SQUARE Multi-functional Peripherals 1,100

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Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Ultraviolet Erasable Terminal Position DMA Channels Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length ROM Bits Size No. of Timers RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode JESD-609 Code Maximum Standby Current On Chip Program ROM Width No. of I/O Lines Maximum Access Time

TDA2PHGRCQACDQ1

Texas Instruments

AUTOMOTIVE

BALL

784

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.2 V

AEC-Q100

16

GRID ARRAY, LOW PROFILE, FINE PITCH

1.11 V

125 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.63 mm

2.5M

23 mm

YES

32

38.4 MHz

30

250

23 mm

CMOS

1.15 V

CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB

.8 mm

S-PBGA-B784

3

e1

247

TDA2PSXTQABZQ1

Texas Instruments

AUTOMOTIVE

BALL

760

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.2 V

AEC-Q100

16

GRID ARRAY, LOW PROFILE, FINE PITCH

1.11 V

125 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.63 mm

2.5M

23 mm

YES

32

38.4 MHz

30

250

23 mm

CMOS

1.15 V

CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB

.8 mm

S-PBGA-B760

3

e1

247

TDA2EGAHQABCQ1

Texas Instruments

AUTOMOTIVE

BALL

760

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.2 V

AEC-Q100

16

GRID ARRAY, FINE PITCH

1.11 V

125 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

2.96 mm

512K

23 mm

YES

32

38.4 MHz

30

250

23 mm

CMOS

1.15 V

CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB

.8 mm

S-PBGA-B760

3

e1

215

TDA2PHVDQACDRQ1

Texas Instruments

AUTOMOTIVE

BALL

784

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.2 V

AEC-Q100

16

GRID ARRAY, LOW PROFILE, FINE PITCH

1.11 V

125 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.63 mm

2.5M

23 mm

YES

32

38.4 MHz

30

250

23 mm

CMOS

1.15 V

CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB

.8 mm

S-PBGA-B784

3

e1

247

TDA3MASBABFRQ1

Texas Instruments

MULTIFUNCTION PERIPHERAL

AUTOMOTIVE

BALL

367

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.11 V

AEC-Q100

16

GRID ARRAY, FINE PITCH

BGA367,22X22,25

1.02 V

125 Cel

-40 Cel

BOTTOM

2.82 mm

524288

15 mm

YES

32

38.4 MHz

15 mm

CMOS

1.06 V

13

CAN(2), I2C(2), QSPI, SPI(4), UART(3)

