Part | RoHS | Manufacturer | Peripheral IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Integrated Cache | Surface Mount | Maximum Supply Voltage | On Chip Data RAM Width | Screening Level | Address Bus Width | DAC Channels | Bit Size | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Minimum Supply Voltage | Maximum Operating Temperature | CPU Family | No. of External Interrupts | Minimum Operating Temperature | Terminal Finish | ADC Channels | Terminal Position | DMA Channels | Maximum Seated Height | ROM Words | RAM Words | Width | Data EEPROM Size | Additional Features | Boundary Scan | Peripherals | External Data Bus Width | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Total Dose (V) | RAM Bytes | Technology | Analog To Digital Convertors | Maximum Supply Current | Nominal Supply Voltage | No. of DMA Channels | PWM Channels | No. of Serial I/Os | Sub-Category | Connectivity | ROM Programmability | Bus Compatibility | Terminal Pitch | Format | JESD-30 Code | Moisture Sensitivity Level (MSL) | Qualification | Speed | Low Power Mode | JESD-609 Code | On Chip Program ROM Width | No. of I/O Lines |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
OTHER |
GULL WING |
144 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.3 V |
8 |
13 |
32 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP144,.87SQ,20 |
1.25 V |
95 Cel |
0 Cel |
QUAD |
1.6 mm |
262144 |
20 mm |
YES |
32 |
24 MHz |
40 |
260 |
20 mm |
CMOS |
90 mA |
32 |
14 |
.5 mm |
FLOATING POINT |
S-PQFP-G144 |
3 |
500 rpm |
YES |
||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
INDUSTRIAL |
GULL WING |
144 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.26 V |
8 |
0 |
32 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP144,.87SQ,20 |
1.15 V |
105 Cel |
0 |
-40 Cel |
QUAD |
1.6 mm |
262144 |
20 mm |
YES |
0 |
24 MHz |
40 |
260 |
20 mm |
CMOS |
90 mA |
32 |
20 |
.5 mm |
FLOATING-POINT |
S-PQFP-G144 |
3 |
396 rpm |
YES |
|||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR, RISC |
BALL |
516 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.6 V |
32 |
32 |
GRID ARRAY |
1.45 V |
BOTTOM |
2.55 mm |
27 mm |
YES |
64 |
266 MHz |
27 mm |
CMOS |
1.5 V |
1 mm |
FLOATING POINT |
S-PBGA-B516 |
66.67 rpm |
NO |
||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
491 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.248 V |
8 |
16 |
16 |
1.2,1.8,3.3 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA491,25X25,25 |
1.152 V |
105 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1.3 mm |
65536 |
17 mm |
YES |
16 |
26 MHz |
30 |
260 |
17 mm |
CMOS |
1500 mA |
1.2 V |
32 |
Microprocessors |
.65 mm |
FLOATING POINT |
S-PBGA-B491 |
3 |
Not Qualified |
600 rpm |
YES |
e1 |
|||||||||||||||||||||
|
IXYS Corporation |
MICROPROCESSOR |
INDUSTRIAL |
THROUGH-HOLE |
40 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
NO |
5.5 V |
0 |
16 |
8 |
IN-LINE |
4.5 V |
100 Cel |
2 |
-40 Cel |
MATTE TIN |
DUAL |
4.75 mm |
0 |
15.24 mm |
DRAM REFRESH COUNTER |
NO |
8 |
8 MHz |
52.325 mm |
CMOS |
40 mA |
5 V |
0 |
0 |
2.54 mm |
FIXED POINT |
R-PDIP-T40 |
Not Qualified |
8 rpm |
YES |
e3 |
||||||||||||||||||||||||
|
Microchip Technology |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
217 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.95 V |
8 |
26 |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA217,17X17,32 |
