81 Other Function uPs,uCs & Peripheral ICs 10

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Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Information Access Method Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width No. of Bits DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Interrupt Capability Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Ultraviolet Erasable Terminal Position DMA Channels No. of Ports Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Total Dose (V) ROM Bits Size No. of Timers RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Minimum Time Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode Volatile JESD-609 Code Maximum Standby Current On Chip Program ROM Width No. of I/O Lines Maximum Access Time

MAX78000EXG+

Analog Devices

SoC

BALL

81

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.21 V

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA81,9X9,32

.9 V

105 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.3 mm

8 mm

30

260

8 mm

CMOS

1.1 V

.8 mm

S-PBGA-B81

3

e1

CYWB0125ABX-FDXI

Infineon Technologies

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

81

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1.9 V

1.8,1.8/3.3

GRID ARRAY, FINE PITCH

BGA81,9X9,16

1.7 V

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

.55 mm

3.784 mm

260

3.788 mm

CMOS

115 mA

1.8 V

Bus Controllers

.4 mm

S-PBGA-B81

Not Qualified

e1

CYWB0220ABSX2-FDXIT

Infineon Technologies

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

81

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1.9 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

1.7 V

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

.55 mm

3.907 mm

3.91 mm

CMOS

1.8 V

.4 mm

R-PBGA-B81

3

e1

CYWB0220ABSX2-FDXI

Infineon Technologies

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

81

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1.9 V

1.8,1.8/3.3

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA81,9X9,16

1.7 V

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

.55 mm

3.907 mm

260

3.91 mm

CMOS

115 mA

1.8 V

Bus Controllers

.4 mm

R-PBGA-B81

Not Qualified

e1

CYWB0224ABSX-FDXI

Infineon Technologies

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

81

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1.9 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

1.7 V

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

.55 mm

3.907 mm

260

3.91 mm

CMOS

1.8 V

.4 mm

R-PBGA-B81

1

e1

CYWB0124ABX-FDXI

Infineon Technologies

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

81

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1.9 V

1.8,1.8/3.3

GRID ARRAY, FINE PITCH

BGA81,9X9,16

1.7 V

85 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

.55 mm

3.784 mm

260

3.788 mm

CMOS

1.8 V

Bus Controllers

.4 mm

S-PBGA-B81

Not Qualified

e1

CYWB0321ABX-FDXIT

Infineon Technologies

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

81

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1.9 V

1.8,1.8/3.3,3.3

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA81,9X9,16

1.7 V

85 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

.55 mm

3.91 mm

3.91 mm

CMOS

115 mA

1.8 V

Bus Controllers

.4 mm

S-PBGA-B81

Not Qualified

e1

CYWB0321ABX-FDXI

Infineon Technologies

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

81

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1.9 V

1.8,1.8/3.3,3.3

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA81,9X9,16

1.7 V

85 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

.55 mm

3.91 mm

3.91 mm

CMOS

115 mA

1.8 V

Bus Controllers

.4 mm

S-PBGA-B81

Not Qualified

e1

CYWB0320ABX-FDXI

Infineon Technologies

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

81

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1.9 V

1.8,1.8/3.3,3.3

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA81,9X9,16

1.7 V

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

.55 mm

3.91 mm

3.91 mm

CMOS

115 mA

1.8 V

Bus Controllers

.4 mm

S-PBGA-B81

Not Qualified

e1

CYWB0226ABSX-FDXI

Infineon Technologies

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

81

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1.9 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

1.7 V

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

.55 mm

3.907 mm

40

260

3.91 mm

CMOS

1.8 V

.4 mm

R-PBGA-B81

1

e1

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.