.65 mm

S-PBGA-B367

126

CC1111F16RSPR

Texas Instruments

OTHER

NO LEAD

36

HVQCCN

SQUARE

UNSPECIFIED

YES

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

NICKEL PALLADIUM GOLD

QUAD

.9 mm

6 mm

30

260

6 mm

CMOS

.5 mm

S-XQCC-N36

3

Not Qualified

e4

DRA725AGGABCRQ1

Texas Instruments

MICROPROCESSOR, RISC

AUTOMOTIVE

BALL

760

FBGA

SQUARE

PLASTIC/EPOXY

NO

YES

1.2 V

8

AEC-Q100

16

GRID ARRAY, FINE PITCH

1.11 V

125 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

2.96 mm

512K

23 mm

YES

32

38.4 MHz

30

250

23 mm

CMOS

1.15 V

CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB

.8 mm

FIXED POINT

S-PBGA-B760

3

1176 rpm

YES

e1

215

DRA716BGGCBDRQ1

Texas Instruments

AUTOMOTIVE

BALL

538

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.2 V

AEC-Q100

16

GRID ARRAY, LOW PROFILE, FINE PITCH

1.11 V

125 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.298 mm

512K

17 mm

YES

32

38.4 MHz

30

260

17 mm

CMOS

1.15 V

CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB

.65 mm

S-PBGA-B538

3

800 rpm

e1

186

DRA710BEGCBDQ1

Texas Instruments

AUTOMOTIVE

BALL

538

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.2 V

AEC-Q100

16

GRID ARRAY, LOW PROFILE, FINE PITCH

1.11 V

125 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.298 mm

512K

17 mm

YES

32

32 MHz

30

260

17 mm

CMOS

1.15 V

CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB

.65 mm

S-PBGA-B538

3

600 rpm

e1

186

TDA2PSXTQABZRQ1

Texas Instruments

AUTOMOTIVE

BALL

760

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.2 V

AEC-Q100

16

GRID ARRAY, LOW PROFILE, FINE PITCH

1.11 V

125 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.63 mm

2.5M

23 mm

YES

32

38.4 MHz

30

250

23 mm

CMOS

1.15 V

CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB

.8 mm

S-PBGA-B760

3

e1

247

DRA773PSGACDQ1

Texas Instruments

AUTOMOTIVE

BALL

784

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.2 V

AEC-Q100

32

GRID ARRAY, LOW PROFILE, FINE PITCH

1.11 V

125 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.63 mm

2.5M

23 mm

YES

64

38.4 MHz

30

250

23 mm

CMOS

1.15 V

CAN; ETHERNET; I2C; SPI; UART; USB

.8 mm

S-PBGA-B784

3

1800 rpm

e1

247

CC1111F16RSP

Texas Instruments

OTHER

NO LEAD

36

HVQCCN

SQUARE

UNSPECIFIED

YES

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

NICKEL PALLADIUM GOLD

QUAD

.9 mm

6 mm

30

260

6 mm

CMOS

.5 mm

S-XQCC-N36

3

Not Qualified

e4

X66AK2G12ABY60

Texas Instruments

MULTIFUNCTION PERIPHERAL

COMMERCIAL

BALL

625

LFBGA

SQUARE

PLASTIC/EPOXY

YES

.945 V

16

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA625,25X25,32

.855 V

70 Cel

0 Cel

BOTTOM

1.56 mm

1M

21 mm

YES

32

21 mm

CMOS

.9 V

CAN; ETHERNET; I2C; PCI; SPI; UART; USB

.8 mm

S-PBGA-B625

212

TDA2PHVRQACDRQ1

Texas Instruments

AUTOMOTIVE

BALL

784

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.2 V

AEC-Q100

16

GRID ARRAY, LOW PROFILE, FINE PITCH

1.11 V

125 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.63 mm

2.5M

23 mm

YES

32

38.4 MHz

30

250

23 mm

CMOS

1.15 V

CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB

.8 mm

S-PBGA-B784

3

e1

247

DRA726APGABCQ1

Texas Instruments

MICROPROCESSOR, RISC

AUTOMOTIVE

BALL

760

FBGA

SQUARE

PLASTIC/EPOXY

NO

YES

1.2 V

AEC-Q100

16

GRID ARRAY, FINE PITCH

1.11 V

125 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

2.96 mm

512K

23 mm

YES

32

27 MHz

30

