SQUARE Multi-functional Peripherals 1,100

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	Screening Level	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	CPU Family	Minimum Operating Temperature	Terminal Finish	Ultraviolet Erasable	Terminal Position	Maximum Seated Height	ROM Words	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	ROM Bits Size	RAM Bytes	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of Serial I/Os	Sub-Category	ROM Programmability	Bus Compatibility	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code	No. of I/O Lines
CY8C20666A-24LTXI	Cypress Semiconductor		INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED		YES	5.5 V		0	8	1.8/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	1.71 V	85 Cel	M8C	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)		QUAD	1 mm	32768	1024	7 mm		NO	0	25.2 MHz	20	260	7 mm		2048	CMOS	4 mA	3 V		Microcontrollers	FLASH	USB	.5 mm		S-XQCC-N48	3	Not Qualified	25.2 rpm		e4	36
CY8C24423A-24LTXI	Infineon Technologies		INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED		YES	5.25 V		0	8	2.7/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	4.75 V	85 Cel	M8C	-40 Cel	NICKEL PALLADIUM GOLD		QUAD	1 mm	4096	256	5 mm	ALSO OPERATES AT 2.7V AND 3.3V SUPPLY	NO	0	24.6 MHz	40	260	5 mm		256	CMOS	8 mA	5 V		Microcontrollers	FLASH	USB	.5 mm		S-XQCC-N32	3	Not Qualified	24 rpm		e4	24
CY8C28643-24LTXI	Infineon Technologies	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED		YES	5.25 V		0	8	3.3/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	4.75 V	85 Cel	M8C	-40 Cel	NICKEL PALLADIUM GOLD		QUAD	1 mm	16384	1024	7 mm	ALSO OPERATES AT 3V MINIMUM SUPPLY	NO	0	24 MHz	20	260	7 mm		1024	CMOS	14 mA	5 V		Microcontrollers	FLASH	I2C, IRDA, SPI, UART, USB	.5 mm		S-XQCC-N48	3	Not Qualified	24 rpm		e4	44
CY8C3666AXI-052	Infineon Technologies		INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY		YES	5.5 V		0	8	2/5	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.71 V	85 Cel	8051	-40 Cel	NICKEL PALLADIUM GOLD		QUAD	1.6 mm	65536	4096	14 mm		YES	0	67 MHz	40	260	14 mm		8192	CMOS		3.3 V		Microcontrollers	FLASH	I2C; USB	.5 mm		S-PQFP-G100	3	Not Qualified	67 rpm		e4	62
CY8C3866LTI-030	Infineon Technologies		INDUSTRIAL	NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED		YES	5.5 V		0		2/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC68,.3SQ,40	1.71 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	N	QUAD	1 mm		4096	8 mm		YES	0	67 MHz	30	260	8 mm	65536 Bits		CMOS		3.3 V		Other uPs/uCs/Peripheral ICs			.4 mm		S-XQCC-N68	3	Not Qualified			e4	48
CY8C4245AXI-M445	Infineon Technologies	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	GULL WING	64	LQFP	SQUARE	PLASTIC/EPOXY		YES	5.5 V					FLATPACK, LOW PROFILE	QFP64,.63SQ,32	1.71 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD	1.6 mm		2048	14 mm		NO		48 MHz			14 mm			CMOS	13.8 mA		11			I2C; SPI; UART; IRDA; IDE; LIN	.8 mm		S-PQFP-G64	3				e4	51
CY8C4245AZI-473	Infineon Technologies	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY		YES	5.5 V					FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	1.71 V	85 Cel		-40 Cel	PURE TIN		QUAD	1.6 mm		4K	7 mm		YES		48 MHz			7 mm			CMOS	13.8 mA	1.8 V	3			I2C	.5 mm		S-PQFP-G48	3					36
CY8C4245AZI-M445	Infineon Technologies	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY		YES	5.5 V		0			FLATPACK, LOW PROFILE, FINE PITCH	QFP64(UNSPEC)	1.71 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD	1.6 mm		4K	10 mm		NO	0	48 MHz			10 mm			CMOS	13.8 mA	3.3 V	11			I2C; SPI; UART; IRDA; IDE; LIN	.5 mm		S-PQFP-G64	3				e4	51
