Microprocessors

Reset All

Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Screening Level	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	No. of Serial I/Os	Sub-Category	Bus Compatibility	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code	No. of I/O Lines
SPC5200CVR400BR2	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	272	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.58 V		AEC-Q100	32	32	1.5,3.3	GRID ARRAY	BGA272,20X20,50	1.42 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.65 mm		27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	66 MHz	40	260	27 mm	CMOS		1.5 V			Microprocessors		1.27 mm	FLOATING POINT	S-PBGA-B272	3	Not Qualified	400 rpm	YES	e1
DM3730CBP100	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	515	VFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V	8		26	32	1.2,1.8	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA515,28X28,16	1.08 V	90 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	.71 mm	16384	12 mm		YES	16	54 MHz	NOT SPECIFIED	260	12 mm	CMOS	37 mA	1.14 V	128		Digital Signal Processors		.4 mm	FLOATING POINT	S-PBGA-B515	3	Not Qualified	1000 rpm	YES	e1
AM3352BZCZA30	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	324	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.144 V	8		28	32	0.95/1.1	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA324,18X18,32	1.056 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	131072	15 mm	ALSO OPERATES AT MIN 0.912 V	YES	16	26 MHz	30	260	15 mm	CMOS	400 mA	1.1 V	64		Microprocessors		.8 mm	FIXED POINT	S-PBGA-B324	3	Not Qualified	300 rpm	YES	e1
AT91SAM9G45B-CU	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	324	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V	8		26	32	1,1.8/3.3,3.3	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA324,18X18,32	.9 V	85 Cel	1	-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	65536	15 mm		YES	32	50 MHz	40	260	15 mm	CMOS		1 V	37	7	Microcontrollers		.8 mm	FIXED POINT	S-PBGA-B324	3	Not Qualified	400 rpm	YES	e1
ADSP-21489KSWZ-3A	Analog Devices	MICROPROCESSOR	COMMERCIAL	GULL WING	100	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V			24	40	1.1,3.3	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.05 V	70 Cel		0 Cel	Matte Tin (Sn) - annealed	QUAD	1.6 mm	163840	14 mm		YES	16	25 MHz			14 mm	CMOS		1.1 V			Digital Signal Processors		.5 mm	FLOATING POINT	S-PQFP-G100	3	Not Qualified	350 rpm	NO	e3
BV80605001911APSLBLC	Intel	MICROPROCESSOR		NO LEAD	1156	LGA	SQUARE	PLASTIC/EPOXY		YES					64	0.65/1.4	GRID ARRAY	LGA1156,40X40,36						BOTTOM											CMOS	110000 mA				Microprocessors		.9 mm		S-PBGA-N1156		Not Qualified	2660 rpm
P2010NXN2KFC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V			16			GRID ARRAY		1 V				TIN SILVER	BOTTOM	2.46 mm		31 mm		YES	64	100 MHz	40	260	31 mm	CMOS		1.05 V					1 mm	FLOATING POINT	S-PBGA-B689	3		1000 rpm	YES	e2
14305R-500	Dialog Semiconductor	MICROPROCESSOR	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	NO	YES	3.6 V			0			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		3 V	85 Cel		-40 Cel		QUAD	.9 mm		7 mm		YES	0	10 MHz		260	7 mm	CMOS		3.3 V					.5 mm	FIXED POINT	S-XQCC-N48			80 rpm	NO
MIMXRT595SFFOC	NXP Semiconductors	MICROPROCESSOR, RISC																														40	260												3
XAM5718AABCXEA	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.2 V			16			GRID ARRAY, FINE PITCH		1.11 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.96 mm		23 mm		YES	32	38.4 MHz	30	250	23 mm	CMOS		1.15 V					.8 mm	FLOATING POINT	S-PBGA-B760	3		1500 rpm	YES	e1
ADSP-21489KSWZ-5B	Analog Devices	MICROPROCESSOR	COMMERCIAL	GULL WING	176	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V			24	40		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH		1 V	70 Cel		0 Cel	Matte Tin (Sn) - annealed	QUAD	1.6 mm		24 mm		YES	16	25 MHz			24 mm	CMOS		1.1 V					.5 mm	FLOATING POINT	S-PQFP-G176	3		450 rpm	NO	e3
