Microprocessors

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Address Bus Width	DAC Channels	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	ADC Channels	Terminal Position	DMA Channels	Maximum Seated Height	RAM Words	Width	Data EEPROM Size	Additional Features	Boundary Scan	Peripherals	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	RAM Bytes	Technology	Analog To Digital Convertors	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	PWM Channels	No. of Serial I/Os	Sub-Category	Connectivity	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code	No. of I/O Lines
MCF53281CVM240	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V		24		32		GRID ARRAY, LOW PROFILE		1.4 V	85 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		1.6 mm		17 mm			YES		32	80 MHz	40	260	17 mm		CMOS			1.5 V						1 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	240 rpm	YES	e1
MCF54453CVP200	NXP Semiconductors	MICROPROCESSOR																																		40	260															3
MCF54455VP266	NXP Semiconductors	MICROPROCESSOR																																		40	260															3
MCIMX6Q4AVT10ADR	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V		16		32		GRID ARRAY, FINE PITCH		1.35 V	125 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		2.16 mm		21 mm		PKG DETAIL: HTTP://CACHE.FREESCALE.COM/FILES/SHARED/DOC/PACKAGE_INFO/98ASA00330D.	YES		64		40	260	21 mm		CMOS									.8 mm	FLOATING POINT	S-PBGA-B624	3		1000 rpm	YES	e1
MIMXRT1015CAF4BR	NXP Semiconductors	MICROPROCESSOR, RISC
MIMXRT106ADVL6B	NXP Semiconductors	MICROCONTROLLER, RISC																																		40	260															3
MIMXRT106LCVL5B	NXP Semiconductors	MICROPROCESSOR, RISC																																		40	260															3
MIMXRT555SFFOCR	NXP Semiconductors	MICROPROCESSOR, RISC																																		40	260															3
MPC8245LVV266D	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	352	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.1 V		32		32	2,3.3	GRID ARRAY, LOW PROFILE	BGA352,26X26,50	1.7 V	105 Cel		0 Cel	TIN SILVER COPPER		BOTTOM		1.65 mm		35 mm			YES		32	66 MHz	30	245	35 mm		CMOS			1.8 V				Microprocessors		1.27 mm	FLOATING POINT	S-PBGA-B352	3	Not Qualified	266 rpm	YES	e1
MPC8270VVQLDA	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	480	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V		32		32	1.5,3.3	GRID ARRAY, LOW PROFILE	BGA480,29X29,50	1.45 V	70 Cel		0 Cel	TIN SILVER COPPER		BOTTOM		1.65 mm		37.5 mm		ALSO REQUIRES 3.3V SUPPLY	YES		64	83.33 MHz	40	260	37.5 mm		CMOS			1.5 V				Other uPs/uCs/Peripheral ICs		1.27 mm	FLOATING POINT	S-PBGA-B480	4	Not Qualified	333 rpm	NO	e1
MPC8270ZQMIBA	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V		32		32	1.5,3.3	GRID ARRAY	BGA516,26X26,40	1.45 V	70 Cel		0 Cel	TIN LEAD SILVER		BOTTOM		2.55 mm		27 mm			YES		64	266 MHz	30	245	27 mm		CMOS			1.5 V				Other uPs/uCs/Peripheral ICs		1 mm	FLOATING POINT	S-PBGA-B516	3	Not Qualified	66.67 rpm	NO	e0
MPC8308CVMAGD	Freescale Semiconductor	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	473	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V					1,1.8,2.5/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA473,23X23,32	.95 V	105 Cel		-40 Cel			BOTTOM		1.54 mm		19 mm			YES			66.67 MHz	40	260	19 mm		CMOS			1 V			2	Microprocessors		.8 mm	FLOATING POINT	S-PBGA-B473	3	Not Qualified	400 rpm	YES	e2
MPC8309CVMAGDCA	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	489	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		0		32	1	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA489,23X23,32	.95 V	105 Cel		-40 Cel	TIN SILVER		BOTTOM		1.61 mm		19 mm			YES		0	66.67 MHz	40	260	19 mm		CMOS			1 V				Microprocessors		.8 mm	FLOATING POINT	S-PBGA-B489	3	Not Qualified	400 rpm	YES	e2
