625 Other Function uPs,uCs & Peripheral ICs 90

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Sub-Category	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	JESD-609 Code
XCZU3EG-1SFVA625E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	625	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM				30	250		CMOS	.85 V			R-PBGA-B625	4		e1
XCZU2EG-1SFVA625E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	625	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM				30	250		CMOS	.85 V			R-PBGA-B625	4		e1
XAZU2EG-L1SFVA625I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	625	FBGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY, FINE PITCH			100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.43 mm	21 mm		30	250	21 mm	CMOS	.72 V		.8 mm	S-PBGA-B625	3		e1
XCZU2CG-1SFVA625E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	625	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM				30	250		CMOS	.85 V			R-PBGA-B625	4		e1
XCZU3CG-1SFVA625E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	625	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM				30	250		CMOS	.85 V			R-PBGA-B625	4		e1
66AK2G12ABY60	Texas Instruments	SYSTEM ON CHIP	COMMERCIAL	BALL	625	LFBGA	SQUARE	PLASTIC/EPOXY	YES	.945 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA625,25X25,32	.855 V	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.56 mm	21 mm		30	260	21 mm	CMOS	.9 V		.8 mm	S-PBGA-B625	3		e1
XCZU2EG-1SFVA625I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	625	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY		.825 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM				30	250		CMOS	.85 V			R-PBGA-B625	4		e1
XCZU2CG-L1SFVA625I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	625	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V		GRID ARRAY		.698 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	30	250		CMOS	.72 V			R-PBGA-B625	4		e1
66AK2G12ABYA60	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	625	LFBGA	SQUARE	PLASTIC/EPOXY	YES	.945 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA625,25X25,32	.855 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.56 mm	21 mm		30	260	21 mm	CMOS	.9 V		.8 mm	S-PBGA-B625	3		e1
66AK2G12ABY100	Texas Instruments	SYSTEM ON CHIP	COMMERCIAL	BALL	625	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA625,25X25,32	.95 V	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.56 mm	21 mm		30	260	21 mm	CMOS	1 V		.8 mm	S-PBGA-B625	3		e1
XCZU3CG-1SFVA625I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	625	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY		.825 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM				30	250		CMOS	.85 V			R-PBGA-B625	4		e1
XCZU3CG-L2SFVA625E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	625	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V		GRID ARRAY		.698 V	110 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	30	250		CMOS	.72 V			R-PBGA-B625	4		e1
XCZU2CG-L2SFVA625E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	625	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V		GRID ARRAY		.698 V	110 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	30	250		CMOS	.72 V			R-PBGA-B625	4		e1
XAZU2EG-1SFVA625I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	625	FBGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY, FINE PITCH			100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.43 mm	21 mm		30	250	21 mm	CMOS	.85 V		.8 mm	S-PBGA-B625	3		e1
