SQUARE Multi-functional Peripherals 1,100

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	Screening Level	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	CPU Family	Minimum Operating Temperature	Terminal Finish	Ultraviolet Erasable	Terminal Position	Maximum Seated Height	ROM Words	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	ROM Bits Size	RAM Bytes	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of Serial I/Os	Sub-Category	ROM Programmability	Bus Compatibility	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code	No. of I/O Lines
LS1026ASN8P1A	NXP Semiconductors			BALL	780	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.03 V		14			GRID ARRAY, FINE PITCH		.97 V				TIN SILVER COPPER		BOTTOM	2.61 mm			23 mm		YES	64	1400 MHz	30	250	23 mm			CMOS		1 V				I2C, PCI, SPI, UART, USB	.8 mm		S-PBGA-B780	3				e1	76
LS1046AXE8P1A	NXP Semiconductors			BALL	780	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.03 V		14			GRID ARRAY, FINE PITCH		.97 V				TIN SILVER COPPER		BOTTOM	2.61 mm			23 mm		YES	64		30	250	23 mm			CMOS		1 V				I2C, PCI, SPI, UART, USB	.8 mm		S-PBGA-B780	3				e1	76
MIMX8UX6AVLFZAC	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	AUTOMOTIVE	BALL	609	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.15 V					GRID ARRAY, FINE PITCH	BGA609,35X35,32	1.05 V	125 Cel		-40 Cel	TIN SILVER		BOTTOM	2.52 mm		512K	21 mm		YES		24 MHz	40	260	21 mm			CMOS	5000 mA	1.1 V				CAN(3), SAI(4), SPI(4), UART(6)	.8 mm		S-PBGA-B609	3				e2	99
CY8C4248AZI-L475	Infineon Technologies	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	NO LEAD	64	LFQFP	SQUARE	PLASTIC/EPOXY		YES	5.5 V					FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.8 V	85 Cel		-40 Cel	PURE TIN		QUAD	1.6 mm		16384	10 mm		NO		48 MHz			10 mm			CMOS	14.5 mA					I2C; IRDA; LIN; SPI; UART; USB	.5 mm		S-PQFP-G64	3					53
LS1046AXE8MQA	NXP Semiconductors			BALL	780	FBGA	SQUARE	PLASTIC/EPOXY		YES	.93 V		14			GRID ARRAY, FINE PITCH		.87 V				Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM	2.61 mm			23 mm		YES	64		30	250	23 mm			CMOS		.9 V				I2C, PCI, SPI, UART, USB	.8 mm		S-PBGA-B780	3				e1	76
CY8C5468LTI-LP026	Infineon Technologies		INDUSTRIAL	NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED		YES	5.5 V				2/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	BGA99,9X11,20	1.71 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	N	QUAD	1 mm		32768	8 mm		YES		33 MHz	30	260	8 mm	2097152 Bits		CMOS		1.8 V		Other uPs/uCs/Peripheral ICs		I2C; USB; PS/2	.4 mm		S-XQCC-N68	3	Not Qualified			e4	48
CY8C4246AZI-M445	Infineon Technologies	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY		YES	5.5 V					FLATPACK, LOW PROFILE, FINE PITCH	QFP64(UNSPEC)	1.71 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD	1.6 mm		4096	10 mm		NO		48 MHz			10 mm			CMOS	13.8 mA		11			I2C; SPI; UART; IRDA; IDE; LIN	.5 mm		S-PQFP-G64	3				e4	51
CY8C5688AXI-LP099	Infineon Technologies		INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY		YES	5.5 V				1.8/5	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.71 V	85 Cel		-40 Cel	PURE TIN	N	QUAD	1.6 mm		32768	14 mm		YES		33 MHz			14 mm	2097152 Bits		CMOS		1.8 V		Other uPs/uCs/Peripheral ICs		I2C; USB	.5 mm		S-PQFP-G100	3	Not Qualified				62
CY8C4125LTI-M445	Infineon Technologies	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	NO LEAD	68	HQCCN	SQUARE	UNSPECIFIED		YES	5.5 V					CHIP CARRIER, HEAT SINK/SLUG	LCC68,.32SQ,16	1.8 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD	1 mm		2048	8 mm		NO		48 MHz			8 mm			CMOS	7.2 mA		7			I2C; IRDA; LIN; SPI; UART	.4 mm		S-XQCC-N68	3				e4	55