MPC8313VRADDC	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V				32	1,1.8/2.5,3.3	GRID ARRAY	BGA516,26X26,40	.95 V	105 Cel		0 Cel	TIN SILVER		BOTTOM		2.55 mm		27 mm			YES			66.67 MHz	40	260	27 mm		CMOS			1 V				Microprocessors		1 mm	FLOATING POINT	S-PBGA-B516	3	Not Qualified	266 rpm	YES	e2
MPC8313VRAFFB	Freescale Semiconductor	MICROPROCESSOR	OTHER	BALL	516	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V		32		32	1,1.8/2.5,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA516,26X26,40	.95 V	105 Cel		0 Cel	TIN SILVER		BOTTOM		2.55 mm		27 mm		ALSO REQUIRES 3.3V I/O SUPPLY	YES		32	66.67 MHz	40	260	27 mm		CMOS			1 V				Microprocessors		1 mm	FLOATING POINT	S-PBGA-B516	3	Not Qualified	333 rpm	YES	e2
MPC8343VRADDB	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	620	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		32		32	1.2,2.5,3.3	GRID ARRAY	BGA620,28X28,40	1.14 V	105 Cel		0 Cel	TIN SILVER		BOTTOM		2.46 mm		29 mm		ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES		32	66 MHz	40	260	29 mm		CMOS			1.2 V				Microprocessors		1 mm	FLOATING POINT	S-PBGA-B620	3	Not Qualified	266 rpm	YES	e2
MPC8347ECZQAGDB	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	620	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		32		32	1.2,2.5,3.3	GRID ARRAY	BGA620,28X28,40	1.14 V	105 Cel		-40 Cel	TIN LEAD SILVER		BOTTOM		2.46 mm		29 mm		ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES		32	66 MHz	40	260	29 mm		CMOS			1.2 V				Microprocessors		1 mm	FLOATING POINT	S-PBGA-B620	3	Not Qualified	400 rpm	YES	e0
MPC8347EVVAJDB	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	672	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		32		32	1.2,2.5,3.3	GRID ARRAY, LOW PROFILE	BGA672,34X34,40	1.14 V	105 Cel		0 Cel			BOTTOM		1.69 mm		35 mm		ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES		32	66 MHz	40	260	35 mm		CMOS			1.2 V				Microprocessors		1 mm	FLOATING POINT	S-PBGA-B672	3	Not Qualified	533 rpm	YES
MPC8349EZUAJDB	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	672	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		32		32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE	BGA672,34X34,40	1.14 V	105 Cel		0 Cel	TIN LEAD		BOTTOM		1.69 mm		35 mm		ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES		32	66 MHz	40	260	35 mm		CMOS			1.2 V				Microprocessors		1 mm	FLOATING POINT	S-PBGA-B672	3	Not Qualified	533 rpm	YES	e0
MPC8377VRAGDA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	689	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		15		32	1,1.8/2.5,2.5/3.3	GRID ARRAY, HEAT SINK/SLUG	BGA689,29X29,40	.95 V	125 Cel	8	0 Cel	TIN SILVER		BOTTOM		2.46 mm		31 mm			YES		64		40	260	31 mm		CMOS		.03 mA	1 V	4			Microprocessors		1 mm	FLOATING POINT	S-PBGA-B689	3	Not Qualified	400 rpm	YES	e2
MPC860PCVR50D4	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V		32		32	3.3	GRID ARRAY	BGA357,19X19,50	3.135 V				TIN SILVER COPPER		BOTTOM		2.52 mm		25 mm			YES		32	50 MHz	30	245	25 mm		CMOS			3.3 V				Microprocessors		1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	50 rpm	YES	e1
MPC875VR66	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	256	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V		32		32	1.8,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA256,16X16,50	1.7 V				TIN SILVER COPPER		BOTTOM		2.54 mm		23 mm			YES		32		30	245	23 mm		CMOS			1.8 V				Microprocessors		1.27 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	66 rpm	YES	e1
MPC880ZP80	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V		32		32	1.8,3.3	GRID ARRAY	BGA357,19X19,50	1.7 V				Tin/Lead (Sn/Pb)		BOTTOM		2.52 mm		25 mm			YES		32		30	245	25 mm		CMOS			1.8 V				Microprocessors		1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	80 rpm	YES	e0
