Microprocessors

Reset All

Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Screening Level	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	No. of Serial I/Os	Sub-Category	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code
MCF5307CFT66B	Motorola	MICROPROCESSOR, RISC	INDUSTRIAL	GULL WING	208	QFP	SQUARE	PLASTIC/EPOXY	YES	YES					32		FLATPACK			85 Cel		-40 Cel		QUAD					YES		66 MHz				CMOS		3.3 V					FIXED POINT	S-PQFP-G208		Not Qualified	66 rpm	YES
MG80486DX475	Intel	MICROPROCESSOR	MILITARY	PIN/PEG	168	PGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	NO	5.25 V	0	38535Q/M;38534H;883B	32	32	3.3	GRID ARRAY	PGA168,17X17	3.135 V	125 Cel	3	-55 Cel	Tin/Lead (Sn/Pb)	PERPENDICULAR	4.57 mm	0	44.45 mm		YES	32	25 MHz			44.45 mm	CMOS	1100 mA	5 V	0	0	Microprocessors	2.54 mm	FLOATING POINT	S-CPGA-P168		Not Qualified	75 rpm	YES	e0
MPC8250ACZUMHBB	Motorola	MICROPROCESSOR, RISC	COMMERCIAL	BALL	480	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.2 V			32	32	1.7/2.1,3.3	GRID ARRAY, LOW PROFILE	BGA480,29X29,50	1.9 V	70 Cel		0 Cel	Tin/Lead (Sn/Pb)	BOTTOM	1.65 mm		37.5 mm	REQUIRES 3.3V SUPPLY FOR I/O	YES	64				37.5 mm	CMOS					Microprocessors	1.27 mm	FLOATING POINT	S-PBGA-B480		Not Qualified	266 rpm		e0
MPC8347VRAGD	Freescale Semiconductor	MICROPROCESSOR, RISC	OTHER	BALL	620	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V			32	32	1.2,2.5,3.3	GRID ARRAY	BGA620,28X28,40	1.14 V	105 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	2.46 mm		29 mm		YES	32	66 MHz	40	260	29 mm	CMOS		1.2 V			Microprocessors	1 mm	FLOATING POINT	S-PBGA-B620	3	Not Qualified	400 rpm	YES	e1
MPC8347VVAJF	Freescale Semiconductor	MICROPROCESSOR, RISC	OTHER	BALL	672	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V			32	32	1.2,2.5,3.3	GRID ARRAY, LOW PROFILE	BGA672,34X34,40	1.14 V	105 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	1.69 mm		35 mm		YES	32	66 MHz	40	260	35 mm	CMOS		1.2 V			Microprocessors	1 mm	FLOATING POINT	S-PBGA-B672	3	Not Qualified	533 rpm	YES	e1
MPC8543VUAQG	Freescale Semiconductor	MICROPROCESSOR		BALL	783	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.155 V			64	32	1.2,2.5/3.3	GRID ARRAY	BGA783,28X28,40	1.045 V				Tin/Silver (Sn/Ag)	BOTTOM	3.38 mm		29 mm		YES	64	133 MHz	40	260	29 mm	CMOS		1.1 V			Microprocessors	1 mm	FLOATING POINT	S-CBGA-B783	1	Not Qualified	1000 rpm	YES	e2
MPC8544EAVTAQG	Freescale Semiconductor	MICROPROCESSOR		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V			32	32	1,1.8/2.5,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA783,28X28,40	.95 V				Tin/Silver (Sn/Ag)	BOTTOM	2.8 mm		29 mm		YES	32	1000 MHz	40	260	29 mm	CMOS		1 V			Microprocessors	1 mm	FLOATING POINT	S-PBGA-B783	3	Not Qualified	400 rpm	NO	e2
MPC8545EVUATG	Freescale Semiconductor	MICROPROCESSOR		BALL	783	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.155 V			64	32	1.2,2.5/3.3	GRID ARRAY	BGA783,28X28,40	1.045 V				Tin/Silver (Sn/Ag)	BOTTOM	3.38 mm		29 mm		YES	64	133 MHz	40	260	29 mm	CMOS		1.1 V			Microprocessors	1 mm	FLOATING POINT	S-CBGA-B783	1	Not Qualified	1200 rpm	YES	e2