XCZU3EG-1SFVA625I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	625	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY		.825 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM				30	250		CMOS	.85 V			R-PBGA-B625	4		e1
66AK2G12ABYA100	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	625	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA625,25X25,32	.95 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.56 mm	21 mm		30	260	21 mm	CMOS	1 V		.8 mm	S-PBGA-B625	3		e1
66AK2G12ABYA60E	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	625	LFBGA	SQUARE	PLASTIC/EPOXY	YES	.945 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA625,25X25,32	.855 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.56 mm	21 mm		30	260	21 mm	CMOS	.9 V		.8 mm	S-PBGA-B625	3		e1
66AK2G12ABYT100	Texas Instruments	SYSTEM ON CHIP	AUTOMOTIVE	BALL	625	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA625,25X25,32	.95 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.56 mm	21 mm		30	260	21 mm	CMOS	1 V		.8 mm	S-PBGA-B625	3		e1
66AK2G12ABYA100E	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	625	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA625,25X25,32	.95 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.56 mm	21 mm		30	260	21 mm	CMOS	1 V		.8 mm	S-PBGA-B625	3		e1
MCIMX515DVK8C	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	625	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V	1.2	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA527,25X25,20	1.05 V	85 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	13 mm	UNAVAILABLE FOR IMPORT OR SALE IN US	40	260	13 mm	CMOS	1.1 V	Graphics Processors	.5 mm	S-PBGA-B625	3	Not Qualified	e1
XCVE2002-2HSISBVA625	Xilinx	MICROPROCESSOR CIRCUIT		BALL	625	BGA	SQUARE	PLASTIC/EPOXY	YES	.906 V		GRID ARRAY		.854 V	110 Cel	-40 Cel		BOTTOM							CMOS	.88 V			S-PBGA-B625
XCVE2102-2HSISBVA625	Xilinx	MICROPROCESSOR CIRCUIT		BALL	625	BGA	SQUARE	PLASTIC/EPOXY	YES	.906 V		GRID ARRAY		.854 V	110 Cel	-40 Cel		BOTTOM							CMOS	.88 V			S-PBGA-B625
XCVE2002-2LLISBVA625	Xilinx	MICROPROCESSOR CIRCUIT		BALL	625	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V		GRID ARRAY		.676 V	110 Cel	-40 Cel		BOTTOM							CMOS	.7 V			S-PBGA-B625
XCVE2002-1LLISBVA625	Xilinx	MICROPROCESSOR CIRCUIT		BALL	625	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V		GRID ARRAY		.676 V	110 Cel	-40 Cel		BOTTOM							CMOS	.7 V			S-PBGA-B625
XCVE2102-1LSISBVA625	Xilinx	MICROPROCESSOR CIRCUIT		BALL	625	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V		GRID ARRAY		.676 V	110 Cel	-40 Cel		BOTTOM							CMOS	.7 V			S-PBGA-B625
XCVE2002-1MSESBVA625	Xilinx	MICROPROCESSOR CIRCUIT		BALL	625	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V		GRID ARRAY		.775 V	100 Cel	0 Cel		BOTTOM							CMOS	.8 V			S-PBGA-B625
XCVE2102-2MLESBVA625	Xilinx	MICROPROCESSOR CIRCUIT		BALL	625	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V		GRID ARRAY		.775 V	110 Cel	0 Cel		BOTTOM							CMOS	.8 V			S-PBGA-B625
XCVE2002-1LSISBVA625	Xilinx	MICROPROCESSOR CIRCUIT		BALL	625	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V		GRID ARRAY		.676 V	110 Cel	-40 Cel		BOTTOM							CMOS	.7 V			S-PBGA-B625
XCVE2102-1MLISBVA625	Xilinx	MICROPROCESSOR CIRCUIT		BALL	625	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V		GRID ARRAY		.775 V	110 Cel	-40 Cel		BOTTOM							CMOS	.8 V			S-PBGA-B625
XCVE2002-2MLESBVA625	Xilinx	MICROPROCESSOR CIRCUIT		BALL	625	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V		GRID ARRAY		.775 V	110 Cel	0 Cel		BOTTOM							CMOS	.8 V			S-PBGA-B625