1.65 V |
85 Cel |
3 |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1.4 mm |
8192 |
15 mm |
YES |
32 |
50 MHz |
15 mm |
CMOS |
1.8 V |
22 |
.8 mm |
FIXED POINT |
S-PBGA-B217 |
210 rpm |
YES |
e1 |
|||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
TIN |
40 |
260 |
3 |
e3 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
OTHER |
BALL |
196 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.3 V |
8 |
0 |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA196,14X14,32 |
1.25 V |
85 Cel |
0 |
0 Cel |
BOTTOM |
1.52 mm |
1048576 |
12 mm |
YES |
0 |
24 MHz |
40 |
260 |
12 mm |
CMOS |
110 mA |
32 |
10 |
.8 mm |
FLOATING-POINT |
S-PBGA-B196 |
3 |
600 rpm |
YES |
|||||||||||||||||||||||||
|
Texas Instruments |
MICROPROCESSOR, RISC |
OTHER |
BALL |
324 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.144 V |
8 |
28 |
32 |
0.95/1.1 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA324,18X18,32 |
1.056 V |
90 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1.4 mm |
131072 |
15 mm |
YES |
16 |
26 MHz |
30 |
260 |
15 mm |
CMOS |
400 mA |
1.1 V |
64 |
Microprocessors |
.8 mm |
FIXED POINT |
S-PBGA-B324 |
3 |
Not Qualified |
600 rpm |
YES |
e1 |
|||||||||||||||||||||
|
Octavo Systems |
MICROPROCESSOR, RISC |
OTHER |
BALL |
400 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
16 |
GRID ARRAY |
85 Cel |
0 Cel |
BOTTOM |
2.6 mm |
27 mm |
24MHZ NOMINAL EXTERNAL FREQUENCY AVAILABLE |
YES |
8 |
245 |
27 mm |
CMOS |
1.1 V |
1.27 mm |
FIXED POINT |
S-PBGA-B400 |
4 |
1000 rpm |
YES |
|||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR |
INDUSTRIAL |
BALL |
225 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.32 V |
24 |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
1.08 V |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1.6 mm |
13 mm |
YES |
32 |
140 MHz |
40 |
260 |
13 mm |
CMOS |
1.2 V |
.8 mm |
FIXED POINT |
S-PBGA-B225 |
3 |
140 rpm |
NO |
e1 |
|||||||||||||||||||||||||||||
|
STMicroelectronics |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
257 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.25 V |
8 |
16 |
32 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
.85 V |
125 Cel |
-40 Cel |
BOTTOM |
1.2 mm |
724992 |
10 mm |
YES |
16 |
64 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
10 mm |
CMOS |
1000 mA |
.9 V |
48 |
.65 mm |
FLOATING POINT |
S-PBGA-B257 |
650 rpm |
YES |
||||||||||||||||||||||||||||
|
Texas Instruments |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
484 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.248 V |
8 |
16 |
16 |
1.2,1.8,3.3 |
GRID ARRAY |
BGA484,22X22,40 |
1.152 V |
105 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
2.48 mm |
65536 |
23 mm |
YES |
16 |
26 MHz |
30 |
260 |
23 mm |
CMOS |
1400 mA |
1.2 V |
32 |
Microprocessors |
1 mm |
FLOATING POINT |
S-PBGA-B484 |
3 |
Not Qualified |
600 rpm |
YES |
e1 |
|||||||||||||||||||||
|
STMicroelectronics |
MICROPROCESSOR, RISC |
BALL |
320 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.38 V |
8 |
26 |
32 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA320,21X21,20 |
1.32 V |
105 Cel |
-40 Cel |
BOTTOM |
1.2 mm |
172032 |
11 mm |
YES |
16 |
48 MHz |
11 mm |
CMOS |
268 mA |
1.35 V |
56 |
10 |
.5 mm |
FIXED POINT |
S-PBGA-B320 |
1000 rpm |
YES |
|||||||||||||||||||||||||||||
|
Microchip Technology |
MICROPROCESSOR, RISC |
