625 Other Function uPs,uCs & Peripheral ICs 90

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	External Data Bus Width	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Bus Compatibility	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	JESD-609 Code
XCZU3CG-L1SFVA625I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	625	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V	GRID ARRAY		.698 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY		30	250		CMOS	.72 V			R-PBGA-B625	4	e1
XAZU2EG-1SFVA625Q	Xilinx	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	625	FBGA	SQUARE	PLASTIC/EPOXY	YES		GRID ARRAY, FINE PITCH			125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.43 mm	21 mm			30	250	21 mm	CMOS	.85 V		.8 mm	S-PBGA-B625	3	e1
XCZU3CG-2SFVA625I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	625	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY		.825 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM					30	250		CMOS	.85 V			R-PBGA-B625	4	e1
XCZU2CG-1SFVA625I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	625	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY		.825 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM					30	250		CMOS	.85 V			R-PBGA-B625	4	e1
XCZU3EG-L1SFVA625I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	625	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V	GRID ARRAY		.698 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY		30	250		CMOS	.72 V			R-PBGA-B625	4	e1
XCZU3EG-L2SFVA625E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	625	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V	GRID ARRAY		.698 V	110 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY		30	250		CMOS	.72 V			R-PBGA-B625	4	e1
XCZU3CG-1LSFVA625I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	625	FBGA	SQUARE	PLASTIC/EPOXY	YES		GRID ARRAY, FINE PITCH	BGA625,25X25,32		100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.43 mm	21 mm		0	30	250	21 mm	CMOS	.85 V	CAN, I2C, SPI, UART	.8 mm	S-PBGA-B625	4	e1
XCZU9CG-1SFVA625I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	625	FBGA	SQUARE	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY, FINE PITCH	BGA625,25X25,32	.825 V	100 Cel	-40 Cel		BOTTOM	3.43 mm	21 mm					21 mm	CMOS	.85 V	I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)	.8 mm	S-PBGA-B625
XCZU2EG-L2SFVA625E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	625	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V	GRID ARRAY		.698 V	110 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY		30	250		CMOS	.72 V			R-PBGA-B625	4	e1
XCZU9CG-2SFVA625E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	625	FBGA	SQUARE	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY, FINE PITCH	BGA625,25X25,32	.825 V	100 Cel	0 Cel		BOTTOM	3.43 mm	21 mm					21 mm	CMOS	.85 V	I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)	.8 mm	S-PBGA-B625
XCZU2CG-1LSFVA625I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	625	FBGA	SQUARE	PLASTIC/EPOXY	YES		GRID ARRAY, FINE PITCH	BGA625,25X25,32		100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.43 mm	21 mm		0	30	250	21 mm	CMOS	.85 V	CAN, I2C, SPI, UART	.8 mm	S-PBGA-B625	4	e1
XCZU9CG-L1SFVA625I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	625	FBGA	SQUARE	PLASTIC/EPOXY	YES	.742 V	GRID ARRAY, FINE PITCH	BGA625,25X25,32	.698 V	100 Cel	-40 Cel		BOTTOM	3.43 mm	21 mm	ALSO OPERATES AT 0.85V NOMINAL SUPPLY				21 mm	CMOS	.72 V	I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)	.8 mm	S-PBGA-B625
XAZU3EG-1SFVA625I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	625	FBGA	SQUARE	PLASTIC/EPOXY	YES		GRID ARRAY, FINE PITCH			100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.43 mm	21 mm			30	250	21 mm	CMOS	.85 V		.8 mm	S-PBGA-B625	3	e1
