Microprocessors

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Screening Level	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	No. of Serial I/Os	Sub-Category	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code
AM1802EZCED3	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8		23	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	90 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	172032	13 mm		YES	16	30 MHz	30	260	13 mm	CMOS		1.2 V	80			.65 mm	FIXED POINT	S-PBGA-B361	3		300 rpm	YES	e1
AM486DX4-100V16BHI	Advanced Micro Devices	MICROPROCESSOR	INDUSTRIAL	GULL WING	208	FQFP	SQUARE	PLASTIC/EPOXY	YES	YES	3.6 V	0		32	32	3.3	FLATPACK, FINE PITCH	QFP208,1.2SQ,20	3 V	100 Cel	3	-40 Cel	TIN LEAD	QUAD	3.7 mm	0	28 mm		YES	32	33.33 MHz			28 mm	CMOS	700 mA	3.3 V	0	0	Microprocessors	.5 mm	FLOATING POINT	S-PQFP-G208		Not Qualified	100 rpm	YES	e0
AM486DX5-133V16BHC	Advanced Micro Devices	MICROPROCESSOR	OTHER	GULL WING	208	FQFP	SQUARE	PLASTIC/EPOXY	YES	YES	3.6 V	0		32	32	3.3	FLATPACK, FINE PITCH	QFP208,1.2SQ,20	3 V	85 Cel	3	0 Cel	TIN LEAD	QUAD	3.7 mm	0	28 mm		YES	32	33.33 MHz			28 mm	CMOS	931 mA	3.3 V	0	0	Microprocessors	.5 mm	FLOATING POINT	S-PQFP-G208		Not Qualified	133 rpm	YES	e0
AM5729BABCXA	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.2 V			16			GRID ARRAY, FINE PITCH	BGA760,28X28,31	1.11 V	105 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	2.96 mm		23 mm	ALSO HAVING 16-BIT ADDRESS AND 32-BIT DATA BUS OF EMIF2	YES	32	32 MHz		250	23 mm	CMOS		1.15 V				.8 mm	FIXED POINT	S-PBGA-B760	3		1500 rpm	YES	e1
AM5729BABCXEA	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.2 V			16			GRID ARRAY, FINE PITCH	BGA760,28X28,31	1.11 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.96 mm		23 mm	ALSO HAVING 16-BIT ADDRESS AND 32-BIT DATA BUS OF EMIF2	YES	32	32 MHz	30	250	23 mm	CMOS		1.15 V				.8 mm	FIXED POINT	S-PBGA-B760	3		1500 rpm	YES	e1
AT80614003597ACSLBWZ	Intel	MICROPROCESSOR		NO LEAD	1366	LGA	RECTANGULAR	PLASTIC/EPOXY		YES					64	0.75/1.35	GRID ARRAY	LGA1366,41X43,40						BOTTOM								NOT SPECIFIED	NOT SPECIFIED		CMOS	150000 mA				Microprocessors	1 mm		R-PBGA-N1366		Not Qualified	2400 rpm
AT91SAM9G15-CU	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	217	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V	8		26	32	1,1.8/3.3,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA217,17X17,32	.9 V	85 Cel	2	-40 Cel		BOTTOM	1.4 mm	32768	15 mm		YES	32	133 MHz			15 mm	CMOS		1 V	16	3	Microprocessors	.8 mm	FIXED POINT	S-PBGA-B217		Not Qualified	400 rpm	YES
AT91SAM9X35-CU	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	217	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V	8		26	32	1,1.8/3.3,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA217,17X17,32	.9 V	85 Cel	1	-40 Cel		BOTTOM	1.4 mm	32768	15 mm		YES	32	50 MHz			15 mm	CMOS		1 V	16		Microprocessors	.8 mm	FIXED POINT	S-PBGA-B217		Not Qualified	400 rpm	YES
