Microprocessors

Reset All

Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	No. of Serial I/Os	Sub-Category	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code
MPC860DEVR80D4	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V		32	32	3.3	GRID ARRAY	BGA357,19X19,50	3.135 V				TIN SILVER COPPER	BOTTOM	2.52 mm		25 mm		YES	32	50 MHz	30	245	25 mm	CMOS		3.3 V			Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	80 rpm	YES	e1
P1011NSN2HFB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16	32		GRID ARRAY	BGA689,29X29,40	.95 V		7			BOTTOM	2.46 mm		31 mm		YES	32		40	260	31 mm	CMOS		1 V	4			1 mm	FIXED POINT	S-PBGA-B689	3		800 rpm	NO
P1021NSE2HFB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		0	32		GRID ARRAY		.95 V				TIN SILVER	BOTTOM	2.46 mm		31 mm		YES	0	100 MHz	40	260	31 mm	CMOS		1 V				1 mm	FIXED POINT	S-PBGA-B689	3		800 rpm	YES	e2
STM32MP151CAA3T	STMicroelectronics	MICROPROCESSOR, RISC																													NOT SPECIFIED	NOT SPECIFIED
T1023NSE7PQA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V		16	64		GRID ARRAY, FINE PITCH	BGA525,23X23,32	.97 V	105 Cel	6	0 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm		19 mm		YES	32		40	260	19 mm	CMOS	5 mA	1 V	2	5		.8 mm	FIXED POINT	S-PBGA-B525	3		1400 rpm	YES	e1
T1042NXE7MQB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V		16	32		GRID ARRAY, FINE PITCH		.97 V				TIN SILVER COPPER	BOTTOM	2.07 mm		23 mm		YES	64	133.3 MHz	30	250	23 mm	CMOS		1 V				.8 mm	FIXED POINT	S-PBGA-B780	3		1200 rpm	YES	e1
XAM3359ZCZ	Texas Instruments	MICROPROCESSOR, RISC																				TIN SILVER COPPER									30	260		CMOS									3				e1
ADSP-BF607BBCZ-5	Analog Devices	MICROPROCESSOR	INDUSTRIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V			32	1.8/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA349,22X22,32	1.19 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.5 mm		19 mm		YES		60 MHz			19 mm	CMOS		1.25 V			Microprocessors	.8 mm	FIXED POINT	S-PBGA-B349	3	Not Qualified	500 rpm	YES	e1
AM1705DPTP4	Texas Instruments	MICROPROCESSOR, RISC	OTHER	GULL WING	176	LFQFP	SQUARE	PLASTIC/EPOXY	YES	YES	1.35 V	8	13	32	1.3,1.8/3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP176,1.0SQ,20	1.25 V	90 Cel		0 Cel	NICKEL PALLADIUM GOLD	QUAD	1.6 mm	172032	24 mm		YES	16	50 MHz	30	260	24 mm	CMOS		1.3 V	40		Microprocessors	.5 mm	FIXED POINT	S-PQFP-G176	4	Not Qualified	456 rpm	YES	e4
AM3354BZCZ30	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	324	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.144 V	8	28	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.056 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	131072	15 mm		YES	16	26 MHz	30	260	15 mm	CMOS	400 mA	1.1 V	64			.8 mm	FIXED POINT	S-PBGA-B324	3		300 rpm	YES	e1
AM5726BABCXEA	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.2 V		16			GRID ARRAY, FINE PITCH	BGA760,28X28,31	1.11 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.55 mm		23 mm		YES	32	38.4 MHz	30	250	23 mm	CMOS		1.15 V				.8 mm	FLOATING POINT	S-PBGA-B760	3		1500 rpm	YES	e1
MC68HC000EI8	Freescale Semiconductor	MICROPROCESSOR, RISC	COMMERCIAL	J BEND	68	QCCJ	SQUARE	PLASTIC/EPOXY		YES				32	5	CHIP CARRIER	LDCC68,1.0SQ		70 Cel		0 Cel	MATTE TIN	QUAD								30	245		CMOS	25 mA	5 V			Microprocessors	1.27 mm		S-PQCC-J68	3	Not Qualified	8 rpm		e3
MCF5206AB33A	Freescale Semiconductor	MICROPROCESSOR, RISC	COMMERCIAL	GULL WING	160	QFP	SQUARE	PLASTIC/EPOXY	YES	YES	5.25 V		28	32		FLATPACK		4.75 V	70 Cel		0 Cel	MATTE TIN	QUAD	3.85 mm		28 mm		YES	32	33.33 MHz	30	245	28 mm	CMOS		5 V				.65 mm	FIXED POINT	S-PQFP-G160	3	Not Qualified	33.33 rpm	YES	e3