CY8C4245LTI-DM405	Infineon Technologies		INDUSTRIAL	NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED		YES	5.5 V		0			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.71 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD	1 mm		2048	8 mm		NO	0	48 MHz			8 mm			CMOS		3.3 V				I2C; SPI; UART; IRDA; IDE; LIN	.4 mm		S-XQCC-N68	3				e4	55
CY8C4245LTI-M445	Infineon Technologies	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	NO LEAD	68	HQCCN	SQUARE	UNSPECIFIED		YES	5.5 V					CHIP CARRIER, HEAT SINK/SLUG	LCC68,.32SQ,16	1.71 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD	1 mm		2048	8 mm		NO		48 MHz			8 mm			CMOS	13.8 mA		11			I2C; SPI; UART; IRDA; IDE; LIN	.4 mm		S-XQCC-N68	3				e4	55
CY8C4246LTI-M445	Infineon Technologies	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	NO LEAD	68	HQCCN	SQUARE	UNSPECIFIED		YES	5.5 V					CHIP CARRIER, HEAT SINK/SLUG	LCC68,.32SQ,16	1.71 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD	1 mm		4096	8 mm		NO		48 MHz			8 mm			CMOS	13.8 mA		11			I2C; SPI; UART; IRDA; IDE; LIN	.4 mm		S-XQCC-N68	3				e4	55
CY8C4247AZI-L445	Infineon Technologies	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	NO LEAD	64	LFQFP	SQUARE	PLASTIC/EPOXY		YES	5.5 V					FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.8 V	85 Cel		-40 Cel	PURE TIN		QUAD	1.6 mm		8192	10 mm		NO		48 MHz			10 mm			CMOS	14.5 mA					I2C; IRDA; LIN; SPI; UART; USB	.5 mm		S-PQFP-G64	3					53
CY8C4247AZI-M475	Infineon Technologies	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY		YES	5.5 V		0			FLATPACK, LOW PROFILE, FINE PITCH	QFP64(UNSPEC)	1.71 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD	1.6 mm		16K	10 mm		NO	0	48 MHz			10 mm			CMOS	13.8 mA	3.3 V	11			I2C; SPI; UART; IRDA; IDE; LIN	.5 mm		S-PQFP-G64	3				e4	51
CY8C4248LQI-BL563T	Infineon Technologies		INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED		YES	5.5 V		0			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.71 V	85 Cel		-40 Cel	PURE TIN		QUAD	.6 mm		16384	7 mm		NO	0	48 MHz			7 mm			CMOS		3.3 V				I2C; I2S; SPI; UART; IRDA; LIN; IDE	.4 mm		S-XQCC-N56	3					36
CY8C5246LTI-029	Cypress Semiconductor		INDUSTRIAL	NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED		YES	5.5 V		0		1.8/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC68,.32SQ,16	1.71 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	N	QUAD	1 mm		32768	8 mm		YES	0	40 MHz		260	8 mm	65536 Bits		CMOS		1.8 V		Other Microprocessor ICs			.4 mm		S-XQCC-N68	3	Not Qualified			e4	48
CY8C5468LTI-037	Cypress Semiconductor		INDUSTRIAL	NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED		YES	5.5 V				3/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC68,.32SQ,16	2.7 V	85 Cel		-40 Cel		N	QUAD	1 mm		32768	8 mm		NO		25 MHz	NOT SPECIFIED	NOT SPECIFIED	8 mm	2097152 Bits		CMOS		5 V		Other Microprocessor ICs		I2C; USB	.4 mm		S-XQCC-N68		Not Qualified				46
CY8C5666AXQ-LP004	Cypress Semiconductor		INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY		YES	5.5 V		0		1.8/5	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.71 V	105 Cel		-40 Cel		N	QUAD	1.6 mm		32768	14 mm		YES	0	33 MHz			14 mm	524288 Bits		CMOS		3.3 V		Other uPs/uCs/Peripheral ICs		I2C; I2S, LIN; PS/2; SPI, USB	.5 mm		S-PQFP-G100		Not Qualified				62
CYBL10561-56LQXI	Cypress Semiconductor		INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED		YES	5.5 V					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.71 V	85 Cel		-40 Cel			QUAD	.6 mm		8192	7 mm		YES		48 MHz			7 mm			CMOS		1.8 V				I2C	.4 mm		S-XQCC-N56						36