INDUSTRIAL |
GULL WING |
208 |
FQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.95 V |
8 |
26 |
NO |
32 |
1.8,3.3 |
FLATPACK, FINE PITCH |
QFP208,1.2SQ,20 |
1.65 V |
85 Cel |
ARM7 |
7 |
-40 Cel |
MATTE TIN |
NO |
QUAD |
YES |
4.1 mm |
131072 |
16384 |
28 mm |
SEATED HEIGHT -MIN |
YES |
32 |
80 MHz |
260 |
28 mm |
16384 |
CMOS |
1.8 V |
20 |
YES |
1 |
Microcontrollers |
FLASH |
.5 mm |
FIXED POINT |
S-PQFP-G208 |
3 |
Not Qualified |
209 rpm |
YES |
e3 |
94 |
|||||||||||
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
OTHER |
BALL |
196 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.3 V |
8 |
0 |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA196,14X14,25 |
1.25 V |
95 Cel |
0 |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1.43 mm |
524288 |
10 mm |
YES |
0 |
24 MHz |
40 |
260 |
10 mm |
CMOS |
105 mA |
32 |
29 |
.65 mm |
FLOATING-POINT |
S-PBGA-B196 |
3 |
600 rpm |
YES |
e1 |
|||||||||||||||||||||||
|
Freescale Semiconductor |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
32 |
1.5,1.8/3.3 |
GRID ARRAY |
BGA256,16X16,40 |
85 Cel |
-40 Cel |
TIN SILVER COPPER OVER NICKEL |
BOTTOM |
40 |
260 |
Microprocessors |
1 mm |
S-PBGA-B256 |
3 |
Not Qualified |
240 rpm |
||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR |
INDUSTRIAL |
BALL |
225 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.32 V |
24 |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
1.08 V |
85 Cel |
-40 Cel |
BOTTOM |
1.6 mm |
13 mm |
YES |
32 |
140 MHz |
40 |
260 |
13 mm |
CMOS |
1.2 V |
.8 mm |
FIXED POINT |
S-PBGA-B225 |
3 |
140 rpm |
NO |
|||||||||||||||||||||||||||||||
|
STMicroelectronics |
MICROPROCESSOR, RISC |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
COMMERCIAL |
GULL WING |
208 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
32 |
1.5,3.3 |
FLATPACK |
QFP208,1.2SQ,20 |
70 Cel |
-20 Cel |
QUAD |
CMOS |
200 mA |
Microprocessors |
.5 mm |
S-PQFP-G208 |
Not Qualified |
100 rpm |
|||||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
AUTOMOTIVE |
BALL |
624 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.5 V |
16 |
64 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
1.275 V |
125 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1.6 mm |
21 mm |
24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE |
YES |
32 |
24 MHz |
40 |
260 |
21 mm |
CMOS |
1.35 V |
.8 mm |
FIXED POINT |
S-PBGA-B624 |
3 |
800 rpm |
YES |
e1 |
||||||||||||||||||||||||||||
|
Texas Instruments |
MICROPROCESSOR, RISC |
OTHER |
BALL |
324 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.144 V |
8 |
28 |
32 |
0.95/1.1 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA324,18X18,32 |
1.056 V |
90 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1.4 mm |
131072 |
15 mm |
YES |
16 |
26 MHz |
30 |
260 |
15 mm |
CMOS |
400 mA |
1.1 V |
64 |
Microprocessors |
.8 mm |
FIXED POINT |
S-PBGA-B324 |
3 |
Not Qualified |
600 rpm |
YES |
e1 |
|||||||||||||||||||||
|
STMicroelectronics |
MICROPROCESSOR, RISC |
BALL |
289 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.38 V |
8 |
26 |
32 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA289,17X17,20 |
1.21 V |
125 Cel |
-40 Cel |
BOTTOM |
1.2 mm |
172032 |
9 mm |
YES |
16 |
48 MHz |
9 mm |
CMOS |
239 mA |
1.25 V |
56 |
10 |
.5 mm |
FIXED POINT |
S-PBGA-B289 |
650 rpm |
YES |
|||||||||||||||||||||||||||||
|
Analog Devices |