250

23 mm

CMOS

1.15 V

CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB

.8 mm

FIXED POINT

S-PBGA-B760

3

1500 rpm

YES

e1

215

DRA722AHGABCQ1

Texas Instruments

MICROPROCESSOR, RISC

AUTOMOTIVE

BALL

760

FBGA

SQUARE

PLASTIC/EPOXY

NO

YES

1.2 V

AEC-Q100

16

GRID ARRAY, FINE PITCH

1.11 V

125 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

2.96 mm

512K

23 mm

YES

32

27 MHz

30

250

23 mm

CMOS

1.15 V

CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB

.8 mm

FIXED POINT

S-PBGA-B760

3

800 rpm

YES

e1

215

TDA2EGADQABCRQ1

Texas Instruments

AUTOMOTIVE

BALL

760

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.2 V

AEC-Q100

16

GRID ARRAY, FINE PITCH

1.11 V

125 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

2.96 mm

512K

23 mm

YES

32

38.4 MHz

30

250

23 mm

CMOS

1.15 V

CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB

.8 mm

S-PBGA-B760

3

e1

215

TDA2PHVRQACDQ1

Texas Instruments

AUTOMOTIVE

BALL

784

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.2 V

AEC-Q100

16

GRID ARRAY, LOW PROFILE, FINE PITCH

1.11 V

125 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.63 mm

2.5M

23 mm

YES

32

38.4 MHz

30

250

23 mm

CMOS

1.15 V

CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB

.8 mm

S-PBGA-B784

3

e1

247

DRA714BEGCBDRQ1

Texas Instruments

AUTOMOTIVE

BALL

538

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.2 V

AEC-Q100

16

GRID ARRAY, LOW PROFILE, FINE PITCH

1.11 V

125 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.298 mm

512K

17 mm

YES

32

38.4 MHz

30

260

17 mm

CMOS

1.15 V

CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB

.65 mm

S-PBGA-B538

3

600 rpm

e1

186

DRA718BIGCBDQ1

Texas Instruments

AUTOMOTIVE

BALL

538

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.2 V

AEC-Q100

16

GRID ARRAY, LOW PROFILE, FINE PITCH

1.11 V

125 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.298 mm

512K

17 mm

YES

32

38.4 MHz

30

260

17 mm

CMOS

1.15 V

CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB

.65 mm

S-PBGA-B538

3

1000 rpm

e1

186

TDA2PHVDQACDQ1

Texas Instruments

AUTOMOTIVE

BALL

784

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.2 V

AEC-Q100

16

GRID ARRAY, LOW PROFILE, FINE PITCH

1.11 V

125 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.63 mm

2.5M

23 mm

YES

32

38.4 MHz

30

250

23 mm

CMOS

1.15 V

CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB

.8 mm

S-PBGA-B784

3

e1

247

DRA718BJGCBDRQ1

Texas Instruments

AUTOMOTIVE

BALL

538

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.2 V

AEC-Q100

16

GRID ARRAY, LOW PROFILE, FINE PITCH

1.11 V

125 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.298 mm

512K

17 mm

YES

32

38.4 MHz

30

260

17 mm

CMOS

1.15 V

CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB

.65 mm

S-PBGA-B538

3

1000 rpm

e1

186

TDA2EGBDQCBDQ1

Texas Instruments

AUTOMOTIVE

BALL

538

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.2 V

AEC-Q100

16

GRID ARRAY, LOW PROFILE, FINE PITCH

1.11 V

125 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.298 mm

512K

17 mm

YES

32

38.4 MHz

30

260

17 mm

CMOS

1.15 V

CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB

.65 mm

S-PBGA-B538

3

e1

186

DRA773PSGACDRQ1

Texas Instruments

AUTOMOTIVE

BALL

784

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.2 V

AEC-Q100

32

GRID ARRAY, LOW PROFILE, FINE PITCH

1.11 V