CYBL10573-56LQXI	Cypress Semiconductor		INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED		YES	5.5 V		0			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.71 V	85 Cel		-40 Cel			QUAD	.6 mm		16384	7 mm		NO	0	48 MHz			7 mm			CMOS		3.3 V				I2C; I2S; IDE; IRDA; LIN; SPI; UART	.4 mm		S-XQCC-N56						36
EFR32BG21B010F1024IM32-B	Silicon Labs	MULTIFUNCTION PERIPHERAL	AUTOMOTIVE	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED		YES	3.8 V		0			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.16SQ,16	1.71 V	125 Cel		-40 Cel			QUAD	.9 mm		98304	4 mm		NO	0	38.4 MHz			4 mm			CMOS		3 V	3			I2C, I2S, IRDA, SPI, UART, USART	.4 mm		S-XQCC-N32						20
FW82801DB	Intel			BALL	421	BGA	SQUARE	PLASTIC/EPOXY		YES	1.575 V		32			GRID ARRAY		1.425 V						BOTTOM	2.59 mm		256	31 mm	ALSO REQUIRES 3.3V SUPPLY	NO	32	66 MHz			31 mm			CMOS		1.5 V				PCI; USB; LPC	1.27 mm		S-PBGA-B421	1					29
LE3100MICH/SL9PU	Intel			BALL	1284	BGA	SQUARE	PLASTIC/EPOXY		YES						GRID ARRAY								BOTTOM						NO								CMOS						PCI; SATA; SMBUS; UART; USB			S-PBGA-B1284						38
NH82801GB	Intel			BALL	652	BGA	SQUARE	PLASTIC/EPOXY		YES					1.05,1.5,3.3,5	GRID ARRAY	BGA652,28X28,40							BOTTOM														CMOS				Other Microprocessor ICs			1 mm		S-PBGA-B652		Not Qualified
NHE6300ESB	Intel			BALL	689	BGA	SQUARE	PLASTIC/EPOXY		YES	1.575 V		64			GRID ARRAY		1.425 V						BOTTOM			256			NO	64	48 MHz						CMOS		1.5 V				PCI			S-PBGA-B689						4
XPC107APX100LB	Motorola			BALL	503	BGA	SQUARE	PLASTIC/EPOXY		YES	2.625 V		32			GRID ARRAY		2.375 V						BOTTOM	2.75 mm			33 mm		YES	64	100 MHz			33 mm			CMOS		2.5 V				PCI; I2C; 60X PROCESSOR	1.27 mm		S-PBGA-B503		Not Qualified				64
XPC107APX100LD	NXP Semiconductors			BALL	503	BGA	SQUARE	PLASTIC/EPOXY		YES	2.625 V					GRID ARRAY		2.375 V				TIN LEAD SILVER		BOTTOM	2.75 mm		256	33 mm		YES		66 MHz			33 mm			CMOS		2.5 V				PCI	1.27 mm		S-PBGA-B503					e0
66AK2H06DAAW2	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY		YES	1.05 V		32			GRID ARRAY		.95 V	85 Cel		0 Cel	TIN SILVER COPPER		BOTTOM	3.62 mm		6M	40 mm		YES	128		30	245	40 mm			CMOS		1 V				ETHERNET; I2C; PCI; SPI; UART; USB	1 mm		S-PBGA-B1517	4				e1	32
CY8C3865AXI-204	Cypress Semiconductor		INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY		YES	5.5 V				1.8/5	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.71 V	85 Cel		-40 Cel	Matte Tin (Sn)	N	QUAD	1.6 mm		4096	14 mm		YES		33 MHz	30	260	14 mm	262144 Bits		CMOS		3.3 V		Other uPs/uCs/Peripheral ICs		I2C; USB; PS/2; 8051	.5 mm		S-PQFP-G100	3	Not Qualified			e3	72
CY8C4125AZI-M443	Infineon Technologies	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY		YES	5.5 V					FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	1.8 V	85 Cel		-40 Cel	PURE TIN		QUAD	1.6 mm		2048	7 mm		NO		48 MHz			7 mm			CMOS	7.2 mA		7			I2C; IRDA; LIN; SPI; UART	.5 mm		S-PQFP-G48	3					38
CY8C4248BZI-L489	Infineon Technologies	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	BALL	124	VFBGA	SQUARE	PLASTIC/EPOXY		YES	5.5 V					GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA124,13X13,25	1.8 V	85 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	1 mm		16384	9 mm		NO		48 MHz			9 mm			CMOS	14.5 mA					I2C; IRDA; LIN; SPI; UART; USB	.65 mm		S-PBGA-B124	3				e1	98
LH75411N0Q100C0	NXP Semiconductors	MULTIFUNCTION PERIPHERAL		GULL WING	144	LFQFP	SQUARE	PLASTIC/EPOXY		YES	1.98 V		24			FLATPACK, LOW PROFILE, FINE PITCH	QFP144,.87SQ,20	1.7 V	85 Cel		-40 Cel	Tin (Sn)		QUAD	1.6 mm		32768	20 mm	ALSO REQUIRES 3.3 V SUPPLY	YES	16	20 MHz	30	260	20 mm			CMOS	70 mA	1.8 V	5			CAN, SSP, UART(3)	.5 mm		S-PQFP-G144	3	Not Qualified			e3	76
