Microprocessors

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Screening Level	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	No. of Serial I/Os	Sub-Category	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code
MPC860TCZQ50D4	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V			32	32	3.3	GRID ARRAY	BGA357,19X19,50	3.135 V			-40 Cel	TIN LEAD SILVER	BOTTOM	2.52 mm		25 mm		YES	32	50 MHz	30	245	25 mm	CMOS		3.3 V			Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	50 rpm	YES	e0
MPC860TCZQ66D4	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V			32	32	3.3	GRID ARRAY	BGA357,19X19,50	3.135 V			-40 Cel	TIN LEAD	BOTTOM	2.52 mm		25 mm		YES	32	50 MHz	30	245	25 mm	CMOS		3.3 V			Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	66 rpm	YES	e0
MPC860TZQ80D4	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V			32	32	3.3	GRID ARRAY	BGA357,19X19,50	3.135 V			0 Cel	TIN LEAD SILVER	BOTTOM	2.52 mm		25 mm		YES	32	50 MHz	30	245	25 mm	CMOS		3.3 V			Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	80 rpm	YES	e0
STM32MP153FAA1	STMicroelectronics	MICROPROCESSOR, RISC
AM6411AKCGHAALV	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	441	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	.79 V	16		0	64		GRID ARRAY, FINE PITCH	BGA441,21X21,32	.715 V	105 Cel	1	-40 Cel		BOTTOM	2.652 mm	1048576	17.2 mm	ALSO OPERATES AT 0.85V NOMINAL SUPPLY	YES	16	25 MHz			17.2 mm	CMOS		.75 V				.8 mm	FIXED POINT	S-PBGA-B441			1000 rpm	YES
AT91SAM9G45-CU	Microchip Technology	MICROPROCESSOR, RISC		BALL	324	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V	8		26	32		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA324,18X18,32	.9 V	85 Cel	1	-40 Cel		BOTTOM	1.2 mm	65536	15 mm		YES	32	50 MHz			15 mm	CMOS		1 V	37	7		.8 mm	FIXED POINT	S-PBGA-B324			400 rpm	YES
AT91SAM9G45-CU-999	Microchip Technology	MICROPROCESSOR, RISC		BALL	324	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V	8		26	32		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA324,18X18,32	.9 V	85 Cel	1	-40 Cel		BOTTOM	1.2 mm	65536	15 mm		YES	32	50 MHz			15 mm	CMOS		1 V	37	7		.8 mm	FIXED POINT	S-PBGA-B324			400 rpm	YES
ATSAMA5D44B-CUR	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	361	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8	TS 16949	26	32		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA361,19X19,32	1.16 V	85 Cel	1	-40 Cel		BOTTOM	1.2 mm	131072	16 mm		YES	32	50 MHz			16 mm	CMOS		1.26 V	32	2		.8 mm	FLOATING POINT	S-PBGA-B361			600 rpm	YES
DF8064101211300/SR0VY	Intel	MICROPROCESSOR, RISC		BALL	559	BGA		PLASTIC/EPOXY		YES					64	1,1.5	GRID ARRAY	BGA559(UNSPEC)						BOTTOM											CMOS	6700 mA				Microprocessors					Not Qualified	1860 rpm
FH8066802980002SR2YB	Intel	MICROPROCESSOR		BALL	1296	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES					64		GRID ARRAY							BOTTOM					NO						CMOS							FIXED POINT	R-PBGA-B1296			2400 rpm	NO
FH8066802980002SR2Z7	Intel	MICROPROCESSOR		BALL	1296	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES					64		GRID ARRAY							BOTTOM					NO						CMOS							FIXED POINT	R-PBGA-B1296			2400 rpm	NO
KMPC8347EVRAGDB	Freescale Semiconductor	MICROPROCESSOR		BALL	620	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V			32	32		GRID ARRAY		1.14 V				Tin/Silver (Sn/Ag)	BOTTOM	2.46 mm		29 mm		YES	32	66 MHz	40	260	29 mm	CMOS		1.2 V				1 mm	FLOATING POINT	S-PBGA-B620	3	Not Qualified	400 rpm	YES	e2
