Microprocessors

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Screening Level	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	CPU Family	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	ROM Words	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	RAM Bytes	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	No. of Serial I/Os	Sub-Category	ROM Programmability	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code
MPC880VR66	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V			32	32	1.8,3.3	GRID ARRAY	BGA357,19X19,50	1.7 V					TIN SILVER COPPER	BOTTOM	2.52 mm			25 mm		YES	32		30	245	25 mm		CMOS		1.8 V			Microprocessors		1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	66 rpm	YES	e1
MPC880VR80	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V			32	32	1.8,3.3	GRID ARRAY	BGA357,19X19,50	1.7 V					TIN SILVER COPPER	BOTTOM	2.52 mm			25 mm		YES	32		30	245	25 mm		CMOS		1.8 V			Microprocessors		1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	80 rpm	YES	e1
MPC880ZP133	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V			32	32	1.8,3.3	GRID ARRAY	BGA357,19X19,50	1.7 V					TIN LEAD	BOTTOM	2.52 mm			25 mm		YES	32		30	245	25 mm		CMOS		1.8 V			Microprocessors		1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	133 rpm	YES	e0
MPC880ZP66	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V			32	32	1.8,3.3	GRID ARRAY	BGA357,19X19,50	1.7 V					Tin/Lead (Sn/Pb)	BOTTOM	2.52 mm			25 mm		YES	32		30	245	25 mm		CMOS		1.8 V			Microprocessors		1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	66 rpm	YES	e0
P1011NXN2HFB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V			16	32		GRID ARRAY	BGA689,29X29,40	.95 V			7		TIN SILVER	BOTTOM	2.46 mm			31 mm		YES	32		40	260	31 mm		CMOS		1 V	4				1 mm	FIXED POINT	S-PBGA-B689	3		800 rpm	NO	e2
PPC460EX-SUB1000T	M/a-com Technology Solutions	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	728	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.3 V			32			GRID ARRAY		1.2 V	85 Cel			-40 Cel		BOTTOM	2.65 mm			35 mm		YES	32	100 MHz	NOT SPECIFIED	NOT SPECIFIED	35 mm		CMOS		1.25 V					1 mm	FLOATING POINT	S-PBGA-B728			1000 rpm	YES
QU80386EXTC33	Intel	MICROPROCESSOR, RISC		GULL WING	132	BQFP	SQUARE	PLASTIC/EPOXY	NO	YES	5.5 V			26	32	5	FLATPACK, BUMPER	SPQFP132,1.1SQ	4.5 V	117 Cel		12	-40 Cel		QUAD	4.57 mm		0	24.13 mm		YES	16	25 MHz			24.13 mm		CMOS	320 mA	5 V	2	3	Microprocessors		.635 mm	FIXED POINT	S-PQFP-G132		Not Qualified	33 rpm	YES
SPC5125YVN400	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	324	BGA	SQUARE	PLASTIC/EPOXY		YES			AEC-Q100		32	1.4,3.3	GRID ARRAY	BGA324,22X22,40		85 Cel			-40 Cel	TIN SILVER	BOTTOM									40	260								Microprocessors		1 mm		S-PBGA-B324	3	Not Qualified	400 rpm		e2
STM32MP131CAG3	STMicroelectronics	MICROPROCESSOR, RISC		BALL	289	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.38 V	8		26	32		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA289,17X17,20	1.21 V	125 Cel			-40 Cel		BOTTOM	1.2 mm		172032	9 mm		YES	16	48 MHz			9 mm		CMOS	239 mA	1.25 V	56	8			.5 mm	FIXED POINT	S-PBGA-B289			650 rpm	YES
STM32MP131FAG7	STMicroelectronics	MICROPROCESSOR, RISC		BALL	289	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.38 V	8		26	32		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA289,17X17,20	1.32 V	105 Cel			-40 Cel		BOTTOM	1.2 mm		172032	9 mm		YES	16	48 MHz			9 mm		CMOS	268 mA	1.35 V	56	8			.5 mm	FIXED POINT	S-PBGA-B289			1000 rpm	YES
STM32MP135FAG7T	STMicroelectronics	MICROPROCESSOR, RISC		BALL	289	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.38 V	8		26	32		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA289,17X17,20	1.32 V	105 Cel			-40 Cel		BOTTOM	1.2 mm		172032	9 mm		YES	16	48 MHz			9 mm		CMOS	268 mA	1.35 V	56	10			.5 mm	FIXED POINT	S-PBGA-B289			1000 rpm	YES
