400 Other Function uPs,uCs & Peripheral ICs 116

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Ultraviolet Erasable	Terminal Position	Maximum Seated Height	Width	Additional Features	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Sub-Category	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	JESD-609 Code
XA7Z020-1CLG400I	Xilinx	MICROPROCESSOR CIRCUIT		BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES		AEC-Q100	1,1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32				Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	N	BOTTOM	1.6 mm	17 mm		30	260	17 mm	CMOS		Other uPs/uCs/Peripheral ICs	.8 mm	S-PBGA-B400	3	Not Qualified	e1
XA7Z010-1CLG400Q	Xilinx	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES		AEC-Q100	1,1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32		125 Cel	-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	N	BOTTOM	1.6 mm	17 mm		30	260	17 mm	CMOS		Other uPs/uCs/Peripheral ICs	.8 mm	S-PBGA-B400	3	Not Qualified	e1
CC-WMX-L87C-TE	Digi International	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	400	LGA	SQUARE	UNSPECIFIED	YES				GRID ARRAY			85 Cel	-40 Cel			BOTTOM		50 mm				50 mm	CMOS			2 mm	S-XBGA-N400
MCIMX257DJM4A	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.52 V		1.2/1.5,1.8/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.38 V	70 Cel	-20 Cel	TIN SILVER COPPER		BOTTOM	1.6 mm	17 mm	ALSO REQUIRES 3.3 V I/O SUPPLY	40	260	17 mm	CMOS	1.45 V	Microprocessors	.8 mm	S-PBGA-B400	3	Not Qualified	e1
MCIMX258CJM4A	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.52 V		1.2/1.5,1.8/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.38 V	85 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	1.6 mm	17 mm	ALSO REQUIRES 3.3 V I/O SUPPLY	40	260	17 mm	CMOS	1.45 V	Microprocessors	.8 mm	S-PBGA-B400	3	Not Qualified	e1
MCIMX503CVM8B	NXP Semiconductors	SYSTEM ON CHIP	COMMERCIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.275 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.175 V	70 Cel	0 Cel	TIN SILVER COPPER		BOTTOM	1.6 mm	17 mm	ALSO OPERATES AT 0.9 V MINIMUM SUPPLY 24 MHZ	40	260	17 mm	CMOS	1.225 V		.8 mm	S-PBGA-B400	3	Not Qualified	e1
ADSP-SC573-BCZENG	Analog Devices	MICROPROCESSOR CIRCUIT	COMMERCIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	3.47 V			GRID ARRAY, LOW PROFILE, FINE PITCH		3.13 V	70 Cel	0 Cel			BOTTOM	1.5 mm	17 mm				17 mm	CMOS	3.3 V		.8 mm	S-PBGA-B400
ADSP-21573-BCZENG	Analog Devices	MICROPROCESSOR CIRCUIT	COMMERCIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	3.47 V			GRID ARRAY, LOW PROFILE, FINE PITCH		3.13 V	70 Cel	0 Cel			BOTTOM	1.5 mm	17 mm				17 mm	CMOS	3.3 V		.8 mm	S-PBGA-B400
MCIMX353DJQ5CR2	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.47 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.22 V	70 Cel	-20 Cel	TIN SILVER COPPER		BOTTOM	1.6 mm	17 mm		40	260	17 mm		1.8 V		.8 mm	S-PBGA-B400	3		e1
MCIMX503EVM8B	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.275 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.175 V	70 Cel	-20 Cel			BOTTOM	1.6 mm	17 mm				17 mm	CMOS	1.225 V		.8 mm	S-PBGA-B400	3
MCIMX6X3EVN10AC	NXP Semiconductors	SoC		BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.35 V	105 Cel	-20 Cel	TIN SILVER COPPER		BOTTOM	1.53 mm	17 mm		40	260	17 mm	CMOS			.8 mm	S-PBGA-B400	3		e1
MCIMX507CVM8B	NXP Semiconductors	SYSTEM ON CHIP	COMMERCIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.275 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.175 V	70 Cel	0 Cel	TIN SILVER COPPER		BOTTOM	1.6 mm	17 mm	ALSO OPERATES AT 0.9 V MINIMUM SUPPLY 24 MHZ	40	260	17 mm	CMOS	1.225 V		.8 mm	S-PBGA-B400	3	Not Qualified	e1
MCIMX6X3CVK08AB	NXP Semiconductors	SoC	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.275 V	105 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	1.3 mm	14 mm		40	260	14 mm	CMOS			.8 mm	S-PBGA-B400	3		e1
MCIMX6X3EVO10AC	NXP Semiconductors	SoC		BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.35 V	105 Cel	-20 Cel	TIN SILVER COPPER		BOTTOM	1.53 mm	17 mm		40	260	17 mm	CMOS			.8 mm	S-PBGA-B400	3		e1
MCIMX357DJQ5CR2	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.47 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.22 V	70 Cel	-20 Cel	TIN SILVER COPPER		BOTTOM	1.6 mm	17 mm		40	260	17 mm		1.8 V		.8 mm	S-PBGA-B400	3		e1
