Microprocessors

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	No. of Serial I/Os	Sub-Category	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code
AT80612002931ABSLBWG	Intel	MICROPROCESSOR		NO LEAD	1366	LGA	RECTANGULAR	PLASTIC/EPOXY		YES				64	0.75/1.35	GRID ARRAY	LGA1366,41X43,40						BOTTOM								NOT SPECIFIED	NOT SPECIFIED		CMOS	100000 mA				Microprocessors	1 mm		R-PBGA-N1366		Not Qualified	1730 rpm
MCF5484CZP200	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.6 V			32		GRID ARRAY		3 V	85 Cel		-40 Cel	TIN LEAD	BOTTOM	2.55 mm		27 mm		YES		66.67 MHz	40	260	27 mm	CMOS		3.3 V				1 mm	FLOATING POINT	S-PBGA-B388	3	Not Qualified	200 rpm	YES	e0
MCF53721CVM240	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	196	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V		24	32		GRID ARRAY		1.4 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.75 mm		15 mm		YES	32	80 MHz	40	260	15 mm	CMOS		1.5 V				1 mm	FIXED POINT	S-PBGA-B196	3	Not Qualified	240 rpm	YES	e1
MPC5200CBV266	Motorola	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	272	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.58 V		32			GRID ARRAY		1.42 V	85 Cel		-40 Cel		BOTTOM	2.65 mm		27 mm		YES	32	35 MHz			27 mm	CMOS		1.5 V				1.27 mm	FIXED POINT	S-PBGA-B272		Not Qualified	266 rpm	YES
MV78460-B0-BJR2C133	Marvell Technology	MICROPROCESSOR, RISC			732			PLASTIC/EPOXY		YES				32	0.9		BGA732,48X48,18																		2200 mA	.9 V			Microprocessors					Not Qualified	1600 rpm
N80C186XL20	Rochester Electronics	MICROPROCESSOR	COMMERCIAL	J BEND	68	QCCJ	SQUARE	PLASTIC/EPOXY	NO	YES	5.5 V		20	16		CHIP CARRIER		4.5 V	70 Cel		0 Cel		QUAD	4.83 mm		24.2316 mm	DRAM REFRESH CONTROLLER; 3 PROGRAMMABLE TIMERS; NUMERIC COPROCESSOR INTERFACE	NO	16	40 MHz	NOT SPECIFIED	NOT SPECIFIED	24.2316 mm	CMOS		5 V				1.27 mm	FIXED POINT	S-PQCC-J68		Not Qualified	20 rpm	YES
MC7448THX1400ND	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.2 V		36	32	1.3,1.8/2.5	GRID ARRAY	BGA360,19X19,50	1.1 V	105 Cel		-40 Cel	TIN LEAD	BOTTOM	2.8 mm		25 mm		YES	64	200 MHz	40	260	25 mm	CMOS		1.15 V			Microprocessors	1.27 mm	FLOATING POINT	S-CBGA-B360	1	Not Qualified	1400 rpm	YES	e0
MPC7410HX500LE	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	360	HBGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.9 V		32	32		GRID ARRAY, HEAT SINK/SLUG		1.7 V				TIN LEAD	BOTTOM	3.2 mm		25 mm		YES	64	133 MHz	40	260	25 mm	CMOS		1.8 V				1.27 mm	FLOATING POINT	S-CBGA-B360	1	Not Qualified	500 rpm	YES	e0
MCF54452CVP200	NXP Semiconductors	MICROPROCESSOR																													40	260											3
MPC8313CVRADDC	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		32	32	1,1.8/2.5,3.3	GRID ARRAY	BGA516,26X26,40	.95 V	105 Cel		-40 Cel	TIN SILVER	BOTTOM	2.55 mm		27 mm		YES	32	66.67 MHz	40	260	27 mm	CMOS		1 V			Microprocessors	1 mm	FLOATING POINT	S-PBGA-B516	3	Not Qualified	266 rpm	YES	e2
RH80536GC0332MSL8U6	Intel	MICROPROCESSOR		PIN/PEG	478	SPGA	SQUARE	PLASTIC/EPOXY	YES	NO			28	32	1.3	GRID ARRAY, SHRINK PITCH	PGA478,26X26,50						PERPENDICULAR	4.13 mm		35 mm	ITS ALSO OPERATES AT TYPICAL CORE VOLTAGE 0.988 V AT 600MHZ	YES	64				35 mm	CMOS	21000 mA	1.34 V			Microprocessors	1.27 mm	FLOATING POINT	S-PPGA-P478		Not Qualified	1800 rpm	YES