LS1017AXE7PQA	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	BALL	448	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.03 V		14			GRID ARRAY, FINE PITCH	BGA448,30X30,30	.97 V	105 Cel		-40 Cel			BOTTOM	2.61 mm		262144	17 mm		YES	32		40	260	17 mm			CMOS		1 V	8			I2C, SAI, SPI, UART	.75 mm		S-PBGA-B448	3					68
OMAP3530ECBBALPD	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	515	VFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.4175 V		26			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		1.2825 V	105 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM	.9 mm		64K	12 mm		YES	16	38.4 MHz	NOT SPECIFIED	260	12 mm			CMOS		1.35 V				CAN; I2C; IRDA; PCI; SPI; UART; USB	.5 mm	FIXED POINT	S-PBGA-B515	3		720 rpm	YES	e1	188
CY8C4013LQI-411T	Infineon Technologies		INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED		YES	5.5 V		0			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.71 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD	.6 mm		1024	3 mm		NO	0	16 MHz			3 mm			CMOS		3.3 V				I2C	.5 mm		S-XQCC-N16	3				e4	12
CY8C4125AXI-473	Infineon Technologies	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	GULL WING	44	LQFP	SQUARE	PLASTIC/EPOXY		YES	5.5 V					FLATPACK, LOW PROFILE	QFP44,.47SQ,32	1.71 V	85 Cel		-40 Cel	MATTE TIN		QUAD	1.6 mm		2048	10 mm		NO	0	24 MHz	20	260	10 mm			CMOS	7.2 mA	1.8 V	0			I2C, I2S, SPI, UART	.8 mm		S-PQFP-G44	3	Not Qualified			e3	36
LS1027AXE7PQA	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	BALL	448	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.03 V		14			GRID ARRAY, FINE PITCH	BGA448,30X30,30	.97 V	105 Cel		-40 Cel			BOTTOM	2.61 mm		262144	17 mm		YES	32		40	260	17 mm			CMOS		1 V	8			I2C, SAI, SPI, UART	.75 mm		S-PBGA-B448	3					68
LS1027AXN7PQA	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	BALL	448	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.03 V		14			GRID ARRAY, FINE PITCH	BGA448,30X30,30	.97 V	105 Cel		-40 Cel			BOTTOM	2.61 mm		262144	17 mm		YES	32		40	260	17 mm			CMOS		1 V	8			I2C, SAI, SPI, UART	.75 mm		S-PBGA-B448	3					68
MIMX8UX5AVLFZAC	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	AUTOMOTIVE	BALL	609	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.15 V					GRID ARRAY, FINE PITCH	BGA609,35X35,32	1.05 V	125 Cel		-40 Cel	TIN SILVER		BOTTOM	2.52 mm		512K	21 mm		YES		24 MHz	40	260	21 mm			CMOS	5000 mA	1.1 V				CAN(3), SAI(4), SPI(4), UART(6)	.8 mm		S-PBGA-B609	3				e2	99
CY8C20436A-24LQXIT	Infineon Technologies		INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED		YES	5.5 V		0	8	1.8/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	1.71 V	85 Cel	M8C	-40 Cel	NICKEL PALLADIUM GOLD		QUAD	.6 mm	8192	512	5 mm		NO	0	25.2 MHz	40	260	5 mm		1024	CMOS	4 mA	3 V		Microcontrollers	FLASH	USB	.5 mm		S-XQCC-N32	3	Not Qualified	25.2 rpm		e4	28
CY8C4247AZI-L423	Infineon Technologies	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY		YES	5.5 V					FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	1.8 V	85 Cel		-40 Cel	PURE TIN		QUAD	1.6 mm		8192	7 mm		NO		48 MHz			7 mm			CMOS	14.5 mA					I2C; IRDA; LIN; SPI; UART; USB	.5 mm		S-PQFP-G48	3					38
A82380-20	Rochester Electronics			PIN/PEG	132	PGA	SQUARE	CERAMIC, METAL-SEALED COFIRED		NO						GRID ARRAY								PERPENDICULAR				36.802 mm		NO		20 MHz	NOT SPECIFIED	NOT SPECIFIED	36.802 mm			CHMOS						80386	2.54 mm		S-CPGA-P132						0
