5601 Other Function uPs,uCs & Peripheral ICs 52

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Part	Manufacturer	Peripheral IC Type	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Position	Maximum Seated Height	Width	Length	Technology	Nominal Supply Voltage	Terminal Pitch	JESD-30 Code
XCVP1802-2MLEVSVA5601	Xilinx	MICROPROCESSOR CIRCUIT	BALL	5601	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA5601,75X75,36	.775 V	110 Cel	0 Cel	BOTTOM	4.55 mm	70 mm	70 mm	CMOS	.8 V	.92 mm	S-PBGA-B5601
XCVP1802-2MSIVSVA5601	Xilinx	MICROPROCESSOR CIRCUIT	BALL	5601	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA5601,75X75,36	.775 V	110 Cel	-40 Cel	BOTTOM	4.55 mm	70 mm	70 mm	CMOS	.8 V	.92 mm	S-PBGA-B5601
XCVP2802-1LSIVSVA5601	Xilinx	MICROPROCESSOR CIRCUIT	BALL	5601	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA5601,75X75,36	.676 V	110 Cel	-40 Cel	BOTTOM	4.55 mm	70 mm	70 mm	CMOS	.7 V	.92 mm	S-PBGA-B5601
XCVP1802-3HSEVSVA5601	Xilinx	MICROPROCESSOR CIRCUIT	BALL	5601	HBGA	SQUARE	PLASTIC/EPOXY	YES	.906 V	GRID ARRAY, HEAT SINK/SLUG	BGA5601,75X75,36	.854 V	100 Cel	0 Cel	BOTTOM	4.55 mm	70 mm	70 mm	CMOS	.88 V	.92 mm	S-PBGA-B5601
XCVP1702-1MLIVSVA5601	Xilinx	MICROPROCESSOR CIRCUIT	BALL	5601	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	-40 Cel	BOTTOM				CMOS	.8 V		R-PBGA-B5601
XCVP2502-2MSEVSVA5601	Xilinx	MICROPROCESSOR CIRCUIT	BALL	5601	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	0 Cel	BOTTOM				CMOS	.8 V		R-PBGA-B5601
XCVP1702-2MSEVSVA5601	Xilinx	MICROPROCESSOR CIRCUIT	BALL	5601	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	0 Cel	BOTTOM				CMOS	.8 V		R-PBGA-B5601
XCVP2802-2MLEVSVA5601	Xilinx	MICROPROCESSOR CIRCUIT	BALL	5601	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA5601,75X75,36	.775 V	110 Cel	0 Cel	BOTTOM	4.55 mm	70 mm	70 mm	CMOS	.8 V	.92 mm	S-PBGA-B5601
XCVP1802-1MLIVSVA5601	Xilinx	MICROPROCESSOR CIRCUIT	BALL	5601	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA5601,75X75,36	.775 V	110 Cel	-40 Cel	BOTTOM	4.55 mm	70 mm	70 mm	CMOS	.8 V	.92 mm	S-PBGA-B5601
XCVP2802-2MSIVSVA5601	Xilinx	MICROPROCESSOR CIRCUIT	BALL	5601	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA5601,75X75,36	.775 V	110 Cel	-40 Cel	BOTTOM	4.55 mm	70 mm	70 mm	CMOS	.8 V	.92 mm	S-PBGA-B5601
XCVP1702-1LLIVSVA5601	Xilinx	MICROPROCESSOR CIRCUIT	BALL	5601	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	110 Cel	-40 Cel	BOTTOM				CMOS	.7 V		R-PBGA-B5601
XCVP1702-3HSEVSVA5601	Xilinx	MICROPROCESSOR CIRCUIT	BALL	5601	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.906 V	GRID ARRAY		.854 V	100 Cel	0 Cel	BOTTOM				CMOS	.88 V		R-PBGA-B5601
XCVP1802-2MLIVSVA5601	Xilinx	MICROPROCESSOR CIRCUIT	BALL	5601	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA5601,75X75,36	.775 V	110 Cel	-40 Cel	BOTTOM	4.55 mm	70 mm	70 mm	CMOS	.8 V	.92 mm	S-PBGA-B5601
XCVP2802-1MLIVSVA5601	Xilinx	MICROPROCESSOR CIRCUIT	BALL	5601	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA5601,75X75,36	.775 V	110 Cel	-40 Cel	BOTTOM	4.55 mm	70 mm	70 mm	CMOS	.8 V	.92 mm	S-PBGA-B5601
