Microprocessors

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Screening Level	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	CPU Family	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	ROM Words	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	RAM Bytes	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	No. of Serial I/Os	Sub-Category	ROM Programmability	Bus Compatibility	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code	No. of I/O Lines
LS1020AXE7KQB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V			16	32		GRID ARRAY, FINE PITCH		.97 V					TIN SILVER COPPER	BOTTOM	2.07 mm			19 mm		YES	32	133.3 MHz	40	260	19 mm		CMOS		1 V						.8 mm	FLOATING POINT	S-PBGA-B525	3		1000 rpm	YES	e1
MPC8280CZUQLDA	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	480	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V			32	32	1.5,3.3	GRID ARRAY, LOW PROFILE	BGA480,29X29,50	1.45 V	105 Cel			-40 Cel	TIN LEAD	BOTTOM	1.65 mm			37.5 mm		YES	64		40	260	37.5 mm		CMOS		1.5 V			Other uPs/uCs/Peripheral ICs			1.27 mm	FLOATING POINT	S-PBGA-B480	4	Not Qualified	333 rpm	YES	e0
MCIMX31CVMN4D	NXP Semiconductors	MICROPROCESSOR, RISC														1.5,3.3								TIN SILVER COPPER										40	260								Microprocessors		I2C; SPI; UART; USB				3	Not Qualified			e1	9
AM3517AZERAC	Texas Instruments	MICROPROCESSOR, RISC		BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.248 V			16	16	1.2,1.8,3.3	GRID ARRAY	BGA484,22X22,40	1.152 V					TIN SILVER COPPER	BOTTOM	2.48 mm			23 mm		YES	16	26 MHz	30	260	23 mm		CMOS		1.2 V			Microprocessors			1 mm	FLOATING POINT	S-PBGA-B484	3	Not Qualified	600 rpm	YES	e1
P1021NXE2HFB	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V			0	32		GRID ARRAY		.95 V	125 Cel			-40 Cel	TIN SILVER	BOTTOM	2.46 mm			31 mm		YES	0	100 MHz	40	260	31 mm		CMOS		1 V						1 mm	FIXED POINT	S-PBGA-B689	3		800 rpm	YES	e2
DM3725CUSD100	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	423	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V			26	32	1.2,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA423,24X24,25	1.08 V	90 Cel			-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	1.4 mm		16384	16 mm		YES	16	54 MHz	NOT SPECIFIED	260	16 mm		CMOS	37 mA	1.14 V	128		Digital Signal Processors			.65 mm	FLOATING POINT	S-PBGA-B423	3	Not Qualified	1000 rpm	YES	e1
MC7455ARX1000LG	Motorola	MICROPROCESSOR, RISC		BALL	483	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.35 V			36	32	1.3,1.5/2.5,1.8/2.5	GRID ARRAY	BGA483,22X22,50	1.25 V						BOTTOM	3.2 mm			29 mm		YES	64	133 MHz			29 mm		CMOS		1.3 V			Microprocessors			1.27 mm	FLOATING POINT	S-CBGA-B483		Not Qualified	1000 rpm	YES
MIMXRT1051DVL6A	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.3 V	8		0	32		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,25	1.25 V	95 Cel		0	0 Cel		BOTTOM	1.43 mm		524288	10 mm		YES	0	24 MHz			10 mm		CMOS	105 mA		32	29				.65 mm	FLOATING-POINT	S-PBGA-B196			600 rpm	YES
Z0840006PSC	IXYS Corporation	MICROPROCESSOR, RISC	COMMERCIAL	THROUGH-HOLE	40	DIP	RECTANGULAR	PLASTIC/EPOXY		NO					8	5	IN-LINE	DIP40,.6		70 Cel			0 Cel		DUAL													MOS	200 mA	5 V			Microprocessors			2.54 mm		R-PDIP-T40		Not Qualified	6 rpm
DM3730CUS	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	423	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V	8		26	32	1.2,1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA423,24X24,25	1.08 V	90 Cel			0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	1.4 mm		16384	16 mm		YES	16	54 MHz	NOT SPECIFIED	260	16 mm		CMOS	37 mA	1.14 V	128		Digital Signal Processors			.65 mm	FLOATING POINT	S-PBGA-B423	3	Not Qualified	800 rpm	YES	e1
DM3730CUSD100	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	423	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V	8		26	32	1.2,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA423,24X24,25	1.08 V	90 Cel			-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	1.4 mm		16384	16 mm		YES	16	54 MHz	NOT SPECIFIED	260	16 mm		CMOS	37 mA	1.14 V	128		Digital Signal Processors			.65 mm	FLOATING POINT	S-PBGA-B423	3	Not Qualified	1000 rpm	YES	e1