DW82801HBMSLJ4Y	Intel			BALL	676	BGA	SQUARE	PLASTIC/EPOXY		YES			32		1.05,1.5,3.3,5	GRID ARRAY	BGA676,29X29,40							BOTTOM	2.49 mm			31 mm	PITCH_MINI	NO	32	48 MHz			31 mm			CMOS		1.05 V		Other uPs/uCs/Peripheral ICs		USB; PCI; I2C	1 mm		S-PBGA-B676		Not Qualified
NH82801HBMSLB9A	Intel			BALL	676	BGA	SQUARE	PLASTIC/EPOXY		YES			32		1.05,1.5,3.3,5	GRID ARRAY	BGA676,29X29,40							BOTTOM	2.49 mm			31 mm	PITCH_MINI	NO	32	48 MHz			31 mm			CMOS		1.05 V		Other uPs/uCs/Peripheral ICs		USB; PCI; I2C	1 mm		S-PBGA-B676		Not Qualified
66AK2H06DAAWA24	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY		YES	1.05 V		32			GRID ARRAY		.95 V	100 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	3.62 mm		6M	40 mm		YES	128		30	245	40 mm			CMOS		1 V				ETHERNET; I2C; PCI; SPI; UART; USB	1 mm		S-PBGA-B1517	4				e1	32
CY8C4014LQI-412	Infineon Technologies	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	NO LEAD	24	HQCCN	SQUARE	UNSPECIFIED		YES	5.5 V					CHIP CARRIER, HEAT SINK/SLUG	LCC24,.16SQ,20	1.8 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD SILVER		QUAD	.55 mm		1024	4 mm		NO		16 MHz	30	260	4 mm			CMOS	4.5 mA	3.3 V				I2C	.5 mm		S-XQCC-N24	3				e4	20
CY8C5868AXI-LP031	Infineon Technologies		INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY		YES	5.5 V				2/5	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.71 V	85 Cel		-40 Cel	MATTE TIN	N	QUAD	1.6 mm		32768	14 mm		YES		33 MHz	30	260	14 mm	2097152 Bits		CMOS		1.8 V		Other uPs/uCs/Peripheral ICs		I2C; USB; PS/2	.5 mm		S-PQFP-G100	3	Not Qualified			e3	70
LH75401N0Q100C0,55	NXP Semiconductors	MULTIFUNCTION PERIPHERAL		GULL WING	144	LFQFP	SQUARE	PLASTIC/EPOXY		YES	1.98 V		24			FLATPACK, LOW PROFILE, FINE PITCH	QFP144,.87SQ,20	1.7 V	85 Cel		-40 Cel	Tin (Sn)		QUAD	1.6 mm		32768	20 mm	ALSO REQUIRES 3.3 V SUPPLY	YES	16	20 MHz	40	250	20 mm			CMOS	70 mA	1.8 V	5			CAN, SSP, UART(3)	.5 mm		S-PQFP-G144	3	Not Qualified			e3	76
LS1026ASN8MQA	NXP Semiconductors			BALL	780	FBGA	SQUARE	PLASTIC/EPOXY		YES	.93 V		14			GRID ARRAY, FINE PITCH		.87 V				TIN SILVER COPPER		BOTTOM	2.61 mm			23 mm		YES	64		30	250	23 mm			CMOS		.9 V				I2C, PCI, SPI, UART, USB	.8 mm		S-PBGA-B780	3				e1	76
LS1046ASN8MQA	NXP Semiconductors			BALL	780	FBGA	SQUARE	PLASTIC/EPOXY		YES	.93 V		14			GRID ARRAY, FINE PITCH		.87 V				TIN SILVER COPPER		BOTTOM	2.61 mm			23 mm		YES	64		30	250	23 mm			CMOS		.9 V				I2C, PCI, SPI, UART, USB	.8 mm		S-PBGA-B780	3				e1	76
LS1046ASN8Q1A	NXP Semiconductors			BALL	780	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.03 V		14			GRID ARRAY, FINE PITCH		.97 V				TIN SILVER COPPER		BOTTOM	2.61 mm			23 mm		YES	64		30	250	23 mm			CMOS		1 V				I2C, PCI, SPI, UART, USB	.8 mm		S-PBGA-B780	3				e1	76
CY8C3865AXI-019	Infineon Technologies		INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY		YES	5.5 V		0		2/5	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.71 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	N	QUAD	1.6 mm		2048	14 mm		YES	0	67 MHz	40	260	14 mm	32768 Bits		CMOS		3.3 V		Other uPs/uCs/Peripheral ICs			.5 mm		S-PQFP-G100	3	Not Qualified			e4	72
CY8C4124LQI-443T	Infineon Technologies		INDUSTRIAL	NO LEAD	56	HQCCN	SQUARE	UNSPECIFIED		YES	5.5 V		0			CHIP CARRIER, HEAT SINK/SLUG		1.71 V	105 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD	1.6 mm		2048	10 mm		NO	0	24 MHz			10 mm			CMOS		1.8 V				I2C; SPI; UART	.8 mm		S-XQCC-N56	3				e4	34
CY8C4248LTI-L475	Infineon Technologies	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED		YES	5.5 V					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC68,.32SQ,16	1.8 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD	1 mm		16384	8 mm		NO		48 MHz			8 mm			CMOS	14.5 mA					I2C; IRDA; LIN; SPI; UART; USB	.4 mm		S-XQCC-N68	3				e4	57