N80186	Rochester Electronics	MICROPROCESSOR	COMMERCIAL	J BEND	68	QCCJ	SQUARE	PLASTIC/EPOXY	NO	YES	5.5 V			20	16		CHIP CARRIER		4.5 V	70 Cel		0 Cel	TIN LEAD	QUAD	4.83 mm		24.2316 mm		NO	16	16 MHz			24.2316 mm	CMOS		5 V				1.27 mm	FIXED POINT	S-PQCC-J68		Not Qualified	8 rpm	NO	e0
N80C186EB-25	Intel	MICROPROCESSOR	COMMERCIAL	J BEND	84	QCCJ	SQUARE	PLASTIC/EPOXY	NO	YES	5.5 V	0		20	16	5	CHIP CARRIER	LDCC84,1.2SQ	4.5 V	70 Cel	6	0 Cel	TIN LEAD	QUAD	4.83 mm	0	29.3 mm		NO	16	50 MHz			29.3 mm	CMOS	115 mA	5 V	0	2	Microprocessors	1.27 mm	FIXED POINT	S-PQCC-J84		Not Qualified	25 rpm	YES	e0
N80C188XL12	Intel	MICROPROCESSOR	COMMERCIAL	J BEND	68	QCCJ	SQUARE	PLASTIC/EPOXY	NO	YES	5.5 V	0		20	16	5	CHIP CARRIER	LDCC68,1.0SQ	4.5 V	70 Cel	5	0 Cel	Tin/Lead (Sn/Pb)	QUAD	4.83 mm	0	24.2316 mm	DRAM REFRESH CONTROLLER; 3 PROGRAMMABLE TIMERS	NO	8	25 MHz			24.2316 mm	CMOS	62.5 mA	5 V	2	0	Microprocessors	1.27 mm	FIXED POINT	S-PQCC-J68		Not Qualified	12 rpm	YES	e0
NG80960JA3V33	Intel	MICROPROCESSOR, RISC		GULL WING	132	QFP	SQUARE	PLASTIC/EPOXY	YES	YES	3.45 V			32	32		FLATPACK		3.15 V					QUAD					YES	32	33.3 MHz	NOT SPECIFIED	NOT SPECIFIED		CMOS		3.3 V					FIXED POINT	S-PQFP-G132		Not Qualified	33 rpm	YES
NG80960JS25	Intel	MICROPROCESSOR, RISC		GULL WING	132	QFP	SQUARE	PLASTIC/EPOXY	YES	YES	3.45 V			32	32	3.3,3.3/5	FLATPACK	SPQFP132,1.1SQ	3.15 V					QUAD					YES	32	25 MHz	NOT SPECIFIED	NOT SPECIFIED		CMOS	190 mA	3.3 V			Microprocessors	.635 mm	FIXED POINT	S-PQFP-G132		Not Qualified	25 rpm	YES
NHIXP435ADT	Intel		INDUSTRIAL		460			PLASTIC		YES						1.3,3.3		BGA460,24X24,50		85 Cel		-40 Cel																		Microprocessors					Not Qualified
NU80579ED009C	Intel	MICROPROCESSOR	COMMERCIAL	BALL	1088	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V			25	32	1.2,1.8,2.5,3.3,5	GRID ARRAY	BGA1088,33X33,43	1.14 V	70 Cel		0 Cel		BOTTOM	5.635 mm		37.5 mm		YES	16	1200 MHz	NOT SPECIFIED	NOT SPECIFIED	37.5 mm	CMOS	12000 mA	1.2 V			Microprocessors	1.09 mm	FLOATING POINT	S-PBGA-B1088		Not Qualified	1200 rpm	YES
P80C88	Intel	MICROPROCESSOR, RISC	COMMERCIAL	THROUGH-HOLE	40	DIP	RECTANGULAR	PLASTIC/EPOXY		NO					16	5	IN-LINE	DIP40,.6		70 Cel		0 Cel	Tin/Lead (Sn/Pb)	DUAL											CMOS		5 V			Microprocessors	2.54 mm		R-PDIP-T40		Not Qualified	5 rpm		e0
PRIXP420ABB	Intel	MICROPROCESSOR, RISC	COMMERCIAL	BALL	492	BGA	SQUARE	PLASTIC/EPOXY		YES						1.3,3.3	GRID ARRAY	BGA492,26X26,50		70 Cel		0 Cel		BOTTOM											CMOS					Microprocessors	1.27 mm		S-PBGA-B492		Not Qualified
PRIXP420BB	Intel	MICROPROCESSOR, RISC	COMMERCIAL	BALL	492	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.365 V			32	32		GRID ARRAY		1.235 V	70 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	2.59 mm		35 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	33.33 MHz			35 mm	CMOS		1.3 V				1.27 mm	FIXED POINT	S-PBGA-B492		Not Qualified	533 rpm	NO	e1