STM32MP151CAB3T	STMicroelectronics	MICROPROCESSOR, RISC																																NOT SPECIFIED	NOT SPECIFIED
STM32MP151FAA1	STMicroelectronics	MICROPROCESSOR, RISC
STM32MP153AAA3T	STMicroelectronics	MICROPROCESSOR, RISC																																NOT SPECIFIED	NOT SPECIFIED
STM32MP157AAA3T	STMicroelectronics	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	448	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.25 V	8		26	32		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA448,22X22,32	.85 V	125 Cel			-40 Cel		BOTTOM	1.32 mm		724992	18 mm		YES	0	64 MHz	NOT SPECIFIED	NOT SPECIFIED	18 mm		CMOS	1000 mA	.9 V	48				.8 mm	FLOATING POINT	S-PBGA-B448			650 rpm	YES
T1013NSE7PQA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V			16	64		GRID ARRAY, FINE PITCH	BGA525,23X23,32	.97 V	105 Cel		6	0 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm			19 mm		YES	32		40	260	19 mm		CMOS	5 mA	1 V	2	5			.8 mm	FIXED POINT	S-PBGA-B525	3		1400 rpm	YES	e1
T1042NXN7PQB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V			16	32		GRID ARRAY, FINE PITCH		.97 V					TIN SILVER COPPER	BOTTOM	2.07 mm			23 mm		YES	64	133.3 MHz	30	250	23 mm		CMOS		1 V					.8 mm	FIXED POINT	S-PBGA-B780	3		1400 rpm	YES	e1
XTDA4VMXXXGALF	Texas Instruments	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	827	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	.84 V	8		0	64		GRID ARRAY, FINE PITCH	BGA827,29X29,32	.77 V	125 Cel			-40 Cel		BOTTOM	2.8 mm		5242880	24 mm		YES	32	27 MHz			24 mm		CMOS		.8 V					.8 mm	FLOATING POINT	S-PBGA-B827			1000 rpm	YES
Z8038025FSC	Zilog	MICROPROCESSOR	COMMERCIAL	GULL WING	100	QFP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	5.5 V	0		32	32		FLATPACK		4.5 V	70 Cel		5	0 Cel		QUAD	3.1 mm		0	14 mm	16-BIT OR 32-BIT LINEAR ADDRESS SPACE; DYNAMIC REFRESH CONTROL	NO	16	25 MHz		240	20 mm		CMOS		5 V	0	0			.65 mm	FIXED POINT	R-PQFP-G100		Not Qualified	25 rpm	YES
Z84C0008VEG	IXYS Corporation	MICROPROCESSOR	INDUSTRIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	NO	YES	5.5 V	0		16	8	5	CHIP CARRIER	LDCC44,.7SQ	4.5 V	100 Cel		2	-40 Cel	Matte Tin (Sn)	QUAD	4.57 mm		0	16.5862 mm	DRAM MEMORY REFRESH COUNTER	NO	8	8 MHz	40	260	16.5862 mm		CMOS	40 mA	5 V	0	0	Microprocessors		1.27 mm	FIXED POINT	S-PQCC-J44		Not Qualified	8 rpm	YES	e3
AM1705DPTPD4	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	GULL WING	176	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	YES		8		13	32		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH			105 Cel			-40 Cel	NICKEL PALLADIUM GOLD	QUAD	1.6 mm		172032	24 mm		YES	16	50 MHz	30	260	24 mm		CMOS		1.2 V	40				.5 mm	FIXED POINT	S-PQFP-G176	4		375 rpm	YES	e4
AM3352BZCE30R	Texas Instruments	MICROPROCESSOR, RISC		BALL	298	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.144 V	8		28	32	0.95/1.1	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA298,19X19,25	1.056 V					TIN SILVER COPPER	BOTTOM	1.3 mm		131072	13 mm	ALSO OPERATES AT MIN 0.912 V	YES	16	26 MHz	30	260	13 mm		CMOS	400 mA	1.1 V	64		Microprocessors		.65 mm	FIXED POINT	S-PBGA-B298	3	Not Qualified	300 rpm	YES	e1
AM3352BZCED60	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	298	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.144 V	8		28	32	0.95/1.1	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA298,19X19,25	1.056 V	90 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm		131072	13 mm		YES	16	26 MHz	30	260	13 mm		CMOS	400 mA	1.1 V	64		Microprocessors		.65 mm	FIXED POINT	S-PBGA-B298	3	Not Qualified	600 rpm	YES	e1
