Part | RoHS | Manufacturer | Peripheral IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Integrated Cache | Surface Mount | Maximum Supply Voltage | On Chip Data RAM Width | Screening Level | Address Bus Width | DAC Channels | Bit Size | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Minimum Supply Voltage | Maximum Operating Temperature | CPU Family | No. of External Interrupts | Minimum Operating Temperature | Terminal Finish | ADC Channels | Terminal Position | DMA Channels | Maximum Seated Height | ROM Words | RAM Words | Width | Data EEPROM Size | Additional Features | Boundary Scan | Peripherals | External Data Bus Width | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Total Dose (V) | RAM Bytes | Technology | Analog To Digital Convertors | Maximum Supply Current | Nominal Supply Voltage | No. of DMA Channels | PWM Channels | No. of Serial I/Os | Sub-Category | Connectivity | ROM Programmability | Bus Compatibility | Terminal Pitch | Format | JESD-30 Code | Moisture Sensitivity Level (MSL) | Qualification | Speed | Low Power Mode | JESD-609 Code | On Chip Program ROM Width | No. of I/O Lines |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Intel |
MICROPROCESSOR, RISC |
AUTOMOTIVE |
PIN/PEG |
132 |
PGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
NO |
NO |
5.5 V |
0 |
32 |
32 |
5 |
GRID ARRAY |
PGA132,14X14 |
4.5 V |
125 Cel |
4 |
-40 Cel |
PERPENDICULAR |
4.57 mm |
0 |
37.08 mm |
OPTEMP SPECIFIED AS TC; REGISTER SCOREBOARDING; BURST BUS |
NO |
32 |
32 MHz |
37.08 mm |
CMOS |
315 mA |
5 V |
0 |
0 |
Microprocessors |
2.54 mm |
FLOATING POINT |
S-CPGA-P132 |
Not Qualified |
16 rpm |
NO |
||||||||||||||||||||||||
Intel |
MICROPROCESSOR |
INDUSTRIAL |
J BEND |
68 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
5.5 V |
0 |
20 |
16 |
5 |
CHIP CARRIER |
LDCC68,1.0SQ |
4.5 V |
85 Cel |
5 |
-40 Cel |
TIN LEAD |
QUAD |
4.83 mm |
0 |
24.2316 mm |
DRAM REFRESH CONTROLLER; 3 PROGRAMMABLE TIMERS |
NO |
8 |
25 MHz |
24.2316 mm |
CMOS |
62.5 mA |
5 V |
2 |
0 |
Microprocessors |
1.27 mm |
FIXED POINT |
S-PQCC-J68 |
Not Qualified |
12 rpm |
YES |
e0 |
||||||||||||||||||||||
Motorola |
MICROPROCESSOR, RISC |
BALL |
357 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.465 V |
32 |
32 |
3.3 |
GRID ARRAY |
BGA357,19X19,50 |
3.135 V |
0 Cel |
TIN LEAD |
BOTTOM |
2.05 mm |
25 mm |
32 |
50 MHz |
25 mm |
CMOS |
3.3 V |
Other Microprocessor ICs |
1.27 mm |
S-PBGA-B357 |
Not Qualified |
50 rpm |
e0 |
|||||||||||||||||||||||||||||||||||
|
Intel |
MICROPROCESSOR |
INDUSTRIAL |
BALL |
437 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.1 V |
AEC-Q100 |
28 |
64 |
1 |
GRID ARRAY, HEAT SINK/SLUG |
BGA437,21X21,40 |
.9 V |
85 Cel |
-40 Cel |
BOTTOM |
2.792 mm |
22 mm |
IT ALSO OPERATES IN 800 MHZ AT 0.9V SUPPLY |
YES |
64 |
NOT SPECIFIED |
NOT SPECIFIED |
22 mm |
CMOS |
1 V |
Microprocessors |
1 mm |
FLOATING POINT |
S-PBGA-B437 |
Not Qualified |
1330 rpm |
YES |
|||||||||||||||||||||||||||
|
Intel |
MICROPROCESSOR |
NO LEAD |
1155 |
SQUARE |
UNSPECIFIED |
YES |
YES |
64 |
BOTTOM |
NO |
CMOS |
FIXED POINT |
S-XBGA-N1155 |
3500 rpm |
NO |
|||||||||||||||||||||||||||||||||||||||||||||||||
Intel |