PRIXP425BC	Intel	MICROPROCESSOR, RISC	COMMERCIAL	BALL	492	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.365 V			32	32		GRID ARRAY		1.235 V	70 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	2.59 mm		35 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	33.33 MHz			35 mm	CMOS		1.3 V				1.27 mm	FIXED POINT	S-PBGA-B492		Not Qualified	533 rpm	NO	e1
R80C188	Intel	MICROPROCESSOR	COMMERCIAL	NO LEAD	68	QCCN	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	YES	5.5 V			20	8	5	CHIP CARRIER	LCC68A,.95SQ	4.5 V	70 Cel		0 Cel	TIN LEAD	QUAD	3.68 mm		24.13 mm		NO	8	10 MHz			24.13 mm	CMOS	100 mA	5 V			Microprocessors	1.27 mm	FIXED POINT	S-CQCC-N68		Not Qualified	10 rpm	YES	e0
RJ80530KZ800512	Intel	MICROPROCESSOR		BALL	479	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES				36	32	1.15,1.25	GRID ARRAY, HEAT SINK/SLUG	BGA479,26X26,50						BOTTOM	2.77 mm		35 mm		YES	64	133 MHz			35 mm	CMOS		1.15 V			Microprocessors	1.27 mm	FLOATING POINT	S-PBGA-B479		Not Qualified	800 rpm	YES
RK80530RY009256/SL6C8	Intel	MICROPROCESSOR, RISC		PIN/PEG	370	PGA	SQUARE	PLASTIC/EPOXY		NO					32	1.475	GRID ARRAY	SPGA370,37X37						PERPENDICULAR								NOT SPECIFIED	NOT SPECIFIED		CMOS	20600 mA	1.475 V			Microprocessors	1.27 mm		S-PPGA-P370		Not Qualified	1200 rpm
RTPXA270C5C312	Intel	MICROPROCESSOR, RISC		BALL	356	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.375 V			26	32		GRID ARRAY		1.1875 V					BOTTOM					YES	32	3.6864 MHz	30	240		CMOS		1.25 V					FIXED POINT	S-PBGA-B356		Not Qualified	312 rpm	YES
RTPXA270C5C416	Intel	MICROPROCESSOR, RISC		BALL	356	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.485 V			26	32		GRID ARRAY		1.2825 V					BOTTOM					YES	32	3.6864 MHz	30	240		CMOS		1.35 V					FIXED POINT	S-PBGA-B356		Not Qualified	416 rpm	YES
SB80486DX2SC50SX920	Intel	MICROPROCESSOR, RISC		GULL WING	208	FQFP	SQUARE	PLASTIC/EPOXY	YES	YES	3.6 V			32	32		FLATPACK, FINE PITCH	QFP208,1.2SQ,20	3 V	85 Cel	2	0 Cel		QUAD	3.7 mm		28 mm		YES	32	25 MHz			28 mm	CMOS	550 mA	3.3 V				.5 mm	FLOATING POINT	S-PQFP-G208			50 rpm	YES
SB80L186EC-13	Intel	MICROPROCESSOR	COMMERCIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	NO	YES	5.5 V	0		20	16	3/5	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	2.7 V	70 Cel	9	0 Cel	TIN LEAD	QUAD	1.66 mm	0	14 mm		NO	16	26 MHz			14 mm	CMOS	36 mA	3 V	4	2	Microprocessors	.5 mm	FIXED POINT	S-PQFP-G100		Not Qualified	13 rpm	YES	e0
TA80960KB-25	Intel	MICROPROCESSOR, RISC	AUTOMOTIVE	PIN/PEG	132	PGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	NO	5.25 V	0		32	32	5	GRID ARRAY	PGA132,14X14	4.75 V	125 Cel	4	-40 Cel		PERPENDICULAR	4.57 mm	0	37.08 mm	OPTEMP SPECIFIED AS TC; REGISTER SCOREBOARDING; 25 MIPS MAX; 9.4 MIPS SUSTAINED; BURST BUS	NO	32	50 MHz			37.08 mm	CMOS	420 mA	5 V	0	0	Microprocessors	2.54 mm	FLOATING POINT	S-CPGA-P132		Not Qualified	25 rpm	NO
TMP68HC000P-12	Toshiba	MICROPROCESSOR	COMMERCIAL	THROUGH-HOLE	64	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	NO	5.25 V	0		23	16		IN-LINE		4.75 V	70 Cel	7	0 Cel	TIN LEAD	DUAL	5.66 mm	0	22.86 mm		NO	16	12.5 MHz			81.5 mm	CMOS	35 mA	5 V	0	0		2.54 mm	FIXED POINT	R-PDIP-T64		Not Qualified	12.5 rpm	YES	e0