125 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.63 mm

2.5M

23 mm

YES

64

38.4 MHz

30

250

23 mm

CMOS

1.15 V

CAN; ETHERNET; I2C; SPI; UART; USB

.8 mm

S-PBGA-B784

3

1800 rpm

e1

247

66AK2H06DAAWA2

Texas Instruments

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

1517

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

32

GRID ARRAY

.95 V

100 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

3.62 mm

6M

40 mm

YES

128

30

245

40 mm

CMOS

1 V

ETHERNET; I2C; PCI; SPI; UART; USB

1 mm

S-PBGA-B1517

4

e1

32

TDA2PHFUQACDQ1

Texas Instruments

AUTOMOTIVE

BALL

784

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.2 V

AEC-Q100

16

GRID ARRAY, LOW PROFILE, FINE PITCH

1.11 V

125 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.63 mm

2.5M

23 mm

YES

32

38.4 MHz

30

250

23 mm

CMOS

1.15 V

CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB

.8 mm

S-PBGA-B784

3

e1

247

DRA756PPIGABZQ1

Texas Instruments

AUTOMOTIVE

BALL

760

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.2 V

AEC-Q100

16

GRID ARRAY, LOW PROFILE, FINE PITCH

1.11 V

125 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.63 mm

2.5M

23 mm

YES

32

32 MHz

30

250

23 mm

CMOS

1.15 V

CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB

.8 mm

S-PBGA-B760

3

1500 rpm

e1

247

TDA2LFBTQABCRQ1

Texas Instruments

MICROPROCESSOR, RISC

AUTOMOTIVE

BALL

760

FBGA

SQUARE

PLASTIC/EPOXY

NO

YES

1.2 V

AEC-Q100

16

32

GRID ARRAY, FINE PITCH

1.11 V

125 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

2.96 mm

2.5M

23 mm

YES

32

38.4 MHz

30

250

23 mm

CMOS

1.15 V

CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB

.8 mm

FLOATING POINT

S-PBGA-B760

3

1176 rpm

YES

e1

247

AVCE6467TZUTL1

Texas Instruments

OTHER

BALL

529

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.365 V

0

32

1.3,1.8/3.3

GRID ARRAY, FINE PITCH

BGA529,23X23,32

1.235 V

85 Cel

0 Cel

BOTTOM

3.3 mm

128

19 mm

YES

0

35 MHz

30

245

19 mm

CMOS

1.3 V

Digital Signal Processors

I2C; USB

.8 mm

FIXED POINT

S-PBGA-B529

4

Not Qualified

33

DRA767PSIGACDRQ1

Texas Instruments

AUTOMOTIVE

BALL

784

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.2 V

AEC-Q100

32

GRID ARRAY, LOW PROFILE, FINE PITCH

1.11 V

125 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.63 mm

2.5M

23 mm

YES

64

38.4 MHz

30

250

23 mm

CMOS

1.15 V

CAN; ETHERNET; I2C; SPI; UART; USB

.8 mm

S-PBGA-B784

3

1800 rpm

e1

247

TFB2002BIPPM

Texas Instruments

OTHER

GULL WING

208

FQFP

SQUARE

PLASTIC/EPOXY

YES

5.25 V

36

FLATPACK, FINE PITCH

4.75 V

85 Cel

-20 Cel

QUAD

4.1 mm

28 mm

YES

64

25 MHz

28 mm

CMOS

5 V

680X0; 88XXX; 80X86; SPARC; R4000; AXP

.5 mm

S-PQFP-G208

Not Qualified

0

TDA2HVBRQABCQ1

Texas Instruments

MICROPROCESSOR, RISC

AUTOMOTIVE

BALL

760

FBGA

SQUARE

PLASTIC/EPOXY

NO

YES

1.2 V

AEC-Q100

16

32

GRID ARRAY, FINE PITCH

1.11 V

125 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

2.96 mm

2.5M

23 mm

YES

32

38.4 MHz

30

250

23 mm

CMOS

1.15 V

CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB

.8 mm

FLOATING POINT

S-PBGA-B760

3

750 rpm

YES

e1

247

XDRA746PPIGABZ

Texas Instruments

AUTOMOTIVE

BALL

760

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.2 V

AEC-Q100

32

GRID ARRAY, LOW PROFILE, FINE PITCH

1.11 V

125 Cel

-40 Cel

BOTTOM

1.63 mm

2.5M

23 mm

YES

64

38.4 MHz

23 mm

CMOS

1.15 V

CAN; ETHERNET; I2C; SPI; UART; USB

.8 mm