XCZU9CG-1SFVA625E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	625	FBGA	SQUARE	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY, FINE PITCH	BGA625,25X25,32	.825 V	100 Cel	0 Cel		BOTTOM	3.43 mm	21 mm					21 mm	CMOS	.85 V	I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)	.8 mm	S-PBGA-B625
XCZU2EG-L1SFVA625I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	625	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V	GRID ARRAY		.698 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY		30	250		CMOS	.72 V			R-PBGA-B625	4	e1
XCZU6CG-2SFVA625E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	625	FBGA	SQUARE	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY, FINE PITCH	BGA625,25X25,32	.825 V	100 Cel	0 Cel		BOTTOM	3.43 mm	21 mm					21 mm	CMOS	.85 V	I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)	.8 mm	S-PBGA-B625
XCZU2EG-2SFVA625E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	625	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.43 mm	21 mm			30	250	21 mm	CMOS	.85 V		.8 mm	R-PBGA-B625	4	e1
XCZU6CG-1SFVA625I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	625	FBGA	SQUARE	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY, FINE PITCH	BGA625,25X25,32	.825 V	100 Cel	-40 Cel		BOTTOM	3.43 mm	21 mm					21 mm	CMOS	.85 V	I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)	.8 mm	S-PBGA-B625
XCZU2EG-3SFVA625E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	625	BGA	SQUARE	PLASTIC/EPOXY	YES		GRID ARRAY			100 Cel	0 Cel	TIN SILVER COPPER	BOTTOM					30	250		CMOS	.9 V			S-PBGA-B625	4	e1
XCZU2CG-2SFVA625I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	625	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY		.825 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM					30	250		CMOS	.85 V			R-PBGA-B625	4	e1
XCZU2EG-2LSFVA625E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	625	FBGA	SQUARE	PLASTIC/EPOXY	YES		GRID ARRAY, FINE PITCH	BGA625,25X25,32		110 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.43 mm	21 mm		0	30	250	21 mm	CMOS	.85 V	CAN, I2C, SPI, UART	.8 mm	S-PBGA-B625	4	e1
XCZU3EG-1LSFVA625I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	625	FBGA	SQUARE	PLASTIC/EPOXY	YES		GRID ARRAY, FINE PITCH	BGA625,25X25,32		100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.43 mm	21 mm		0	30	250	21 mm	CMOS	.85 V	CAN, I2C, SPI, UART	.8 mm	S-PBGA-B625	4	e1
XCZU2CG-2LSFVA625I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	625	FBGA	SQUARE	PLASTIC/EPOXY	YES		GRID ARRAY, FINE PITCH	BGA625,25X25,32		100 Cel	-40 Cel		BOTTOM	3.43 mm	21 mm		0			21 mm	CMOS	.85 V	CAN, I2C, SPI, UART	.8 mm	S-PBGA-B625
XCZU3EG-2SFVA625E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	625	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.43 mm	21 mm			30	250	21 mm	CMOS	.85 V		.8 mm	R-PBGA-B625	4	e1
XCZU3EG-2LSFVA625I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	625	FBGA	SQUARE	PLASTIC/EPOXY	YES		GRID ARRAY, FINE PITCH	BGA625,25X25,32		100 Cel	-40 Cel		BOTTOM	3.43 mm	21 mm		0			21 mm	CMOS	.85 V	CAN, I2C, SPI, UART	.8 mm	S-PBGA-B625
XCZU6CG-2SFVA625I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	625	FBGA	SQUARE	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY, FINE PITCH	BGA625,25X25,32	.825 V	100 Cel	-40 Cel		BOTTOM	3.43 mm	21 mm					21 mm	CMOS	.85 V	I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)	.8 mm	S-PBGA-B625
XCZU6CG-1SFVA625E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	625	FBGA	SQUARE	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY, FINE PITCH	BGA625,25X25,32	.825 V	100 Cel	0 Cel		BOTTOM	3.43 mm	21 mm					21 mm	CMOS	.85 V	I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)	.8 mm	S-PBGA-B625
