Microprocessors

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	No. of Serial I/Os	Sub-Category	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code
DM388AAAR11F	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	609	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.42 V	8	28	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.28 V	95 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.32 mm	655360	16 mm		YES	16	30 MHz	30	260	16 mm	CMOS		1.35 V	72			.5 mm	FLOATING POINT	S-PBGA-B609	3		970 rpm	YES	e1
FH8065301567313SR3UZ	Intel	MICROPROCESSOR	INDUSTRIAL	BALL	1170	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES				64		GRID ARRAY			110 Cel		-40 Cel		BOTTOM					NO						CMOS							FIXED POINT	R-PBGA-B1170			1330 rpm
KMC7448VU1267ND	Freescale Semiconductor	MICROPROCESSOR, RISC	OTHER	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.15 V		36	32		GRID ARRAY		1.05 V	105 Cel		0 Cel		BOTTOM	2.8 mm		25 mm	LOW POWER TAKEN FROM SLEEP MODE	YES	64	200 MHz	40	260	25 mm	CMOS		1.1 V				1.27 mm	FLOATING POINT	S-CBGA-B360	1	Not Qualified	1267 rpm	YES
KMPC8270CZQMIBA	Freescale Semiconductor	MICROPROCESSOR, RISC		BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V		32	32		GRID ARRAY		1.45 V				Tin/Lead/Silver (Sn/Pb/Ag)	BOTTOM	2.55 mm		27 mm		YES	64	266 MHz	30	245	27 mm	CMOS		1.5 V				1 mm	FLOATING POINT	S-PBGA-B516	3	Not Qualified	66.67 rpm	NO	e0
LS1012ASE7EKB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	NO LEAD	211	VFLGA	SQUARE	UNSPECIFIED	YES	YES	.93 V		16	64		GRID ARRAY, VERY THIN PROFILE, FINE PITCH		.87 V	105 Cel		0 Cel		BOTTOM	.925 mm		9.6 mm		YES	16	25 MHz	40	260	9.6 mm	CMOS		.9 V				.5 mm	FIXED POINT	S-XBGA-N211	3		600 rpm	YES
MC68EC000EI10	Freescale Semiconductor	MICROPROCESSOR, RISC	COMMERCIAL	J BEND	68	QCCJ	SQUARE	PLASTIC/EPOXY		YES				32	5	CHIP CARRIER	LDCC68,1.0SQ		70 Cel		0 Cel	MATTE TIN	QUAD								30	245		CMOS	30 mA	5 V			Microprocessors	1.27 mm		S-PQCC-J68	2	Not Qualified	10 rpm		e3
MIMXRT1061DVJ6A	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.3 V	8				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,32	1.25 V	95 Cel		0 Cel	TIN SILVER	BOTTOM	1.52 mm	1048576	12 mm		YES		24 MHz	40	260	12 mm	CMOS	110 mA		32	8		.8 mm	FLOATING POINT	S-PBGA-B196	3		600 rpm	YES	e2
MPC8280CZUUPEA	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	480	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V		32	32	1.5,3.3	GRID ARRAY, LOW PROFILE	BGA480,29X29,50	1.45 V	70 Cel		0 Cel	TIN LEAD SILVER	BOTTOM	1.65 mm		37.5 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	100 MHz	40	260	37.5 mm	CMOS		1.5 V			Other uPs/uCs/Peripheral ICs	1.27 mm	FLOATING POINT	S-PBGA-B480	4	Not Qualified	450 rpm	NO	e0
MPC8349ECVVAJDB	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	672	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		32	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE	BGA672,34X34,40	1.14 V	105 Cel		-40 Cel	TIN SILVER	BOTTOM	1.69 mm		35 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz	40	260	35 mm	CMOS		1.2 V			Microprocessors	1 mm	FLOATING POINT	S-PBGA-B672	3	Not Qualified	533 rpm	YES	e2
MPC8349ECZUAJDB	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	672	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		32	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE	BGA672,34X34,40	1.14 V	105 Cel		-40 Cel	TIN LEAD	BOTTOM	1.69 mm		35 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz	40	260	35 mm	CMOS		1.2 V			Microprocessors	1 mm	FLOATING POINT	S-PBGA-B672	3	Not Qualified	533 rpm	YES	e0
P2041NXE7PNC	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	780	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.89 V		16			GRID ARRAY	BGA780,28X28,32	1.71 V	105 Cel	12	-40 Cel	TIN SILVER COPPER	BOTTOM	2.51 mm		23 mm	ALSO OPERATES WITH 2.5V NOM AND 3.3V NOM SUPPLY	YES	64		30	245	23 mm	CMOS		1.8 V	4			.8 mm	FIXED POINT	S-PBGA-B780	3		1500 rpm	YES	e1