TDA4VM88TGBALFRQ1	Texas Instruments	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	827	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	.84 V	8	AEC-Q100	0	64		GRID ARRAY, FINE PITCH	BGA827,29X29,32	.76 V	125 Cel		1	-40 Cel	TIN SILVER COPPER	BOTTOM	2.8 mm		9961472	24 mm		YES	32	27 MHz		250	24 mm		CMOS		.8 V		26				.8 mm	FLOATING-POINT	S-PBGA-B827	3		2000 rpm	YES	e1
ATSAMA5D44B-CU	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	361	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8	TS 16949	26	32		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA361,19X19,32	1.16 V	85 Cel		1	-40 Cel		BOTTOM	1.2 mm		131072	16 mm		YES	32	50 MHz			16 mm		CMOS		1.26 V	32	2				.8 mm	FLOATING POINT	S-PBGA-B361			600 rpm	YES
KMPC866TZP133A	Motorola	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES				32	32		GRID ARRAY								BOTTOM	2.52 mm			25 mm	REQUIRES 3.3V SUPPLY FOR I/O	YES	32	133 MHz			25 mm		CMOS		1.8 V						1.27 mm	FIXED POINT	S-PBGA-B357		Not Qualified	133 rpm	YES
MCF54416CMJ250	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V			0	32	1.2,1.8,1.8/3.3,3.3	GRID ARRAY	BGA256,16X16,40	1.14 V	85 Cel			-40 Cel		BOTTOM						YES	0	100 MHz	40	260			CMOS		1.2 V			Microprocessors			1 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	250 rpm	YES
MPC852TVR100A	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V			32	32	1.8,3.3	GRID ARRAY	BGA256,16X16,50	1.7 V					TIN SILVER COPPER	BOTTOM	2.54 mm			23 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	66 MHz	30	245	23 mm		CMOS		1.8 V			Other uPs/uCs/Peripheral ICs			1.27 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	100 rpm	YES	e1
STM32MP157CAD3	STMicroelectronics	MICROPROCESSOR, RISC																																NOT SPECIFIED	NOT SPECIFIED
AM3505AZERC	Texas Instruments	MICROPROCESSOR, RISC		BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.248 V			16	16	1.2,1.8,3.3	GRID ARRAY	BGA484,22X22,40	1.152 V					TIN SILVER COPPER	BOTTOM	2.48 mm			23 mm		YES	16	26 MHz	30	260	23 mm		CMOS		1.2 V			Microprocessors			1 mm	FLOATING POINT	S-PBGA-B484	3	Not Qualified	600 rpm	YES	e1
STM32MP131AAF3	STMicroelectronics	MICROPROCESSOR, RISC		BALL	320	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.38 V	8		26	32		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA320,21X21,20	1.21 V	125 Cel			-40 Cel		BOTTOM	1.2 mm		172032	11 mm		YES	16	48 MHz			11 mm		CMOS	239 mA	1.25 V	56	8				.5 mm	FIXED POINT	S-PBGA-B320			650 rpm	YES
AM3356BZCZD60	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	324	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.144 V	8		28	32	0.95/1.1	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA324,18X18,32	1.056 V	90 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		131072	15 mm		YES	16	26 MHz	30	260	15 mm		CMOS	400 mA	1.1 V	64		Microprocessors			.8 mm	FIXED POINT	S-PBGA-B324	3	Not Qualified	600 rpm	YES	e1
MC9S08PT8VLC	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	GULL WING	32	QFP	SQUARE	PLASTIC/EPOXY		YES					8	3/5	FLATPACK	QFP32,.35SQ,32		105 Cel	HCS08		-40 Cel	TIN	QUAD		8192							40	260		2048	CMOS	14 mA				Microcontrollers	FLASH		.8 mm		S-PQFP-G32	3	Not Qualified	20 rpm		e3
AM3517AZERA	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.248 V	8		16	16	1.2,1.8,3.3	GRID ARRAY	BGA484,22X22,40	1.152 V	105 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	2.48 mm		65536	23 mm		YES	16	26 MHz	30	260	23 mm		CMOS	1500 mA	1.2 V	32		Microprocessors			1 mm	FLOATING POINT	S-PBGA-B484	3	Not Qualified	600 rpm	YES	e1
MCIMX6U6AVM08AC	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V			16	64		GRID ARRAY, LOW PROFILE, FINE PITCH		1.275 V	125 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm			21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	YES	64	24 MHz	40	260	21 mm		CMOS		1.35 V						.8 mm	FIXED POINT	S-PBGA-B624	3		800 rpm	YES	e1
MPC8321VRADDC	Freescale Semiconductor	MICROPROCESSOR, RISC	OTHER	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V			0	32	1,1.8/2.5,3.3	GRID ARRAY	BGA516,26X26,40	.95 V	105 Cel			0 Cel	TIN SILVER	BOTTOM	2.55 mm			27 mm		YES	0	66.67 MHz	40	260	27 mm		CMOS		1 V			Microprocessors			1 mm	FIXED POINT	S-PBGA-B516	3	Not Qualified	266 rpm	YES	e2
