SQUARE Other Function uPs,uCs & Peripheral ICs 2,400+

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	Sub-Category	Bus Compatibility	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	JESD-609 Code
TCI6636K2HCSAAW2	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY		.95 V				BOTTOM	3.75 mm	40 mm					40 mm	CMOS		1 V			1 mm	S-PBGA-B1517
TCI6636K2HAAW	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY		.95 V				BOTTOM	3.75 mm	40 mm					40 mm	CMOS		1 V			1 mm	S-PBGA-B1517
CC1310F128RHB	Texas Instruments	MICROPROCESSOR CIRCUIT		NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.8 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.8 V				QUAD	1 mm	5 mm					5 mm	CMOS					.5 mm	S-PQCC-N32
TCI6636K2HDDAAWA24	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY		.95 V				BOTTOM	3.75 mm	40 mm					40 mm	CMOS		1 V			1 mm	S-PBGA-B1517
AM6252ASGGHAALW	Texas Instruments	SoC		BALL	425	VFBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA425,25X25,20	.715 V	105 Cel	-40 Cel		BOTTOM	.89 mm	13 mm					13 mm	CMOS		.75 V			.5 mm	S-PBGA-B425
AM6421BSEFHAALV	Texas Instruments	SYSTEM ON CHIP		BALL	441	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V			GRID ARRAY, FINE PITCH	BGA441,21X21,32	.715 V	105 Cel	-40 Cel		BOTTOM	2.652 mm	17.2 mm	ALSO OPERATES AT 0.85V NOMINAL SUPPLY				17.2 mm	CMOS		.75 V			.8 mm	S-PBGA-B441
AM6441BSFFHAALV	Texas Instruments	SYSTEM ON CHIP		BALL	441	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V			GRID ARRAY, FINE PITCH	BGA441,21X21,32	.715 V	105 Cel	-40 Cel		BOTTOM	2.652 mm	17.2 mm	ALSO OPERATES AT 0.85V NOMINAL SUPPLY			250	17.2 mm	CMOS		.75 V			.8 mm	S-PBGA-B441	3
AM6441BSDFHAALV	Texas Instruments	SYSTEM ON CHIP		BALL	441	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V			GRID ARRAY, FINE PITCH	BGA441,21X21,32	.715 V	105 Cel	-40 Cel		BOTTOM	2.652 mm	17.2 mm	ALSO OPERATES AT 0.85V NOMINAL SUPPLY				17.2 mm	CMOS		.75 V			.8 mm	S-PBGA-B441
AM6421BSEGHAALV	Texas Instruments	SYSTEM ON CHIP		BALL	441	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V			GRID ARRAY, FINE PITCH	BGA441,21X21,32	.715 V	105 Cel	-40 Cel		BOTTOM	2.652 mm	17.2 mm	ALSO OPERATES AT 0.85V NOMINAL SUPPLY				17.2 mm	CMOS		.75 V			.8 mm	S-PBGA-B441
AM6441BSEGHAALV	Texas Instruments	SYSTEM ON CHIP		BALL	441	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V			GRID ARRAY, FINE PITCH	BGA441,21X21,32	.715 V	105 Cel	-40 Cel		BOTTOM	2.652 mm	17.2 mm	ALSO OPERATES AT 0.85V NOMINAL SUPPLY				17.2 mm	CMOS		.75 V			.8 mm	S-PBGA-B441
AM6421BSDFHAALV	Texas Instruments	SYSTEM ON CHIP		BALL	441	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V			GRID ARRAY, FINE PITCH	BGA441,21X21,32	.715 V	105 Cel	-40 Cel		BOTTOM	2.652 mm	17.2 mm	ALSO OPERATES AT 0.85V NOMINAL SUPPLY				17.2 mm	CMOS		.75 V			.8 mm	S-PBGA-B441