P2041NXN7NNC	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	780	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.89 V		16			GRID ARRAY	BGA780,28X28,32	1.71 V	105 Cel	12	-40 Cel	TIN SILVER COPPER	BOTTOM	2.51 mm		23 mm	ALSO OPERATES WITH 2.5V NOM AND 3.3V NOM SUPPLY	YES	64		30	245	23 mm	CMOS		1.8 V	4			.8 mm	FIXED POINT	S-PBGA-B780	3		1333 rpm	YES	e1
PPC440GX-3CF667C	Applied Micro Circuits	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	552	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.6 V		64	32	1.5	GRID ARRAY	BGA552,24X24,40	1.5 V	85 Cel		-40 Cel		BOTTOM	3.977 mm		25 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	83 MHz	NOT SPECIFIED	NOT SPECIFIED	25 mm	CMOS	2200 mA	1.55 V			Microprocessors	1 mm	FIXED POINT	S-CBGA-B552		Not Qualified	667 rpm	NO
SMOMAPL138BGWTA3R	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8	23	32	1.2,1.8/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA361,19X19,32	1.14 V	105 Cel		-40 Cel	TIN LEAD	BOTTOM	1.4 mm	131072	16 mm		YES	16	30 MHz	20	220	16 mm	CMOS	.31 mA	1.2 V	64		Other uPs/uCs/Peripheral ICs	.8 mm	FLOATING POINT	S-PBGA-B361	3	Not Qualified	456 rpm	YES	e0
STM32MP153AAB3T	STMicroelectronics	MICROPROCESSOR, RISC																													NOT SPECIFIED	NOT SPECIFIED
T4240NSN7PQB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1932	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.055 V		16			GRID ARRAY		.995 V				TIN SILVER COPPER	BOTTOM	3.33 mm		45 mm		YES	64	133.3 MHz	30	250	45 mm	CMOS		1.025 V				1 mm	FIXED POINT	S-PBGA-B1932	3		1500 rpm	YES	e1
ADSP-21489KCPZ-4	Analog Devices	MICROPROCESSOR	INDUSTRIAL	NO LEAD	88	HVQCCN	SQUARE	UNSPECIFIED	YES	YES	1.15 V	1	24	40		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC88,.47SQ,20	1.05 V	115 Cel	3	0 Cel		QUAD	.9 mm	5242880	12 mm		YES	16		30	260	12 mm	CMOS	500 mA	1.1 V	65			.5 mm	FLOATING POINT	S-XQCC-N88	3		400 rpm	NO
AM1802EZWTD3	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8	23	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	90 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	172032	16 mm		YES	16	30 MHz	30	260	16 mm	CMOS		1.2 V	80			.8 mm	FIXED POINT	S-PBGA-B361	3		300 rpm	YES	e1
AM1808EZWTA3	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V		23	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		16 mm		YES	16	30 MHz	30	260	16 mm	CMOS		1.2 V				.8 mm	FIXED POINT	S-PBGA-B361	3		375 rpm	YES	e1
AM3354BZCE60	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	298	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.144 V	8	28	32	0.95/1.1	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA298,19X19,25	1.056 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	131072	13 mm		YES	16	26 MHz	30	260	13 mm	CMOS	400 mA	1.1 V	64		Microprocessors	.65 mm	FIXED POINT	S-PBGA-B298	3	Not Qualified	600 rpm	YES	e1
AM3357BZCZA60	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	324	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.144 V	8	28	32	0.95/1.1	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA324,18X18,32	1.056 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	131072	15 mm		YES	16	26 MHz	30	260	15 mm	CMOS	400 mA	1.1 V	64		Microprocessors	.8 mm	FIXED POINT	S-PBGA-B324	3	Not Qualified	600 rpm	YES	e1
AM3357ZCZD27	Texas Instruments	MICROPROCESSOR, RISC		BALL	324	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.144 V		28	32	0.95/1.1,0.95/1.26	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA324,18X18,32	1.056 V				TIN SILVER COPPER	BOTTOM	1.4 mm		15 mm		YES	16	26 MHz	30	260	15 mm	CMOS		1.1 V			Microprocessors	.8 mm	FIXED POINT	S-PBGA-B324	3	Not Qualified	275 rpm	YES	e1