XPC8240LZU200E	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	352	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.625 V		32	32		GRID ARRAY, LOW PROFILE	BGA352,26X26,50	2.375 V	105 Cel	5	0 Cel		BOTTOM	1.65 mm		35 mm		YES	64	66 MHz			35 mm	CMOS		2.5 V	2			1.27 mm	FLOATING POINT	S-PBGA-B352			200 rpm	YES
I5-3470	Intel	MICROPROCESSOR																																CMOS
MCF5207CVM166	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	144	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V		24	32	1.5,1.8/3.3	GRID ARRAY, LOW PROFILE	BGA144,12X12,40	1.4 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		13 mm		YES	32	40 MHz	40	260	13 mm	CMOS		1.5 V			Microprocessors	1 mm	FIXED POINT	S-PBGA-B144	3	Not Qualified	166.67 rpm	YES	e1
MCF54453CVR200	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	360	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.65 V		32	32	1.5,1.8,2.5,3.3	GRID ARRAY	BGA360,22X22,40	1.35 V	85 Cel		-40 Cel	TIN SILVER	BOTTOM	2.48 mm		23 mm		YES	32	66 MHz	40	260	23 mm	CMOS		1.5 V			Microprocessors	1 mm	FIXED POINT	S-PBGA-B360	3	Not Qualified	200 rpm	YES	e2
MCF54454CVP200	NXP Semiconductors	MICROPROCESSOR																													40	260											3
XCF5206EFT40	Motorola	MICROPROCESSOR, RISC	COMMERCIAL	GULL WING	160	QFP	SQUARE	PLASTIC/EPOXY	YES	YES	3.6 V		28	32		FLATPACK		3 V	70 Cel		0 Cel		QUAD	3.85 mm		28 mm		YES	32				28 mm	CMOS		3.3 V				.65 mm	FIXED POINT	S-PQFP-G160		Not Qualified	40 rpm	YES
21281-DB	Intel	MICROPROCESSOR, RISC	COMMERCIAL	GULL WING	144	LFQFP	SQUARE	PLASTIC/EPOXY	YES	YES	2.2 V		32	32	2,3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP144,.87SQ,20	1.8 V	70 Cel		0 Cel		QUAD	1.6 mm		20 mm		YES	32	3.68 MHz			20 mm	CMOS		2 V			Microprocessors	.5 mm	FIXED POINT	S-PQFP-G144		Not Qualified	166 rpm	YES
CS80C286-25	Renesas Electronics	MICROPROCESSOR	COMMERCIAL	J BEND	68	QCCJ	SQUARE	PLASTIC/EPOXY	NO	YES	5.25 V		24			CHIP CARRIER		4.75 V	70 Cel		0 Cel		QUAD	4.57 mm		24.23 mm		NO	16				24.23 mm	CMOS		5 V				1.27 mm	FIXED POINT	S-PQCC-J68			20 rpm	YES
MC68000P10	Motorola	MICROPROCESSOR	COMMERCIAL	THROUGH-HOLE	64	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	NO	5.25 V	0	23	32		IN-LINE		4.75 V	70 Cel	7	0 Cel	TIN LEAD	DUAL	5.84 mm	0	22.86 mm		NO	16	10 MHz			81.535 mm	CMOS	30 mA	5 V	0	0		2.54 mm	FIXED POINT	R-PDIP-T64		Not Qualified	10 rpm	NO	e0
MCF54452VP266	NXP Semiconductors	MICROPROCESSOR																													40	260											3
MIMXRT106SCVL5B	NXP Semiconductors	MICROPROCESSOR, RISC																													40	260											3
STM32MP153DAA1	STMicroelectronics	MICROPROCESSOR, RISC
A80960CF-40	Intel	MICROPROCESSOR, RISC	OTHER	PIN/PEG	168	PGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	NO	5.5 V	8	32	32	5	GRID ARRAY	PGA168,17X17	4.5 V	85 Cel	9	0 Cel		PERPENDICULAR	4.57 mm	512	44.7 mm	OPERATING CASE TEMPERTURE 0 TO 85 C	NO	32	80 MHz			44.7 mm	MOS	1150 mA	5 V	4	0	Microprocessors	2.54 mm	FIXED POINT	S-CPGA-P168		Not Qualified	40 rpm	NO