TMPR4937XBG-300	Toshiba	MICROPROCESSOR, RISC	COMMERCIAL	BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V			20	64	1.5,3.3	GRID ARRAY	BGA484,26X26,50	1.4 V	70 Cel		0 Cel		BOTTOM	2.46 mm		35 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	133.3 MHz	NOT SPECIFIED	NOT SPECIFIED	35 mm	CMOS		1.5 V			Microprocessors	1.27 mm	FLOATING POINT	S-PBGA-B484		Not Qualified	300 rpm	YES
TMPZ84C00AP	Toshiba	MICROPROCESSOR, RISC	INDUSTRIAL	THROUGH-HOLE	40	DIP	RECTANGULAR	PLASTIC/EPOXY		NO					8	5	IN-LINE	DIP40,.6		85 Cel		-40 Cel	Tin/Lead (Sn/Pb)	DUAL											CMOS		5 V			Microprocessors	2.54 mm		R-PDIP-T40		Not Qualified	4 rpm		e0
TN80C188EB-8	Intel	MICROPROCESSOR	INDUSTRIAL	J BEND	84	QCCJ	SQUARE	PLASTIC/EPOXY	NO	YES	5.5 V			20	16	5	CHIP CARRIER	LDCC84,1.2SQ	4.5 V	85 Cel		-40 Cel	Tin/Lead (Sn/Pb)	QUAD				8MHZ, 16MHZ SPEED VERSION NOT AVAILABLE FOR 5V OPTION	NO	8					CMOS	45 mA	5 V			Microprocessors	1.27 mm	FIXED POINT	S-PQCC-J84		Not Qualified	8 rpm	YES	e0
TN80L186EA-13	Intel	MICROPROCESSOR	INDUSTRIAL	J BEND	68	QCCJ	SQUARE	PLASTIC/EPOXY	NO	YES	5.5 V	0		20	16	3/5	CHIP CARRIER	LDCC68,1.0SQ	2.7 V	85 Cel	5	-40 Cel	TIN LEAD	QUAD	4.83 mm	0	24.2 mm		NO	16	26 MHz			24.2 mm	CMOS	65 mA	5 V	2	0	Microprocessors	1.27 mm	FIXED POINT	S-PQCC-J68		Not Qualified	13 rpm	YES	e0
TS68C000VC8A	Atmel	MICROPROCESSOR	INDUSTRIAL	THROUGH-HOLE	64	DIP	RECTANGULAR	CERAMIC, METAL-SEALED COFIRED	NO	NO	5.5 V			24	32	5	IN-LINE	DIP64,.9	4.5 V	85 Cel		-40 Cel	Tin/Lead (Sn/Pb)	DUAL	4.83 mm		22.86 mm		NO	16	8 MHz			81.28 mm	HCMOS	42 mA	5 V			Microprocessors	2.54 mm	FIXED POINT	R-CDIP-T64		Not Qualified	8 rpm	NO	e0
TS80C186EB13	Rochester Electronics	MICROPROCESSOR	INDUSTRIAL	GULL WING	80	QFP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	5.5 V			20	16		FLATPACK		4.5 V	85 Cel		-40 Cel	TIN LEAD	QUAD	3.15 mm		14 mm	DRAM REFRESH CONTROLLER; 3 PROGRAMMABLE TIMERS; EMULATION HARDWARE	NO	16	26 MHz			20 mm	CMOS		5 V				.8 mm	FIXED POINT	R-PQFP-G80		Not Qualified	13 rpm	YES	e0
XPC755BRX300LD	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	360	BGA	RECTANGULAR	CERAMIC, METAL-SEALED COFIRED	NO	YES	2.1 V						GRID ARRAY		1.9 V					BOTTOM					YES						CMOS		2 V					FIXED POINT	R-CBGA-B360			300 rpm	NO
XPC823ZT66B2	Motorola	MICROPROCESSOR, RISC	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY		YES					32	3.3	GRID ARRAY	BGA256,16X16,50		70 Cel		0 Cel		BOTTOM													3.3 V			Microprocessors	1.27 mm		S-PBGA-B256		Not Qualified	66 rpm
XPC860ENCZP50D4	Motorola	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V			32	32	3.3	GRID ARRAY	BGA357,19X19,50	3.135 V			-40 Cel		BOTTOM	2.05 mm		25 mm		YES	32	50 MHz			25 mm	CMOS		3.3 V			Other Microprocessor ICs	1.27 mm	FIXED POINT	S-PBGA-B357		Not Qualified	50 rpm	YES
Z3735F	Intel	MICROPROCESSOR		BALL	592		SQUARE	PLASTIC/EPOXY	YES	YES					64									BOTTOM					NO						CMOS							FIXED POINT	S-PBGA-B592			1830 rpm	NO
AT97SC3205T-H3M4C00B	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	NO	YES				0	8		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.16SQ,16		85 Cel		-40 Cel		QUAD	.9 mm		4 mm		NO	0				4 mm	CMOS		3.3 V				.4 mm	FIXED POINT	S-PQCC-N32				NO