KMPC885VR133	Freescale Semiconductor	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V			32	32	1.8,3.3	GRID ARRAY	BGA357,19X19,50	1.7 V				TIN SILVER COPPER	BOTTOM	2.52 mm		25 mm		YES	32		40	260	25 mm	CMOS		1.8 V			Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	133 rpm	YES	e1
MC7448HX1000ND	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	YES	1.05 V			0	32	1.3,1.8/2.5	GRID ARRAY	BGA360,19X19,50	.95 V	105 Cel		0 Cel	TIN LEAD	BOTTOM	2.8 mm		25 mm		NO	0	1000 MHz	40	260	25 mm	CMOS		1 V			Microprocessors	1.27 mm	FIXED POINT	S-CBGA-B360	1	Not Qualified	1000 rpm	YES	e0
MC7448HX1250ND	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	YES	1.15 V			0	32	1.3,1.8/2.5	GRID ARRAY	BGA360,19X19,50	1.05 V	105 Cel		0 Cel	TIN LEAD	BOTTOM	2.8 mm		25 mm		NO	0	1250 MHz	40	260	25 mm	CMOS		1.1 V			Microprocessors	1.27 mm	FIXED POINT	S-CBGA-B360	1	Not Qualified	1250 rpm	YES	e0
MC7448HX1700LD	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.32 V			36	32	1.3,1.8/2.5	GRID ARRAY	BGA360,19X19,50	1.25 V	105 Cel		0 Cel	TIN LEAD	BOTTOM	2.8 mm		25 mm		YES	64	200 MHz	40	260	25 mm	CMOS		1.3 V			Microprocessors	1.27 mm	FLOATING POINT	S-CBGA-B360	1	Not Qualified	1700 rpm	YES	e0
MC7448HX600ND	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	YES	1.05 V			0	32	1.3,1.8/2.5	GRID ARRAY	BGA360,19X19,50	.95 V	105 Cel		0 Cel	TIN LEAD	BOTTOM	2.8 mm		25 mm		NO	0	600 MHz	40	260	25 mm	CMOS		1 V			Microprocessors	1.27 mm	FIXED POINT	S-CBGA-B360	1	Not Qualified	600 rpm	YES	e0
MC7448THX1000ND	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.2 V			36	32	1.3,1.8/2.5	GRID ARRAY	BGA360,19X19,50	1.1 V	105 Cel		-40 Cel	TIN LEAD	BOTTOM	2.8 mm		25 mm		YES	64	200 MHz	40	260	25 mm	CMOS		1.15 V			Microprocessors	1.27 mm	FLOATING POINT	S-CBGA-B360	1	Not Qualified	1000 rpm	YES	e0
MC7448TVU1000ND	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	YES	1.05 V			0	32		GRID ARRAY		.95 V	105 Cel		0 Cel		BOTTOM	2.8 mm		25 mm		NO	0	1000 MHz	40	260	25 mm	CMOS		1 V				1.27 mm	FIXED POINT	S-CBGA-B360	1		1000 rpm	YES
MC7448VS1400ND	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	NO LEAD	360	LGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	YES	1.2 V			0	32	1.3,1.8/2.5	GRID ARRAY	LGA360,19X19,50	1.1 V	105 Cel		0 Cel		BOTTOM	2.8 mm		25 mm		NO	0	1400 MHz	30	245	25 mm	CMOS		1.15 V			Microprocessors	1.27 mm	FIXED POINT	S-CBGA-N360	1	Not Qualified	1400 rpm	YES
MC7448VU1000LD	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.2 V			36	32	1.3,1.8/2.5	GRID ARRAY	BGA360,19X19,50	1.1 V	105 Cel		0 Cel		BOTTOM	2.4 mm		25 mm		YES	64	200 MHz	40	260	25 mm	CMOS		1.15 V			Microprocessors	1.27 mm	FLOATING POINT	S-CBGA-B360	1	Not Qualified	1000 rpm	YES
MC7448VU1000ND	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	NO LEAD	360	LGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	YES	1.05 V			0	32	1.3,1.8/2.5	GRID ARRAY	BGA360,19X19,50	.95 V	105 Cel		0 Cel		BOTTOM	2.8 mm		25 mm		NO	0	1000 MHz	40	260	25 mm	CMOS		1 V			Microprocessors	1.27 mm	FIXED POINT	S-CBGA-N360	1	Not Qualified	1000 rpm	YES
MC7448VU1250ND	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	NO LEAD	360	LGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	YES	1.15 V			0	32	1.3,1.8/2.5	GRID ARRAY	BGA360,19X19,50	1.05 V	105 Cel		0 Cel		BOTTOM	2.8 mm		25 mm		NO	0	1250 MHz	40	260	25 mm	CMOS		1.1 V			Microprocessors	1.27 mm	FIXED POINT	S-CBGA-N360	1	Not Qualified	1250 rpm	YES