LH75411N0Q100C0,55	NXP Semiconductors	MULTIFUNCTION PERIPHERAL		GULL WING	144	LFQFP	SQUARE	PLASTIC/EPOXY		YES	1.98 V		24			FLATPACK, LOW PROFILE, FINE PITCH	QFP144,.87SQ,20	1.7 V	85 Cel		-40 Cel	TIN		QUAD	1.6 mm		32768	20 mm	ALSO REQUIRES 3.3 V SUPPLY	YES	16	20 MHz			20 mm			CMOS	70 mA	1.8 V	5			CAN, SSP, UART(3)	.5 mm		S-PQFP-G144		Not Qualified			e3	76
LPC47N217N-ABZJ	Microchip Technology			NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED		YES						CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE						MATTE TIN		QUAD	1 mm			8 mm		NO					8 mm			CMOS		3.3 V				PCI; ISA	.5 mm		S-XQCC-N56					e3	13
MCIMX27LVOP4AR2	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	OTHER	BALL	404	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.52 V		26	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.38 V	85 Cel		-20 Cel	TIN SILVER COPPER		BOTTOM	1.4 mm			17 mm	ALSO OPERATES 1.3V AT 266MHZ	YES	32	32 MHz	40	260	17 mm			CMOS		1.45 V					.65 mm	FIXED POINT	S-PBGA-B404	3		400 rpm	YES	e1
MCIMX6G3DVM05AA	NXP Semiconductors	MULTIFUNCTION PERIPHERAL		BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V		16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.275 V						BOTTOM	1.32 mm			14 mm		YES	16		40	260	14 mm			CMOS							.8 mm	FIXED POINT	S-PBGA-B289	3		528 rpm	YES
SCH3114I-NU	Microchip Technology	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	GULL WING	128	TQFP	SQUARE	PLASTIC/EPOXY		YES	3.63 V		4		3.3	FLATPACK, THIN PROFILE	TQFP128,.63SQ,16	2.97 V	85 Cel		-40 Cel	MATTE TIN		QUAD	1.2 mm		256	14 mm		NO	4				14 mm			CMOS	1 mA	3.3 V		Other uPs/uCs/Peripheral ICs		LPC	.4 mm		S-PQFP-G128		Not Qualified			e3	46
ST2100	STMicroelectronics	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	BALL	373	TFBGA	SQUARE	PLASTIC/EPOXY		YES	1.32 V		15			GRID ARRAY, THIN PROFILE, FINE PITCH	BGA373,23X23,20	1.08 V	85 Cel		-40 Cel			BOTTOM	1.2 mm		8192	12 mm		YES	16		NOT SPECIFIED	NOT SPECIFIED	12 mm			CMOS		1.2 V	4			CAN; ETHERNET; I2C; I2S; IRDA; PCI; SPI; UART; USB	.5 mm		S-PBGA-B373						40
66AK2H06DAAW24	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY		YES	1.05 V		32			GRID ARRAY		.95 V	85 Cel		0 Cel	TIN SILVER COPPER		BOTTOM	3.62 mm		6M	40 mm		YES	128		30	245	40 mm			CMOS		1 V				ETHERNET; I2C; PCI; SPI; UART; USB	1 mm		S-PBGA-B1517	4				e1	32
66AK2G12ABYQ100	Texas Instruments		AUTOMOTIVE	BALL	625	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.05 V		16			GRID ARRAY, LOW PROFILE, FINE PITCH		.95 V	125 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	1.56 mm		1M	21 mm		YES	32		30	260	21 mm			CMOS		1 V				CAN; ETHERNET; I2C; PCI; SPI; UART; USB	.8 mm		S-PBGA-B625	3				e1	212
DRA791BBGCBDRQ1	Texas Instruments		AUTOMOTIVE	BALL	538	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.2 V	AEC-Q100	16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.11 V	125 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	1.298 mm		512K	17 mm		YES	32	38.4 MHz	30	260	17 mm			CMOS		1.15 V				CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB	.65 mm		S-PBGA-B538	3		300 rpm		e1	186
DRA716BHGCBDRQ1	Texas Instruments		AUTOMOTIVE	BALL	538	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.2 V	AEC-Q100	16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.11 V	125 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	1.298 mm		512K	17 mm		YES	32	38.4 MHz	30	260	17 mm			CMOS		1.15 V				CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB	.65 mm		S-PBGA-B538	3		800 rpm		e1	186