MICROPROCESSOR |
COMMERCIAL |
GULL WING |
176 |
HLFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.15 V |
24 |
40 |
1.1,3.3 |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH |
QFP176,1.0SQ,20 |
1.05 V |
70 Cel |
0 Cel |
Matte Tin (Sn) - annealed |
QUAD |
1.6 mm |
163840 |
24 mm |
YES |
16 |
25 MHz |
24 mm |
CMOS |
1.1 V |
Digital Signal Processors |
.5 mm |
FLOATING POINT |
S-PQFP-G176 |
3 |
Not Qualified |
400 rpm |
NO |
e3 |
||||||||||||||||||||||||||
|
Texas Instruments |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
491 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.248 V |
8 |
16 |
16 |
1.2,1.8,3.3 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA491,25X25,25 |
1.152 V |
105 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1.3 mm |
65536 |
17 mm |
YES |
16 |
26 MHz |
30 |
260 |
17 mm |
CMOS |
1400 mA |
1.2 V |
32 |
Microprocessors |
.65 mm |
FLOATING POINT |
S-PBGA-B491 |
3 |
Not Qualified |
600 rpm |
YES |
e1 |
|||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
360 |
BGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
YES |
1.1 V |
36 |
32 |
1.3,1.8/2.5 |
GRID ARRAY |
BGA360,19X19,50 |
1 V |
105 Cel |
-40 Cel |
TIN LEAD |
BOTTOM |
2.8 mm |
25 mm |
YES |
64 |
200 MHz |
40 |
260 |
25 mm |
CMOS |
1.05 V |
Microprocessors |
1.27 mm |
FLOATING POINT |
S-CBGA-B360 |
1 |
Not Qualified |
1267 rpm |
YES |
e0 |
||||||||||||||||||||||||||
|
STMicroelectronics |
MICROPROCESSOR, RISC |
BALL |
320 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.38 V |
8 |
26 |
32 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA320,21X21,20 |
1.21 V |
125 Cel |
-40 Cel |
BOTTOM |
1.2 mm |
172032 |
11 mm |
YES |
16 |
48 MHz |
11 mm |
CMOS |
239 mA |
1.25 V |
56 |
10 |
.5 mm |
FIXED POINT |
S-PBGA-B320 |
650 rpm |
YES |
|||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
425 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.05 V |
16 |
GRID ARRAY, FINE PITCH |
BGA425,23X23,32 |
.95 V |
105 Cel |
4 |
-40 Cel |
TIN SILVER |
BOTTOM |
1.9 mm |
19 mm |
YES |
32 |
40 |
260 |
19 mm |
CMOS |
1 V |
4 |
.8 mm |
FIXED POINT |
S-PBGA-B425 |
3 |
800 rpm |
NO |
e2 |
||||||||||||||||||||||||||||
|
STMicroelectronics |
MICROPROCESSOR, RISC |
BALL |
289 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.38 V |
8 |
26 |
32 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA289,17X17,20 |
1.32 V |
105 Cel |
-40 Cel |
BOTTOM |
1.2 mm |
172032 |
9 mm |
YES |
16 |
48 MHz |
9 mm |
CMOS |
268 mA |
1.35 V |
56 |
10 |
.5 mm |
FIXED POINT |
S-PBGA-B289 |
1000 rpm |
YES |
|||||||||||||||||||||||||||||
|
STMicroelectronics |
MICROPROCESSOR, RISC |
BALL |
320 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.38 V |
8 |
26 |
32 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA320,21X21,20 |
1.21 V |
125 Cel |
-40 Cel |
BOTTOM |
1.2 mm |
172032 |
11 mm |
YES |
16 |
48 MHz |
11 mm |
CMOS |
239 mA |
1.25 V |
56 |
10 |
.5 mm |
FIXED POINT |
S-PBGA-B320 |
650 rpm |
YES |
|||||||||||||||||||||||||||||
|
STMicroelectronics |
MICROPROCESSOR, RISC |
BALL |
289 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.38 V |
8 |
26 |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA289,17X17,32 |
1.32 V |
105 Cel |
-40 Cel |
BOTTOM |
1.7 mm |
172032 |
14 mm |
YES |
16 |
48 MHz |
14 mm |
CMOS |
268 mA |
1.35 V |
56 |
10 |
.8 mm |
FIXED POINT |
S-PBGA-B289 |
1000 rpm |
YES |
|||||||||||||||||||||||||||||