MC7448VU1267ND	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	NO LEAD	360	LGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	YES	1.1 V			0	32	1.3,1.8/2.5	GRID ARRAY	BGA360,19X19,50	1 V	105 Cel		0 Cel		BOTTOM	2.8 mm		25 mm		NO	0	1267 MHz	40	260	25 mm	CMOS		1.05 V			Microprocessors	1.27 mm	FIXED POINT	S-CBGA-N360	1	Not Qualified	1267 rpm	YES
MC7448VU1400ND	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	NO LEAD	360	LGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	YES	1.2 V			0	32	1.3,1.8/2.5	GRID ARRAY	BGA360,19X19,50	1.1 V	105 Cel		0 Cel		BOTTOM	2.8 mm		25 mm		NO	0	1400 MHz	40	260	25 mm	CMOS		1.15 V			Microprocessors	1.27 mm	FIXED POINT	S-CBGA-N360	1	Not Qualified	1400 rpm	YES
MC7448VU1600LD	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.3 V			36	32	1.3,1.8/2.5	GRID ARRAY	BGA360,19X19,50	1.2 V	105 Cel		0 Cel		BOTTOM	2.4 mm		25 mm		YES	64	200 MHz	40	260	25 mm	CMOS		1.25 V			Microprocessors	1.27 mm	FLOATING POINT	S-CBGA-B360	1	Not Qualified	1600 rpm	YES
MCF5272CVM66	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	196	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.6 V			23	32		GRID ARRAY		3 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.75 mm		15 mm		YES	32	66 MHz	40	260	15 mm	CMOS		3.3 V				1 mm	FIXED POINT	S-PBGA-B196	3	Not Qualified	66 rpm	YES	e1
MCF5275LCVM166	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	196	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V			24	32		GRID ARRAY, LOW PROFILE		1.4 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		15 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	83 MHz	40	260	15 mm	CMOS		1.5 V				1 mm	FIXED POINT	S-PBGA-B196	3	Not Qualified	166 rpm	YES	e1
MIMXRT533SFFOCR	NXP Semiconductors	MICROPROCESSOR, RISC																														40	260											3
MPC8309CVMAHFCA	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	489	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V			0	32	1	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA489,23X23,32	.95 V	105 Cel		-40 Cel	TIN SILVER	BOTTOM	1.61 mm		19 mm		YES	0	66.67 MHz	40	260	19 mm	CMOS		1 V			Microprocessors	.8 mm	FLOATING POINT	S-PBGA-B489	3	Not Qualified	417 rpm	YES	e2
MPC8349CVVAJDB	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	672	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V			32	32	1.2,1.8/2.5,2.5/3.3	GRID ARRAY, LOW PROFILE	BGA672,34X34,40	1.14 V	105 Cel		-40 Cel	TIN SILVER	BOTTOM	1.69 mm		35 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz	40	260	35 mm	CMOS		1.2 V			Microprocessors	1 mm	FLOATING POINT	S-PBGA-B672	3	Not Qualified	533 rpm	YES	e2
MPC8349CZUAJDB	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	672	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V			32	32	1.2,1.8/2.5,2.5/3.3	GRID ARRAY, LOW PROFILE	BGA672,34X34,40	1.14 V	105 Cel		-40 Cel	TIN LEAD	BOTTOM	1.69 mm		35 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz	40	260	35 mm	CMOS		1.2 V			Microprocessors	1 mm	FLOATING POINT	S-PBGA-B672	3	Not Qualified	533 rpm	YES	e0
MPC8349ECVVAJFB	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	672	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V			32	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE	BGA672,34X34,40	1.14 V	105 Cel		-40 Cel	TIN SILVER	BOTTOM	1.69 mm		35 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz	40	260	35 mm	CMOS		1.2 V			Microprocessors	1 mm	FLOATING POINT	S-PBGA-B672	3	Not Qualified	533 rpm	YES	e2
MPC860TVR66D4	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V			32	32	3.3	GRID ARRAY	BGA357,19X19,50	3.135 V				TIN SILVER COPPER	BOTTOM	2.52 mm		25 mm		YES	32	50 MHz	30	245	25 mm	CMOS		3.3 V			Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	66 rpm	YES	e1