AT97SC3205T-G3M4C20B	Microchip Technology	MICROPROCESSOR, RISC	COMMERCIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	NO	YES				0	8		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.16SQ,16		70 Cel		0 Cel		QUAD	.9 mm		4 mm		NO	0				4 mm	CMOS		3.3 V				.4 mm	FIXED POINT	S-PQCC-N32				NO
AT97SC3205T-X3A1C-10	Microchip Technology	MICROPROCESSOR, RISC	COMMERCIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES				0	8		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP28,.25		70 Cel		0 Cel		DUAL	1.1 mm		4.4 mm		NO	0				9.7 mm	CMOS		3.3 V				.65 mm	FIXED POINT	R-PDSO-G28				NO
ATSAMA5D22A-CU	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	196	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8	TS 16949	26	32		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA196,14X14,30	1.1 V	85 Cel	1	-40 Cel	Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)	BOTTOM	1.2 mm	131072	11 mm		YES	32	24 MHz			11 mm	CMOS		1.2 V	51	1		.75 mm	FLOATING POINT	S-PBGA-B196			500 rpm	YES	e2
ATSAMA5D22C-CN	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	196	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8		26	32		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA196,14X14,30	1.2 V	105 Cel	1	-40 Cel	TIN SILVER COPPER NICKEL	BOTTOM	1.2 mm	131072	11 mm	ALSO OPERATES WITH 1.2V NOM @ 400 MHZ SPEED	YES	16	24 MHz			11 mm	CMOS		1.25 V	32			.75 mm	FLOATING POINT	S-PBGA-B196			500 rpm	YES	e2
ATSAMA5D22C-CUR	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	196	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8		26	32		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA196,14X14,30	1.2 V	85 Cel	1	-40 Cel	TIN SILVER COPPER NICKEL	BOTTOM	1.2 mm	131072	11 mm	ALSO OPERATES WITH 1.2V NOM @ 400 MHZ SPEED	YES	16	24 MHz			11 mm	CMOS		1.25 V	32			.75 mm	FLOATING POINT	S-PBGA-B196			500 rpm	YES	e2
ATSAMA5D26C-CN	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8		26	32		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.2 V	105 Cel	1	-40 Cel		BOTTOM	1.4 mm	131072	14 mm	ALSO OPERATES WITH 1.2V NOM @ 400 MHZ SPEED	YES	16	24 MHz	NOT SPECIFIED	NOT SPECIFIED	14 mm	CMOS		1.25 V	32			.8 mm	FLOATING POINT	S-PBGA-B289			500 rpm	YES
ATSAMA5D26C-CNR	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8		26	32		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.2 V	105 Cel	1	-40 Cel		BOTTOM	1.4 mm	131072	14 mm	ALSO OPERATES WITH 1.2V NOM @ 400 MHZ SPEED	YES	16	24 MHz	NOT SPECIFIED	NOT SPECIFIED	14 mm	CMOS		1.25 V	32			.8 mm	FLOATING POINT	S-PBGA-B289			500 rpm	YES
ATSAMA5D27A-CNR	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V			26			GRID ARRAY, LOW PROFILE, FINE PITCH		1.1 V	105 Cel		-40 Cel		BOTTOM	1.4 mm		14 mm		YES	32	24 MHz			14 mm	CMOS		1.2 V				.8 mm	FLOATING POINT	S-PBGA-B289			500 rpm	YES
ATSAMA5D41B-CU	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8	TS 16949	26	32		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.16 V	85 Cel	1	-40 Cel		BOTTOM	1.4 mm	131072	14 mm		YES	16	50 MHz			14 mm	CMOS		1.26 V	32	2		.8 mm	FLOATING POINT	S-PBGA-B289			600 rpm	YES