XCVP1802-1MSIVSVA5601	Xilinx	MICROPROCESSOR CIRCUIT	BALL	5601	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA5601,75X75,36	.775 V	110 Cel	-40 Cel	BOTTOM	4.55 mm	70 mm	70 mm	CMOS	.8 V	.92 mm	S-PBGA-B5601
XCVP2502-1MSEVSVA5601	Xilinx	MICROPROCESSOR CIRCUIT	BALL	5601	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	100 Cel	0 Cel	BOTTOM				CMOS	.8 V		R-PBGA-B5601
XCVP2502-1LSIVSVA5601	Xilinx	MICROPROCESSOR CIRCUIT	BALL	5601	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	110 Cel	-40 Cel	BOTTOM				CMOS	.7 V		R-PBGA-B5601
XCVP1702-1LSEVSVA5601	Xilinx	MICROPROCESSOR CIRCUIT	BALL	5601	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	100 Cel	0 Cel	BOTTOM				CMOS	.7 V		R-PBGA-B5601
XCVP2502-2MLEVSVA5601	Xilinx	MICROPROCESSOR CIRCUIT	BALL	5601	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	0 Cel	BOTTOM				CMOS	.8 V		R-PBGA-B5601
XCVP2802-2MLIVSVA5601	Xilinx	MICROPROCESSOR CIRCUIT	BALL	5601	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA5601,75X75,36	.775 V	110 Cel	-40 Cel	BOTTOM	4.55 mm	70 mm	70 mm	CMOS	.8 V	.92 mm	S-PBGA-B5601
XCVP1702-1MSEVSVA5601	Xilinx	MICROPROCESSOR CIRCUIT	BALL	5601	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	100 Cel	0 Cel	BOTTOM				CMOS	.8 V		R-PBGA-B5601
XCVP2502-1LSEVSVA5601	Xilinx	MICROPROCESSOR CIRCUIT	BALL	5601	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	100 Cel	0 Cel	BOTTOM				CMOS	.7 V		R-PBGA-B5601
XCVP1702-1MSIVSVA5601	Xilinx	MICROPROCESSOR CIRCUIT	BALL	5601	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	-40 Cel	BOTTOM				CMOS	.8 V		R-PBGA-B5601
XCVP2502-2LSEVSVA5601	Xilinx	MICROPROCESSOR CIRCUIT	BALL	5601	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	110 Cel	0 Cel	BOTTOM				CMOS	.7 V		R-PBGA-B5601
XCVP2802-2LSEVSVA5601	Xilinx	MICROPROCESSOR CIRCUIT	BALL	5601	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA5601,75X75,36	.676 V	110 Cel	0 Cel	BOTTOM	4.55 mm	70 mm	70 mm	CMOS	.7 V	.92 mm	S-PBGA-B5601
XCVP1802-1LSEVSVA5601	Xilinx	MICROPROCESSOR CIRCUIT	BALL	5601	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA5601,75X75,36	.676 V	100 Cel	0 Cel	BOTTOM	4.55 mm	70 mm	70 mm	CMOS	.7 V	.92 mm	S-PBGA-B5601
XCVP2502-3HSEVSVA5601	Xilinx	MICROPROCESSOR CIRCUIT	BALL	5601	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.906 V	GRID ARRAY		.854 V	100 Cel	0 Cel	BOTTOM				CMOS	.88 V		R-PBGA-B5601
XCVP1702-2LSEVSVA5601	Xilinx	MICROPROCESSOR CIRCUIT	BALL	5601	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	110 Cel	0 Cel	BOTTOM				CMOS	.7 V		R-PBGA-B5601
XCVP1702-2MLEVSVA5601	Xilinx	MICROPROCESSOR CIRCUIT	BALL	5601	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	0 Cel	BOTTOM				CMOS	.8 V		R-PBGA-B5601
XCVP1802-2LLEVSVA5601	Xilinx	MICROPROCESSOR CIRCUIT	BALL	5601	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA5601,75X75,36	.676 V	110 Cel	0 Cel	BOTTOM	4.55 mm	70 mm	70 mm	CMOS	.7 V	.92 mm	S-PBGA-B5601
XCVP1802-1LLIVSVA5601	Xilinx	MICROPROCESSOR CIRCUIT	BALL	5601	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA5601,75X75,36	.676 V	110 Cel	-40 Cel	BOTTOM	4.55 mm	70 mm	70 mm	CMOS	.7 V	.92 mm	S-PBGA-B5601
XCVP2502-2MLIVSVA5601	Xilinx	MICROPROCESSOR CIRCUIT	BALL	5601	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	-40 Cel	BOTTOM				CMOS	.8 V		R-PBGA-B5601