CL8068404165200SRFEH	Intel	MICROPROCESSOR		BALL	1440		RECTANGULAR	PLASTIC/EPOXY	YES	YES				64			BGA1440(UNSPEC)						BOTTOM					NO						CMOS							FIXED POINT	R-PBGA-B1440			4100 rpm	NO
CM8067702868416SR339	Intel	MICROPROCESSOR
GCIXP1200GA	Intel	MICROPROCESSOR, RISC	COMMERCIAL	BALL	432	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.1 V		32	32	2,3.3	GRID ARRAY, LOW PROFILE	BGA432,31X31,50	1.9 V	70 Cel		0 Cel	TIN LEAD	BOTTOM	1.67 mm		40 mm		YES	32	166 MHz			40 mm	CMOS		2 V			Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B432		Not Qualified	166 rpm	NO	e0
LH8066803102701SREKA	Intel	MICROPROCESSOR		BALL	1296		RECTANGULAR	PLASTIC/EPOXY	YES	YES				64					85 Cel		-40 Cel		BOTTOM					NO						CMOS							FIXED POINT	R-PBGA-B1296			1800 rpm	NO
MC6809EP	Motorola	MICROPROCESSOR	COMMERCIAL	THROUGH-HOLE	40	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	NO	5.25 V	0	16	8	5	IN-LINE	DIP40,.6	4.75 V	70 Cel	3	0 Cel	TIN LEAD	DUAL	5.08 mm	0	15.24 mm		NO	8	1 MHz			52.07 mm	NMOS		5 V	0	0	Microprocessors	2.54 mm	FIXED POINT	R-PDIP-T40		Not Qualified	1 rpm	NO	e0
MCF5233CVM150	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V		24	32		GRID ARRAY, LOW PROFILE		1.4 V	85 Cel		-40 Cel	TIN SILVER COPPER OVER NICKEL	BOTTOM	1.6 mm		17 mm	LOW POWER MODE TAKEN FROM LOW POWER MODE	YES	32	75 MHz	40	260	17 mm	CMOS		1.5 V				1 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	150 rpm	YES
MCF5235CVM150	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V		24	32		GRID ARRAY, LOW PROFILE		1.4 V	85 Cel		-40 Cel	TIN SILVER COPPER OVER NICKEL	BOTTOM	1.6 mm		17 mm	LOW POWER MODE TAKEN FROM LOW POWER MODE	YES	32	75 MHz	40	260	17 mm	CMOS		1.5 V				1 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	150 rpm	YES
P1022NXN2HFB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V			32		GRID ARRAY		.95 V				TIN SILVER	BOTTOM	2.46 mm		31 mm		YES		133 MHz	40	260	31 mm	CMOS		1 V				1 mm	FIXED POINT	S-PBGA-B689	3		800 rpm	YES	e2
P2010NXE2MHC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V		16	32		GRID ARRAY		1 V				TIN SILVER	BOTTOM	2.46 mm		31 mm		YES	64	100 MHz	40	260	31 mm	CMOS		1.05 V				1 mm	FLOATING POINT	S-PBGA-B689	3		1200 rpm	YES	e2
P3041NXN7PNC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1295	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.04 V		0			GRID ARRAY		.96 V				TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm		YES	0	133 MHz	30	245	37.5 mm	CMOS		1 V				1 mm	FIXED POINT	S-PBGA-B1295	3		1500 rpm	YES	e1
A80960KA25	Intel	MICROPROCESSOR, RISC	OTHER	PIN/PEG	132	PGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	NO	5.5 V	0	32	32	5	GRID ARRAY	PGA132,14X14	4.5 V	85 Cel	4	0 Cel		PERPENDICULAR	4.57 mm	0	37.08 mm	REGISTER SCOREBOARDING; 25 MIPS MAX; 9.4 MIPS SUSTAINED; BURST BUS	NO	32	32 MHz	NOT SPECIFIED	NOT SPECIFIED	37.08 mm	CMOS	420 mA	5 V	0	0	Microprocessors	2.54 mm	FIXED POINT	S-CPGA-P132		Not Qualified	25 rpm	NO
AF82801JIRSLB8S	Intel	MICROPROCESSOR		BALL	676	BGA	SQUARE	PLASTIC/EPOXY		YES					1.1,1.5,3.3,5	GRID ARRAY	BGA676,30X30,40						BOTTOM											CMOS					Other uPs/uCs/Peripheral ICs	1 mm		S-PBGA-B676		Not Qualified