ATSAMA5D44A-CU	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	361	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8	TS 16949	26	32		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA361,19X19,32	1.16 V	85 Cel	1	-40 Cel	TIN SILVER COPPER NICKEL	BOTTOM	1.2 mm	131072	16 mm		YES	32	50 MHz			16 mm	CMOS		1.26 V	32	2		.8 mm	FLOATING POINT	S-PBGA-B361	3		600 rpm	YES	e2
CD80C88	Intersil	MICROPROCESSOR	COMMERCIAL	THROUGH-HOLE	40	DIP	RECTANGULAR	CERAMIC, GLASS-SEALED	NO	NO	5.5 V			20	16	5	IN-LINE	DIP40,.6	4.5 V	70 Cel		0 Cel	TIN LEAD	DUAL	5.72 mm		15.24 mm		NO	8	5 MHz				CMOS	50.5 mA	5 V			Microprocessors	2.54 mm	FIXED POINT	R-GDIP-T40		Not Qualified	5 rpm	YES	e0
CDP1802ACE	Intersil	MICROPROCESSOR	INDUSTRIAL	THROUGH-HOLE	40	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	NO	6.5 V			8	8	5	IN-LINE	DIP40,.6	4 V	85 Cel		-40 Cel	TIN LEAD	DUAL	6.35 mm		15.24 mm		NO	8	3.2 MHz			51.75 mm	CMOS	4 mA	5 V			Microprocessors	2.54 mm	FIXED POINT	R-PDIP-T40		Not Qualified	3.2 rpm	NO	e0
CDP1802AE	Intersil	MICROPROCESSOR	INDUSTRIAL	THROUGH-HOLE	40	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	NO	6.5 V			8	8	5/10	IN-LINE	DIP40,.6	4 V	85 Cel		-40 Cel	TIN LEAD	DUAL	6.35 mm		15.24 mm		NO	8	3.2 MHz			51.75 mm	CMOS	4 mA	10 V			Microprocessors	2.54 mm	FIXED POINT	R-PDIP-T40		Not Qualified	3.2 rpm	NO	e0
CDP1802CDX	Intersil	MICROPROCESSOR, RISC	INDUSTRIAL	THROUGH-HOLE	40	DIP	RECTANGULAR	CERAMIC		NO					8	5/10	IN-LINE	DIP40,.6		85 Cel		-40 Cel	Tin/Lead (Sn/Pb)	DUAL											CMOS					Microprocessors	2.54 mm		R-XDIP-T40			2.5 rpm		e0
CM8066002032201	Intel	MICROPROCESSOR		NO LEAD	2011	LGA	RECTANGULAR	UNSPECIFIED	YES	YES					64		GRID ARRAY							BOTTOM					NO						CMOS							FIXED POINT	R-XBGA-N2011			2100 rpm	NO
CP80C88-2	Intersil	MICROPROCESSOR	COMMERCIAL	THROUGH-HOLE	40	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	NO	5.5 V			20	16	5	IN-LINE	DIP40,.6	4.5 V	70 Cel		0 Cel	TIN LEAD	DUAL	6.35 mm		15.24 mm		NO	8	8 MHz			51.75 mm	CMOS	80.5 mA	5 V			Microprocessors	2.54 mm	FIXED POINT	R-PDIP-T40		Not Qualified	8 rpm	YES	e0
CT80618003201AB	Intel	MICROPROCESSOR	INDUSTRIAL	BALL	676	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V			32	32		GRID ARRAY, FINE PITCH		.75 V	85 Cel		-40 Cel		BOTTOM	2.35 mm		22 mm		NO	32	14.318 MHz	NOT SPECIFIED	NOT SPECIFIED	22 mm	CMOS		1.05 V				.8 mm	FLOATING POINT	S-PBGA-B676			1300 rpm	YES
D6417750RBA240HVU0	Renesas Electronics	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	256	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V			26	32		GRID ARRAY, HEAT SINK/SLUG		1.35 V	85 Cel		-40 Cel		BOTTOM	2.6 mm		27 mm		YES	64	34 MHz			27 mm	CMOS		1.5 V				1.27 mm	FLOATING POINT	S-PBGA-B256	3		240 rpm	YES
HD6417727F160CV	Renesas Electronics	MICROPROCESSOR, RISC	COMMERCIAL	GULL WING	240	FQFP	SQUARE	PLASTIC/EPOXY	YES	YES	2.05 V	8		26	32	1.9,3.3	FLATPACK, FINE PITCH	QFP240,1.3SQ,20	1.7 V	75 Cel	6	-20 Cel		QUAD	3.95 mm	16384	32 mm		YES	32	66.67 MHz			32 mm	CMOS	650 mA	1.9 V	4	3	Microprocessors	.5 mm	FIXED POINT	S-PQFP-G240		Not Qualified	160 rpm	YES