LS1026AXN8T1A	NXP Semiconductors			BALL	780	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.03 V		14			GRID ARRAY, FINE PITCH		.97 V				TIN SILVER COPPER		BOTTOM	2.61 mm			23 mm		YES	64		30	250	23 mm			CMOS		1 V				I2C, PCI, SPI, UART, USB	.8 mm		S-PBGA-B780	3				e1	76
CY8C20236A-24LKXIT	Infineon Technologies		INDUSTRIAL	NO LEAD	16	VQCCN	SQUARE	UNSPECIFIED		YES	5.5 V		0	8	1.8/5	CHIP CARRIER, VERY THIN PROFILE	LCC16,.12SQ,20	1.71 V	85 Cel	M8C	-40 Cel	NICKEL PALLADIUM GOLD		QUAD	.6 mm	8192	512	3 mm		NO	0	25.2 MHz	30	260	3 mm		1024	CMOS	4 mA	3 V		Microcontrollers	FLASH	USB	.5 mm		S-XQCC-N16	3	Not Qualified	25.2 rpm		e4	13
CYONS2101-LBXC	Cypress Semiconductor		OTHER	NO LEAD	42	HQCCN	SQUARE	PLASTIC/EPOXY		YES	3.6 V					CHIP CARRIER, HEAT SINK/SLUG		2.7 V	45 Cel		5 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)		QUAD	2.46 mm		1024	8.3 mm	SEATED HT-CALCULATED	NO		25.2 MHz	20	260	8.3 mm			CMOS		3.3 V				I2C; USB	.5 mm		S-PQCC-N42	3	Not Qualified			e4	28
LS1026ASN8Q1A	NXP Semiconductors			BALL	780	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.03 V		14			GRID ARRAY, FINE PITCH		.97 V				TIN SILVER COPPER		BOTTOM	2.61 mm			23 mm		YES	64		30	250	23 mm			CMOS		1 V				I2C, PCI, SPI, UART, USB	.8 mm		S-PBGA-B780	3				e1	76
LS1046AXN8Q1A	NXP Semiconductors			BALL	780	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.03 V		14			GRID ARRAY, FINE PITCH		.97 V				TIN SILVER COPPER		BOTTOM	2.61 mm			23 mm		YES	64		30	250	23 mm			CMOS		1 V				I2C, PCI, SPI, UART, USB	.8 mm		S-PBGA-B780	3				e1	76
MCIMX233DAG4B	Freescale Semiconductor	MULTIFUNCTION PERIPHERAL	COMMERCIAL	GULL WING	128	LFQFP	SQUARE	PLASTIC/EPOXY	YES	YES	1.55 V		13			FLATPACK, LOW PROFILE, FINE PITCH		1 V	70 Cel		-10 Cel	Matte Tin (Sn)		QUAD	1.6 mm			14 mm	IT ALSO REQUIRES 1.62V-2.1V ANALOG SUPPLY	YES	16	24 MHz	40	260	14 mm			CMOS		1.35 V					.4 mm	FIXED POINT	S-PQFP-G128	3		454 rpm	YES	e3
TDA2EGBHQCBDRQ1	Texas Instruments		AUTOMOTIVE	BALL	538	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.2 V	AEC-Q100	16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.11 V	125 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	1.298 mm		512K	17 mm		YES	32	38.4 MHz	30	260	17 mm			CMOS		1.15 V				CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB	.65 mm		S-PBGA-B538	3				e1	186
CC1111F32RSPR	Texas Instruments		OTHER	NO LEAD	36	HVQCCN	SQUARE	PLASTIC/EPOXY		YES						CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			85 Cel	8051	0 Cel	NICKEL PALLADIUM GOLD		QUAD	.9 mm			6 mm					30	260	6 mm		4096	CMOS							.5 mm		S-PQCC-N36	3	Not Qualified			e4	21
CY7C60323-LTXC	Cypress Semiconductor		COMMERCIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED		YES	3.6 V		0	8	2.4/3.6	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	2.7 V	70 Cel	M8C	0 Cel	NICKEL PALLADIUM GOLD		QUAD	1 mm	8192	512	5 mm	IT ALSO OPERATES AT 2.4V AT 93KHZ	NO	0	12 MHz	40	260	5 mm		512	CMOS	2 mA	3 V		Microcontrollers	FLASH	I2C; USB	.5 mm		S-XQCC-N32	3	Not Qualified	24.6 rpm		e4	28
CY8C4013LQI-411	Infineon Technologies	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	NO LEAD	16	HQCCN	SQUARE	UNSPECIFIED		YES	5.5 V					CHIP CARRIER, HEAT SINK/SLUG	LCC16,.12SQ,20	1.8 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD	.6 mm		1024	3 mm		NO		16 MHz	30	260	3 mm			CMOS	4.5 mA	3.3 V				I2C	.5 mm		S-XQCC-N16	3				e4	12