AM6421BSFFHAALV	Texas Instruments	SYSTEM ON CHIP		BALL	441	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V			GRID ARRAY, FINE PITCH	BGA441,21X21,32	.715 V	105 Cel	-40 Cel		BOTTOM	2.652 mm	17.2 mm	ALSO OPERATES AT 0.85V NOMINAL SUPPLY			250	17.2 mm	CMOS		.75 V			.8 mm	S-PBGA-B441	3
TDA4VE88TGAALZRQ1	Texas Instruments	SYSTEM ON CHIP		BALL	770	FBGA	SQUARE	PLASTIC/EPOXY	YES	.84 V	AEC-Q100; ISO 26262		GRID ARRAY, FINE PITCH	BGA770,28X28,32	.76 V	125 Cel	-40 Cel		BOTTOM	2.57 mm	23 mm					23 mm	CMOS		.8 V			.8 mm	S-PBGA-B770	3		2000 rpm
TDA4VL21HGAALZRQ1	Texas Instruments	SYSTEM ON CHIP		BALL	770	FBGA	SQUARE	PLASTIC/EPOXY	YES	.84 V	AEC-Q100; ISO 26262		GRID ARRAY, FINE PITCH	BGA770,28X28,32	.76 V	125 Cel	-40 Cel		BOTTOM	2.57 mm	23 mm					23 mm	CMOS		.8 V			.8 mm	S-PBGA-B770	3		1200 rpm
AM62A74AVMSIAMBQ1	Texas Instruments	SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V	AEC-Q100		GRID ARRAY, FINE PITCH	BGA484,22X22,32	.715 V	125 Cel	-40 Cel		BOTTOM	2.556 mm	18 mm					18 mm	CMOS		.75 V			.8 mm	S-PBGA-B484
AM68A92ATGGHAALZR	Texas Instruments	SoC		BALL	770	FBGA	SQUARE	PLASTIC/EPOXY	YES	.84 V			GRID ARRAY, FINE PITCH	BGA770,28X28,32	.76 V	105 Cel	-40 Cel		BOTTOM	2.57 mm	23 mm			30	260	23 mm	CMOS		.8 V			.8 mm	S-PBGA-B770	3
AM62A32AMLHAAMB	Texas Instruments	SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V			GRID ARRAY, FINE PITCH	BGA484,22X22,32	.715 V	105 Cel	-40 Cel		BOTTOM	2.556 mm	18 mm					18 mm	CMOS		.75 V			.8 mm	S-PBGA-B484
AM62A74AUMSIAMBRQ1	Texas Instruments	SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V	AEC-Q100		GRID ARRAY, FINE PITCH	BGA484,22X22,32	.715 V	125 Cel	-40 Cel		BOTTOM	2.556 mm	18 mm					18 mm	CMOS		.75 V			.8 mm	S-PBGA-B484
AM62A74AUMHAAMBR	Texas Instruments	SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V			GRID ARRAY, FINE PITCH	BGA484,22X22,32	.715 V	105 Cel	-40 Cel		BOTTOM	2.556 mm	18 mm					18 mm	CMOS		.75 V			.8 mm	S-PBGA-B484
AM6252ATCGHAALW	Texas Instruments	SoC		BALL	425	VFBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA425,25X25,20	.715 V	105 Cel	-40 Cel		BOTTOM	.89 mm	13 mm			30	250	13 mm	CMOS		.75 V			.5 mm	S-PBGA-B425	3
AM62A32AMLSIAMBQ1	Texas Instruments	SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V	AEC-Q100		GRID ARRAY, FINE PITCH	BGA484,22X22,32	.715 V	125 Cel	-40 Cel		BOTTOM	2.556 mm	18 mm					18 mm	CMOS		.75 V			.8 mm	S-PBGA-B484
AM62A74AUMHAAMB	Texas Instruments	SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V			GRID ARRAY, FINE PITCH	BGA484,22X22,32	.715 V	105 Cel	-40 Cel		BOTTOM	2.556 mm	18 mm					18 mm	CMOS		.75 V			.8 mm	S-PBGA-B484
AM62A74AUMSIAMBQ1	Texas Instruments	SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V	AEC-Q100		GRID ARRAY, FINE PITCH	BGA484,22X22,32	.715 V	125 Cel	-40 Cel		BOTTOM	2.556 mm	18 mm					18 mm	CMOS		.75 V			.8 mm	S-PBGA-B484