XCVP1702-2MSIVSVA5601	Xilinx	MICROPROCESSOR CIRCUIT	BALL	5601	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	-40 Cel	BOTTOM				CMOS	.8 V		R-PBGA-B5601
XCVP1802-1MSEVSVA5601	Xilinx	MICROPROCESSOR CIRCUIT	BALL	5601	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA5601,75X75,36	.775 V	100 Cel	0 Cel	BOTTOM	4.55 mm	70 mm	70 mm	CMOS	.8 V	.92 mm	S-PBGA-B5601
XCVP1702-1LSIVSVA5601	Xilinx	MICROPROCESSOR CIRCUIT	BALL	5601	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	110 Cel	-40 Cel	BOTTOM				CMOS	.7 V		R-PBGA-B5601
XCVP2802-1MSEVSVA5601	Xilinx	MICROPROCESSOR CIRCUIT	BALL	5601	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA5601,75X75,36	.775 V	100 Cel	0 Cel	BOTTOM	4.55 mm	70 mm	70 mm	CMOS	.8 V	.92 mm	S-PBGA-B5601
XCVP1702-2LLEVSVA5601	Xilinx	MICROPROCESSOR CIRCUIT	BALL	5601	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	110 Cel	0 Cel	BOTTOM				CMOS	.7 V		R-PBGA-B5601
XCVP2802-3HSEVSVA5601	Xilinx	MICROPROCESSOR CIRCUIT	BALL	5601	HBGA	SQUARE	PLASTIC/EPOXY	YES	.906 V	GRID ARRAY, HEAT SINK/SLUG	BGA5601,75X75,36	.854 V	100 Cel	0 Cel	BOTTOM	4.55 mm	70 mm	70 mm	CMOS	.88 V	.92 mm	S-PBGA-B5601
XCVP2502-1MLIVSVA5601	Xilinx	MICROPROCESSOR CIRCUIT	BALL	5601	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	-40 Cel	BOTTOM				CMOS	.8 V		R-PBGA-B5601
XCVP1702-2MLIVSVA5601	Xilinx	MICROPROCESSOR CIRCUIT	BALL	5601	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	-40 Cel	BOTTOM				CMOS	.8 V		R-PBGA-B5601
XCVP2502-1LLIVSVA5601	Xilinx	MICROPROCESSOR CIRCUIT	BALL	5601	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	110 Cel	-40 Cel	BOTTOM				CMOS	.7 V		R-PBGA-B5601
XCVP1802-2LSEVSVA5601	Xilinx	MICROPROCESSOR CIRCUIT	BALL	5601	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA5601,75X75,36	.676 V	110 Cel	0 Cel	BOTTOM	4.55 mm	70 mm	70 mm	CMOS	.7 V	.92 mm	S-PBGA-B5601
XCVP2802-1LLIVSVA5601	Xilinx	MICROPROCESSOR CIRCUIT	BALL	5601	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA5601,75X75,36	.676 V	110 Cel	-40 Cel	BOTTOM	4.55 mm	70 mm	70 mm	CMOS	.7 V	.92 mm	S-PBGA-B5601
XCVP2802-2MSEVSVA5601	Xilinx	MICROPROCESSOR CIRCUIT	BALL	5601	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA5601,75X75,36	.775 V	110 Cel	0 Cel	BOTTOM	4.55 mm	70 mm	70 mm	CMOS	.8 V	.92 mm	S-PBGA-B5601
XCVP2502-2LLEVSVA5601	Xilinx	MICROPROCESSOR CIRCUIT	BALL	5601	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	110 Cel	0 Cel	BOTTOM				CMOS	.7 V		R-PBGA-B5601
XCVP2502-1MSIVSVA5601	Xilinx	MICROPROCESSOR CIRCUIT	BALL	5601	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	-40 Cel	BOTTOM				CMOS	.8 V		R-PBGA-B5601
XCVP2802-1MSIVSVA5601	Xilinx	MICROPROCESSOR CIRCUIT	BALL	5601	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA5601,75X75,36	.775 V	110 Cel	-40 Cel	BOTTOM	4.55 mm	70 mm	70 mm	CMOS	.8 V	.92 mm	S-PBGA-B5601
XCVP2802-1LSEVSVA5601	Xilinx	MICROPROCESSOR CIRCUIT	BALL	5601	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA5601,75X75,36	.676 V	100 Cel	0 Cel	BOTTOM	4.55 mm	70 mm	70 mm	CMOS	.7 V	.92 mm	S-PBGA-B5601

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.