MICROPROCESSOR |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Intel |
MICROPROCESSOR |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR |
COMMERCIAL |
J BEND |
68 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
5.25 V |
24 |
CHIP CARRIER |
4.75 V |
70 Cel |
0 Cel |
QUAD |
4.57 mm |
24.23 mm |
NO |
16 |
24.23 mm |
CMOS |
5 V |
1.27 mm |
FIXED POINT |
S-PQCC-J68 |
16 rpm |
YES |
|||||||||||||||||||||||||||||||||||||
|
Intel |
MICROPROCESSOR |
BALL |
1170 |
BGA |
RECTANGULAR |
UNSPECIFIED |
YES |
YES |
16 |
64 |
GRID ARRAY |
BOTTOM |
YES |
64 |
NOT SPECIFIED |
NOT SPECIFIED |
CMOS |
FIXED POINT |
R-XBGA-B1170 |
1910 rpm |
YES |
|||||||||||||||||||||||||||||||||||||||||||
|
Intel |
MICROPROCESSOR |
BALL |
1170 |
BGA |
RECTANGULAR |
UNSPECIFIED |
YES |
YES |
16 |
64 |
GRID ARRAY |
BOTTOM |
YES |
64 |
NOT SPECIFIED |
NOT SPECIFIED |
CMOS |
FIXED POINT |
R-XBGA-B1170 |
1910 rpm |
YES |
|||||||||||||||||||||||||||||||||||||||||||
Intel |
MICROPROCESSOR |
INDUSTRIAL |
BALL |
1667 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
0 |
64 |
GRID ARRAY |
85 Cel |
-40 Cel |
BOTTOM |
NO |
0 |
CMOS |
FIXED POINT |
S-PBGA-B1667 |
1500 rpm |
NO |
|||||||||||||||||||||||||||||||||||||||||||
Intel |
MICROPROCESSOR |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Intel |
MICROPROCESSOR |
CMOS |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Rochester Electronics |
MICROPROCESSOR |
INDUSTRIAL |
GULL WING |
132 |
QFP |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
5.5 V |
26 |
32 |
FLATPACK |
4.5 V |
117 Cel |
-40 Cel |
QUAD |
4.57 mm |
24.13 mm |
YES |
16 |
50 MHz |
24.13 mm |
CMOS |
5 V |
.635 mm |
FIXED POINT |
S-PQFP-G132 |
25 rpm |
YES |
|||||||||||||||||||||||||||||||||||
|
Intel |
MICROPROCESSOR |
OTHER |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.1 V |
26 |
32 |
1,2.5/3.3,3.3 |
GRID ARRAY |
BGA256,16X16,40 |
.95 V |
85 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
2 mm |
17 mm |
YES |
32 |
3.6864 MHz |
17 mm |
CMOS |
1 V |
Microprocessors |
1 mm |
FIXED POINT |
S-PBGA-B256 |
Not Qualified |
200 rpm |
YES |
e1 |
||||||||||||||||||||||||||||
Motorola |
MICROPROCESSOR |
COMMERCIAL |
J BEND |
68 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
5.25 V |
0 |
23 |
32 |
5 |
CHIP CARRIER |
LDCC68,1.0SQ |
4.75 V |
70 Cel |
7 |
0 Cel |
TIN LEAD |
QUAD |
0 |
NO |
16 |
10 MHz |
CMOS |
30 mA |
5 V |
0 |
0 |
Microprocessors |
1.27 mm |
FIXED POINT |
S-PQCC-J68 |
Not Qualified |
10 rpm |
NO |
e0 |
||||||||||||||||||||||||||
Motorola |
MICROPROCESSOR |
COMMERCIAL |
THROUGH-HOLE |
64 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
NO |
5.25 V |
0 |
23 |
32 |
IN-LINE |
DIP64,.9 |
4.75 V |
70 Cel |
7 |
0 Cel |
TIN LEAD |
DUAL |
5.84 mm |
0 |
22.86 mm |
NO |
16 |
12 MHz |
81.535 mm |
CMOS |
35 mA |
5 V |
0 |
0 |
Microprocessors |
2.54 mm |
FIXED POINT |
R-PDIP-T64 |
Not Qualified |
12 rpm |
NO |
e0 |
||||||||||||||||||||||||
Motorola |
MICROPROCESSOR |
PIN/PEG |
206 |
PGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
NO |
3.465 V |
0 |
32 |
32 |
GRID ARRAY |
3.135 V |
7 |
PERPENDICULAR |
3.05 mm |
0 |
47.245 mm |
BUS CONTROLLER |
YES |
32 |
50 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