S-PBGA-B760

247

DRA797BHGCBDRQ1

Texas Instruments

AUTOMOTIVE

BALL

538

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.2 V

AEC-Q100

16

GRID ARRAY, LOW PROFILE, FINE PITCH

1.11 V

125 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.298 mm

512K

17 mm

YES

32

38.4 MHz

30

260

17 mm

CMOS

1.15 V

CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB

.65 mm

S-PBGA-B538

3

800 rpm

e1

186

DRA712BEGCBDRQ1

Texas Instruments

AUTOMOTIVE

BALL

538

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.2 V

AEC-Q100

16

GRID ARRAY, LOW PROFILE, FINE PITCH

1.11 V

125 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.298 mm

512K

17 mm

YES

32

32 MHz

30

260

17 mm

CMOS

1.15 V

CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB

.65 mm

S-PBGA-B538

3

600 rpm

e1

186

DRA767PSIGACDQ1

Texas Instruments

AUTOMOTIVE

BALL

784

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.2 V

AEC-Q100

32

GRID ARRAY, LOW PROFILE, FINE PITCH

1.11 V

125 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.63 mm

2.5M

23 mm

YES

64

38.4 MHz

30

250

23 mm

CMOS

1.15 V

CAN; ETHERNET; I2C; SPI; UART; USB

.8 mm

S-PBGA-B784

3

1800 rpm

e1

247

DRA725LGABCRQ1

Texas Instruments

MICROPROCESSOR, RISC

AUTOMOTIVE

BALL

760

FBGA

SQUARE

PLASTIC/EPOXY

NO

YES

1.2 V

8

AEC-Q100

16

GRID ARRAY, FINE PITCH

1.11 V

125 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

2.96 mm

512K

23 mm

YES

32

38.4 MHz

30

250

23 mm

CMOS

1.15 V

CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB

.8 mm

FIXED POINT

S-PBGA-B760

3

1176 rpm

YES

e1

215

TDA2LFBFQABCRQ1

Texas Instruments

MICROPROCESSOR, RISC

AUTOMOTIVE

BALL

760

FBGA

SQUARE

PLASTIC/EPOXY

NO

YES

1.2 V

AEC-Q100

16

32

GRID ARRAY, FINE PITCH

1.11 V

125 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

2.96 mm

2.5M

23 mm

YES

32

38.4 MHz

30

250

23 mm

CMOS

1.15 V

CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB

.8 mm

FLOATING POINT

S-PBGA-B760

3

650 rpm

YES

e1

247

DRA726APGABCRQ1

Texas Instruments

MICROPROCESSOR, RISC

AUTOMOTIVE

BALL

760

FBGA

SQUARE

PLASTIC/EPOXY

NO

YES

1.2 V

AEC-Q100

16

GRID ARRAY, FINE PITCH

1.11 V

125 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

2.96 mm

512K

23 mm

YES

32

27 MHz

30

250

23 mm

CMOS

1.15 V

CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB

.8 mm

FIXED POINT

S-PBGA-B760

3

1500 rpm

YES

e1

215

TDA2EGADQABCQ1

Texas Instruments

AUTOMOTIVE

BALL

760

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.2 V

AEC-Q100

16

GRID ARRAY, FINE PITCH

1.11 V

125 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

2.96 mm

512K

23 mm

YES

32

38.4 MHz

30

250

23 mm

CMOS

1.15 V

CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB

.8 mm

S-PBGA-B760

3

e1

215

DRA746PPIGABZQ1

Texas Instruments

AUTOMOTIVE

BALL

760

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.2 V

AEC-Q100

16

GRID ARRAY, LOW PROFILE, FINE PITCH

1.11 V

125 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.63 mm

512K

23 mm

YES

32

32 MHz

30

250

23 mm

CMOS

1.15 V

CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB

.8 mm

S-PBGA-B760

3

1500 rpm

e1

247

TFB2002BMHFHB

Texas Instruments

MILITARY

FLAT

256

QFF

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

5.25 V

36

FLATPACK

4.75 V

125 Cel

-55 Cel

QUAD

3.21 mm

36 mm

YES

64

25 MHz

36 mm

CMOS

5 V

680X0; 88XXX; 80X86; SPARC; R4000; AXP

.5 mm

S-CQFP-F256