SPC5123YVY400B	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	516	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.47 V		AEC-Q100	32	32	1.4,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA516,26X26,40	1.33 V	85 Cel		-40 Cel	TIN SILVER	BOTTOM	2.55 mm		27 mm		YES	32	35 MHz	40	260	27 mm	CMOS		1.4 V			Microprocessors	1 mm	FIXED POINT	S-PBGA-B516	3	Not Qualified	400 rpm	YES	e2
STM32MP135FAE7T	STMicroelectronics	MICROPROCESSOR, RISC		BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.38 V	8		26	32		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.32 V	105 Cel		-40 Cel		BOTTOM	1.7 mm	172032	14 mm		YES	16	48 MHz			14 mm	CMOS	268 mA	1.35 V	56	10		.8 mm	FIXED POINT	S-PBGA-B289			1000 rpm	YES
STM32MP151CAD3T	STMicroelectronics	MICROPROCESSOR, RISC																														NOT SPECIFIED	NOT SPECIFIED
STM32MP151FAB1	STMicroelectronics	MICROPROCESSOR, RISC
STM32MP153AAD3T	STMicroelectronics	MICROPROCESSOR, RISC																														NOT SPECIFIED	NOT SPECIFIED
STM32MP153CAB3T	STMicroelectronics	MICROPROCESSOR, RISC																														NOT SPECIFIED	NOT SPECIFIED
STM32MP153FAC1	STMicroelectronics	MICROPROCESSOR, RISC
T2080NXN8MQB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	896	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.055 V			16	64		GRID ARRAY, FINE PITCH	BGA896,30X30,32	.995 V	105 Cel	12	-40 Cel		BOTTOM	2.61 mm		25 mm		YES	64		30	250	25 mm	CMOS		1.025 V		8		.8 mm	FIXED POINT	S-PBGA-B896	3		1200 rpm	NO
T2080NXN8P1B	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	896	BGA	SQUARE	PLASTIC/EPOXY	YES	YES					64		GRID ARRAY	BGA896(UNSPEC)		105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM					NO			30	250		CMOS							FIXED POINT	S-PBGA-B896	3		1533 rpm	NO	e1
TMS320DM8147SCYE1	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	684	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.42 V	8		28	32	1.1/1.35	GRID ARRAY, FINE PITCH	BGA684,28X28,32	1.28 V	90 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.06 mm	8192	23 mm		YES	16	30 MHz	NOT SPECIFIED	250	23 mm	CMOS		1.35 V	72		Digital Signal Processors	.8 mm	FLOATING POINT	S-PBGA-B684	4	Not Qualified	1000 rpm	YES	e1
ADSP-21489KSWZ-3B	Analog Devices	MICROPROCESSOR	COMMERCIAL	GULL WING	176	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V			24	40	1.1,3.3	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP176,1.0SQ,20	1.05 V	70 Cel		0 Cel	Matte Tin (Sn) - annealed	QUAD	1.6 mm	163840	24 mm		YES	16	25 MHz			24 mm	CMOS		1.1 V			Digital Signal Processors	.5 mm	FLOATING POINT	S-PQFP-G176	3	Not Qualified	350 rpm	NO	e3
APX81129UG-7	Diodes Incorporated	MICROPROCESSOR	INDUSTRIAL	GULL WING	4	VSOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	5.5 V			0			SMALL OUTLINE		1.1 V	85 Cel		-40 Cel	MATTE TIN	DUAL	1 mm		1.3 mm		NO	0		30	260	2.9 mm	CMOS		2.5 V				1.778 mm	FIXED POINT	R-PDSO-G4	1	Not Qualified		NO	e3
ATSAMA5D33A-CUR	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	324	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8		26	32	1.2	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA324,18X18,32	1.08 V	85 Cel	1	-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	131072	15 mm		YES	16	48 MHz			15 mm	CMOS		1.2 V	39	10	Microprocessors	.8 mm	FLOATING POINT	S-PBGA-B324		Not Qualified	536 rpm	YES	e1
CM8070104282329SRH70	Intel	MICROPROCESSOR

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.