MCIMX6X3CVK08AC	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,25	1.275 V	105 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	1.3 mm	14 mm	24MHZ NOMINAL FREQUENCY AVAILABLE	40	260	14 mm	CMOS	1.8 V		.65 mm	S-PBGA-B400	3		e1
MCIMX357DVM5BR2	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.47 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.22 V	70 Cel	-20 Cel	TIN SILVER COPPER		BOTTOM	1.6 mm	17 mm		40	260	17 mm		1.8 V		.8 mm	S-PBGA-B400	3		e1
MCIMX258CVM4	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.52 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.38 V	85 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM	1.6 mm	17 mm	ALSO REQUIRES 3.3 V I/O SUPPLY; UNAVAILABLE FOR IMPORT OR SALE IN US	40	260	17 mm	CMOS	1.45 V		.8 mm	S-PBGA-B400	3	Not Qualified	e1
MCIMX356AJQ4C	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.47 V	AEC-Q100		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.22 V	85 Cel	-40 Cel			BOTTOM	1.6 mm	17 mm				17 mm	CMOS	1.8 V		.8 mm	S-PBGA-B400		Not Qualified
MCIMX253CJM4A	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.52 V		1.2/1.5,1.8/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.38 V	85 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	1.6 mm	17 mm	ALSO REQUIRES 3.3 V I/O SUPPLY	40	260	17 mm	CMOS	1.45 V	Microprocessors	.8 mm	S-PBGA-B400	3	Not Qualified	e1
MCIMX351AVM4BR2	NXP Semiconductors	SYSTEM ON CHIP		BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.47 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.22 V	85 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	1.6 mm	17 mm		40	260	17 mm	CMOS	1.8 V		.8 mm	S-PBGA-B400	3		e1
MCIMX507CVM1BR2	NXP Semiconductors	SYSTEM ON CHIP	COMMERCIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.2 V	70 Cel	0 Cel	TIN SILVER COPPER		BOTTOM	1.6 mm	17 mm		40	260	17 mm	CMOS	1.275 V		.8 mm	S-PBGA-B400	3	Not Qualified	e1
MCIMX507CVM1B	NXP Semiconductors	SYSTEM ON CHIP	COMMERCIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.2 V	70 Cel	0 Cel	TIN SILVER COPPER		BOTTOM	1.6 mm	17 mm		40	260	17 mm	CMOS	1.275 V		.8 mm	S-PBGA-B400	3	Not Qualified	e1
MCIMX356AVM5B	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.47 V	AEC-Q100		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.33 V	85 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	1.6 mm	17 mm		40	260	17 mm	CMOS	1.8 V		.8 mm	S-PBGA-B400	3	Not Qualified	e1
MCIMX355AJQ5C	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.47 V	AEC-Q100		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.33 V	85 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	1.6 mm	17 mm		40	260	17 mm	CMOS	1.8 V		.8 mm	S-PBGA-B400	3	Not Qualified	e1
MCIMX6X2CVN08AB	NXP Semiconductors	SoC	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.275 V	105 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	1.53 mm	17 mm		40	260	17 mm	CMOS			.8 mm	S-PBGA-B400	3		e1
MCIMX351AJQ4C	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.47 V	AEC-Q100		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,25	1.22 V	85 Cel	-40 Cel			BOTTOM	1.6 mm	17 mm				17 mm	CMOS			.8 mm	S-PBGA-B400		Not Qualified
MCIMX6X1CVO08AC	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.275 V	105 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	1.53 mm	17 mm	24MHZ NOMINAL FREQUENCY AVAILABLE	40	260	17 mm	CMOS	1.8 V		.8 mm	S-PBGA-B400	3		e1
MCIMX355AVM4B	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.47 V	AEC-Q100		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.22 V	85 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	1.6 mm	17 mm		40	260	17 mm	CMOS	1.8 V		.8 mm	S-PBGA-B400	3	Not Qualified	e1
MCIMX6X3EVK10AC	NXP Semiconductors	SoC		BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,25	1.35 V	105 Cel	-20 Cel	TIN SILVER COPPER		BOTTOM	1.3 mm	14 mm		40	260	14 mm	CMOS			.65 mm	S-PBGA-B400	3		e1
MCIMX502EVM8B	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	.95 V	70 Cel	-20 Cel	TIN SILVER COPPER		BOTTOM	1.6 mm	17 mm		40	260	17 mm	CMOS	1.05 V		.8 mm	S-PBGA-B400	3	Not Qualified	e1
MCIMX255AJM4AR2	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.52 V		1.2/1.5,1.8/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.38 V	85 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	1.6 mm	17 mm		40	260	17 mm	CMOS	1.45 V	Microprocessors	.8 mm	S-PBGA-B400	3	Not Qualified	e1