CY8C4246AZI-M475	Infineon Technologies	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY		YES	5.5 V		0			FLATPACK, LOW PROFILE, FINE PITCH	QFP64(UNSPEC)	1.71 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD	1.6 mm		8K	10 mm		NO	0	48 MHz			10 mm			CMOS	13.8 mA	3.3 V	11			I2C; SPI; UART; IRDA; IDE; LIN	.5 mm		S-PQFP-G64	3				e4	51
CY8C4247LTI-L485	Infineon Technologies	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED		YES	5.5 V					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC68,.32SQ,16	1.8 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD	1 mm		8192	8 mm		NO		48 MHz			8 mm			CMOS	14.5 mA					I2C; IRDA; LIN; SPI; UART; USB	.4 mm		S-XQCC-N68	3				e4	57
CY8C5246AXI-054	Cypress Semiconductor		INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY		YES	5.5 V		0		1.8/5	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.71 V	85 Cel		-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	N	QUAD	1.6 mm		32768	14 mm		YES	0	40 MHz	40	260	14 mm	65536 Bits		CMOS		1.8 V		Other Microprocessor ICs			.5 mm		S-PQFP-G100	3	Not Qualified			e4	72
CY8C5466LTI-063	Cypress Semiconductor		INDUSTRIAL	NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED		YES	5.5 V				3/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC68,.32SQ,16	2.7 V	85 Cel		-40 Cel		N	QUAD	1 mm		8192	8 mm		NO		25 MHz	NOT SPECIFIED	NOT SPECIFIED	8 mm	524288 Bits		CMOS		5 V		Other Microprocessor ICs		I2C; USB	.4 mm		S-XQCC-N68		Not Qualified				46
CY8C5566LTI-017	Cypress Semiconductor		INDUSTRIAL	NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED		YES	5.5 V				3/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC68,.32SQ,16	2.7 V	85 Cel		-40 Cel		N	QUAD	1 mm		8192	8 mm		NO		25 MHz	NOT SPECIFIED	NOT SPECIFIED	8 mm	65536 Bits		CMOS		5 V		Other Microprocessor ICs		I2C; USB	.4 mm		S-XQCC-N68		Not Qualified				46
LS1026ASE8T1A	NXP Semiconductors			BALL	780	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.03 V		14			GRID ARRAY, FINE PITCH		.97 V				TIN SILVER COPPER		BOTTOM	2.61 mm			23 mm		YES	64		30	250	23 mm			CMOS		1 V				I2C, PCI, SPI, UART, USB	.8 mm		S-PBGA-B780	3				e1	76
LS1026AXN8MQA	NXP Semiconductors			BALL	780	FBGA	SQUARE	PLASTIC/EPOXY		YES	.93 V		14			GRID ARRAY, FINE PITCH		.87 V				Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM	2.61 mm			23 mm		YES	64		30	250	23 mm			CMOS		.9 V				I2C, PCI, SPI, UART, USB	.8 mm		S-PBGA-B780	3				e1	76

Multi-functional Peripherals

Multi-functional peripherals (MFPs) are devices that combine several different functions, such as printing, scanning, copying, and faxing, into a single piece of equipment. These devices are often used in office settings to streamline workflows and reduce the need for multiple pieces of equipment.

MFPs typically come with a range of features and capabilities, including high-quality printing and scanning, fast copying and faxing, and the ability to handle large volumes of documents. They may also offer additional features, such as double-sided printing, wireless connectivity, and cloud-based printing and scanning.

One of the key benefits of MFPs is their ability to save space and reduce clutter in an office environment. By combining several different functions into a single device, MFPs eliminate the need for separate printers, scanners, copiers, and fax machines, freeing up valuable space and reducing costs.

In addition to their space-saving benefits, MFPs also offer enhanced efficiency and productivity. With the ability to print, scan, copy, and fax all from a single device, users can complete tasks quickly and easily, without the need to switch between different pieces of equipment.