MPC8270CZQMIBA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V			32	32	1.5,3.3	GRID ARRAY	BGA516,26X26,40	1.45 V				TIN LEAD SILVER	BOTTOM	2.55 mm		27 mm		YES	64	266 MHz	30	245	27 mm	CMOS		1.5 V			Other uPs/uCs/Peripheral ICs		1 mm	FLOATING POINT	S-PBGA-B516	3	Not Qualified	66.67 rpm	NO	e0
MPC8270CZUQLDA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	480	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V			32	32	1.5,3.3	GRID ARRAY, LOW PROFILE	BGA480,29X29,50	1.45 V				TIN LEAD SILVER	BOTTOM	1.65 mm		37.5 mm		YES	64	83.33 MHz	40	260	37.5 mm	CMOS		1.5 V			Other uPs/uCs/Peripheral ICs		1.27 mm	FLOATING POINT	S-PBGA-B480	4	Not Qualified	333 rpm	NO	e0
APX81131UG-7	Diodes Incorporated	MICROPROCESSOR	INDUSTRIAL	GULL WING	4	VSOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	5.5 V			0			SMALL OUTLINE		1.1 V	85 Cel		-40 Cel	MATTE TIN	DUAL	1 mm		1.3 mm		NO	0		30	260	2.9 mm	CMOS		2.5 V					1.778 mm	FIXED POINT	R-PDSO-G4	1	Not Qualified		NO	e3
AV8063801149203/SR0ND	Intel	MICROPROCESSOR		BALL	1023	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES					64		GRID ARRAY	BGA1023(UNSPEC)						BOTTOM					NO						CMOS					Microprocessors			FIXED POINT	R-PBGA-B1023		Not Qualified	2100 rpm	YES
SAM9X60-V/DWB	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	228	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.21 V	8		26	32		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA228,16X16,26	1.12 V	105 Cel	1	-40 Cel		BOTTOM	1.2 mm	69632	11 mm		YES	32	48 MHz			11 mm	CMOS		1.15 V	16				.65 mm	FIXED POINT	S-PBGA-B228			600 rpm	YES
STM32MP135FAF7T	STMicroelectronics	MICROPROCESSOR, RISC		BALL	320	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.38 V	8		26	32		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA320,21X21,20	1.32 V	105 Cel		-40 Cel		BOTTOM	1.2 mm	172032	11 mm		YES	16	48 MHz			11 mm	CMOS	268 mA	1.35 V	56	10			.5 mm	FIXED POINT	S-PBGA-B320			1000 rpm	YES
STM32MP157AAC3T	STMicroelectronics	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	361	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.25 V	8		26	32		GRID ARRAY, THIN PROFILE, FINE PITCH		.85 V	125 Cel		-40 Cel		BOTTOM	1.2 mm	724992	12 mm		YES	0	64 MHz	NOT SPECIFIED	NOT SPECIFIED	12 mm	CMOS	1000 mA	.9 V	48				.65 mm	FLOATING POINT	S-PBGA-B361			650 rpm	YES
AM3357BZCZD60	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	324	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.144 V	8		28	32	0.95/1.1	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA324,18X18,32	1.056 V	90 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	131072	15 mm		YES	16	26 MHz	30	260	15 mm	CMOS	400 mA	1.1 V	64		Microprocessors		.8 mm	FIXED POINT	S-PBGA-B324	3	Not Qualified	600 rpm	YES	e1
AM3703CUSD100	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	423	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V	8		26	32	1.1,1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA423,24X24,25	.9 V	90 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	1.4 mm	65536	16 mm		YES	16	54 MHz	NOT SPECIFIED	260	16 mm	CMOS	900 mA	1.1 V			Microprocessors		.65 mm	FLOATING POINT	S-PBGA-B423	3	Not Qualified	1000 rpm	YES	e1
AM5726BABCXA	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.2 V			16			GRID ARRAY, FINE PITCH	BGA760,28X28,31	1.11 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.55 mm		23 mm		YES	32	38.4 MHz	30	250	23 mm	CMOS		1.15 V					.8 mm	FLOATING POINT	S-PBGA-B760	3		1500 rpm	YES	e1
MC7448TVU1267ND	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.1 V			0			GRID ARRAY		1 V					BOTTOM	2.4 mm		25 mm		YES	0	200 MHz	40	260	25 mm	CMOS		1.05 V					1.27 mm	FLOATING POINT	S-CBGA-B360	1		1267 rpm	YES