MCF54451CVM180	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.65 V		32	32	1.5,1.8,2.5,3.3	GRID ARRAY, LOW PROFILE	BGA256,16X16,40	1.35 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		17 mm		YES	32	60 MHz	40	260	17 mm	CMOS		1.5 V			Microprocessors	1 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	180 rpm	YES	e1
MCIMX6S1AVM08AC	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V		16	64		GRID ARRAY, LOW PROFILE, FINE PITCH		1.275 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	YES	32	24 MHz	40	260	21 mm	CMOS		1.35 V				.8 mm	FIXED POINT	S-PBGA-B624	3		800 rpm	YES	e1
MPC5121YVY400B	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.47 V		0	32		GRID ARRAY		1.33 V	85 Cel		-40 Cel	TIN SILVER	BOTTOM	2.55 mm		27 mm		YES	0		40	260	27 mm	CMOS		1.4 V				1 mm	FIXED POINT	S-PBGA-B516	3	Not Qualified	400 rpm	YES	e2
MPC8347VVAJFB	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	672	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		32	32	1.2	GRID ARRAY, LOW PROFILE	BGA672,34X34,40	1.14 V	105 Cel		0 Cel	TIN SILVER	BOTTOM	1.69 mm		35 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz	40	260	35 mm	CMOS		1.2 V			Microprocessors	1 mm	FLOATING POINT	S-PBGA-B672	3	Not Qualified	533 rpm	YES	e2
MPC8540VT833LB	Freescale Semiconductor	MICROPROCESSOR	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		64	32	1.2,2.5/3.3	GRID ARRAY	BGA783,28X28,40	1.14 V	105 Cel		0 Cel	Tin/Silver (Sn/Ag)	BOTTOM	3.85 mm		29 mm		YES	64	166 MHz	40	260	29 mm	CMOS		1.2 V			Microprocessors	1 mm	FIXED POINT	S-PBGA-B783	3	Not Qualified	667 rpm	YES	e2
OMAP3530ECBBAR	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	515	VFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.35 V	8	26		1.1,1.8,3.3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA515,28X28,16	.985 V	85 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	.9 mm	65536	12 mm		YES	16	38.4 MHz	NOT SPECIFIED	260	12 mm	CMOS		1 V	32		Graphics Processors	.4 mm	FLOATING POINT	S-PBGA-B515	3	Not Qualified	600 rpm	YES	e1
STM32MP131CAF3	STMicroelectronics	MICROPROCESSOR, RISC		BALL	320	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.38 V	8	26	32		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA320,21X21,20	1.21 V	125 Cel		-40 Cel		BOTTOM	1.2 mm	172032	11 mm		YES	16	48 MHz			11 mm	CMOS	239 mA	1.25 V	56	8		.5 mm	FIXED POINT	S-PBGA-B320			650 rpm	YES
STM32MP151CAB3	STMicroelectronics	MICROPROCESSOR, RISC																													NOT SPECIFIED	NOT SPECIFIED
TMS320DM8148CCYEA0	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	684	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	8	28	32	0.95/1.35	GRID ARRAY, FINE PITCH	BGA684,28X28,32	1.14 V	90 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.06 mm	16384	23 mm		YES	16	30 MHz	NOT SPECIFIED	250	23 mm	CMOS		1.2 V	72		Digital Signal Processors	.8 mm	FLOATING POINT	S-PBGA-B684	4	Not Qualified	720 rpm	YES	e1
XAM3517AZER	Texas Instruments	MICROPROCESSOR		BALL	484	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.248 V		16			GRID ARRAY, HEAT SINK/SLUG		1.152 V				TIN SILVER COPPER	BOTTOM	2.48 mm		23 mm		YES	16	26 MHz			23 mm	CMOS		1.2 V				1 mm	FLOATING POINT	S-PBGA-B484	3	Not Qualified	600 rpm	YES	e1
AM3357BZCZA30	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	324	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.144 V	8	28	32	0.95/1.1	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA324,18X18,32	1.056 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	131072	15 mm	ALSO OPERATES AT MIN 0.912 V	YES	16	26 MHz	30	260	15 mm	CMOS	400 mA	1.1 V	64		Microprocessors	.8 mm	FIXED POINT	S-PBGA-B324	3	Not Qualified	300 rpm	YES	e1