47.245 mm |
CMOS |
3.3 V |
0 |
0 |
2.54 mm |
FLOATING POINT |
S-CPGA-P206 |
Not Qualified |
50 rpm |
YES |
|||||||||||||||||||||||||||||
Motorola |
MICROPROCESSOR |
COMMERCIAL |
J BEND |
68 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
5.25 V |
0 |
23 |
32 |
5 |
CHIP CARRIER |
LDCC68,1.0SQ |
4.75 V |
70 Cel |
7 |
0 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
4.57 mm |
0 |
24.2062 mm |
NO |
16 |
12 MHz |
24.2062 mm |
CMOS |
35 mA |
5 V |
0 |
0 |
Microprocessors |
1.27 mm |
FIXED POINT |
S-PQCC-J68 |
Not Qualified |
12 rpm |
NO |
e0 |
|||||||||||||||||||||||
Motorola |
MICROPROCESSOR, RISC |
COMMERCIAL |
BALL |
256 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.9 V |
25 |
32 |
1.8,1.8/3 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA256,16X16,32 |
1.7 V |
70 Cel |
0 Cel |
BOTTOM |
1.6 mm |
14 mm |
YES |
32 |
16 MHz |
14 mm |
CMOS |
1.8 V |
Microprocessors |
.8 mm |
FIXED POINT |
S-PBGA-B256 |
Not Qualified |
150 rpm |
YES |
|||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
INDUSTRIAL |
GULL WING |
44 |
QFP |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
5.5 V |
0 |
8 |
3/5 |
FLATPACK |
QFP44,.47SQ,32 |
2.7 V |
105 Cel |
HCS08 |
-40 Cel |
TIN |
QUAD |
16384 |
NO |
0 |
20 MHz |
40 |
260 |
2048 |
CMOS |
14 mA |
5 V |
Microcontrollers |
FLASH |
.8 mm |
FIXED POINT |
S-PQFP-G44 |
3 |
Not Qualified |
20 rpm |
YES |
e3 |
|||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
COMMERCIAL |
BALL |
360 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.65 V |
32 |
32 |
1.5,1.8,2.5,3.3 |
GRID ARRAY |
BGA360,22X22,40 |
1.35 V |
70 Cel |
0 Cel |
TIN SILVER |
BOTTOM |
2.48 mm |
23 mm |
YES |
32 |
66 MHz |
40 |
260 |
23 mm |
CMOS |
1.5 V |
Microprocessors |
1 mm |
FIXED POINT |
S-PBGA-B360 |
3 |
Not Qualified |
266 rpm |
YES |
e2 |
|||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR |
40 |
260 |
3 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Intersil |
MICROPROCESSOR |
MILITARY |
THROUGH-HOLE |
40 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
NO |
5.25 V |
38535Q/M;38534H;883B |
20 |
16 |
5 |
IN-LINE |
DIP40,.6 |
4.75 V |
125 Cel |
-55 Cel |
TIN LEAD |
DUAL |
5.72 mm |
15.24 mm |
NO |
8 |
8 MHz |
CMOS |
80.5 mA |
5 V |
Microprocessors |
2.54 mm |
FIXED POINT |
R-GDIP-T40 |
Not Qualified |
8 rpm |
YES |
e0 |
||||||||||||||||||||||||||||
|
Freescale Semiconductor |
MICROPROCESSOR, RISC |
COMMERCIAL |
BALL |
516 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.47 V |
32 |
32 |
1.4,3.3 |
GRID ARRAY, HEAT SINK/SLUG |
BGA516,26X26,40 |
1.33 V |
70 Cel |
0 Cel |
TIN SILVER |
BOTTOM |
2.55 mm |
27 mm |
YES |
32 |
35 MHz |
40 |
260 |
27 mm |
CMOS |
1.4 V |
Microprocessors |
1 mm |
FIXED POINT |
S-PBGA-B516 |
3 |
Not Qualified |
400 rpm |
YES |
e2 |
|||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
BALL |
516 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.05 V |
0 |
32 |
GRID ARRAY |
.95 V |
TIN SILVER |
BOTTOM |
2.55 mm |
27 mm |
YES |
0 |
66.67 MHz |
40 |
260 |
27 mm |
CMOS |
1 V |
1 mm |
FLOATING POINT |
S-PBGA-B516 |
3 |
Not Qualified |
333 rpm |
YES |
e2 |
|||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR, RISC |
BALL |
357 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