AM3703CBP100	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	515	VFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V	8		26	32	1.1,1.8	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA515,28X28,16	.9 V	90 Cel			0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	.71 mm		65536	12 mm		YES	16	54 MHz	NOT SPECIFIED	260	12 mm		CMOS	740 mA	1.1 V			Microprocessors		.5 mm	FLOATING POINT	S-PBGA-B515	3	Not Qualified	1000 rpm	YES	e1
AM5706BCBDJAS	Texas Instruments	MICROPROCESSOR, RISC																						TIN SILVER COPPER										30	260													3				e1
AM5708BCBDJEAR	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	538	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V			16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.11 V	105 Cel			-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	1.298 mm			17 mm		YES	32	38.4 MHz	30	260	17 mm		CMOS		1.15 V					.65 mm	FIXED POINT	S-PBGA-B538	3		1000 rpm	YES	e1
AM5708BCBDJEAS	Texas Instruments	MICROPROCESSOR, RISC																						TIN SILVER COPPER										30	260													3				e1
AM5K2E04XABD4	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	1089	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	8		16			GRID ARRAY, FINE PITCH		.95 V	85 Cel			0 Cel	TIN SILVER COPPER	BOTTOM	3.55 mm		2097152	27 mm		YES	64		30	245	27 mm		CMOS		1 V	5				.8 mm	FLOATING POINT	S-PBGA-B1089	4		1400 rpm	YES	e1
AM6412BKCGGAALV	Texas Instruments	MICROPROCESSOR, RISC		BALL	441	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	.79 V	16		14	64		GRID ARRAY, FINE PITCH	BGA441,21X21,32	.715 V	105 Cel		1	-40 Cel		BOTTOM	2.652 mm		2359296	17.2 mm	ALSO OPERATES AT 0.85V NOMINAL SUPPLY	YES	16	25 MHz			17.2 mm		CMOS		.75 V		7			.8 mm	FIXED POINT	S-PBGA-B441			1000 rpm	YES
AM6412BSCGGAALV	Texas Instruments	MICROPROCESSOR, RISC		BALL	441	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	.79 V	16		14	64		GRID ARRAY, FINE PITCH	BGA441,21X21,32	.715 V	105 Cel		1	-40 Cel		BOTTOM	2.652 mm		2359296	17.2 mm	ALSO OPERATES AT 0.85V NOMINAL SUPPLY	YES	16	25 MHz			17.2 mm		CMOS		.75 V		7			.8 mm	FIXED POINT	S-PBGA-B441			1000 rpm	YES
AT97SC3205T-H3M4C10B	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	NO	YES				0	8		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.16SQ,16		85 Cel			-40 Cel		QUAD	.9 mm			4 mm		NO	0				4 mm		CMOS		3.3 V					.4 mm	FIXED POINT	S-PQCC-N32				NO
ATSAMA5D22C-CNR	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	196	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8		26	32		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA196,14X14,30	1.2 V	105 Cel		1	-40 Cel	TIN SILVER COPPER NICKEL	BOTTOM	1.2 mm		131072	11 mm	ALSO OPERATES WITH 1.2V NOM @ 400 MHZ SPEED	YES	16	24 MHz			11 mm		CMOS		1.25 V	32				.75 mm	FLOATING POINT	S-PBGA-B196			500 rpm	YES	e2
ATSAMA5D27C-CNR	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8		26	32		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.2 V	105 Cel		1	-40 Cel		BOTTOM	1.4 mm		131072	14 mm	ALSO OPERATES WITH 1.2V NOM @ 400 MHZ SPEED	YES	16	24 MHz	NOT SPECIFIED	NOT SPECIFIED	14 mm		CMOS		1.25 V	32				.8 mm	FLOATING POINT	S-PBGA-B289			500 rpm	YES
AV8063801116903SR0T5	Intel	MICROPROCESSOR		BALL	1023	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES					64		GRID ARRAY	BGA1023(UNSPEC)							BOTTOM									NOT SPECIFIED	NOT SPECIFIED			CMOS					Microprocessors				R-PBGA-B1023		Not Qualified	3200 rpm
AV8063801149402SR0T6	Intel	MICROPROCESSOR		BALL	1023	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES					64		GRID ARRAY	BGA1023(UNSPEC)							BOTTOM						NO							CMOS					Microprocessors			FIXED POINT	R-PBGA-B1023		Not Qualified	2800 rpm	NO
CM8068403380018	Intel
CP3BT26Y98ADK/NOPB	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	GULL WING	144	LFQFP	SQUARE	PLASTIC/EPOXY	NO	YES	2.75 V			23	16	2.5,2.5/3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP144,.87SQ,20	2.25 V	85 Cel	CR16C		-40 Cel	MATTE TIN	QUAD	1.6 mm	262144		20 mm		YES	16		30	260	20 mm	32768	CMOS	20 mA	2.5 V			Microcontrollers	FLASH	.5 mm	FIXED POINT	S-PQFP-G144	3	Not Qualified	24 rpm	YES	e3
