1156 Other Function uPs,uCs & Peripheral ICs 186

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Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Information Access Method Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width No. of Bits DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Interrupt Capability Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Ultraviolet Erasable Terminal Position DMA Channels No. of Ports Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Total Dose (V) ROM Bits Size No. of Timers RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Minimum Time Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode Volatile JESD-609 Code Maximum Standby Current On Chip Program ROM Width No. of I/O Lines Maximum Access Time

XC7Z100-2FFG1156I

Xilinx

SYSTEM ON CHIP

BALL

1156

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

GRID ARRAY

BGA1156,34X34,40

.95 V

100 Cel

-40 Cel

BOTTOM

3.1 mm

35 mm

35 mm

CMOS

1 V

1 mm

S-PBGA-B1156

XCZU9EG-2FFVB1156I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

1156

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B1156

4

e1

XCZU7EV-L2FFVC1156E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

1156

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.742 V

GRID ARRAY

.698 V

110 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

30

245

CMOS

.72 V

R-PBGA-B1156

4

e1

XCZU7EV-1FFVC1156E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

1156

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B1156

4

e1

XCZU7EV-2FFVC1156E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

1156

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

3.51 mm

35 mm

30

245

35 mm

CMOS

.85 V

1 mm

R-PBGA-B1156

4

e1

XCZU7EV-1FFVC1156I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

1156

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B1156

4

e1

XCZU7EV-2FFVC1156I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

1156

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B1156

4

e1

XCZU7EV-L1FFVC1156I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

1156

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.742 V

GRID ARRAY

.698 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

30

245

CMOS

.72 V

R-PBGA-B1156

4

e1

XCZU11EG-1FFVC1156E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

1156

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B1156

4

e1

XC7Z100-1FFG1156I

Xilinx

SYSTEM ON CHIP

BALL

1156

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

GRID ARRAY

BGA1156,34X34,40

.95 V

100 Cel

-40 Cel

BOTTOM

3.1 mm

35 mm

35 mm

CMOS

1 V

1 mm

S-PBGA-B1156

XCZU25DR-1FFVE1156I

Xilinx

PROGRAMMABLE SoC

INDUSTRIAL

BALL

1156

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B1156

4

e1

XCZU25DR-L1FFVE1156I

Xilinx

PROGRAMMABLE SoC

INDUSTRIAL

BALL

1156

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.742 V

GRID ARRAY

.698 V

100 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

30

245

CMOS

.72 V

R-PBGA-B1156

4

e1

XC7Z100-L2FFG1156I

Xilinx

SYSTEM ON CHIP

BALL

1156

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

GRID ARRAY

BGA1156,34X34,40

.95 V

100 Cel

-40 Cel

BOTTOM

3.1 mm

35 mm

35 mm

CMOS

1 V

1 mm

S-PBGA-B1156

XCZU25DR-2FFVE1156I

Xilinx

PROGRAMMABLE SoC

INDUSTRIAL

BALL

1156

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B1156

4

e1

XCZU25DR-2FFVE1156E

Xilinx

PROGRAMMABLE SoC

OTHER

BALL

1156

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B1156

4

e1

XCZU25DR-L2FSVE1156I

Xilinx

PROGRAMMABLE SoC

INDUSTRIAL

BALL

1156

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.742 V

GRID ARRAY

.698 V

100 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

30

240

CMOS

.72 V

R-PBGA-B1156

4

e1

XCZU7EV-3FFVC1156E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

1156

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.927 V

GRID ARRAY

.873 V

100 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.9 V

R-PBGA-B1156

4

e1

XCZU7EV-3FFVC1156I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

1156

BGA

SQUARE

PLASTIC/EPOXY

YES

GRID ARRAY

100 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

3.51 mm

35 mm

35 mm

CMOS

.9 V

1 mm

S-PBGA-B1156

4

e1

XCZU15EG-2FFVB1156I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

1156

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B1156

4

e1

XCZU48DR-2FFVE1156I

Xilinx

PROGRAMMABLE SoC

INDUSTRIAL

BALL

1156

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B1156

4

e1

XCZU9CG-1FFVB1156I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

1156

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B1156

4

e1

XCZU9EG-1FFVB1156I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

1156

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B1156

4

e1