AM62A34ASMHAAMB	Texas Instruments	SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V			GRID ARRAY, FINE PITCH	BGA484,22X22,32	.715 V	105 Cel	-40 Cel		BOTTOM	2.556 mm	18 mm					18 mm	CMOS		.75 V			.8 mm	S-PBGA-B484
AM62A34ASMSIAMBQ1	Texas Instruments	SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V	AEC-Q100		GRID ARRAY, FINE PITCH	BGA484,22X22,32	.715 V	125 Cel	-40 Cel		BOTTOM	2.556 mm	18 mm					18 mm	CMOS		.75 V			.8 mm	S-PBGA-B484
AM62A31AMLHAAMB	Texas Instruments	SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V			GRID ARRAY, FINE PITCH	BGA484,22X22,32	.715 V	105 Cel	-40 Cel		BOTTOM	2.556 mm	18 mm					18 mm	CMOS		.75 V			.8 mm	S-PBGA-B484
AM6251ATCGHAALW	Texas Instruments	SoC		BALL	425	VFBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA425,25X25,20	.715 V	105 Cel	-40 Cel		BOTTOM	.89 mm	13 mm				250	13 mm	CMOS		.75 V			.5 mm	S-PBGA-B425	3
AM6232ATCGHAALW	Texas Instruments	SoC		BALL	425	VFBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA425,25X25,20	.715 V	105 Cel	-40 Cel		BOTTOM	.89 mm	13 mm				250	13 mm	CMOS		.75 V			.5 mm	S-PBGA-B425	3
AM6231ATCGHAALW	Texas Instruments	SoC		BALL	425	VFBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA425,25X25,20	.715 V	105 Cel	-40 Cel		BOTTOM	.89 mm	13 mm				250	13 mm	CMOS		.75 V			.5 mm	S-PBGA-B425	3
ADMC200AP	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	J BEND	68	QCCJ	SQUARE	PLASTIC/EPOXY	YES	5.25 V			CHIP CARRIER		4.75 V	85 Cel	-40 Cel	TIN LEAD	QUAD	4.45 mm	24.1808 mm					24.1808 mm	CMOS		5 V			1.27 mm	S-PQCC-J68		Not Qualified		e0
AD897JS	Analog Devices	MICROPROCESSOR CIRCUIT	COMMERCIAL	GULL WING	52	QFP	SQUARE	PLASTIC/EPOXY	YES				FLATPACK			70 Cel	0 Cel	TIN LEAD	QUAD	2.39 mm	10 mm	ALSO REQUIRES 12V SUPPLY				10 mm	CMOS		5 V			.65 mm	S-PQFP-G52		Not Qualified		e0
AD6620AS	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	80	QFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V		3.3	FLATPACK	QFP80,.7SQ	3 V	85 Cel	-40 Cel	Tin/Lead (Sn/Pb)	QUAD	3.4 mm	14 mm			30	240	14 mm	CMOS		3.3 V	DSP Peripherals		.65 mm	S-PQFP-G80	3	Not Qualified		e0
IA82510-PLC28I-00	Analog Devices		INDUSTRIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES			5	CHIP CARRIER	LDCC28,.5SQ		85 Cel	-40 Cel	TIN LEAD	QUAD						235			22.4 mA	5 V	Other Microprocessor ICs		1.27 mm	S-PQCC-J28	3	Not Qualified		e0
IA8X44PDW40I3	Analog Devices		INDUSTRIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES			5	CHIP CARRIER	LDCC44,.7SQ		85 Cel	-40 Cel		QUAD								CMOS	50 mA	5 V	Other uPs/uCs/Peripheral ICs		1.27 mm	S-PQCC-J44		Not Qualified
ADSP-SC583KBCZ-3A	Analog Devices	MICROPROCESSOR CIRCUIT	COMMERCIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.5 mm	19 mm		500 MHz	30	260	19 mm	CMOS		1.1 V		SPI; UART	.8 mm	S-PBGA-B349	3			e1