IBM25PPC970MP7TR25AFT	Ibm Microelectronics	MICROPROCESSOR, RISC		BALL	575	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	2.75 V			0	64		GRID ARRAY	BGA576,24X24,40	2.65 V					BOTTOM	2.23 mm		25 mm		YES	0	700 MHz			25 mm	CMOS		2.7 V			Microprocessors	1 mm	FLOATING POINT	S-CBGA-B575		Not Qualified	1800 rpm	YES
IMST805-G20S	STMicroelectronics	MICROPROCESSOR, RISC	COMMERCIAL	PIN/PEG	84	PGA	SQUARE	CERAMIC		NO					32	5	GRID ARRAY	PGA84,10X10		70 Cel		0 Cel	TIN LEAD	PERPENDICULAR											CMOS	230 mA	5 V			Microprocessors	2.54 mm		S-XPGA-P84		Not Qualified	20 rpm		e0
INS8060N	National Semiconductor	MICROPROCESSOR, RISC	COMMERCIAL	THROUGH-HOLE	40	DIP	RECTANGULAR	PLASTIC/EPOXY		NO					8		IN-LINE	DIP40,.6		70 Cel		0 Cel	Tin/Lead (Sn/Pb)	DUAL											MOS					Microprocessors	2.54 mm		R-PDIP-T40		Not Qualified			e0
INS8080AN	National Semiconductor	MICROPROCESSOR, RISC	COMMERCIAL	THROUGH-HOLE	40	DIP	RECTANGULAR	PLASTIC/EPOXY		NO					8	+-5,12	IN-LINE	DIP40,.6		70 Cel		0 Cel	Tin/Lead (Sn/Pb)	DUAL											MOS					Microprocessors	2.54 mm		R-PDIP-T40		Not Qualified	2 rpm		e0
IS80C88	Intersil	MICROPROCESSOR	INDUSTRIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	NO	YES	5.5 V			20	16	5	CHIP CARRIER	LDCC44,.7SQ	4.5 V	85 Cel		-40 Cel	TIN LEAD	QUAD	4.57 mm		16.585 mm		NO	8	5 MHz			16.585 mm	CMOS	50.5 mA	5 V			Microprocessors	1.27 mm	FIXED POINT	S-PQCC-J44		Not Qualified	5 rpm	YES	e0
KU80386EXTC33	Rochester Electronics	MICROPROCESSOR	INDUSTRIAL	GULL WING	132	QFP	SQUARE	PLASTIC/EPOXY	NO	YES	5.5 V			26	32		FLATPACK		4.5 V	117 Cel		-40 Cel		QUAD	4.57 mm		24.13 mm		YES	16	66 MHz			24.13 mm	CMOS		5 V				.635 mm	FIXED POINT	S-PQFP-G132			33 rpm	YES
KU80386SLB1A20	Intel	MICROPROCESSOR, RISC		GULL WING	196	BQFP	SQUARE	PLASTIC/EPOXY		YES					32	3.3/5	FLATPACK	SPQFP196,1.5SQ						QUAD											CMOS	325 mA				Microprocessors	.635 mm		S-PQFP-G196		Not Qualified	20 rpm
LS1020ASN7HNB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V			16	32		GRID ARRAY, FINE PITCH		.97 V				TIN SILVER COPPER	BOTTOM	2.07 mm		19 mm		YES	32	133.3 MHz	40	260	19 mm	CMOS		1 V				.8 mm	FLOATING POINT	S-PBGA-B525	3		800 rpm	YES	e1
LS1043ASE8PQB	NXP Semiconductors	SoC	OTHER	BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	.93 V			14	64		GRID ARRAY, FINE PITCH		.87 V	105 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm		23 mm	ALSO OPERATES AT 1V NOMINAL SUPPLY	YES	32		30	250	23 mm	CMOS		.9 V				.8 mm	FIXED POINT	S-PBGA-B780	3		1400 rpm	YES	e1
MC68000FN8	Motorola	MICROPROCESSOR	COMMERCIAL	J BEND	68	QCCJ	SQUARE	PLASTIC/EPOXY	NO	YES	5.25 V	0		23	32	5	CHIP CARRIER	LDCC68,1.0SQ	4.75 V	70 Cel	7	0 Cel	TIN LEAD	QUAD		0			NO	16	8 MHz				CMOS	25 mA	5 V	0	0	Microprocessors	1.27 mm	FIXED POINT	S-PQCC-J68		Not Qualified	8 rpm	NO	e0
MC68000R10	Motorola	MICROPROCESSOR	COMMERCIAL	THROUGH-HOLE	64	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	NO	5.25 V	0		23	32		IN-LINE		4.75 V	70 Cel	7	0 Cel	TIN LEAD	DUAL	5.84 mm	0	22.86 mm		NO	16	10 MHz			81.535 mm	CMOS	30 mA	5 V	0	0		2.54 mm	FIXED POINT	R-PDIP-T64		Not Qualified	10 rpm	NO	e0