SPC5200CVR400B	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	272	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.58 V		AEC-Q100	32	32	1.5,3.3	GRID ARRAY	BGA272,20X20,50	1.42 V	85 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	2.65 mm			27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	66 MHz	40	260	27 mm		CMOS		1.5 V			Microprocessors			1.27 mm	FLOATING POINT	S-PBGA-B272	3	Not Qualified	400 rpm	YES	e1
STM32MP153AAD3	STMicroelectronics	MICROPROCESSOR, RISC																																NOT SPECIFIED	NOT SPECIFIED
XAM6254ATCGGAALW	Texas Instruments	MICROPROCESSOR, RISC		BALL	425	VFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	.895 V	8		14	64		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA425,25X25,20	.81 V	105 Cel		1	-40 Cel		BOTTOM	.89 mm		835584	13 mm	also available with 0.75V Nom suppl	YES	16	26 MHz			13 mm		CMOS		.85 V		9				.5 mm	FIXED POINT	S-PBGA-B425			1400 rpm	YES
AM3351BZCE30R	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	298	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.144 V	8		28	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.056 V	90 Cel			0 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm		131072	13 mm	ALSO OPERATES AT MIN 0.912 V	YES	16	26 MHz	30	260	13 mm		CMOS	400 mA	1.1 V	64					.65 mm	FIXED POINT	S-PBGA-B298	3		300 rpm	YES	e1
MCIMX6U1AVM08AD	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V			16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.275 V	125 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm			21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	YES	64		40	260	21 mm		CMOS								.8 mm	FLOATING POINT	S-PBGA-B624	3		800 rpm	YES	e1
XAM6234ATCGGAALW	Texas Instruments	MICROPROCESSOR, RISC		BALL	425	VFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	.895 V	8		14	64		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA425,25X25,20	.81 V	105 Cel		1	-40 Cel		BOTTOM	.89 mm		835584	13 mm	also available with 0.75V Nom suppl	YES	16	26 MHz			13 mm		CMOS		.85 V		9				.5 mm	FIXED POINT	S-PBGA-B425			1400 rpm	YES
AM3354BZCZA80	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	324	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.326 V	8		28	32	0.95/1.1	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA324,18X18,32	1.21 V	105 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		131072	15 mm		YES	16	26 MHz	30	260	15 mm		CMOS	400 mA	1.26 V	64		Microprocessors			.8 mm	FIXED POINT	S-PBGA-B324	3	Not Qualified	800 rpm	YES	e1
MCF5206EAB54	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	GULL WING	160	QFP	SQUARE	PLASTIC/EPOXY	YES	YES	3.6 V			28	32		FLATPACK		3 V	70 Cel			0 Cel	TIN	QUAD	3.85 mm			28 mm		YES	32	54 MHz	30	245	28 mm		CMOS		3.3 V						.65 mm	FIXED POINT	S-PQFP-G160	3		54 rpm	YES	e3
MPC8313EVRAFFC	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	516	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V			32	32	1,1.8/2.5,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA516,26X26,40	.95 V	105 Cel			0 Cel	TIN SILVER	BOTTOM	2.55 mm			27 mm	ALSO REQUIRES 3.3V I/O SUPPLY	YES	32	66.67 MHz	40	260	27 mm		CMOS		1 V			Microprocessors			1 mm	FLOATING POINT	S-PBGA-B516	3	Not Qualified	333 rpm	YES	e2
OMAP3530ECBBA	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	515	VFBGA	SQUARE	PLASTIC/EPOXY		YES						1.1,1.2,1.8,1.8/3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA515,28X28,16		105 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	.9 mm			12 mm					30	260	12 mm		CMOS					Graphics Processors			.4 mm		S-PBGA-B515	3	Not Qualified	720 rpm		e1
AM3356BZCZA60	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	324	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.144 V	8		28	32	0.95/1.1	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA324,18X18,32	1.056 V	105 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		131072	15 mm		YES	16	26 MHz	30	260	15 mm		CMOS	400 mA	1.1 V	64		Microprocessors			.8 mm	FIXED POINT	S-PBGA-B324	3	Not Qualified	600 rpm	YES	e1
AM5748ABZXA	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	760	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V			16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.11 V	105 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	1.63 mm			23 mm		YES	32	38.4 MHz	30	250	23 mm		CMOS		1.15 V						.8 mm	FIXED POINT	S-PBGA-B760	3		1500 rpm	YES	e1