CP3BT26Y98ADKX/NOPB	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	GULL WING	144	LFQFP	SQUARE	PLASTIC/EPOXY	NO	YES	2.75 V			23	16	2.5,2.5/3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP144,.87SQ,20	2.25 V	85 Cel	CR16C		-40 Cel	MATTE TIN	QUAD	1.6 mm	262144		20 mm		YES	16		30	260	20 mm	32768	CMOS	20 mA	2.5 V			Microcontrollers	FLASH	.5 mm	FIXED POINT	S-PQFP-G144	3	Not Qualified	24 rpm	YES	e3
FH8065301567313	Intel	MICROPROCESSOR	INDUSTRIAL	BALL	1170	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES					64		GRID ARRAY			110 Cel			-40 Cel		BOTTOM						NO							CMOS								FIXED POINT	R-PBGA-B1170			1330 rpm
KMPC8275CVRMIBA	Freescale Semiconductor	MICROPROCESSOR, RISC		BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V			32	32		GRID ARRAY		1.45 V					TIN SILVER	BOTTOM	2.55 mm			27 mm		YES	64	266 MHz	30	245	27 mm		CMOS		1.5 V					1 mm	FLOATING POINT	S-PBGA-B516	3	Not Qualified	66.67 rpm	NO	e2
KMPC8343CVRAGDB	Freescale Semiconductor	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	620	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V			32	32		GRID ARRAY		1.14 V	105 Cel			-40 Cel	TIN SILVER	BOTTOM	2.46 mm			29 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz	40	260	29 mm		CMOS		1.2 V					1 mm	FLOATING POINT	S-PBGA-B620	3	Not Qualified	400 rpm	YES	e2
LX2160XC72232B	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	.88 V			36	64		GRID ARRAY	BGA1517.39X39,40	.82 V	105 Cel		12	-40 Cel	TIN SILVER COPPER	BOTTOM	3.51 mm			40 mm		YES	128		30	245	40 mm		CMOS	.05 mA	.85 V		17			1 mm	FIXED POINT	S-PBGA-B1517	3		2200 rpm	YES	e1
MC68HC000EI16	Freescale Semiconductor	MICROPROCESSOR	COMMERCIAL	J BEND	68	QCCJ	SQUARE	PLASTIC/EPOXY	NO	YES	5.25 V			24	16		CHIP CARRIER		4.75 V	70 Cel			0 Cel	MATTE TIN	QUAD	4.57 mm			24.2 mm		NO	16	20 MHz	30	245	24.2 mm		HCMOS		5 V					1.27 mm	FIXED POINT	S-PQCC-J68	3		20 rpm	YES	e3
MC68HC000EI8R2	Freescale Semiconductor	MICROPROCESSOR, RISC	COMMERCIAL	J BEND	68	QCCJ	SQUARE	PLASTIC/EPOXY		YES					32	5	CHIP CARRIER	LDCC68,1.0SQ		70 Cel			0 Cel	MATTE TIN	QUAD									30	245			CMOS	25 mA	5 V			Microprocessors		1.27 mm		S-PQCC-J68	3	Not Qualified	8 rpm		e3
MC8640DTHX1250HC	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	1023	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.1 V			32	32		GRID ARRAY		1 V	105 Cel			-40 Cel	Tin/Lead (Sn/Pb)	BOTTOM	2.97 mm			33 mm		YES	32	166.66 MHz	30	245	33 mm		CMOS		1.05 V					1 mm	FLOATING POINT	S-CBGA-B1023	3	Not Qualified	1250 rpm	YES	e0
MCF5232CVM150J	Freescale Semiconductor		INDUSTRIAL	BALL	196	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V			24	32	1.5,3.3	GRID ARRAY, LOW PROFILE	BGA196,14X14,40	1.4 V	85 Cel	COLDFIRE		-40 Cel	TIN SILVER COPPER OVER NICKEL	BOTTOM	1.6 mm			15 mm		YES	32		40	260	15 mm	65536	CMOS	150 mA				Microcontrollers		1 mm	FIXED POINT	S-PBGA-B196	3	Not Qualified	150 rpm	YES
MCF5270CVM150R2	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	196	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V			24	32		GRID ARRAY, LOW PROFILE		1.4 V	85 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm			15 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	75 MHz	40	260	15 mm		CMOS		1.5 V					1 mm	FIXED POINT	S-PBGA-B196	3	Not Qualified	150 rpm	YES	e1
MCF5327CVM240	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	196	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V			24	32		GRID ARRAY		1.4 V	85 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	1.75 mm			15 mm		YES	32	80 MHz	40	260	15 mm		CMOS		1.5 V					1 mm	FIXED POINT	S-PBGA-B196	3	Not Qualified	240 rpm	YES	e1

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.