MCIMX6S1AVM08AB	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V			16	64		GRID ARRAY, LOW PROFILE, FINE PITCH		1.275 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	YES	32	24 MHz	40	260	21 mm	CMOS		1.35 V					.8 mm	FIXED POINT	S-PBGA-B624	3		800 rpm	YES	e1
MPC8347CVVAGDB	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	672	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V			32	32	1.2	GRID ARRAY, LOW PROFILE	BGA672,34X34,40	1.14 V	105 Cel		-40 Cel	TIN SILVER	BOTTOM	1.69 mm		35 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz	40	260	35 mm	CMOS		1.2 V			Microprocessors		1 mm	FLOATING POINT	S-PBGA-B672	3	Not Qualified	400 rpm	YES	e2
MPC8358ECZQAGDGA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	668	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V			32	32		GRID ARRAY, HEAT SINK/SLUG		1.14 V				TIN LEAD	BOTTOM	2.46 mm		29 mm		YES	32	66.67 MHz	40	260	29 mm	CMOS		1.2 V					1 mm	FLOATING POINT	S-PBGA-B668	3	Not Qualified	400 rpm	YES	e0
MCF5307AI66B	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	GULL WING	208	FQFP	SQUARE	PLASTIC/EPOXY	YES	YES	3.6 V			32	32		FLATPACK, FINE PITCH		3 V	70 Cel		0 Cel	TIN	QUAD	4.1 mm		28 mm		YES	32	33.33 MHz	30	250	28 mm	CMOS		3.3 V					.5 mm	FIXED POINT	S-PQFP-G208	3	Not Qualified	66 rpm	YES	e3
MCIMX31CVMN4C	NXP Semiconductors	MICROPROCESSOR, RISC														1.5,3.3							TIN SILVER COPPER									40	260							Microprocessors	I2C; SPI; UART; USB				3	Not Qualified			e1	9
MCIMX6U6AVM08AB	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V			16	64		GRID ARRAY, LOW PROFILE, FINE PITCH		1.275 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	YES	64	24 MHz	40	260	21 mm	CMOS		1.35 V					.8 mm	FIXED POINT	S-PBGA-B624	3		800 rpm	YES	e1
MIMXRT595SFFOCR	NXP Semiconductors	MICROPROCESSOR, RISC																														40	260												3
P2010NXN2MHC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V			16	32		GRID ARRAY		1 V				TIN SILVER	BOTTOM	2.46 mm		31 mm		YES	64	100 MHz	40	260	31 mm	CMOS		1.05 V					1 mm	FLOATING POINT	S-PBGA-B689	3		1200 rpm	YES	e2
T1042NSN7MQB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V			16	32		GRID ARRAY, FINE PITCH		.97 V					BOTTOM	2.07 mm		23 mm		YES	64	133.3 MHz	30	250	23 mm	CMOS		1 V					.8 mm	FIXED POINT	S-PBGA-B780	3		1200 rpm	YES
VCBU3730GSCUS100	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	423	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V			26			GRID ARRAY, LOW PROFILE, FINE PITCH		1.08 V	90 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	1.4 mm		16 mm		YES	16	54 MHz	30	260	16 mm	CMOS		1.14 V					.65 mm	FLOATING POINT	S-PBGA-B423	3		1000 rpm	YES	e1
MCF5271CVM100	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	196	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V			24	32		GRID ARRAY, LOW PROFILE		1.4 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		15 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	75 MHz	40	260	15 mm	CMOS		1.5 V					1 mm	FIXED POINT	S-PBGA-B196	3	Not Qualified	100 rpm	YES	e1
MPC8572CLVJAULE	NXP Semiconductors	MICROPROCESSOR																					TIN SILVER									30	245												3				e2
MPC860SRCVR50D4	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V			32	32	3.3	GRID ARRAY	BGA357,19X19,50	3.135 V				TIN SILVER COPPER	BOTTOM	2.52 mm		25 mm		YES	32	50 MHz	30	245	25 mm	CMOS		3.3 V			Microprocessors		1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	50 rpm	YES	e1
MPC860TVR80D4	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V			32	32	3.3	GRID ARRAY	BGA357,19X19,50	3.135 V				TIN SILVER COPPER	BOTTOM	2.52 mm		25 mm		YES	32	50 MHz	30	245	25 mm	CMOS		3.3 V			Microprocessors		1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	80 rpm	YES	e1
STM32MP151FAC1	STMicroelectronics	MICROPROCESSOR, RISC