3530ECUSAGRM	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	423	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.4175 V		26			GRID ARRAY, LOW PROFILE, FINE PITCH		1.2825 V	105 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM	1.4 mm		64K	16 mm		YES	16	38.4 MHz	NOT SPECIFIED	260	16 mm			CMOS		1.35 V				CAN; I2C; IRDA; PCI; SPI; UART; USB	.65 mm	FIXED POINT	S-PBGA-B423	4		720 rpm	YES	e1	188
DRA797BHGCBDQ1	Texas Instruments		AUTOMOTIVE	BALL	538	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.2 V	AEC-Q100	16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.11 V	125 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	1.298 mm		512K	17 mm		YES	32	38.4 MHz	30	260	17 mm			CMOS		1.15 V				CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB	.65 mm		S-PBGA-B538	3		800 rpm		e1	186
DRA746PPIGABZRQ1	Texas Instruments		AUTOMOTIVE	BALL	760	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.2 V	AEC-Q100	16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.11 V	125 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	1.63 mm		512K	23 mm		YES	32	32 MHz	30	250	23 mm			CMOS		1.15 V				CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB	.8 mm		S-PBGA-B760	3		1500 rpm		e1	247
DRA791BBGCBDQ1	Texas Instruments		AUTOMOTIVE	BALL	538	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.2 V	AEC-Q100	16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.11 V	125 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	1.298 mm		512K	17 mm		YES	32	38.4 MHz	30	260	17 mm			CMOS		1.15 V				CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB	.65 mm		S-PBGA-B538	3		300 rpm		e1	186
DRA712BGGCBDRQ1	Texas Instruments		AUTOMOTIVE	BALL	538	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.2 V	AEC-Q100	16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.11 V	125 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	1.298 mm		512K	17 mm		YES	32	32 MHz	30	260	17 mm			CMOS		1.15 V				CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB	.65 mm		S-PBGA-B538	3		600 rpm		e1	186
OMAP3630	Texas Instruments			BALL	515	BGA	SQUARE	PLASTIC/EPOXY		YES						GRID ARRAY								BOTTOM						NO								CMOS						I2C; SPI; UART; USB			S-PBGA-B515
TDA2SABRQABCRQ1	Texas Instruments	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.2 V	AEC-Q100				GRID ARRAY, FINE PITCH		1.11 V	125 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	2.96 mm		2.5M	23 mm		YES		38.4 MHz		250	23 mm			CMOS		1.15 V				CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB	.8 mm		S-PBGA-B760	3		750 rpm		e1	247

Multi-functional Peripherals

Multi-functional peripherals (MFPs) are devices that combine several different functions, such as printing, scanning, copying, and faxing, into a single piece of equipment. These devices are often used in office settings to streamline workflows and reduce the need for multiple pieces of equipment.

MFPs typically come with a range of features and capabilities, including high-quality printing and scanning, fast copying and faxing, and the ability to handle large volumes of documents. They may also offer additional features, such as double-sided printing, wireless connectivity, and cloud-based printing and scanning.

One of the key benefits of MFPs is their ability to save space and reduce clutter in an office environment. By combining several different functions into a single device, MFPs eliminate the need for separate printers, scanners, copiers, and fax machines, freeing up valuable space and reducing costs.

In addition to their space-saving benefits, MFPs also offer enhanced efficiency and productivity. With the ability to print, scan, copy, and fax all from a single device, users can complete tasks quickly and easily, without the need to switch between different pieces of equipment.