1.14 V	105 Cel		-40 Cel	TIN SILVER	BOTTOM	2.46 mm	29 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz	40	260	29 mm		CMOS		1.2 V			1 mm	FLOATING POINT	S-PBGA-B620	3	Not Qualified	400 rpm	YES	e2
MC68HC000EI16	Freescale Semiconductor	MICROPROCESSOR	COMMERCIAL	J BEND	68	QCCJ	SQUARE	PLASTIC/EPOXY	NO	YES	5.25 V	24	16		CHIP CARRIER		4.75 V	70 Cel		0 Cel	MATTE TIN	QUAD	4.57 mm	24.2 mm		NO	16	20 MHz	30	245	24.2 mm		HCMOS		5 V			1.27 mm	FIXED POINT	S-PQCC-J68	3		20 rpm	YES	e3
MC68HC000EI8R2	Freescale Semiconductor	MICROPROCESSOR, RISC	COMMERCIAL	J BEND	68	QCCJ	SQUARE	PLASTIC/EPOXY		YES			32	5	CHIP CARRIER	LDCC68,1.0SQ		70 Cel		0 Cel	MATTE TIN	QUAD							30	245			CMOS	25 mA	5 V		Microprocessors	1.27 mm		S-PQCC-J68	3	Not Qualified	8 rpm		e3
MCF5232CVM150J	Freescale Semiconductor		INDUSTRIAL	BALL	196	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V	24	32	1.5,3.3	GRID ARRAY, LOW PROFILE	BGA196,14X14,40	1.4 V	85 Cel	COLDFIRE	-40 Cel	TIN SILVER COPPER OVER NICKEL	BOTTOM	1.6 mm	15 mm		YES	32		40	260	15 mm	65536	CMOS	150 mA			Microcontrollers	1 mm	FIXED POINT	S-PBGA-B196	3	Not Qualified	150 rpm	YES
MPC8308CVMAGD	Freescale Semiconductor	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	473	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V			1,1.8,2.5/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA473,23X23,32	.95 V	105 Cel		-40 Cel		BOTTOM	1.54 mm	19 mm		YES		66.67 MHz	40	260	19 mm		CMOS		1 V	2	Microprocessors	.8 mm	FLOATING POINT	S-PBGA-B473	3	Not Qualified	400 rpm	YES	e2
MPC8313VRAFFB	Freescale Semiconductor	MICROPROCESSOR	OTHER	BALL	516	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V	32	32	1,1.8/2.5,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA516,26X26,40	.95 V	105 Cel		0 Cel	TIN SILVER	BOTTOM	2.55 mm	27 mm	ALSO REQUIRES 3.3V I/O SUPPLY	YES	32	66.67 MHz	40	260	27 mm		CMOS		1 V		Microprocessors	1 mm	FLOATING POINT	S-PBGA-B516	3	Not Qualified	333 rpm	YES	e2
KMPC8347ECVRAGDB	Freescale Semiconductor	MICROPROCESSOR	INDUSTRIAL	BALL	620	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	32	32		GRID ARRAY		1.14 V	105 Cel		-40 Cel	Tin/Silver (Sn/Ag)	BOTTOM	2.46 mm	29 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz	40	260	29 mm		CMOS		1.2 V			1 mm	FLOATING POINT	S-PBGA-B620	3	Not Qualified	400 rpm	YES	e2
MCF5208CVM166J	Freescale Semiconductor	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	196	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V	24	32	1.5,1.8/3.3	GRID ARRAY, LOW PROFILE	BGA196,14X14,40	1.4 V	85 Cel		-40 Cel	TIN SILVER COPPER OVER NICKEL	BOTTOM	1.6 mm	15 mm		YES	32	40 MHz	40	260	15 mm		CMOS		1.5 V		Microprocessors	1 mm	FIXED POINT	S-PBGA-B196	3	Not Qualified	166.67 rpm	YES
MCF54450VM240J	Freescale Semiconductor	MICROPROCESSOR, RISC	COMMERCIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES		14	32	1.5,1.8,2.5,3.3	GRID ARRAY, LOW PROFILE	BGA256,16X16,40		70 Cel		0 Cel	TIN SILVER COPPER OVER NICKEL	BOTTOM	1.6 mm	17 mm		YES	16		40	260	17 mm		CMOS				Microprocessors	1 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	240 rpm	YES
MPC5123VY400B	Freescale Semiconductor	MICROPROCESSOR, RISC	COMMERCIAL	BALL	516	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.47 V	32	32	1.4,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA516,26X26,40	1.33 V	70 Cel		0 Cel	TIN SILVER	BOTTOM	2.55 mm	27 mm		YES	32	35 MHz	40	260	27 mm		CMOS		1.4 V		Microprocessors	1 mm	FIXED POINT	S-PBGA-B516	3	Not Qualified	400 rpm	YES	e2