Not Qualified

0

66AK2H14DAAW24

Texas Instruments

MICROPROCESSOR, RISC

OTHER

BALL

1517

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

32

GRID ARRAY

.95 V

85 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

3.62 mm

6M

40 mm

YES

128

30

245

40 mm

CMOS

1 V

ETHERNET; I2C; PCI; SPI; UART; USB

1 mm

S-PBGA-B1517

4

e1

32

TDA2HGBRQABCRQ1

Texas Instruments

MICROPROCESSOR, RISC

AUTOMOTIVE

BALL

760

FBGA

SQUARE

PLASTIC/EPOXY

NO

YES

1.2 V

AEC-Q100

16

32

GRID ARRAY, FINE PITCH

1.11 V

125 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

2.96 mm

2.5M

23 mm

YES

32

38.4 MHz

30

250

23 mm

CMOS

1.15 V

CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB

.8 mm

FLOATING POINT

S-PBGA-B760

3

750 rpm

YES

e1

247

DRA718BJGCBDQ1

Texas Instruments

AUTOMOTIVE

BALL

538

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.2 V

AEC-Q100

16

GRID ARRAY, LOW PROFILE, FINE PITCH

1.11 V

125 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.298 mm

512K

17 mm

YES

32

38.4 MHz

30

260

17 mm

CMOS

1.15 V

CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB

.65 mm

S-PBGA-B538

3

1000 rpm

e1

186

DRA777PSIGACDRQ1

Texas Instruments

AUTOMOTIVE

BALL

784

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.2 V

AEC-Q100

32

GRID ARRAY, LOW PROFILE, FINE PITCH

1.11 V

125 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.63 mm

2.5M

23 mm

YES

64

38.4 MHz

30

250

23 mm

CMOS

1.15 V

CAN; ETHERNET; I2C; SPI; UART; USB

.8 mm

S-PBGA-B784

3

1800 rpm

e1

247

XDRA767PSIGACD

Texas Instruments

AUTOMOTIVE

BALL

784

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.2 V

AEC-Q100

32

GRID ARRAY, LOW PROFILE, FINE PITCH

1.11 V

125 Cel

-40 Cel

BOTTOM

1.63 mm

2.5M

23 mm

YES

64

38.4 MHz

23 mm

CMOS

1.15 V

CAN; ETHERNET; I2C; SPI; UART; USB

.8 mm

S-PBGA-B784

247

TDA2SABRQABCQ1

Texas Instruments

MICROPROCESSOR, RISC

AUTOMOTIVE

BALL

760

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.2 V

AEC-Q100

GRID ARRAY, FINE PITCH

1.11 V

125 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

2.96 mm

2.5M

23 mm

YES

38.4 MHz

250

23 mm

CMOS

1.15 V

CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB

.8 mm

S-PBGA-B760

3

750 rpm

e1

247

Multi-functional Peripherals

Multi-functional peripherals (MFPs) are devices that combine several different functions, such as printing, scanning, copying, and faxing, into a single piece of equipment. These devices are often used in office settings to streamline workflows and reduce the need for multiple pieces of equipment.

MFPs typically come with a range of features and capabilities, including high-quality printing and scanning, fast copying and faxing, and the ability to handle large volumes of documents. They may also offer additional features, such as double-sided printing, wireless connectivity, and cloud-based printing and scanning.

One of the key benefits of MFPs is their ability to save space and reduce clutter in an office environment. By combining several different functions into a single device, MFPs eliminate the need for separate printers, scanners, copiers, and fax machines, freeing up valuable space and reducing costs.

In addition to their space-saving benefits, MFPs also offer enhanced efficiency and productivity. With the ability to print, scan, copy, and fax all from a single device, users can complete tasks quickly and easily, without the need to switch between different pieces of equipment.