780 Other Function uPs,uCs & Peripheral ICs 277

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	JESD-609 Code
LS1043ASN8QNLB	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.87 V	105 Cel	0 Cel		BOTTOM	2.07 mm	23 mm				23 mm	CMOS	.9 V	.8 mm	S-PBGA-B780
LS1044ASN7MQA	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V	GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	0 Cel		BOTTOM	2.61 mm	23 mm			250	23 mm	CMOS	1.025 V	.8 mm	S-PBGA-B780	3
LS1088ASE7QTA	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V	GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	0 Cel		BOTTOM	2.61 mm	23 mm				23 mm	CMOS	1.025 V	.8 mm	S-PBGA-B780
LS1084AXE7Q1A	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V	GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm		30	250	23 mm	CMOS	1.025 V	.8 mm	S-PBGA-B780	3	e1
LS1084AXN7Q1A	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V	GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm		30	250	23 mm	CMOS	1.025 V	.8 mm	S-PBGA-B780	3	e1
LS1043ACE9MQB	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.87 V			TIN SILVER COPPER	BOTTOM	2.07 mm	23 mm		30	250	23 mm	CMOS	.9 V	.8 mm	S-PBGA-B780	3	e1
LS1088ASE7QQA	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V	GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	0 Cel		BOTTOM	2.61 mm	23 mm				23 mm	CMOS	1.025 V	.8 mm	S-PBGA-B780
LS1043ASE8PQLA	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.87 V	105 Cel	0 Cel		BOTTOM	2.07 mm	23 mm				23 mm	CMOS	.9 V	.8 mm	S-PBGA-B780
LS1043ASE8MQLA	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.87 V	105 Cel	0 Cel		BOTTOM	2.07 mm	23 mm				23 mm	CMOS	.9 V	.8 mm	S-PBGA-B780
LS1043ASE8KNLA	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.87 V	105 Cel	0 Cel		BOTTOM	2.07 mm	23 mm		30	250	23 mm	CMOS	.9 V	.8 mm	S-PBGA-B780	3
LS1043AXN8PNLB	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.87 V	105 Cel	-40 Cel		BOTTOM	2.07 mm	23 mm				23 mm	CMOS	.9 V	.8 mm	S-PBGA-B780
LS1043AXE8MNLA	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.87 V	105 Cel	-40 Cel		BOTTOM	2.07 mm	23 mm				23 mm	CMOS	.9 V	.8 mm	S-PBGA-B780
LS1084AXN7MQA	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V	GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm		30	250	23 mm	CMOS	1.025 V	.8 mm	S-PBGA-B780	3	e1
LS1088AXE7MQA	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V	GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm		30	250	23 mm	CMOS	1.025 V	.8 mm	S-PBGA-B780	3	e1
LS1088AXN7M1A	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V	GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	-40 Cel		BOTTOM	2.61 mm	23 mm				23 mm	CMOS	1.025 V	.8 mm	S-PBGA-B780
LS1043ASN8PNLB	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.87 V	105 Cel	0 Cel		BOTTOM	2.07 mm	23 mm				23 mm	CMOS	.9 V	.8 mm	S-PBGA-B780
LS1088ASN7QTA	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V	GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	0 Cel		BOTTOM	2.61 mm	23 mm				23 mm	CMOS	1.025 V	.8 mm	S-PBGA-B780
LS1043AXN8PNLA	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.87 V	105 Cel	-40 Cel		BOTTOM	2.07 mm	23 mm				23 mm	CMOS	.9 V	.8 mm	S-PBGA-B780
LS1088ASE7Q1A	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V	GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm		30	250	23 mm	CMOS	1.025 V	.8 mm	S-PBGA-B780	3	e1
LS1088AXN7PQA	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V	GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	-40 Cel		BOTTOM	2.61 mm	23 mm				23 mm	CMOS	1.025 V	.8 mm	S-PBGA-B780
LS1043AXN8MNLB	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.87 V	105 Cel	-40 Cel		BOTTOM	2.07 mm	23 mm				23 mm	CMOS	.9 V	.8 mm	S-PBGA-B780
LS1043AXN8MQLA	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.87 V	105 Cel	-40 Cel		BOTTOM	2.07 mm	23 mm				23 mm	CMOS	.9 V	.8 mm	S-PBGA-B780
LS1043ASN8PQLB	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.87 V	105 Cel	0 Cel		BOTTOM	2.07 mm	23 mm				23 mm	CMOS	.9 V	.8 mm	S-PBGA-B780
LS1023ASE8KQA	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V	GRID ARRAY, FINE PITCH		.87 V	105 Cel	0 Cel		BOTTOM	2.07 mm	23 mm	ALSO OPERATES AT 1V SUPPLY NOM			23 mm	CMOS	.9 V	.8 mm	S-PBGA-B780