CM8064601483405/SR1CN	Intel	MICROPROCESSOR		NO LEAD	1150	LGA	SQUARE		YES	YES				64		GRID ARRAY							BOTTOM					NO						CMOS							FIXED POINT	S-XBGA-N1150			2700 rpm	NO
FA80386EXTC33	Rochester Electronics	MICROPROCESSOR	INDUSTRIAL	GULL WING	144	LFQFP	SQUARE	PLASTIC/EPOXY	NO	YES	5.5 V		26	32		FLATPACK, LOW PROFILE, FINE PITCH		4.5 V	118 Cel		-40 Cel		QUAD	1.7 mm		20 mm		YES	16	66 MHz	NOT SPECIFIED	NOT SPECIFIED	20 mm	CMOS		5 V				.5 mm	FIXED POINT	S-PQFP-G144		Not Qualified	33 rpm	YES
FH8069004541900SRK0Y	Intel
FJ8067702739739SR342	Intel	MICROPROCESSOR
LS1012ASE7KKB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	NO LEAD	211	VFLGA	SQUARE	UNSPECIFIED	YES	YES	.93 V		16	64		GRID ARRAY, VERY THIN PROFILE, FINE PITCH		.87 V	105 Cel		0 Cel		BOTTOM	.925 mm		9.6 mm		YES	16	25 MHz	40	260	9.6 mm	CMOS		.9 V				.5 mm	FIXED POINT	S-XBGA-N211	3		1000 rpm	YES
LUPXA255A0C400	Intel	MICROPROCESSOR	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.43 V		26	32	1.3,2.5/3.3,3.3	GRID ARRAY	BGA256,16X16,40	1.235 V	85 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	2 mm		17 mm		YES	32	3.6864 MHz	40	250	17 mm	CMOS		1.3 V			Microprocessors	1 mm	FIXED POINT	S-PBGA-B256		Not Qualified	400 rpm	YES	e1
MC68010R10	Motorola	MICROPROCESSOR	COMMERCIAL	THROUGH-HOLE	64	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	NO	5.25 V	0	23	32		IN-LINE	PGA68,10X10	4.75 V	70 Cel	7	0 Cel	TIN LEAD	DUAL	5.84 mm	0	22.86 mm		NO	16	10 MHz			81.535 mm	CMOS	30 mA	5 V	0	0	Microprocessors	2.54 mm	FIXED POINT	R-PDIP-T64		Not Qualified	10 rpm	NO	e0
MC6802P	Motorola	MICROPROCESSOR	COMMERCIAL	THROUGH-HOLE	40	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	NO	5.25 V	8	16	8		IN-LINE	DIP40,.6	4.75 V	70 Cel	2	0 Cel	TIN LEAD	DUAL	5.08 mm	128	15.24 mm		NO	8	4 MHz			52.07 mm	NMOS		5 V	0	0	Microprocessors	2.54 mm	FIXED POINT	R-PDIP-T40		Not Qualified	1 rpm	YES	e0
MCF54454CVR200	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	360	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.65 V		32	32	1.5,1.8,2.5,3.3	GRID ARRAY	BGA360,22X22,40	1.35 V	85 Cel		-40 Cel	TIN SILVER	BOTTOM	2.48 mm		23 mm		YES	32	66 MHz	40	260	23 mm	CMOS		1.5 V			Microprocessors	1 mm	FIXED POINT	S-PBGA-B360	3	Not Qualified	200 rpm	YES	e2
MPC860DEZQ50D4	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V		32	32	3.3	GRID ARRAY	BGA357,19X19,50	3.135 V			0 Cel	TIN LEAD	BOTTOM	2.52 mm		25 mm		YES	32	50 MHz	30	245	25 mm	CMOS		3.3 V			Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	50 rpm	YES	e0
NG80960JD3V66	Intel	MICROPROCESSOR, RISC		GULL WING	132	QFP	SQUARE	PLASTIC/EPOXY	YES	YES	3.45 V		32	32		FLATPACK		3.15 V					QUAD					YES	32	33.3 MHz	NOT SPECIFIED	NOT SPECIFIED		CMOS		3.3 V					FIXED POINT	S-PQFP-G132		Not Qualified	66 rpm	YES
SCC68070CCA84	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	J BEND	84	QCCJ	SQUARE	PLASTIC/EPOXY		YES				32	5	CHIP CARRIER	LDCC84,1.2SQ		70 Cel		0 Cel		QUAD											CMOS	112 mA	5 V			Microprocessors	1.27 mm		S-PQCC-J84		Not Qualified	15 rpm

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.