3.465 V |
32 |
32 |
3.3 |
GRID ARRAY |
BGA357,19X19,50 |
3.135 V |
-40 Cel |
TIN LEAD SILVER |
BOTTOM |
2.52 mm |
25 mm |
YES |
32 |
50 MHz |
30 |
245 |
25 mm |
CMOS |
3.3 V |
Microprocessors |
1.27 mm |
FIXED POINT |
S-PBGA-B357 |
3 |
Not Qualified |
50 rpm |
YES |
e0 |
||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR |
OTHER |
BALL |
689 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.05 V |
16 |
32 |
GRID ARRAY, HEAT SINK/SLUG |
.95 V |
105 Cel |
0 Cel |
TIN SILVER |
BOTTOM |
2.46 mm |
31 mm |
YES |
64 |
40 |
260 |
31 mm |
CMOS |
1 V |
1 mm |
FIXED POINT |
S-PBGA-B689 |
3 |
1067 rpm |
YES |
e2 |
||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
BALL |
689 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.1 V |
16 |
1.05 |
GRID ARRAY |
BGA689,29X29,40 |
1 V |
7 |
TIN SILVER |
BOTTOM |
2.46 mm |
31 mm |
YES |
64 |
40 |
260 |
31 mm |
CMOS |
1.05 V |
4 |
Microprocessors |
1 mm |
FIXED POINT |
S-PBGA-B689 |
3 |
Not Qualified |
1200 rpm |
NO |
e2 |
||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
BALL |
1295 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.05 V |
16 |
32 |
1 |
GRID ARRAY, HEAT SINK/SLUG |
BGA1295,36X36,40 |
.95 V |
TIN SILVER COPPER |
BOTTOM |
3.53 mm |
37.5 mm |
YES |
64 |
133.3 MHz |
30 |
245 |
37.5 mm |
CMOS |
1 V |
Microprocessors |
1 mm |
FIXED POINT |
S-PBGA-B1295 |
3 |
Not Qualified |
1200 rpm |
YES |
e1 |
||||||||||||||||||||||||||||
|
Intel |
MICROPROCESSOR, RISC |
COMMERCIAL |
BALL |
492 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.3,3.3 |
GRID ARRAY |
BGA492,26X26,50 |
70 Cel |
0 Cel |
BOTTOM |
CMOS |
Microprocessors |
1.27 mm |
S-PBGA-B492 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||||||
Rochester Electronics |
MICROPROCESSOR, RISC |
GULL WING |
132 |
BQFP |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
5.5 V |
26 |
32 |
5 |
FLATPACK, BUMPER |
SPQFP132,1.1SQ |
4.5 V |
117 Cel |
12 |
-40 Cel |
QUAD |
4.57 mm |
0 |
24.13 mm |
YES |
16 |
25 MHz |
24.13 mm |
CMOS |
320 mA |
5 V |
2 |
3 |
Microprocessors |
.635 mm |
FIXED POINT |
S-PQFP-G132 |
Not Qualified |
25 rpm |
YES |
|||||||||||||||||||||||||||
|
Intel |
MICROPROCESSOR |
PIN/PEG |
478 |
SPGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
NO |
1.4 V |
36 |
32 |
1.2 |
GRID ARRAY, SHRINK PITCH |
BGA478,26X26,50 |
1.25 V |
PERPENDICULAR |
4.5 mm |
35 mm |
YES |
64 |
200 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
35 mm |
CMOS |
1.2 V |
Microprocessors |
1.27 mm |
FLOATING POINT |
S-CPGA-P478 |
Not Qualified |
3000 rpm |
YES |
|||||||||||||||||||||||||||||||
Intel |
MICROPROCESSOR |
COMMERCIAL |
GULL WING |
100 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
5.5 V |
0 |
20 |
16 |
5 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP100,.63SQ,20 |
4.5 V |
70 Cel |
9 |
0 Cel |
TIN LEAD |
QUAD |
1.66 mm |
0 |
14 mm |
NO |
8 |
40 MHz |
14 mm |
CMOS |
100 mA |
5 V |
4 |
2 |
Microprocessors |
.5 mm |
FIXED POINT |
S-PQFP-G100 |
Not Qualified |
20 rpm |
YES |
e0 |
|||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
BALL |
780 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.03 V |
16 |
32 |
GRID ARRAY, FINE PITCH |
.97 V |
BOTTOM |
2.07 mm |