XCZU3EG-2LSFVA625E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	625	FBGA	SQUARE	PLASTIC/EPOXY	YES		GRID ARRAY, FINE PITCH	BGA625,25X25,32		110 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.43 mm	21 mm		0	30	250	21 mm	CMOS	.85 V	CAN, I2C, SPI, UART	.8 mm	S-PBGA-B625	4	e1
XCZU3CG-2LSFVA625E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	625	FBGA	SQUARE	PLASTIC/EPOXY	YES		GRID ARRAY, FINE PITCH	BGA625,25X25,32		110 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.43 mm	21 mm		0	30	250	21 mm	CMOS	.85 V	CAN, I2C, SPI, UART	.8 mm	S-PBGA-B625	4	e1
XCZU3EG-3SFVA625E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	625	BGA	SQUARE	PLASTIC/EPOXY	YES		GRID ARRAY			100 Cel	0 Cel	TIN SILVER COPPER	BOTTOM								CMOS	.9 V			S-PBGA-B625	4	e1
XCZU2EG-1LSFVA625I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	625	FBGA	SQUARE	PLASTIC/EPOXY	YES		GRID ARRAY, FINE PITCH	BGA625,25X25,32		100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.43 mm	21 mm		0	30	250	21 mm	CMOS	.85 V	CAN, I2C, SPI, UART	.8 mm	S-PBGA-B625	4	e1
XCZU3CG-2SFVA625E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	625	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.43 mm	21 mm			30	250	21 mm	CMOS	.85 V		.8 mm	R-PBGA-B625	4	e1
XCZU2EG-2LSFVA625I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	625	FBGA	SQUARE	PLASTIC/EPOXY	YES		GRID ARRAY, FINE PITCH	BGA625,25X25,32		100 Cel	-40 Cel		BOTTOM	3.43 mm	21 mm		0			21 mm	CMOS	.85 V	CAN, I2C, SPI, UART	.8 mm	S-PBGA-B625
XCZU6CG-L1SFVA625I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	625	FBGA	SQUARE	PLASTIC/EPOXY	YES	.742 V	GRID ARRAY, FINE PITCH	BGA625,25X25,32	.698 V	100 Cel	-40 Cel		BOTTOM	3.43 mm	21 mm	ALSO OPERATES AT 0.85V NOMINAL SUPPLY				21 mm	CMOS	.72 V	I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)	.8 mm	S-PBGA-B625
XCZU9CG-2SFVA625I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	625	FBGA	SQUARE	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY, FINE PITCH	BGA625,25X25,32	.825 V	100 Cel	-40 Cel		BOTTOM	3.43 mm	21 mm					21 mm	CMOS	.85 V	I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)	.8 mm	S-PBGA-B625
XCZU2EG-2SFVA625I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	625	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY		.825 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM					30	250		CMOS	.85 V			R-PBGA-B625	4	e1
XCZU2CG-2LSFVA625E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	625	FBGA	SQUARE	PLASTIC/EPOXY	YES		GRID ARRAY, FINE PITCH	BGA625,25X25,32		110 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.43 mm	21 mm		0	30	250	21 mm	CMOS	.85 V	CAN, I2C, SPI, UART	.8 mm	S-PBGA-B625	4	e1
XAZU3EG-L1SFVA625I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	625	FBGA	SQUARE	PLASTIC/EPOXY	YES		GRID ARRAY, FINE PITCH			100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.43 mm	21 mm			30	250	21 mm	CMOS	.72 V		.8 mm	S-PBGA-B625	3	e1
XCZU3CG-2LSFVA625I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	625	FBGA	SQUARE	PLASTIC/EPOXY	YES		GRID ARRAY, FINE PITCH	BGA625,25X25,32		100 Cel	-40 Cel		BOTTOM	3.43 mm	21 mm		0			21 mm	CMOS	.85 V	CAN, I2C, SPI, UART	.8 mm	S-PBGA-B625
XCZU3EG-2SFVA625I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	625	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY		.825 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM					30	250		CMOS	.85 V			R-PBGA-B625	4	e1
XAZU3EG-1SFVA625Q	Xilinx	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	625	FBGA	SQUARE	PLASTIC/EPOXY	YES		GRID ARRAY, FINE PITCH			125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.43 mm	21 mm			30	250	21 mm	CMOS	.85 V		.8 mm	S-PBGA-B625	3	e1
XCZU2CG-2SFVA625E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	625	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM	3.43 mm	21 mm			30	250	21 mm	CMOS	.85 V		.8 mm	R-PBGA-B625	4	e1

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.