ADSP-SC587KBCZ-4B	Analog Devices	MICROPROCESSOR CIRCUIT	COMMERCIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	70 Cel	0 Cel		BOTTOM	1.5 mm	19 mm		500 MHz	30	260	19 mm	CMOS		1.1 V		SPI; UART	.8 mm	S-PBGA-B349	3
ADN2855ACPZ-R7	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		3 V	85 Cel	-40 Cel	MATTE TIN	QUAD	1 mm	5 mm			30	260	5 mm	CMOS		3.3 V			.5 mm	S-XQCC-N32	3	Not Qualified		e3
ADSP-21583-ENG	Analog Devices	MICROPROCESSOR CIRCUIT		BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.05 V				BOTTOM	1.5 mm	19 mm					19 mm	CMOS		1.1 V			.8 mm	S-PBGA-B349
IA8344-PLC44I-P03	Analog Devices		INDUSTRIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES			5	CHIP CARRIER	LDCC44,.7SQ		85 Cel	-40 Cel		QUAD									50 mA	5 V	Other uPs/uCs/Peripheral ICs		1.27 mm	S-PQCC-J44		Not Qualified
ADSP-21584CBCZ-5A	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	95 Cel	-40 Cel		BOTTOM	1.5 mm	19 mm		500 MHz		260	19 mm	CMOS		1.1 V		SPI; UART	.8 mm	S-PBGA-B349	3
IA82050-PLC28IR2	Analog Devices	SERIAL IO/COMMUNICATION CONTROLLER, I2C BUS	INDUSTRIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	5.5 V			CHIP CARRIER	LDCC28,.5SQ		85 Cel	-40 Cel		QUAD	4.57 mm	11.5 mm		20 MHz			11.5 mm	CMOS					1.27 mm	S-PQCC-J28
ADSP-SC589BBCZ-5B	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	85 Cel	-40 Cel		BOTTOM	1.5 mm	19 mm		500 MHz		260	19 mm	CMOS		1.1 V		SPI; UART	.8 mm	S-PBGA-B349	3
ADSP-21584KBCZ-4A	Analog Devices	MICROPROCESSOR CIRCUIT	COMMERCIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.5 mm	19 mm		500 MHz	30	260	19 mm	CMOS		1.1 V		SPI; UART	.8 mm	S-PBGA-B349	3			e1
IA80152JB-PLC68C	Analog Devices		COMMERCIAL	J BEND	68	QCCJ	SQUARE	PLASTIC/EPOXY	YES			5	CHIP CARRIER	LDCC68,1.0SQ		70 Cel	0 Cel	TIN LEAD	QUAD						235		CMOS	.1 mA	5 V	Other Microprocessor ICs		1.27 mm	S-PQCC-J68	3	Not Qualified		e0
ADUCM330WDCPZ	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	18 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		3.6 V	115 Cel	-40 Cel		QUAD	1 mm	6 mm					6 mm	CMOS					.5 mm	S-XQCC-N32
ADSP-SC584KBCZ-4A	Analog Devices	MICROPROCESSOR CIRCUIT	COMMERCIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	70 Cel	0 Cel		BOTTOM	1.5 mm	19 mm		500 MHz	30	260	19 mm	CMOS		1.1 V		SPI; UART	.8 mm	S-PBGA-B349	3
ADSP-SC584-ENG	Analog Devices	MICROPROCESSOR CIRCUIT		BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.05 V				BOTTOM	1.5 mm	19 mm					19 mm	CMOS		1.1 V			.8 mm	S-PBGA-B349
IA82510-PLC28C-00	Analog Devices		COMMERCIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES			5	CHIP CARRIER	LDCC28,.5SQ		70 Cel	0 Cel	TIN LEAD	QUAD						235			22.4 mA	5 V	Other Microprocessor ICs		1.27 mm	S-PQCC-J28	3	Not Qualified		e0

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.