N80C188-12	Rochester Electronics	MICROPROCESSOR	COMMERCIAL	J BEND	68	QCCJ	SQUARE	PLASTIC/EPOXY	NO	YES	5.5 V		20		16		CHIP CARRIER		4.5 V	70 Cel		0 Cel	TIN LEAD		QUAD		4.572 mm		24.2062 mm		DRAM REFRESH CONTROL UNIT; PROGRAMMABLE INTERRUPT CONTROLLER	NO		8	25 MHz			24.2062 mm		CMOS			5 V						1.27 mm	FIXED POINT	S-PQCC-J68		Not Qualified	12.5 rpm	YES	e0
NHPXA270C5C312	Intel	MICROPROCESSOR, RISC		BALL	360	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.375 V		26		32		GRID ARRAY		1.1875 V				TIN SILVER COPPER		BOTTOM							YES		32	3.6864 MHz					CMOS			1.25 V							FIXED POINT	S-PBGA-B360		Not Qualified	312 rpm	YES	e1
P1010NXN5HFB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16			1	GRID ARRAY, FINE PITCH	BGA425,23X23,32	.95 V	105 Cel	4	-40 Cel	TIN SILVER		BOTTOM		1.9 mm		19 mm			YES		32		40	260	19 mm		CMOS			1 V	4			Microprocessors		.8 mm	FIXED POINT	S-PBGA-B425	3	Not Qualified	800 rpm	NO	e2
P1011NSN2DFB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16		32		GRID ARRAY	BGA689,29X29,40	.95 V		7				BOTTOM		2.46 mm		31 mm			YES		32		40	260	31 mm		CMOS			1 V	4					1 mm	FIXED POINT	S-PBGA-B689	3		533 rpm	NO
P1013NXE2LFB	NXP Semiconductors	MICROPROCESSOR	AUTOMOTIVE	BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		0		32		GRID ARRAY		.95 V	125 Cel		-40 Cel	TIN SILVER		BOTTOM		2.46 mm		31 mm			YES		0	133 MHz	40	260	31 mm		CMOS			1 V						1 mm	FLOATING POINT	S-PBGA-B689	3		1067 rpm	YES	e2
P1021NXE2FFB	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		0		32		GRID ARRAY		.95 V	125 Cel		-40 Cel	TIN SILVER		BOTTOM		2.46 mm		31 mm			YES		0	100 MHz	40	260	31 mm		CMOS			1 V						1 mm	FIXED POINT	S-PBGA-B689	3		667 rpm	YES	e2
PPC460EX-SUA1000T	Applied Micro Circuits	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	728	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.3 V		32				GRID ARRAY		1.2 V	85 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		2.65 mm		35 mm			YES		32	100 MHz			35 mm		CMOS			1.25 V						1 mm	FLOATING POINT	S-PBGA-B728		Not Qualified	1000 rpm	YES	e1
R5S72670W144FP#V0	Renesas Electronics	MICROPROCESSOR, RISC																																																		3
R7S721001VCBG	Renesas Electronics	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	324	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	8	26	NO	32		GRID ARRAY, FINE PITCH	BGA324,22X22,32	1.1 V	85 Cel	8	-40 Cel		YES	BOTTOM	YES	2.1 mm	10485760	19 mm	0		YES	DMA(16), LCD, POR, PWM(2), RTC, TIMER(7), WDT	32	48 MHz			19 mm	10485760	CMOS	8-Ch 12-Bit		1.18 V	16	YES	8		CAN(5), ETHERNET(2), I2C(4), IEB, LIN(2), SCI(10), SPDIF, SPI(7), SSI(6), UART, USB(2)	.8 mm	FLOATING POINT	S-PBGA-B324			400 rpm	YES		169
R7S721010VCFP	Renesas Electronics	MICROPROCESSOR, RISC	INDUSTRIAL	GULL WING	256	LFQFP	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	8	26	NO	32		FLATPACK, LOW PROFILE, FINE PITCH	QFP256,1.2SQ,16	1.1 V	85 Cel	8	-40 Cel		YES	QUAD	YES	1.7 mm	5242880	28 mm	0		YES	DMA(16), LCD, POR, PWM(2), RTC, TIMER(7), WDT	32	48 MHz			28 mm	5242880	CMOS	8-Ch 12-Bit		1.18 V	16	YES	8		CAN(5), ETHERNET(2), I2C(4), IEB, LIN(2), SCI(10), SPDIF, SPI(7), SSI(6), UART, USB(2)	.4 mm	FLOATING POINT	S-PQFP-G256			400 rpm	YES		137
R7S721020VLFP#AA1	Renesas Electronics	MICROPROCESSOR, RISC		GULL WING	176	LFQFP	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	8	26				FLATPACK, LOW PROFILE, FINE PITCH	QFP176,1.0SQ,20	1.1 V	85 Cel	8	-40 Cel			QUAD		1.7 mm	3145728	24 mm			YES		32	13.33 MHz			24 mm		CMOS		492 mA	1.18 V	16		13			.5 mm	FLOATING POINT	S-PQFP-G176	3		400 rpm	YES
STM32MP131FAF7T	STMicroelectronics	MICROPROCESSOR, RISC		BALL	320	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.38 V	8	26		32		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA320,21X21,20	1.32 V	105 Cel		-40 Cel			BOTTOM		1.2 mm	172032	11 mm			YES		16	48 MHz			11 mm		CMOS		268 mA	1.35 V	56		8			.5 mm	FIXED POINT	S-PBGA-B320			1000 rpm	YES