LS1043ASE8QQLA	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.87 V	105 Cel	0 Cel		BOTTOM	2.07 mm	23 mm				23 mm	CMOS	.9 V	.8 mm	S-PBGA-B780
LS1043AXN8QNLA	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.87 V	105 Cel	-40 Cel		BOTTOM	2.07 mm	23 mm				23 mm	CMOS	.9 V	.8 mm	S-PBGA-B780
LS1043ASE8MQLB	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.87 V	105 Cel	0 Cel		BOTTOM	2.07 mm	23 mm				23 mm	CMOS	.9 V	.8 mm	S-PBGA-B780
LS1088AXN7QTA	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V	GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	-40 Cel		BOTTOM	2.61 mm	23 mm				23 mm	CMOS	1.025 V	.8 mm	S-PBGA-B780
LS1043AXN8MQLB	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.87 V	105 Cel	-40 Cel		BOTTOM	2.07 mm	23 mm				23 mm	CMOS	.9 V	.8 mm	S-PBGA-B780
LS1088ASN7P1A	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V	GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	0 Cel		BOTTOM	2.61 mm	23 mm				23 mm	CMOS	1.025 V	.8 mm	S-PBGA-B780
LS1048ASE7MQA	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V	GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm		30	250	23 mm	CMOS	1.025 V	.8 mm	S-PBGA-B780	3	e1
LS1088ASE7MTA	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V	GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	0 Cel		BOTTOM	2.61 mm	23 mm				23 mm	CMOS	1.025 V	.8 mm	S-PBGA-B780
LS1043AXE8QNLA	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.87 V	105 Cel	-40 Cel		BOTTOM	2.07 mm	23 mm				23 mm	CMOS	.9 V	.8 mm	S-PBGA-B780
LS1048ASN7PTA	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V	GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm		30	250	23 mm	CMOS	1.025 V	.8 mm	S-PBGA-B780	3	e1
LS1048ASE7Q1A	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V	GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm		30	250	23 mm	CMOS	1.025 V	.8 mm	S-PBGA-B780	3	e1
LS1088AXN7PTA	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V	GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm		30	250	23 mm	CMOS	1.025 V	.8 mm	S-PBGA-B780	3	e1
LS1043AXN8QQLA	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.87 V	105 Cel	-40 Cel		BOTTOM	2.07 mm	23 mm				23 mm	CMOS	.9 V	.8 mm	S-PBGA-B780
LS1043AXE8KNLB	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.87 V	105 Cel	-40 Cel		BOTTOM	2.07 mm	23 mm				23 mm	CMOS	.9 V	.8 mm	S-PBGA-B780
LS1043ASE8MNLB	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.87 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	23 mm		30	250	23 mm	CMOS	.9 V	.8 mm	S-PBGA-B780	3	e1
LS1043ABE9MQB	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.87 V			TIN SILVER COPPER	BOTTOM	2.07 mm	23 mm		30	250	23 mm	CMOS	.9 V	.8 mm	S-PBGA-B780	3	e1
LS1044AXE7Q1A	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V	GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	-40 Cel		BOTTOM	2.61 mm	23 mm			250	23 mm	CMOS	1.025 V	.8 mm	S-PBGA-B780	3
LS1088ASN7PTA	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V	GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm		30	250	23 mm	CMOS	1.025 V	.8 mm	S-PBGA-B780	3	e1
LS1044AXN7PTA	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V	GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	-40 Cel		BOTTOM	2.61 mm	23 mm			250	23 mm	CMOS	1.025 V	.8 mm	S-PBGA-B780	3
LS1088ASN7M1A	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V	GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	0 Cel		BOTTOM	2.61 mm	23 mm				23 mm	CMOS	1.025 V	.8 mm	S-PBGA-B780
LS1044ASE7PTA	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V	GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	0 Cel		BOTTOM	2.61 mm	23 mm			250	23 mm	CMOS	1.025 V	.8 mm	S-PBGA-B780	3
LS1088ASE7P1A	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V	GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	0 Cel		BOTTOM	2.61 mm	23 mm				23 mm	CMOS	1.025 V	.8 mm	S-PBGA-B780
LS1043AXE8KNLA	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.87 V	105 Cel	-40 Cel		BOTTOM	2.07 mm	23 mm				23 mm	CMOS	.9 V	.8 mm	S-PBGA-B780
LS1088AXN7MQA	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V	GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm		30	250	23 mm	CMOS	1.025 V	.8 mm	S-PBGA-B780	3	e1

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.