MC68010RC10	Motorola	MICROPROCESSOR	COMMERCIAL	PIN/PEG	68	PGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	NO	5.25 V	0		23	32		GRID ARRAY	PGA68,10X10	4.75 V	70 Cel	7	0 Cel	TIN LEAD	PERPENDICULAR	5.16 mm	0	26.92 mm		NO	16	10 MHz			26.92 mm	CMOS	30 mA	5 V	0	0	Microprocessors	2.54 mm	FIXED POINT	S-CPGA-P68		Not Qualified	10 rpm	NO	e0
MC6809P	Motorola	MICROPROCESSOR	COMMERCIAL	THROUGH-HOLE	40	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	NO	5.25 V	0		16	8	5	IN-LINE	DIP40,.6	4.75 V	70 Cel	3	0 Cel	TIN LEAD	DUAL	5.08 mm	0	15.24 mm		NO	8	4 MHz			52.07 mm	NMOS		5 V	0	0	Microprocessors	2.54 mm	FIXED POINT	R-PDIP-T40		Not Qualified	1 rpm	NO	e0
MC68SEC000CFU10	Motorola	MICROPROCESSOR	INDUSTRIAL	GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	NO	YES				24	32		FLATPACK			85 Cel		-40 Cel		QUAD	2.45 mm		14 mm	CAN ALSO OPERATE WITH 5V SUPPLY		16	10 MHz			14 mm	CMOS		3.3 V				.8 mm	FIXED POINT	S-PQFP-G64		Not Qualified	10 rpm	YES
MC7447AHX1167NB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.35 V			36	32		GRID ARRAY		1.25 V				TIN LEAD	BOTTOM	3.24 mm		25 mm	ALSO REQUIRES 1.8V OR 2.5V SUPPLY	YES	64	167 MHz	40	260	25 mm	CMOS		1.3 V				1.27 mm	FLOATING POINT	S-CBGA-B360	1	Not Qualified	1167 rpm	YES	e0
MC7447ATHX1167NB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.35 V			36	32		GRID ARRAY		1.25 V				TIN LEAD	BOTTOM	3.24 mm		25 mm	ALSO REQUIRES 1.8V OR 2.5V SUPPLY	YES	64	167 MHz	40	260	25 mm	CMOS		1.3 V				1.27 mm	FLOATING POINT	S-CBGA-B360	1	Not Qualified	1167 rpm	YES	e0
MC7447AVU1267LB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.35 V			36	32		GRID ARRAY		1.25 V					BOTTOM	2.8 mm		25 mm	ALSO REQUIRES 1.8V OR 2.5V SUPPLY	YES	64	167 MHz			25 mm	CMOS		1.3 V				1.27 mm	FLOATING POINT	S-CBGA-B360	1	Not Qualified	1267 rpm	YES	e2
MC7448VU1700LD	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.32 V			36	32	1.3,1.8/2.5	GRID ARRAY	BGA360,19X19,50	1.25 V	105 Cel		0 Cel		BOTTOM	2.4 mm		25 mm		YES	64	200 MHz	40	260	25 mm	CMOS		1.3 V			Microprocessors	1.27 mm	FLOATING POINT	S-CBGA-B360	1	Not Qualified	1700 rpm	YES
MC8640DTHJ1067NE	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1023	HBGA	SQUARE	CERAMIC	YES	YES	1 V			32	32		GRID ARRAY, HEAT SINK/SLUG	BGA1023,32X32,40	.9 V	105 Cel		-40 Cel		BOTTOM	2.97 mm		33 mm		YES	32	166.66 MHz	30	245	33 mm	CMOS		.95 V	4			1 mm	FLOATING POINT	S-CBGA-B1023	3		1067 rpm	NO
MC8641DVJ1333JE	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	1023	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.1 V			16	32		GRID ARRAY		1 V	105 Cel		0 Cel	TIN SILVER	BOTTOM	2.77 mm		33 mm		YES	64		30	245	33 mm	CMOS		1.05 V				1 mm	FLOATING POINT	S-CBGA-B1023	3		1333 rpm	YES	e2
MCF52277CVM160	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V			24	32	1.5,1.8,2.5,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,40	1.4 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm		15 mm		YES	32	66.67 MHz	40	260	15 mm	CMOS	.7 mA	1.5 V			Microprocessors	.5 mm	FIXED POINT	S-PBGA-B196	3	Not Qualified	166.67 rpm	NO	e1

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.