CS80C88	Intersil	MICROPROCESSOR	COMMERCIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	NO	YES	5.5 V			20	16	5	CHIP CARRIER	LDCC44,.7SQ	4.5 V	70 Cel		0 Cel	TIN LEAD	QUAD	4.57 mm		16.585 mm		NO	8	5 MHz			16.585 mm	CMOS	50.5 mA	5 V			Microprocessors	1.27 mm	FIXED POINT	S-PQCC-J44	1	Not Qualified	5 rpm	YES	e0
MC68LC302CAF16CT	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	NO	YES		8		20	32		FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20		85 Cel	3	-40 Cel	TIN	QUAD	1.7 mm	1152	14 mm		NO	16	4 MHz	40	260	14 mm	CMOS		3.3 V	5	3		.5 mm	FIXED POINT	S-PQFP-G100	3		16.67 rpm	YES	e3
MPC8250ACZUMHBC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	480	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.2 V			32	32		GRID ARRAY, LOW PROFILE		1.9 V					BOTTOM	1.65 mm		37.5 mm	REQUIRES 3.3V SUPPLY FOR I/O	YES	64		30	220	37.5 mm	CMOS		2 V				1.27 mm	FLOATING POINT	S-PBGA-B480	3	Not Qualified	266 rpm	NO
MPC8313ECVRAFFC	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	516	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V			32	32	1,1.8/2.5,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA516,26X26,40	.95 V	105 Cel		-40 Cel	NICKEL GOLD	BOTTOM	2.55 mm		27 mm	ALSO REQUIRES 3.3V I/O SUPPLY	YES	32	66.67 MHz	40	260	27 mm	CMOS		1 V			Microprocessors	1 mm	FLOATING POINT	S-PBGA-B516	3	Not Qualified	333 rpm	YES	e4
P2010NSE2MFC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V			16			GRID ARRAY		1 V				TIN SILVER	BOTTOM	2.46 mm		31 mm		YES	64	100 MHz	40	260	31 mm	CMOS		1.05 V				1 mm	FLOATING POINT	S-PBGA-B689	3		1200 rpm	YES	e2
P2041NSE7PNC	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	780	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.89 V			16			GRID ARRAY	BGA780,28X28,32	1.71 V	105 Cel	12	0 Cel	TIN SILVER COPPER	BOTTOM	2.51 mm		23 mm	ALSO OPERATES WITH 2.5V NOM AND 3.3V NOM SUPPLY	YES	64		30	245	23 mm	CMOS		1.8 V	4			.8 mm	FIXED POINT	S-PBGA-B780	3		1500 rpm	YES	e1
20-668-0011	Digi International	MICROPROCESSOR	OTHER	GULL WING	128	LFQFP	SQUARE	PLASTIC/EPOXY	NO	YES	3.6 V			20			FLATPACK, LOW PROFILE, FINE PITCH		1.8 V	85 Cel		-55 Cel		QUAD	1.6 mm		14 mm		NO	8				14 mm	CMOS		3.3 V				.4 mm	FIXED POINT	S-PQFP-G128			55 rpm	YES
ADSP-BF606KBCZ-4	Analog Devices	MICROPROCESSOR	COMMERCIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V				32	1.8/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA349,22X22,32	1.19 V	70 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.5 mm		19 mm		YES		60 MHz	30	260	19 mm	CMOS		1.25 V			Microprocessors	.8 mm	FIXED POINT	S-PBGA-B349	3	Not Qualified	400 rpm	YES	e1
ADSP-BF607KBCZ-5	Analog Devices	MICROPROCESSOR	COMMERCIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V				32	1.8/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA349,22X22,32	1.19 V	70 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.5 mm		19 mm		YES		60 MHz			19 mm	CMOS		1.25 V			Microprocessors	.8 mm	FIXED POINT	S-PBGA-B349	3	Not Qualified	500 rpm	YES	e1

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.