AM3352BZCZT60R	Texas Instruments	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	324	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.248 V	8		28	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.152 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	131072	15 mm		YES	16	26 MHz	30	260	15 mm	CMOS	400 mA	1.2 V	64				.8 mm	FIXED POINT	S-PBGA-B324	3		600 rpm	YES	e1
AM5706BCBDJA	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	538	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V			16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.11 V	105 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	1.298 mm		17 mm		YES	32	38.4 MHz	30	260	17 mm	CMOS		1.15 V					.65 mm	FIXED POINT	S-PBGA-B538	3		1000 rpm	YES	e1
AM5708BCBDJA	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	538	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V			16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.11 V	105 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	1.298 mm		17 mm		YES	32	38.4 MHz	30	260	17 mm	CMOS		1.15 V					.65 mm	FIXED POINT	S-PBGA-B538	3		1000 rpm	YES	e1
MCF5208CVM166	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	196	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V			24	32	1.5,1.8/3.3	GRID ARRAY, LOW PROFILE	BGA196,14X14,40	1.4 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		15 mm		YES	32	40 MHz	40	260	15 mm	CMOS		1.5 V			Microprocessors		1 mm	FIXED POINT	S-PBGA-B196	3	Not Qualified	166.67 rpm	YES	e1
MPC8270CZUUPEA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	480	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V	8		32	32	1.5,3.3	GRID ARRAY, LOW PROFILE	BGA480,29X29,50	1.45 V	105 Cel		-40 Cel	TIN LEAD SILVER	BOTTOM	1.65 mm	32768	37.5 mm		YES	64	100 MHz	40	260	37.5 mm	CMOS		1.5 V	4	16	Other uPs/uCs/Peripheral ICs		1.27 mm	FLOATING POINT	S-PBGA-B480	4	Not Qualified	450 rpm	NO	e0
RTPXA270C5C520	Intel	MICROPROCESSOR, RISC		BALL	356	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.595 V			26	32		GRID ARRAY		1.3775 V					BOTTOM					YES	32	3.6864 MHz	30	240		CMOS		1.45 V						FIXED POINT	S-PBGA-B356		Not Qualified	520 rpm	YES
XAM5728BABCXE	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.2 V			16			GRID ARRAY, FINE PITCH		1.11 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	2.55 mm		23 mm		YES	32	38.4 MHz	30	250	23 mm	CMOS		1.15 V					.8 mm	FLOATING POINT	S-PBGA-B760	3		1500 rpm	YES	e1
AM5706BCBDDA	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	538	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V			16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.11 V	105 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	1.298 mm		17 mm	OPERATES AT 0.85V NOMINAL SUPPLY AFTER AVS ENABLE	YES	32	32 MHz	NOT SPECIFIED	260	17 mm	CMOS		1.15 V					.65 mm	FIXED POINT	S-PBGA-B538	3		500 rpm	YES	e1
AM5706BCBDDEA	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	538	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V			16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.11 V	105 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	1.298 mm		17 mm		YES	32	38.4 MHz	NOT SPECIFIED	260	17 mm	CMOS		1.15 V					.65 mm	FIXED POINT	S-PBGA-B538	3		500 rpm	YES	e1
AT91SAM9G45B-CU-999	Microchip Technology	MICROPROCESSOR, RISC		BALL	324	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V	8		26	32		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA324,18X18,32	.9 V	85 Cel	1	-40 Cel		BOTTOM	1.2 mm	65536	15 mm		YES	32	50 MHz			15 mm	CMOS		1 V	37	7			.8 mm	FIXED POINT	S-PBGA-B324			400 rpm	YES
AT91SAM9M10C-CU	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	324	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V	8		14	32	1,1.8/3.3,3.3	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA324,18X18,32	.9 V	85 Cel	1	-40 Cel		BOTTOM	1.2 mm	65536	15 mm		YES	16	12 MHz			15 mm	CMOS		1 V	37		Microprocessors		.8 mm	FIXED POINT	R-PBGA-B324		Not Qualified	400 rpm	YES

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.