AM5708BCBDJ	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	538	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V		16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.11 V	90 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	1.298 mm		17 mm		YES	32	38.4 MHz	30	260	17 mm	CMOS		1.15 V				.65 mm	FIXED POINT	S-PBGA-B538	3		1000 rpm	YES	e1
DM3730CUSA	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	423	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V	8	26	32	1.2,1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA423,24X24,25	1.08 V	105 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	1.4 mm	16384	16 mm		YES	16	54 MHz	NOT SPECIFIED	260	16 mm	CMOS	1400 mA	1.14 V	128		Digital Signal Processors	.65 mm	FLOATING POINT	S-PBGA-B423	3	Not Qualified	800 rpm	YES	e1
MIMXRT1061DVL6A	NXP Semiconductors	MICROCONTROLLER, RISC																				TIN SILVER COPPER									40	260											3				e1
MIMXRT1061XVN5B	NXP Semiconductors	MICROPROCESSOR																													40	260											3
MPC8270VVUPEA	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	480	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V		32	32	1.5,3.3	GRID ARRAY, LOW PROFILE	BGA480,29X29,50	1.45 V	70 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.65 mm		37.5 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	100 MHz	40	260	37.5 mm	CMOS		1.5 V			Other uPs/uCs/Peripheral ICs	1.27 mm	FLOATING POINT	S-PBGA-B480	4	Not Qualified	450 rpm	NO	e1
MPC8323ECVRAFDCA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		0	32		GRID ARRAY		.95 V				TIN SILVER	BOTTOM	2.55 mm		27 mm		YES	0	66.67 MHz	40	260	27 mm	CMOS		1 V				1 mm	FLOATING POINT	S-PBGA-B516	3	Not Qualified	333 rpm	YES	e2
P3041NXN7NNC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1295	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		0			GRID ARRAY		.95 V				TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm		YES	0	133 MHz	30	245	37.5 mm	CMOS		1 V				1 mm	FIXED POINT	S-PBGA-B1295	3		1333 rpm	YES	e1
PT-100	Sk Hynix
STM32MP153CAB3	STMicroelectronics	MICROPROCESSOR, RISC																													NOT SPECIFIED	NOT SPECIFIED
T1023NXE7MQA	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V		16	64		GRID ARRAY, FINE PITCH	BGA525,23X23,32	.97 V	105 Cel	6	-40 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm		19 mm		YES	32		40	260	19 mm	CMOS	5 mA	1 V	2	5		.8 mm	FIXED POINT	S-PBGA-B525	3		1200 rpm	YES	e1
AM1707DZKBD4	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	256	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8	13	32	1.3,1.8/3.3	GRID ARRAY, FINE PITCH	BGA256,16X16,40	1.14 V	90 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.05 mm	172032	17 mm		YES	16	30 MHz	30	260	17 mm	CMOS		1.2 V	40		Microprocessors	.5 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	456 rpm	YES	e1
AM3352BZCE60	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	298	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.144 V	8	28	32	0.95/1.1	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA298,19X19,25	1.056 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	131072	13 mm		YES	16	26 MHz	30	260	13 mm	CMOS	400 mA	1.1 V	64		Microprocessors	.65 mm	FIXED POINT	S-PBGA-B298	3	Not Qualified	600 rpm	YES	e1
AM3356BZCZ60	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	324	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.144 V	8	28	32	0.95/1.1	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA324,18X18,32	1.056 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	131072	15 mm		YES	16	26 MHz	30	260	15 mm	CMOS	400 mA	1.1 V	64		Microprocessors	.8 mm	FIXED POINT	S-PBGA-B324	3	Not Qualified	600 rpm	YES	e1