AM3357ZCZD72	Texas Instruments	MICROPROCESSOR, RISC		BALL	324	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.326 V		28	32	0.95/1.1,0.95/1.26	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA324,18X18,32	1.21 V				TIN SILVER COPPER	BOTTOM	1.4 mm		15 mm		YES	16	26 MHz	30	260	15 mm	CMOS		1.26 V			Microprocessors	.8 mm	FIXED POINT	S-PBGA-B324	3	Not Qualified	720 rpm	YES	e1
AM3358BGCZA80EP	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	324	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.144 V		28	32		GRID ARRAY		1.056 V	105 Cel		-40 Cel	TIN LEAD	BOTTOM					YES	16		20	220		CMOS		1.1 V					FIXED POINT	S-PBGA-B324	3		800 rpm	YES	e0
AM5706BCBDJEA	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	538	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V		16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.11 V	105 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	1.298 mm		17 mm		YES	32	38.4 MHz	NOT SPECIFIED	260	17 mm	CMOS		1.15 V				.65 mm	FIXED POINT	S-PBGA-B538	3		1000 rpm	YES	e1
AM5706BCBDJEAS	Texas Instruments	MICROPROCESSOR, RISC																				TIN SILVER COPPER									30	260											3				e1
ATSAMA5D26C-CUR	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8	26	32		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.2 V	85 Cel	1	-40 Cel		BOTTOM	1.4 mm	131072	14 mm	ALSO OPERATES WITH 1.2V NOM @ 400 MHZ SPEED	YES	16	24 MHz	NOT SPECIFIED	NOT SPECIFIED	14 mm	CMOS		1.25 V	32			.8 mm	FLOATING POINT	S-PBGA-B289			500 rpm	YES
ATSAMA5D31A-CFUR	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	324	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8	26	32	1.2	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA324,22X22,20	1.08 V	85 Cel	1	-40 Cel		BOTTOM	1.2 mm	131072	12 mm		YES	16	48 MHz	NOT SPECIFIED	NOT SPECIFIED	12 mm	CMOS		1.2 V	39	10	Microprocessors	.5 mm	FLOATING POINT	S-PBGA-B324		Not Qualified	536 rpm	YES
CL8068404164800SRFED	Intel	MICROPROCESSOR		BALL	1440		RECTANGULAR	PLASTIC/EPOXY	YES	YES				64			BGA1440(UNSPEC)						BOTTOM					NO						CMOS							FIXED POINT	R-PBGA-B1440			4400 rpm	NO
DRA829VMTGBALFR	Texas Instruments	MICROPROCESSOR, RISC		BALL	827	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	.84 V	8	0	64		GRID ARRAY, FINE PITCH	BGA827,29X29,32	.76 V	105 Cel	1	-40 Cel	TIN SILVER COPPER	BOTTOM	2.8 mm	3670016	24 mm		YES	32	27 MHz		250	24 mm	CMOS		.8 V		31		.8 mm	FIXED POINT	S-PBGA-B827	3		2000 rpm	YES	e1
FS32R372SCK0MMMT	NXP Semiconductors	MICROPROCESSOR, RISC																													40	260											3
KMPC8347VVAJFB	Freescale Semiconductor	MICROPROCESSOR	OTHER	BALL	672	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		32	32		GRID ARRAY, LOW PROFILE		1.14 V	105 Cel		0 Cel	Tin/Silver (Sn/Ag)	BOTTOM	1.69 mm		35 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz	40	260	35 mm	CMOS		1.2 V				1 mm	FLOATING POINT	S-PBGA-B672	3	Not Qualified	533 rpm	YES	e2
LX2160SN72232B	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	.88 V		36	64		GRID ARRAY	BGA1517.39X39,40	.82 V	105 Cel	12	0 Cel	TIN SILVER COPPER	BOTTOM	3.51 mm		40 mm		YES	128		30	245	40 mm	CMOS	.05 mA	.85 V		17		1 mm	FIXED POINT	S-PBGA-B1517	3		2200 rpm	YES	e1
LX2160XN72232B	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	.88 V		36	64		GRID ARRAY	BGA1517.39X39,40	.82 V	105 Cel	12	-40 Cel	TIN SILVER COPPER	BOTTOM	3.51 mm		40 mm		YES	128		30	245	40 mm	CMOS	.05 mA	.85 V		17		1 mm	FIXED POINT	S-PBGA-B1517	3		2200 rpm	YES	e1
MCF5206ECAB40	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	GULL WING	160	QFP	SQUARE	PLASTIC/EPOXY	YES	YES	3.6 V		28	32		FLATPACK		3 V	85 Cel		-40 Cel	TIN	QUAD	3.85 mm		28 mm		YES	32	40 MHz	30	245	28 mm	CMOS		3.3 V				.65 mm	FIXED POINT	S-PQFP-G160	3		40 rpm	YES	e3