KMPC8255ACVVMHBB	Freescale Semiconductor	MICROPROCESSOR, RISC		BALL	480	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.2 V	32	32		GRID ARRAY, LOW PROFILE		1.9 V				Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	1.65 mm	37.5 mm		YES	64	66.66 MHz	40	260	37.5 mm		CMOS		2 V			1.27 mm	FLOATING POINT	S-PBGA-B480	3	Not Qualified	266 rpm	NO	e1
KMPC880VR133	Freescale Semiconductor	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V	32	32	1.8,3.3	GRID ARRAY	BGA357,19X19,50	1.7 V				TIN SILVER COPPER	BOTTOM	2.52 mm	25 mm		YES	32		30	245	25 mm		CMOS		1.8 V		Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	133 rpm	YES	e1
KMPC885CVR133	Freescale Semiconductor	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V	32	32	1.8,3.3	GRID ARRAY	BGA357,19X19,50	1.7 V				TIN SILVER COPPER	BOTTOM	2.52 mm	25 mm		YES	32		40	260	25 mm		CMOS		1.8 V		Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	133 rpm	YES	e1
MPC8347VRAGD	Freescale Semiconductor	MICROPROCESSOR, RISC	OTHER	BALL	620	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	32	32	1.2,2.5,3.3	GRID ARRAY	BGA620,28X28,40	1.14 V	105 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	2.46 mm	29 mm		YES	32	66 MHz	40	260	29 mm		CMOS		1.2 V		Microprocessors	1 mm	FLOATING POINT	S-PBGA-B620	3	Not Qualified	400 rpm	YES	e1
MPC8347VVAJF	Freescale Semiconductor	MICROPROCESSOR, RISC	OTHER	BALL	672	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	32	32	1.2,2.5,3.3	GRID ARRAY, LOW PROFILE	BGA672,34X34,40	1.14 V	105 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	1.69 mm	35 mm		YES	32	66 MHz	40	260	35 mm		CMOS		1.2 V		Microprocessors	1 mm	FLOATING POINT	S-PBGA-B672	3	Not Qualified	533 rpm	YES	e1
MPC8543VUAQG	Freescale Semiconductor	MICROPROCESSOR		BALL	783	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.155 V	64	32	1.2,2.5/3.3	GRID ARRAY	BGA783,28X28,40	1.045 V				Tin/Silver (Sn/Ag)	BOTTOM	3.38 mm	29 mm		YES	64	133 MHz	40	260	29 mm		CMOS		1.1 V		Microprocessors	1 mm	FLOATING POINT	S-CBGA-B783	1	Not Qualified	1000 rpm	YES	e2
MPC8544EAVTAQG	Freescale Semiconductor	MICROPROCESSOR		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	32	32	1,1.8/2.5,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA783,28X28,40	.95 V				Tin/Silver (Sn/Ag)	BOTTOM	2.8 mm	29 mm		YES	32	1000 MHz	40	260	29 mm		CMOS		1 V		Microprocessors	1 mm	FLOATING POINT	S-PBGA-B783	3	Not Qualified	400 rpm	NO	e2
MPC8545EVUATG	Freescale Semiconductor	MICROPROCESSOR		BALL	783	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.155 V	64	32	1.2,2.5/3.3	GRID ARRAY	BGA783,28X28,40	1.045 V				Tin/Silver (Sn/Ag)	BOTTOM	3.38 mm	29 mm		YES	64	133 MHz	40	260	29 mm		CMOS		1.1 V		Microprocessors	1 mm	FLOATING POINT	S-CBGA-B783	1	Not Qualified	1200 rpm	YES	e2
MPC8313EVRAFFB	Freescale Semiconductor	MICROPROCESSOR	OTHER	BALL	516	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V	32	32	1,1.8/2.5,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA516,26X26,40	.95 V	105 Cel		0 Cel	TIN SILVER	BOTTOM	2.55 mm	27 mm	ALSO REQUIRES 3.3V I/O SUPPLY	YES	32	66.67 MHz	40	260	27 mm		CMOS		1 V		Microprocessors	1 mm	FLOATING POINT	S-PBGA-B516	3	Not Qualified	333 rpm	YES	e2

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.