MCIMX355AVM5BR2	NXP Semiconductors	SYSTEM ON CHIP		BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.47 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.22 V	85 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	1.6 mm	17 mm		40	260	17 mm	CMOS	1.8 V		.8 mm	S-PBGA-B400	3		e1
MCIMX251AJM4AR2	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.52 V		1.2/1.5,1.8/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.38 V	85 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	1.6 mm	17 mm		40	260	17 mm	CMOS	1.45 V	Microprocessors	.8 mm	S-PBGA-B400	3	Not Qualified	e1
MCIMX355AVM5B	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.47 V	AEC-Q100		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.33 V	85 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	1.6 mm	17 mm		40	260	17 mm	CMOS	1.8 V		.8 mm	S-PBGA-B400	3	Not Qualified	e1
MCIMX353CJQ5C	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.47 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.33 V	85 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	1.6 mm	17 mm	IT ALSO OPERATES AT 1.22 TO 1.47 V	40	260	17 mm	CMOS	1.8 V		.8 mm	S-PBGA-B400	3	Not Qualified	e1
MCIMX508CVM8B	NXP Semiconductors	SYSTEM ON CHIP	COMMERCIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.275 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.175 V	70 Cel	0 Cel	TIN SILVER COPPER		BOTTOM	1.6 mm	17 mm	ALSO OPERATES AT 0.9 V MINIMUM SUPPLY 24 MHZ	40	260	17 mm	CMOS	1.225 V		.8 mm	S-PBGA-B400	3	Not Qualified	e1
MCIMX6X3EVO10AB	NXP Semiconductors	SoC	COMMERCIAL EXTENDED	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.35 V	105 Cel	-20 Cel	TIN SILVER COPPER		BOTTOM	1.53 mm	17 mm		40	260	17 mm	CMOS			.8 mm	S-PBGA-B400	3		e1
MCIMX6X1EVO10AC	NXP Semiconductors	SoC		BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.35 V	105 Cel	-20 Cel	TIN SILVER COPPER		BOTTOM	1.53 mm	17 mm		40	260	17 mm	CMOS			.8 mm	S-PBGA-B400	3		e1
MCIMX6X1EVK10AC	NXP Semiconductors	SoC		BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,25	1.35 V	105 Cel	-20 Cel	TIN SILVER COPPER		BOTTOM	1.3 mm	14 mm		40	260	14 mm	CMOS			.65 mm	S-PBGA-B400	3		e1
MCIMX255AJM4A	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.52 V		1.2/1.5,1.8/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.38 V	85 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	1.6 mm	17 mm	ALSO REQUIRES 3.3 V I/O SUPPLY	40	260	17 mm	CMOS	1.45 V	Microprocessors	.8 mm	S-PBGA-B400	3	Not Qualified	e1
MCIMX508CVM1B	NXP Semiconductors	SYSTEM ON CHIP	COMMERCIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.275 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.175 V	70 Cel	0 Cel			BOTTOM	1.6 mm	17 mm				17 mm	CMOS	1.225 V		.8 mm	S-PBGA-B400		Not Qualified
MCIMX357DJQ5C	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.47 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.33 V	70 Cel	-20 Cel	TIN SILVER COPPER		BOTTOM	1.6 mm	17 mm	IT ALSO OPERATES AT 1.22 TO 1.47 V	40	260	17 mm	CMOS	1.8 V		.8 mm	S-PBGA-B400	3	Not Qualified	e1
MCIMX502CVM8B	NXP Semiconductors	SYSTEM ON CHIP	COMMERCIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.275 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.175 V	70 Cel	0 Cel	TIN SILVER COPPER		BOTTOM	1.6 mm	17 mm	ALSO OPERATES AT 0.9 V MINIMUM SUPPLY 24 MHZ	40	260	17 mm	CMOS	1.225 V		.8 mm	S-PBGA-B400	3	Not Qualified	e1
MCIMX508CVM8BR2	NXP Semiconductors	SYSTEM ON CHIP	COMMERCIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	.95 V	70 Cel	0 Cel	TIN SILVER COPPER		BOTTOM	1.6 mm	17 mm		40	260	17 mm	CMOS	1.05 V		.8 mm	S-PBGA-B400	3	Not Qualified	e1
MCIMX251AJM4A	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.52 V		1.2/1.5,1.8/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.38 V	85 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	1.6 mm	17 mm	ALSO REQUIRES 3.3 V I/O SUPPLY	40	260	17 mm	CMOS	1.45 V	Microprocessors	.8 mm	S-PBGA-B400	3	Not Qualified	e1
MCIMX355AJQ4C	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.47 V	AEC-Q100		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.22 V	85 Cel	-40 Cel			BOTTOM	1.6 mm	17 mm				17 mm	CMOS	1.8 V		.8 mm	S-PBGA-B400		Not Qualified
MCIMX353DJQ5C	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.47 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.33 V	70 Cel	-20 Cel	TIN SILVER COPPER		BOTTOM	1.6 mm	17 mm	IT ALSO OPERATES AT 1.22 TO 1.47 V	40	260	17 mm	CMOS	1.8 V		.8 mm	S-PBGA-B400	3	Not Qualified	e1

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.