AM5729BABCXEAR	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.2 V		16			GRID ARRAY, FINE PITCH	BGA760,28X28,31	1.11 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.96 mm		23 mm	ALSO HAVING 16-BIT ADDRESS AND 32-BIT DATA BUS OF EMIF2	YES	32	32 MHz	30	250	23 mm	CMOS		1.15 V				.8 mm	FIXED POINT	S-PBGA-B760	3		1500 rpm	YES	e1
AM6548BACDXEAF	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	784	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V	8	28	32		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA784,28X28,32	1.05 V	105 Cel	1	-40 Cel	TIN SILVER COPPER	BOTTOM	1.63 mm	2097152	23 mm		YES	16	27 MHz		250	23 mm	CMOS		1.1 V	2	5		.8 mm	FIXED POINT	S-PBGA-B784	3		1100 rpm	YES	e1
MC68SEC000CFU20	Motorola	MICROPROCESSOR	INDUSTRIAL	GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	NO	YES			24	32		FLATPACK			85 Cel		-40 Cel		QUAD	2.45 mm		14 mm	CAN ALSO OPERATE WITH 5V SUPPLY		16	20 MHz			14 mm	CMOS		3.3 V				.8 mm	FIXED POINT	S-PQFP-G64		Not Qualified	20 rpm	YES
MC8640DTVJ1250HE	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1023	HBGA	SQUARE	CERAMIC	YES	YES	1.1 V		32	32		GRID ARRAY, HEAT SINK/SLUG	BGA1023,32X32,40	1 V	105 Cel		-40 Cel	TIN SILVER	BOTTOM	2.77 mm		33 mm		YES	32	166.66 MHz	30	245	33 mm	CMOS		1.05 V	4			1 mm	FLOATING POINT	S-CBGA-B1023	3		1250 rpm	NO	e2
MC8641VJ1500KE	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	1023	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.15 V		16	32		GRID ARRAY		1.05 V	105 Cel		0 Cel	TIN SILVER	BOTTOM	2.77 mm		33 mm		YES	64		30	245	33 mm	CMOS		1.1 V				1 mm	FLOATING POINT	S-CBGA-B1023	3		1500 rpm	YES	e2
MC9328MXSVP10	NXP Semiconductors	MICROPROCESSOR	COMMERCIAL	BALL	225	LFBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.9 V		25	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.7 V	70 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		13 mm		YES	32	16 MHz	40	260	13 mm	CMOS		1.8 V				.8 mm	FIXED POINT	S-PBGA-B225	3	Not Qualified	100 rpm	YES	e1
MCF53281CVM240J	Freescale Semiconductor	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY		YES				32	1.5,1.8/3.3	GRID ARRAY	BGA256,16X16,40		85 Cel		-40 Cel	TIN SILVER COPPER OVER NICKEL	BOTTOM								40	260							Microprocessors	1 mm		S-PBGA-B256	3	Not Qualified	240 rpm
MCIMX7D2DVK12SC	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	488	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.25 V		26	32		GRID ARRAY, THIN PROFILE, FINE PITCH		1.2 V	85 Cel		0 Cel		BOTTOM	1.1 mm		12 mm		YES	16		40	260	12 mm	CMOS		1.225 V				.4 mm	FLOATING POINT	S-PBGA-B488	3		1200 rpm	YES
MPC8323ECVRADDCA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		0	32		GRID ARRAY		.95 V				TIN SILVER	BOTTOM	2.55 mm		27 mm		YES	0	66.67 MHz	40	260	27 mm	CMOS		1 V				1 mm	FLOATING POINT	S-PBGA-B516	3	Not Qualified	266 rpm	YES	e2
MPC8343CVRAGDB	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	620	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		32	32	1.2,2.5,3.3	GRID ARRAY	BGA620,28X28,40	1.14 V	105 Cel		-40 Cel	TIN SILVER	BOTTOM	2.46 mm		29 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz	40	260	29 mm	CMOS		1.2 V			Microprocessors	1 mm	FLOATING POINT	S-PBGA-B620	3	Not Qualified	400 rpm	YES	e2
R7S721021VLFP#AA1	Renesas Electronics	MICROPROCESSOR, RISC		GULL WING	208	LFQFP	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	8	26			FLATPACK, LOW PROFILE, FINE PITCH	QFP208,1.2SQ,20	1.1 V	85 Cel	8	-40 Cel		QUAD	1.7 mm	3145728	28 mm		YES	32	13.33 MHz			28 mm	CMOS	492 mA	1.18 V	16	13		.5 mm	FLOATING POINT	S-PQFP-G208	3		400 rpm	YES

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.