23 mm |
YES |
64 |
133.3 MHz |
30 |
250 |
23 mm |
CMOS |
1 V |
.8 mm |
FIXED POINT |
S-PBGA-B780 |
3 |
1500 rpm |
YES |
||||||||||||||||||||||||||||||||||
Intel |
MICROPROCESSOR, RISC |
PIN/PEG |
168 |
PGA |
SQUARE |
CERAMIC |
NO |
32 |
3.3,3.3/5 |
GRID ARRAY |
PGA168,17X17 |
PERPENDICULAR |
CMOS |
1450 mA |
Microprocessors |
2.54 mm |
S-XPGA-P168 |
Not Qualified |
100 rpm |
||||||||||||||||||||||||||||||||||||||||||||||
Intel |
MICROPROCESSOR |
NO LEAD |
1700 |
RECTANGULAR |
UNSPECIFIED |
YES |
YES |
64 |
BOTTOM |
NO |
CMOS |
FIXED POINT |
R-XBGA-N1700 |
5400 rpm |
NO |
||||||||||||||||||||||||||||||||||||||||||||||||||
Intel |
MICROPROCESSOR, RISC |
NO LEAD |
775 |
LGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
64 |
1.2 |
GRID ARRAY |
LGA775,30X33,46/43 |
BOTTOM |
CMOS |
75000 mA |
1.2 V |
Microprocessors |
1.1 mm |
R-PBGA-N775 |
Not Qualified |
1600 rpm |
|||||||||||||||||||||||||||||||||||||||||||||
Intel |
MICROPROCESSOR |
NO LEAD |
3647 |
BGA |
RECTANGULAR |
UNSPECIFIED |
YES |
YES |
64 |
GRID ARRAY |
BOTTOM |
NO |
CMOS |
FIXED POINT |
R-XBGA-N3647 |
2200 rpm |
NO |
||||||||||||||||||||||||||||||||||||||||||||||||
|
Intel |
MICROPROCESSOR |
NO LEAD |
1155 |
LGA |
SQUARE |
UNSPECIFIED |
YES |
YES |
64 |
0.25/1.52 |
GRID ARRAY |
LGA1155,40X40,36 |
BOTTOM |
CMOS |
112000 mA |
Microprocessors |
.9 mm |
S-XBGA-N1155 |
Not Qualified |
3900 rpm |
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|
Intel |
MICROPROCESSOR |
NO LEAD |
1150 |
SQUARE |
UNSPECIFIED |
YES |
YES |
64 |
BOTTOM |
NO |
NOT SPECIFIED |
NOT SPECIFIED |
CMOS |
FIXED POINT |
S-XBGA-N1150 |
2900 rpm |
NO |
|||||||||||||||||||||||||||||||||||||||||||||||
Intel |
MICROPROCESSOR |
NO LEAD |
2011 |
RECTANGULAR |
UNSPECIFIED |
YES |
YES |
64 |
BOTTOM |
NO |
CMOS |
FIXED POINT |
R-XBGA-N2011 |
3200 rpm |
NO |
||||||||||||||||||||||||||||||||||||||||||||||||||
Intel |
MICROPROCESSOR |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Intel |
MICROPROCESSOR, RISC |
OTHER |
GULL WING |
176 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
3.3 V |
0 |
32 |
32 |
3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP176,1.0SQ,20 |
2.7 V |
85 Cel |
3 |
0 Cel |
TIN LEAD |
QUAD |
1.7 mm |
0 |
24 mm |
YES |
32 |
33.33 MHz |
24 mm |
CMOS |
345 mA |
3.3 V |
0 |
0 |
Microprocessors |
.5 mm |
FIXED POINT |
S-PQFP-G176 |
Not Qualified |
33.33 rpm |
YES |
e0 |
|||||||||||||||||||||||
Intel |
MICROPROCESSOR |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Intel |
MICROPROCESSOR |
BALL |
1356 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
YES |
64 |
GRID ARRAY |
BOTTOM |
NO |
CMOS |
FIXED POINT |
R-PBGA-B1356 |
2300 rpm |
NO |
||||||||||||||||||||||||||||||||||||||||||||||||
Intel |
MICROPROCESSOR |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Intel |
MICROPROCESSOR |
BALL |
1310 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
YES |
64 |
GRID ARRAY |
BOTTOM |
NO |
CMOS |
FIXED POINT |
R-PBGA-B1310 |
2200 rpm |
NO |
A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.
Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.
Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.
One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.