STM32MP133FAE7	STMicroelectronics	MICROPROCESSOR, RISC		BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.38 V	8	26		32		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.32 V	105 Cel		-40 Cel			BOTTOM		1.7 mm	172032	14 mm			YES		16	48 MHz			14 mm		CMOS		268 mA	1.35 V	56		10			.8 mm	FIXED POINT	S-PBGA-B289			1000 rpm	YES
STM32MP151AAA3T	STMicroelectronics	MICROPROCESSOR, RISC		BALL	448	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.25 V	8	26		32		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA448,22X22,32	1.18 V	125 Cel		-40 Cel	Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)		BOTTOM		1.32 mm	724992	18 mm			YES		16	48 MHz	30	260	18 mm		CMOS		940 mA	1.2 V	48		8			.8 mm	FLOATING POINT	S-PBGA-B448	3		650 rpm	YES	e2
T1013NSN7KNA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V		16		64		GRID ARRAY, FINE PITCH	BGA525,23X23,32	.97 V	105 Cel	6	0 Cel			BOTTOM		2.07 mm		19 mm			YES		32				19 mm		CMOS		5 mA	1 V	2		5			.8 mm	FIXED POINT	S-PBGA-B525			1000 rpm	YES
T1023NXE7PQA	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V		16		64		GRID ARRAY, FINE PITCH	BGA525,23X23,32	.97 V	105 Cel	6	-40 Cel	TIN SILVER COPPER		BOTTOM		2.07 mm		19 mm			YES		32		40	260	19 mm		CMOS		5 mA	1 V	2		5			.8 mm	FIXED POINT	S-PBGA-B525	3		1400 rpm	YES	e1
T4081NSE7TTB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1932	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES			16				GRID ARRAY, HEAT SINK/SLUG						TIN SILVER COPPER		BOTTOM		3.33 mm		45 mm			YES		64	133.3 MHz	30	250	45 mm		CMOS									1 mm	FIXED POINT	S-PBGA-B1932	3		1800 rpm	YES	e1
TMS320DM8147SCYE0	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	684	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	8	28		32	1.1/1.35	GRID ARRAY, FINE PITCH	BGA684,28X28,32	1.14 V	90 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM		3.06 mm	8192	23 mm			YES		16	30 MHz	NOT SPECIFIED	250	23 mm		CMOS			1.2 V	72			Digital Signal Processors		.8 mm	FLOATING POINT	S-PBGA-B684	4	Not Qualified	720 rpm	YES	e1
TMS320DM8148CCYE0	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	684	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	8	28		32	0.95/1.35	GRID ARRAY, FINE PITCH	BGA684,28X28,32	1.14 V	90 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM		3.06 mm	16384	23 mm			YES		16	30 MHz	NOT SPECIFIED	250	23 mm		CMOS			1.2 V	72			Digital Signal Processors		.8 mm	FLOATING POINT	S-PBGA-B684	4	Not Qualified	720 rpm	YES	e1
UPD70108C8	Renesas Electronics	MICROPROCESSOR, RISC	COMMERCIAL	THROUGH-HOLE	40	DIP	RECTANGULAR	PLASTIC/EPOXY		NO					16	5	IN-LINE	DIP40,.6		70 Cel		-10 Cel	Tin/Lead (Sn/Pb)		DUAL															CMOS		80 mA	5 V				Microprocessors		2.54 mm		R-PDIP-T40		Not Qualified	8 rpm		e0
W65C02S6TPLG-14	Western Design Center
W65C02S6TQG-14	Western Design Center
XAM5708BCBDJEA	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	538	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V		16				GRID ARRAY, LOW PROFILE, FINE PITCH		1.11 V	105 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		1.298 mm		17 mm			YES		32	38.4 MHz	30	260	17 mm		CMOS			1.15 V						.65 mm	FIXED POINT	S-PBGA-B538	3		1000 rpm	YES	e1
XAM5749ABZXEA	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	760	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V		16				GRID ARRAY, LOW PROFILE, FINE PITCH		1.11 V	105 Cel		-40 Cel			BOTTOM		1.63 mm		23 mm			YES		32	38.4 MHz			23 mm		CMOS			1.15 V						.8 mm	FIXED POINT	S-PBGA-B760			1500 rpm	YES
Z84C0006PEG	IXYS Corporation	MICROPROCESSOR	INDUSTRIAL	THROUGH-HOLE	40	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	NO	5.5 V	0	16		8		IN-LINE		4.5 V	100 Cel	2	-40 Cel	MATTE TIN		DUAL		4.75 mm	0	15.24 mm		DRAM REFRESH COUNTER	NO		8	6.17 MHz			52.325 mm		CMOS		30 mA	5 V	0		0			2.54 mm	FIXED POINT	R-PDIP-T40		Not Qualified	6.17 rpm	YES	e3

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.