MCF5270VM100J	Freescale Semiconductor	MICROPROCESSOR, RISC	COMMERCIAL	BALL	196	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V		24	32	1.5,3.3	GRID ARRAY, LOW PROFILE	BGA196,14X14,40	1.4 V	70 Cel		0 Cel	TIN SILVER COPPER OVER NICKEL	BOTTOM	1.6 mm		15 mm		YES	32		40	260	15 mm	CMOS					Microprocessors	1 mm	FIXED POINT	S-PBGA-B196	3	Not Qualified	100 rpm	YES
MCF5271CVM100J	Freescale Semiconductor	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	196	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V		24	32	1.5,3.3	GRID ARRAY, LOW PROFILE	BGA196,14X14,40	1.4 V	85 Cel		-40 Cel	TIN SILVER COPPER OVER NICKEL	BOTTOM	1.6 mm		15 mm		YES	32		40	260	15 mm	CMOS					Microprocessors	1 mm	FIXED POINT	S-PBGA-B196	3	Not Qualified	100 rpm	YES
MCF5307AI90B	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	GULL WING	208	FQFP	SQUARE	PLASTIC/EPOXY	YES	YES	3.6 V		32	32		FLATPACK, FINE PITCH		3 V	70 Cel		0 Cel	TIN	QUAD	4.1 mm		28 mm		YES	32	45.45 MHz	30	250	28 mm	CMOS		3.3 V				.5 mm	FIXED POINT	S-PQFP-G208	3	Not Qualified	90 rpm	YES	e3
MCF5307CAI66B	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	GULL WING	208	FQFP	SQUARE	PLASTIC/EPOXY	YES	YES	3.6 V		32	32	3.3	FLATPACK, FINE PITCH	QFP208,1.2SQ,20	3 V	70 Cel		0 Cel	TIN	QUAD	4.1 mm		28 mm		YES	32	33.33 MHz	30	250	28 mm	CMOS		3.3 V			Microprocessors	.5 mm	FIXED POINT	S-PQFP-G208	3	Not Qualified	66 rpm	YES	e3
MCF5307CAI90B	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	GULL WING	208	QFP	SQUARE	PLASTIC/EPOXY		YES				32	3.3	FLATPACK	QFP208,1.2SQ,20		70 Cel		0 Cel	TIN	QUAD								30	250		CMOS		3.3 V			Microprocessors	.5 mm		S-PQFP-G208	3	Not Qualified	90 rpm		e3
MPC8280CVVUPEA	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	480	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V		32	32	1.5,3.3	GRID ARRAY, LOW PROFILE	BGA480,29X29,50	1.45 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.65 mm		37.5 mm		YES	64		40	260	37.5 mm	CMOS		1.5 V			Other uPs/uCs/Peripheral ICs	1.27 mm	FLOATING POINT	S-PBGA-B480	4	Not Qualified	450 rpm	YES	e1
MPC8323EVRADDC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	516	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		14			GRID ARRAY, HEAT SINK/SLUG		.95 V					BOTTOM	2.55 mm		27 mm		YES	32		40	260	27 mm	CMOS		1 V				1 mm	FLOATING POINT	S-PBGA-B516			266 rpm	YES
MPC8547ECHXAUJ	Freescale Semiconductor	MICROPROCESSOR		BALL	783	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.155 V		64	32	1.2,2.5/3.3	GRID ARRAY	BGA783,28X28,40	1.045 V				TIN LEAD SILVER	BOTTOM	3.38 mm		29 mm		YES	64	133 MHz	40	260	29 mm	CMOS		1.1 V			Microprocessors	1 mm	FLOATING POINT	S-CBGA-B783	1	Not Qualified	1333 rpm	YES	e0
MPC860ENVR66D4	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V		32	32	3.3	GRID ARRAY	BGA357,19X19,50	3.135 V				TIN SILVER COPPER	BOTTOM	2.52 mm		25 mm		YES	32	50 MHz	30	245	25 mm	CMOS		3.3 V			Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	66 rpm	YES	e1
MPC880CVR66	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V		32	32	1.8,3.3	GRID ARRAY	BGA357,19X19,50	1.7 V				TIN SILVER COPPER	BOTTOM	2.52 mm		25 mm		YES	32		30	245	25 mm	CMOS		1.8 V			Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	66 rpm	YES	e1
MPC880CZP133	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V		32	32	1.8,3.3	GRID ARRAY	BGA357,19X19,50	1.7 V				TIN LEAD	BOTTOM	2.52 mm		25 mm		YES	32		30	245	25 mm	CMOS		1.8 V			Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	133 rpm	YES	e0
MPC880CZP66	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V		32	32		GRID ARRAY		1.7 V					BOTTOM	2.52 mm		25 mm		YES	32	66.67 MHz	30	245	25 mm	CMOS		1.8 V				1.27 mm	FIXED POINT	S-PBGA-B357	3		66 rpm	YES
MPC880VR133	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V		32	32	1.8,3.3	GRID ARRAY	BGA357,19X19,50	1.7 V				TIN SILVER COPPER	BOTTOM	2.52 mm		25 mm		YES	32		30	245	25 mm	CMOS		1.8 V			Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	133 rpm	YES	e1

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.