|
STMicroelectronics |
MICROPROCESSOR, RISC |
BALL |
289 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.38 V |
8 |
26 |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA289,17X17,32 |
1.21 V |
125 Cel |
-40 Cel |
BOTTOM |
1.7 mm |
172032 |
14 mm |
YES |
16 |
48 MHz |
14 mm |
CMOS |
239 mA |
1.25 V |
56 |
10 |
.8 mm |
FIXED POINT |
S-PBGA-B289 |
650 rpm |
YES |
|||||||||||||||||||||||||||||
|
STMicroelectronics |
MICROPROCESSOR, RISC |
BALL |
320 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.38 V |
8 |
26 |
32 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA320,21X21,20 |
1.32 V |
105 Cel |
-40 Cel |
BOTTOM |
1.2 mm |
172032 |
11 mm |
YES |
16 |
48 MHz |
11 mm |
CMOS |
268 mA |
1.35 V |
56 |
10 |
.5 mm |
FIXED POINT |
S-PBGA-B320 |
1000 rpm |
YES |
|||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
425 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.05 V |
16 |
GRID ARRAY, FINE PITCH |
BGA425,23X23,32 |
.95 V |
105 Cel |
4 |
-40 Cel |
BOTTOM |
1.9 mm |
19 mm |
YES |
32 |
19 mm |
CMOS |
1 V |
4 |
.8 mm |
FIXED POINT |
S-PBGA-B425 |
3 |
800 rpm |
NO |
e2 |
|||||||||||||||||||||||||||||||
|
STMicroelectronics |
MICROPROCESSOR, RISC |
BALL |
289 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.38 V |
8 |
26 |
32 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA289,17X17,20 |
1.21 V |
125 Cel |
-40 Cel |
BOTTOM |
1.2 mm |
172032 |
9 mm |
YES |
16 |
48 MHz |
9 mm |
CMOS |
239 mA |
1.25 V |
56 |
10 |
.5 mm |
FIXED POINT |
S-PBGA-B289 |
650 rpm |
YES |
|||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
TIN SILVER COPPER |
40 |
260 |
3 |
e1 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
425 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.05 V |
16 |
1 |
GRID ARRAY, FINE PITCH |
BGA425,23X23,32 |
.95 V |
105 Cel |
4 |
-40 Cel |
TIN SILVER |
BOTTOM |
1.9 mm |
19 mm |
YES |
32 |
40 |
260 |
19 mm |
CMOS |
1 V |
4 |
Microprocessors |
.8 mm |
FIXED POINT |
S-PBGA-B425 |
3 |
Not Qualified |
800 rpm |
NO |
e2 |
|||||||||||||||||||||||||
|
STMicroelectronics |
MICROPROCESSOR, RISC |
BALL |
289 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.38 V |
8 |
26 |
32 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA289,17X17,20 |
1.32 V |
105 Cel |
-40 Cel |
BOTTOM |
1.2 mm |
172032 |
9 mm |
YES |
16 |
48 MHz |
9 mm |
CMOS |
268 mA |
1.35 V |
56 |
10 |
.5 mm |
FIXED POINT |
S-PBGA-B289 |
1000 rpm |
YES |
|||||||||||||||||||||||||||||
|
STMicroelectronics |
MICROPROCESSOR, RISC |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
MICROPROCESSOR, RISC |
BALL |
289 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.38 V |
8 |
26 |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA289,17X17,32 |
1.21 V |
125 Cel |
-40 Cel |
BOTTOM |
1.7 mm |
172032 |
14 mm |
YES |
16 |
48 MHz |
14 mm |
CMOS |
239 mA |
1.25 V |
56 |
10 |
.8 mm |
FIXED POINT |
S-PBGA-B289 |
650 rpm |
YES |
|||||||||||||||||||||||||||||
|
Texas Instruments |
MICROPROCESSOR, RISC |
OTHER |
BALL |
491 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.248 V |
8 |
16 |
16 |
1.2,1.8,3.3 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA491,25X25,25 |
1.152 V |
90 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1.3 mm |
65536 |
17 mm |
YES |
16 |
26 MHz |
30 |
260 |
17 mm |
CMOS |
1500 mA |
1.2 V |
32 |
Microprocessors |
.65 mm |
FLOATING POINT |
S-PBGA-B491 |
3 |