XCZU7EG-1FFVC1156I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

1156

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B1156

4

e1

XCZU7EG-3FFVC1156E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

1156

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.927 V

GRID ARRAY

.873 V

100 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.9 V

R-PBGA-B1156

4

e1

XCZU7EG-L1FFVC1156I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

1156

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.742 V

GRID ARRAY

.698 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

30

245

CMOS

.72 V

R-PBGA-B1156

4

e1

XCZU7EG-1FFVC1156E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

1156

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B1156

4

e1

XCZU9EG-2FFVB1156E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

1156

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

3.42 mm

35 mm

30

245

35 mm

CMOS

.85 V

1 mm

R-PBGA-B1156

4

e1

XCZU6EG-1FFVB1156E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

1156

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B1156

4

e1

XC7Z100-1FFG1156C

Xilinx

SYSTEM ON CHIP

BALL

1156

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

GRID ARRAY

BGA1156,34X34,40

.95 V

85 Cel

0 Cel

BOTTOM

3.1 mm

35 mm

35 mm

CMOS

1 V

1 mm

S-PBGA-B1156

XCZU27DR-L2FSVE1156I

Xilinx

PROGRAMMABLE SoC

INDUSTRIAL

BALL

1156

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.742 V

GRID ARRAY

.698 V

100 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

30

240

CMOS

.72 V

R-PBGA-B1156

4

e1

XCZU7CG-1FFVC1156I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

1156

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B1156

4

e1

XCZU27DR-2FFVE1156I

Xilinx

PROGRAMMABLE SoC

INDUSTRIAL

BALL

1156

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B1156

4

e1

XCZU11EG-1FFVC1156I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

1156

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B1156

4

e1

XCZU11EG-3FFVC1156E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

1156

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.927 V

GRID ARRAY

.873 V

100 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.9 V

R-PBGA-B1156

4

e1

XCZU7EG-2FFVC1156E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

1156

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

3.51 mm

35 mm

30

245

35 mm

CMOS

.85 V

1 mm

R-PBGA-B1156

4

e1

XCZU7EG-2FFVC1156I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

1156

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B1156

4

e1

XCZU9EG-3FFVB1156E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

1156

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.927 V

GRID ARRAY

.873 V

100 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.9 V

R-PBGA-B1156

4

e1

XCZU27DR-1FFVE1156I

Xilinx

PROGRAMMABLE SoC

INDUSTRIAL

BALL

1156

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B1156

4

e1

XCZU11EG-L2FFVC1156E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

1156

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.742 V

GRID ARRAY

.698 V

110 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

30

245

CMOS

.72 V

R-PBGA-B1156

4

e1

XCZU27DR-2FSVE1156I

Xilinx

PROGRAMMABLE SoC

INDUSTRIAL

BALL

1156

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

30

240

CMOS

.85 V

R-PBGA-B1156

4

e1

XQZU11EG-1FFRC1156M

Xilinx

PROGRAMMABLE SoC

BALL

1156

BGA

SQUARE

PLASTIC/EPOXY

YES

.892 V

GRID ARRAY

BGA1156,34X34,40

.808 V

125 Cel

-55 Cel

Tin/Lead (Sn/Pb)

BOTTOM

3.71 mm

35 mm

40

245

35 mm

CMOS

.85 V

1 mm

S-PBGA-B1156

4

e0

XCZU15EG-3FFVB1156E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

1156

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.927 V

GRID ARRAY

.873 V

100 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.9 V

R-PBGA-B1156

4

e1

XCZU48DR-1FFVE1156E

Xilinx

PROGRAMMABLE SoC

OTHER

BALL

1156

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B1156

4

e1

XCZU6CG-1FFVB1156I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

1156

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B1156

4

e1

XCZU47DR-1FFVE1156E

Xilinx

PROGRAMMABLE SoC

OTHER

BALL

1156

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B1156

4

e1

XQZU28DR-1FFRE1156M

Xilinx

MICROPROCESSOR CIRCUIT

MILITARY

BALL

1156

BGA

SQUARE

PLASTIC/EPOXY

YES

.892 V

MIL-PRF-38535

GRID ARRAY

.808 V

125 Cel

-55 Cel

Tin/Lead (Sn/Pb)

BOTTOM

40

245

CMOS

.85 V

S-PBGA-B1156

4

e0

XCZU47DR-2FFVE1156I

Xilinx

PROGRAMMABLE SoC

INDUSTRIAL

BALL

1156

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B1156

4

e1

XCZU9CG-2FFVB1156I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

1156

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B1156

4

e1

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.