MCIMX6QP6AVT8AB	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.5 V						GRID ARRAY, FINE PITCH		1.225 V	125 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm			21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE				40	260	21 mm		CMOS								.8 mm		S-PBGA-B624	3				e1
STM32MP131AAG3	STMicroelectronics	MICROPROCESSOR, RISC		BALL	289	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.38 V	8		26	32		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA289,17X17,20	1.21 V	125 Cel			-40 Cel		BOTTOM	1.2 mm		172032	9 mm		YES	16	48 MHz			9 mm		CMOS	239 mA	1.25 V	56	8				.5 mm	FIXED POINT	S-PBGA-B289			650 rpm	YES
AM3703CBPA	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	515	VFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V	8		26	32	1.1,1.8	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA515,28X28,16	.9 V	105 Cel			-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	.71 mm		65536	12 mm		YES	16	54 MHz	NOT SPECIFIED	260	12 mm		CMOS	800 mA	1.1 V			Microprocessors			.5 mm	FLOATING POINT	S-PBGA-B515	3	Not Qualified	800 rpm	YES	e1
AT91SAM9G35-CU-999	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	217	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V	8		26	32	1,1.8/3.3,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA217,17X17,32	.9 V	85 Cel		1	-40 Cel		BOTTOM	1.4 mm		32768	15 mm		YES	32	50 MHz			15 mm		CMOS		1 V	16		Microprocessors			.8 mm	FIXED POINT	S-PBGA-B217		Not Qualified	400 rpm	YES
MCIMX6QP6AVT1AA	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V			26	32		GRID ARRAY, FINE PITCH		1.35 V	125 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm			21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	YES	64		40	260	21 mm		CMOS								.8 mm	FLOATING POINT	S-PBGA-B624	3		1000 rpm	YES	e1
MCIMX6S6AVM08AB	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V			16	64		GRID ARRAY, LOW PROFILE, FINE PITCH		1.275 V	125 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm			21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	YES	32	24 MHz	40	260	21 mm		CMOS		1.35 V						.8 mm	FIXED POINT	S-PBGA-B624	3		800 rpm	YES	e1
MPC8270CVVUPEA	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	480	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V			32	32	1.5,3.3	GRID ARRAY, LOW PROFILE	BGA480,29X29,50	1.45 V	105 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	1.65 mm			37.5 mm		YES	64		40	260	37.5 mm		CMOS		1.5 V			Other uPs/uCs/Peripheral ICs			1.27 mm	FLOATING POINT	S-PBGA-B480	4	Not Qualified	450 rpm	YES	e1
STM32MP131AAE3	STMicroelectronics	MICROPROCESSOR, RISC		BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.38 V	8		26	32		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.21 V	125 Cel			-40 Cel		BOTTOM	1.7 mm		172032	14 mm		YES	16	48 MHz			14 mm		CMOS	239 mA	1.25 V	56	8				.8 mm	FIXED POINT	S-PBGA-B289			650 rpm	YES
T2080NXE8TTB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	896	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES					64		GRID ARRAY, FINE PITCH			105 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm			25 mm		NO			30	250	25 mm		CMOS								.8 mm	FIXED POINT	S-PBGA-B896	3		1800 rpm	NO	e1
AM5749ABZXEA	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	760	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V			16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.11 V	105 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	1.63 mm			23 mm		YES	32	38.4 MHz	30	250	23 mm		CMOS		1.15 V						.8 mm	FIXED POINT	S-PBGA-B760	3		1500 rpm	YES	e1
ATSAMA5D42B-CU	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	361	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8	TS 16949	26	32		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA361,19X19,32	1.16 V	85 Cel		1	-40 Cel		BOTTOM	1.2 mm		131072	16 mm		YES	32	50 MHz			16 mm		CMOS		1.26 V	32	2				.8 mm	FLOATING POINT	S-PBGA-B361			600 rpm	YES
MPC8315CVRAFDA	NXP Semiconductors	MICROPROCESSOR		BALL	620	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V			32	32	1,1.8/2.5,3.3	GRID ARRAY	BGA620,28X28,40	.95 V					TIN SILVER	BOTTOM	2.46 mm			29 mm	ALSO REQUIRES 3.3V I/O SUPPLY	YES	32	66.67 MHz	40	260	29 mm		CMOS		1 V			Microprocessors			1 mm	FLOATING POINT	S-PBGA-B620	3	Not Qualified	333 rpm	YES	e2

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.