Not Qualified |
600 rpm |
YES |
e1 |
|||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
OTHER |
BALL |
196 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.3 V |
8 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA196.14X14,25 |
1.25 V |
85 Cel |
0 Cel |
BOTTOM |
1.43 mm |
1048576 |
10 mm |
YES |
40 |
260 |
10 mm |
CMOS |
100 mA |
.65 mm |
FLOATING POINT |
S-PBGA-B196 |
3 |
600 rpm |
YES |
||||||||||||||||||||||||||||||||
|
Microchip Technology |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
233 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
YES |
1.9 V |
8 |
6 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA233,17X17,32 |
1.7 V |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1.2 mm |
69632 |
14 mm |
1-Gbit DDR2--SDRAM AVAILABLE |
YES |
16 |
50 MHz |
30 |
260 |
14 mm |
CMOS |
1.8 V |
16 |
.8 mm |
FIXED POINT |
R-PBGA-B233 |
3 |
600 rpm |
YES |
e1 |
|||||||||||||||||||||||||
|
Analog Devices |
MICROPROCESSOR |
INDUSTRIAL |
GULL WING |
176 |
HLFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.15 V |
24 |
40 |
1.1,3.3 |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH |
QFP176,1.0SQ,20 |
1.05 V |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
1.6 mm |
163840 |
24 mm |
YES |
16 |
25 MHz |
24 mm |
CMOS |
1.1 V |
Digital Signal Processors |
.5 mm |
FLOATING POINT |
S-PQFP-G176 |
3 |
Not Qualified |
400 rpm |
NO |
e3 |
||||||||||||||||||||||||||
|
Microchip Technology |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
217 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.32 V |
8 |
26 |
32 |
1.2,1.8,3.3 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA217,17X17,32 |
1.08 V |
85 Cel |
3 |
-40 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
1.4 mm |
163840 |
15 mm |
YES |
32 |
20 MHz |
15 mm |
CMOS |
1.2 V |
19 |
7 |
Microcontrollers |
.8 mm |
FIXED POINT |
S-PBGA-B217 |
3 |
Not Qualified |
190 rpm |
YES |
e1 |
||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
OTHER |
BALL |
196 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.3 V |
8 |
0 |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA196,14X14,32 |
1.25 V |
85 Cel |
0 |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1.52 mm |
1048576 |
12 mm |
YES |
0 |
24 MHz |
40 |
260 |
12 mm |
CMOS |
110 mA |
32 |
10 |
.8 mm |
FLOATING-POINT |
S-PBGA-B196 |
3 |
600 rpm |
YES |
e1 |
|||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
473 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.05 V |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA473,23X23,32 |
.95 V |
105 Cel |
4 |
-40 Cel |
TIN SILVER |
BOTTOM |
1.54 mm |
19 mm |
YES |
40 |
260 |
19 mm |
CMOS |
1 V |
.8 mm |
FLOATING POINT |
S-PBGA-B473 |
3 |
Not Qualified |
400 rpm |
YES |
e2 |
|||||||||||||||||||||||||||||
|
Octavo Systems |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
400 |
BGA |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
8 |
28 |
GRID ARRAY |
BGA400,20X20,50 |
85 Cel |
1 |
-40 Cel |
BOTTOM |
2.6 mm |
65536 |
27 mm |
64kbytes shared l3 ram also available |
YES |
16 |
245 |
27 mm |
CMOS |
2000 mA |
1.1 V |
1.27 mm |
FIXED POINT |
S-PBGA-B400 |
4 |
1000 rpm |
NO |
A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.
Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.
Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.
One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.