XCVE2102-2MLISBVA625	Xilinx	MICROPROCESSOR CIRCUIT		BALL	625	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V		GRID ARRAY		.775 V	110 Cel	-40 Cel		BOTTOM							CMOS	.8 V			S-PBGA-B625
XCVE2102-2LLESBVA625	Xilinx	MICROPROCESSOR CIRCUIT		BALL	625	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V		GRID ARRAY		.676 V	110 Cel	0 Cel		BOTTOM							CMOS	.7 V			S-PBGA-B625
XCVE2002-1MSISBVA625	Xilinx	MICROPROCESSOR CIRCUIT		BALL	625	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V		GRID ARRAY		.775 V	110 Cel	-40 Cel		BOTTOM							CMOS	.8 V			S-PBGA-B625
XCVE2102-1LLISBVA625	Xilinx	MICROPROCESSOR CIRCUIT		BALL	625	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V		GRID ARRAY		.676 V	110 Cel	-40 Cel		BOTTOM							CMOS	.7 V			S-PBGA-B625
XCVE2002-1LSESBVA625	Xilinx	MICROPROCESSOR CIRCUIT		BALL	625	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V		GRID ARRAY		.676 V	100 Cel	0 Cel		BOTTOM							CMOS	.7 V			S-PBGA-B625
XCVE2102-2MSESBVA625	Xilinx	MICROPROCESSOR CIRCUIT		BALL	625	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V		GRID ARRAY		.775 V	110 Cel	0 Cel		BOTTOM							CMOS	.8 V			S-PBGA-B625
XCVE2002-2MSESBVA625	Xilinx	MICROPROCESSOR CIRCUIT		BALL	625	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V		GRID ARRAY		.775 V	110 Cel	0 Cel		BOTTOM							CMOS	.8 V			S-PBGA-B625
XCVE2002-2LSESBVA625	Xilinx	MICROPROCESSOR CIRCUIT		BALL	625	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V		GRID ARRAY		.676 V	110 Cel	0 Cel		BOTTOM							CMOS	.7 V			S-PBGA-B625
XCVE2102-1MSESBVA625	Xilinx	MICROPROCESSOR CIRCUIT		BALL	625	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V		GRID ARRAY		.775 V	100 Cel	0 Cel		BOTTOM							CMOS	.8 V			S-PBGA-B625
XCVE2002-2MSISBVA625	Xilinx	MICROPROCESSOR CIRCUIT		BALL	625	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V		GRID ARRAY		.775 V	110 Cel	-40 Cel		BOTTOM							CMOS	.8 V			S-PBGA-B625
XCVE2102-2MSISBVA625	Xilinx	MICROPROCESSOR CIRCUIT		BALL	625	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V		GRID ARRAY		.775 V	110 Cel	-40 Cel		BOTTOM							CMOS	.8 V			S-PBGA-B625
XCVE2002-2LLESBVA625	Xilinx	MICROPROCESSOR CIRCUIT		BALL	625	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V		GRID ARRAY		.676 V	110 Cel	0 Cel		BOTTOM							CMOS	.7 V			S-PBGA-B625
XCVE2002-2MLISBVA625	Xilinx	MICROPROCESSOR CIRCUIT		BALL	625	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V		GRID ARRAY		.775 V	110 Cel	-40 Cel		BOTTOM							CMOS	.8 V			S-PBGA-B625
XCVE2002-1MLISBVA625	Xilinx	MICROPROCESSOR CIRCUIT		BALL	625	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V		GRID ARRAY		.775 V	110 Cel	-40 Cel		BOTTOM							CMOS	.8 V			S-PBGA-B625
XCVE2102-2LSESBVA625	Xilinx	MICROPROCESSOR CIRCUIT		BALL	625	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V		GRID ARRAY		.676 V	110 Cel	0 Cel		BOTTOM							CMOS	.7 V			S-PBGA-B625
XCVE2102-1MSISBVA625	Xilinx	MICROPROCESSOR CIRCUIT		BALL	625	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V		GRID ARRAY		.775 V	110 Cel	-40 Cel		BOTTOM							CMOS	.8 V			S-PBGA-B625
XCVE2102-1LSESBVA625	Xilinx	MICROPROCESSOR CIRCUIT		BALL	625	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V		GRID ARRAY		.676 V	100 Cel	0 Cel		BOTTOM							CMOS	.7 V			S-PBGA-B625
XCVE2102-2LLISBVA625	Xilinx	MICROPROCESSOR CIRCUIT		BALL	625	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V		GRID ARRAY		.676 V	110 Cel	-40 Cel		BOTTOM							CMOS	.7 V			S-PBGA-B625

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.